Semiconductors

SEMICONDUCTORS ARTICLES



North American semiconductor equipment industry posts November 2016 book-to-bill ratio of 0.96

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

Toshio Maruyama to receive SEMI Marketing Excellence Award at SEMICON Japan

12/15/2016  SEMI this week announced that Toshio Maruyama has been selected as the 2017 recipient of the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.

SEMICON China 2017 presents six forums in China's explosive growth market

12/14/2016  SEMI today announced the lineup for six forums at SEMICON China and FPD China held at the Shanghai New International Expo Centre on March 14-16, 2017.

New fab facilities: China dominates, followed by Americas and Taiwan

12/14/2016  The 62 facilities and lines range from R&D to high-volume fabs. Most of the newly operating facilities will be volume fabs; only seven are R&Ds or Pilot facilities.

SiFive named Startup of the Year

12/13/2016  SiFive, the first fabless provider of customized, open-source enabled RISC-V semiconductors, has been named "Startup of the Year" at the UBM Annual Creativity in Electronics (ACE) Awards held in conjunction with the Embedded Systems Conference Silicon Valley in San Jose.

Semiconductor equipment sales forecast: $40 Billion

12/13/2016  SEMI today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 8.7 percent to $39.7 billion in 2016.

SEMICON Japan 2016 opens tomorrow at Tokyo Big Sight

12/13/2016  SEMICON Japan 2016, the largest and most influential event for the electronics manufacturing supply chain in Japan, opens tomorrow at Tokyo Big Sight.

Silicon Labs wins GSA's "Most Respected Public Semiconductor Company" for the second year in a row

12/12/2016  Silicon Labs takes the top spot among semiconductor companies achieving $500 million to $1 billion in annual sales at the Global Semiconductor Alliance (GSA) awards celebration held on Dec. 8 in Santa Clara, California.

Global Semiconductor Alliance announces 2016 Award recipients

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

Mentor Graphics announces 2016 winners of Don Miller Award for Thermo-Fluid Design Excellence

12/09/2016  Mentor Graphics Corporation today announced the winners of its second annual Don Miller Award for Excellence in System-Level Thermo-Fluid Design.

University of California, Berkeley places order for PEALD deposition system from Ultratech Cambridge Nanotech

12/08/2016  Ultratech, Inc. announced that the Laboratory for Emerging and Exploratory Devices has chosen the Ultratech-CNT Fiji G2 PEALD system as its instrument of choice for its research activities.

Global semiconductor sales increase 5% year-over-year in October

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

Leti says FD-SOI light-sensing technique can make transistors far more sensitive to visible light

12/08/2016  In IEDM 2016 presentation, institute’s team demonstrates potential sensing advantages of integrating photodiodes below buried oxide.

Imec develops 3D-compatible germanium nMOS gate stack with high mobility and superior reliability

12/08/2016  At this week's IEEE IEDM conference, imec, the research and innovation hub in nano-electronics and digital technologies showed for the first time a silicon (Si)-passivated germanium (Ge) nMOS gate stack with dramatically reduced interface defect density (DIT) reaching the same level as a Si gate stack and with high mobility and reduced positive bias temperature instability (PBTI).

Five suppliers to hold 41% of global semiconductor marketshare in 2016

12/07/2016  Two years of busy M&A activity boost marketshare among top suppliers.

Leti shows memristive devices can mimic different kind of synaptic plasticity inspired by biology

12/07/2016  Presented at IEDM 2016, breakthrough suggests path to embedding neuromorphic learning in low-power devices that could enable autonomous systems.

Stanford engineers find that a new memory technology may be more energy efficient than previously thought

12/07/2016  While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

Leti shows the way to fabricating CMOS devices for 5nm node using nanowire technology

12/06/2016  IEDM 2016 papers demonstrate novel responses to problems of performance and parasitic capacitances.

Third quarter 2016 worldwide semiconductor equipment billings reach $11B, reports SEMI

12/06/2016  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$11.0 billion in the third quarter of 2016.

Human-focused research and IoT promise profound, positive changes, say Leti CEO

12/06/2016  Leti CEO Marie Semeria today delivered a sweeping, optimistic assessment of a rapidly evolving world where "hyperconnectivity" and the Internet of Things – guided by a "human-centered research approach and symbiotic development strategies" – herald profound changes in the way individuals relate to each other and to the physical world.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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