12/04/2018  World's largest lineup to advance industry roadmap in seven major conferences.

12/03/2018  Silicon Labs President and CEO Tyson Tuttle elected to SIA board of directors.

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

12/03/2018  Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.

12/03/2018  New BONDSCALE system provides a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap.

12/03/2018  SEMI today reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11 percent higher than the same quarter a year ago.

11/30/2018  A new collaboration between Covalent Metrology and Rigaku will deliver metrology capabilities to the semiconductor and electronics markets.

11/30/2018  Keith Jackson, President, CEO, and Director of ON Semiconductor, elected SIA Vice Chair.

11/29/2018  The Process Watch series explores key concepts about process control -- defect inspection, metrology and data analytics -- for the semiconductor industry. This article is the fourth in a series on process control strategies for automotive semiconductor devices.

11/29/2018   Thermal Engineering Associates, Inc. (TEA) announces that its Thermal Test Chip (TTC) will soon be available in 8" (200mm) diameter wafers.

11/29/2018  Samsung's two-year capex spending of $46.8 billion nearly matches the combined two-year capex spending of $48.4 set by Intel and TSMC.

11/29/2018  Industry's most advanced high-speed SiGe technology now available on 300mm manufacturing line for terabit communications and automotive radar applications.

11/28/2018  STMicroelectronics (NYSE: STM) is making its STM32 microcontrollers (MCUs) even more attractive to developers of IoT products and other smart devices by providing free software for creating rich, smooth, and colorful graphical interfaces that deliver a great user experience.

11/28/2018  Researchers report a new method in ACS Applied Materials & Interfacesthat creates an ultrathin, stretchable electronic skin, which could be used for a variety of human-machine interactions.

11/27/2018  Opening of new Christian Doppler Laboratory expands existing relationship with Silvaco for analysis and development of next generation computer memory.

11/26/2018  Professor Michelle Simmons' team at UNSW Sydney has demonstrated a compact sensor for accessing information stored in the electrons of individual atoms - a breakthrough that brings us one step closer to scalable quantum computing in silicon.

11/26/2018  MagnaChip Semiconductor announced that volume production has commenced for an IGBT product for power module targeted to high-voltage industrial applications.

11/26/2018  SEMI, the global industry association serving the global electronics manufacturing supply chain, today announced the industry's first worldwide fab data for power and compound semiconductors.

11/21/2018  October billings of North American equipment suppliers reflect near-term weakening of demand for PC, mobile phones and servers.

11/21/2018  With China now a prominent player in the industry, it has become critically important for semiconductor companies to effectively engage with China.