Semiconductors

SEMICONDUCTORS ARTICLES



President’s Council launches semiconductor working group

11/08/2016  Tthe President’s Council of Advisors on Science and Technology (PCAST) announced the formation of a new working group focused on strengthening the U.S. semiconductor industry in ways that benefit the nation’s economic and security interests.

SunEdison Semiconductor announces regulatory approvals from Taiwan and Austria for proposed acquisition

11/07/2016  SunEdison Semiconductor Limited announced today that it has received notice that the Investment Committee of the Ministry of the Economic Affairs of the Republic of China has approved the proposed acquisition of SunEdison Semiconductor by GlobalWafers Co., Ltd.

Astronics Test Systems announces new semiconductor system-level test platform

11/07/2016  Astronics Corporation (NASDAQ:ATRO), through its wholly-owned subsidiary Astronics Test Systems, introduced its new breakthrough System-Level Test (SLT) platform that is expected to revolutionize the testing of high volume integrated semiconductor devices.

Trace metal recombination centers kill LED efficiency

11/04/2016  UCSB researchers warn that trace amounts of transition metal impurities act as recombination centers in gallium nitride semiconductors.

SMIC Shenzhen launches construction of the first 12-in IC production line in South China

11/04/2016  Semiconductor Manufacturing International Corporation announces the official launch of a 12-inch integrated circuit (IC) production line at SMIC's Shenzhen facility. It will be the very first 12-inch fab in South China.

Lattice Semiconductor to be acquired by Canyon Bridge Capital Partners, Inc. for $1.3B

11/03/2016  Lattice Semiconductor Corporation and Canyon Bridge Capital Partners, Inc. today announced that Lattice and Canyon Bridge Acquisition Company, Inc., an affiliate of Canyon Bridge, have signed a definitive agreement under which Canyon Bridge will acquire all outstanding shares of Lattice for approximately $1.3 billion.

Samsung expands its advanced foundry offerings with 14LPU and 10LPU processes

11/03/2016  The new foundry process offerings as well as EUV-enabled 7nm wafer are presented at the Samsung Foundry Forum.

2016 Global Semiconductor Alliance Award nominees announced

11/03/2016  The Global Semiconductor Alliance (GSA) announced the 2016 award nominees for the GSA Awards Dinner Celebration.

ZEISS and ASML strengthen partnership for next generation of EUV lithography due in early 2020s

11/03/2016  Netherlands-based ASML Holding NV, a chip industry equipment provider, and Germany-based Carl Zeiss SMT, a business group of Carl Zeiss AG (ZEISS), have agreed to strengthen their long-standing and successful partnership in the semiconductor lithography business.

Qualcomm/NXP deal underscores semiconductor merger trend

11/02/2016  Qualcomm's proposed acquisition of NXP Semiconductors marks the latest deal in a wave of industry consolidation that includes increasingly expensive transactions with greater focus on expanding scope rather than economies of scale.

Edwards and GlobalFoundries recognized by Singapore's National Environmental Agency

11/01/2016  Edwards and GlobalFoundries Singapore were recognized by Singapore’s National Environment Agency in the Best Practices category at the 2016 Energy Efficiency National Partnership (EENP) Awards.

Samsung Austin Semiconductor continues central Texas growth with more than $1B in investment

11/01/2016  Investments in its facilities will enhance current System LSI production to meet the growing demands in the industry for advanced system-on-chip (SoC) products especially for mobile and other electronic devices.

Global semiconductor sales increase 11.5% in Q3

11/01/2016  Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

Weakness is good when controlling light

11/01/2016  Study reports how new weak control laser beam could boost computer chips.

Imec reports breakthrough work that advances path for nanoscale spin-wave majority gates

10/31/2016  At the Annual Conference on Magnetism and Magnetic Materials, imec presented breakthrough results supporting the building of technology-relevant majority gates based on spin waves.

van der Pauw and Hall voltage measurements with a parameter analyzer

10/31/2016  van der Pauw measurements with a parameter analyzer are examined followed by a look at Hall effects measurements.

ON Semiconductor selects DSI to improve stock accuracy with Digital Supply Chain Platform

10/31/2016  DSI announced today that ON Semiconductor has selected DSI’s Digital Supply Chain Platform (DSCP) to increase stock accuracy and improve worker productivity in its inventory processes across the global supply chain.

Preview: 2016 IEEE International Electron Devices Meeting

10/30/2016  The 62nd annual IEDM will be held in San Francisco December 3 - 7, 2016.

Reducing ESD in semiconductor fluoropolymer fluid handling systems while maintaining chemical purity

10/30/2016  Fluoropolymer Electrostatic Discharge (ESD) tubing reduces electrostatic charge to levels below the ignition energy of flammable semiconductor chemicals and maintains chemical purity, ensuring safety and improving process yields.

3D-NAND deposition and etch integration

10/30/2016  Lam talks about process control and default roadmaps.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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