Semiconductors

SEMICONDUCTORS ARTICLES



GLOBALFOUNDRIES extends FDX roadmap with 12nm FD-SOI technology

09/08/2016  GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry's first multi-node FD-SOI roadmap.

Fab equipment spending ascending

09/08/2016  Expect 4% growth (YoY) for 2016 and 11% for 2017

M+W Group presents an integrated waste program for semiconductor facilities

09/08/2016  The global high-tech engineering and construction company M+W Group has presented current and future trends, as well as state of the art solutions, for an integrated approach to waste reduction in order to improve the sustainability of semiconductor fabs

GLOBALFOUNDRIES unveils ecosystem partner program to accelerate innovation for tomorrow's connected systems

09/08/2016  GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) design and reduce time-to-market for its customers.

Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.

SPTS Technologies collaborates with Novati Technologies to establish new plasma dicing line

09/07/2016  SPTS Technologies today announced its collaboration with Novati Technologies to establish Novati’s new plasma dicing line at their fab in Austin, Texas.

SEMI recognizes UMC CEO Po Wen Yen for sustainable semiconductor manufacturing leadership

09/07/2016  SEMI today presented its industry leadership award for sustainable manufacturing to Po Wen Yen, CEO of United Microelectronics Corporation (UMC).

SEMICON Taiwan 2016 opens tomorrow; 43,000 attendees expected

09/06/2016  Upbeat about the growth prospects of Taiwan's semiconductor sector, SEMICON Taiwan 2016 features 600 exhibitors covering over 1,600 booths,and is expected to attract more than 43,000 visitors in three days.

For first time, carbon nanotube transistors outperform silicon

09/06/2016  For the first time, University of Wisconsin-Madison materials engineers have created carbon nanotube transistors that outperform state-of-the-art silicon transistors.

ZEISS launches a new high performance wafer and mask tuning system

09/06/2016  ZEISS introduces the new ZEISS ForTune system for photomask tuning. With its latest optical design, it takes two main mask tuning processes to the next level in terms of efficiency, accuracy and throughput. The first tool has already been delivered to the first customer.

Thinner wafers are fostering the growth and emergence of new dicing technologies

09/06/2016  Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.

Cabot Microelectronics appoints Thomas F. Kelly as VP of Corporate Development

09/02/2016  Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.

Top 4 drivers leading to the growth of the RF IC market

09/02/2016  Technavio analysts forecast the global radio frequency (RF) IC market to grow at a CAGR of nearly 12% during the forecast period, according to their latest report.

Memory for future wearable electronics

09/02/2016  Stretchable, flexible, reliable memory device inspired by the brain.

Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

09/02/2016  The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.

Enabling industry collaboration to address critical ATE challenges

09/01/2016  For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.

ASMC 2017 "Call for Papers" deadline is October 17

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

Global GaN semiconductor devices market is expected to be worth $3438.4M by 2024

08/31/2016  The global market for gallium nitride (GaN) semiconductor devices is largely consolidated, with the top four companies commanding a share of over 65% of the overall market in 2015, states Transparency Market Research (TMR) in a new report.

Fujitsu Semiconductor licenses Nantero's NRAM, begins developing memory products

08/31/2016  Agreement covers joint development and licensing of ultrafast, ultrahigh-density NRAM, non-volatile RAM using carbon nanotubes.

Plastic crystals could improve fabrication of memory devices

08/31/2016  A novel 'plastic crystal' developed by Hokkaido University researchers has switching properties suitable for memory-related applications.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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