07/19/2016  Last year, Rudolph Technologies, Inc. announced the widespread adoption and success of its newest macro defect inspection tool, the NSX 330 Series.

07/18/2016  Silicon Valley specialty semiconductor foundry Noel Technologies, a provider of process development and substrate fabrication for a variety of high-technology industries, celebrates its 20th anniversary this month.

07/18/2016  A novel three-dimensional solar cell design developed at Georgia Tech will soon get its first testing in space aboard the International Space Station.

07/15/2016  Toshiba Corporation and Western Digital Corporation today celebrated the opening of the New Fab 2 semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan.

07/15/2016  Approach opens a straightforward route for engineering the properties of single-wall carbon nanotubes.

07/15/2016  Compared to similar aluminum gallium arsenide/gallium arsenide HEMTs, the gallium nitride-based HEMTs are ten times more tolerant of radiation-induced displacement damage.

07/15/2016  Materials researchers at North Carolina State University have fine-tuned a technique that enables them to apply precisely controlled silica coatings to quantum dot nanorods in a day - up to 21 times faster than previous methods.

07/15/2016  Applied Materials has disclosed commercial availability of new Selectra selective etch twin-chamber hardware for the company’s high-volume manufacturing (HVM) Producer platform.

07/14/2016  Infineon Technologies AG and Cree, Inc. announced today that Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and RF division of Cree.

07/14/2016  Cellphone IC market CAGR to exceed total IC market CAGR by 3.0 points through forecast.

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

07/13/2016  Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

07/13/2016  Cisco VP urges conference goers to invest in digitized supply chains to stay relevant.

07/12/2016  Semiconductor manufacturers and their suppliers – both process tool vendors and providers of sub-fab systems – are looking to an open-source industrial networking methodology, EtherCAT, developed by Beckhoff Automation to address the increasingly stringent control requirements of emerging high-precision processes.

07/12/2016  A major theme at SEMICON West 2016 is Smart Manufacturing, a.k.a. Industry 4.0 and Industrial IoT (IIoT).

07/12/2016  SEMI today announced that Jon D. Kemp, president of DuPont Electronics & Communications, and Tadahiro Suhara, president of SCREEN Semiconductor Solutions Co., Ltd., were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

07/12/2016  Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.?