Issue



Table of Contents

Solid State Technology

Year 2013
Issue 3

FEATURES

Cover Artilce


Manufacturing flexible displays: The challenges of handling plastic

The first flexible high-resolution displays will be produced using materials handling techniques that have been developed to allow the use of existing thin transistor fabrication facilities. NICK COLANERI, Flexible Display Center, Arizona State University, Phoenix, AZ


Packaging


Analysis of TSV proximity effects in planar MOSFETs and FinFETs

The impact of TSV-induced stresses on transistor performance are simulated, and a "keep-out-zone" is identified. Ricardo Borges, Victor Moroz and Xiaopeng Xu, Synopsys, Mountain View, CA.


Packaging


First 2.5D acoustic imaging

Acoustic micro imaging enables quick, non-destructive evaluation and can detect whether materials are bonded or not. TOM ADAMS, Sonoscan, Inc., Elk Grove Village, IL


Defects


Current and future defectivity issues for equipment components and materials

The Nanodefect Center is tackling the big challenges in particle detection, characterization and mitigation for critical supply chain components and materials. VIBHU JINDAL, SEMATECH, Albany, NY


Economics


When the chips are down

There's a need for greater R&D efficiency in the semiconductorindustry. SCOTT JONES, Alix Partners, San Francisco, CA


Automation


Meeting the challenge of film frame handling automation

Semiconductor and LED manufacturers are interested in automating the film frame handling process as a means to increase throughput and yield in their BEOL processes. BOB FUNG and JACK YAO, Owens Design, Fremont, CA


COLUMNS

Editorial


450mm in 2017: It's coming

The switch to 450mm will likely be the largest, most expensive retooling the semiconductor industry has ever experienced. 450mm fabs, which will give an unbeatable competitive advantage to the largest semiconductor manufacturers, are likely to cost $10 billion and come on-line in 2017, with production ramp in 2018.


Semiconductors


New MFCs mean higher yield

In what might be a case of the cobbler's children finally getting new shoes, new algorithms and control technology ??? powered by advanced semiconductors, of course ??? are enabling "intelligent" real-time flow error detection in mass flow controllers (MFCs).


Packaging


GlobalFoundries 2.5 / 3D at 20nm

A year ago, GlobalFoundries (GF) CTO Bartlett announced the installation of TSV production tools for the company's 20nm technology platform and announced that "the first full flow silicon with TSVs was expected to start running at Fab 8 (Saratoga, NY) in Q3 2012 with mass production expected in 2014 and the 2.5D line (their 65 nm Fab 7 line in Singapore) had a similar time schedule as the 3D line in the United States."


Industry Forum


Ensuring RoHS 2 success with agility

RoHS 2 is the second phase of the European Union's (EU) Restriction on Hazardous Substances (RoHS).


DEPARTMENTS

News


The UV LED market is booming

Yole D??veloppement announced its new report "UV LEDs: Technology & Application Trends" which presents UV LED new applications and associated market metrics for the period 2012-2020, and a deep analysis of UV LED technology and UV LED lighting industry.


News


A single European semiconductor strategy is on its way

At the International Semiconductor Strategy Symposium (ISS Europe), the European semiconductor industry affirmed its ability to innovate.


News


Intel leads unexpectedly large decline in semiconductor market inventory

After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.


News


Student develops brighter, smarter and more efficient LEDs

Rensselaer Polytechnic Institute student Ming Ma has developed a new method to manufacture light-emitting diodes (LEDs) that are brighter, more energy efficient, and have superior technical properties than those on the market today.