Issue

Through-silicon via (TSV) is an emerging technology widely accepted as a basic enabler for current and future device generations, and also for the industry's advance into the "More Than Moore" space. If you're a well-established supplier of chipmaking equipment or design software, you certainly want to play in the TSV market -- but you want to do it in the way that's most beneficial to your company's bottom line. Today, the supply chain is trailing ITRS expectations for TSVs. Steve Lerner, Alchimer S.A., looks into the push-and-pull of TSV development and TSV adoption.

Electrochemical pattern replication enables fine pitch, >2:1 aspect ratio plating of near vertical sidewall copper metal features without advanced lithography; its uniformity will prove to be very attractive for both front-end of line and back-end of line metallization processes. M. Thompson, P. Moller, M Fredenberg, D. Hays, W. Van den Hoek, D. Carl, Replisaurus, Kista, Sweden