Issue

The industry struggle from node to node along the semi-log Moore’s Law track gets ever tougher.

Worries about a looming US economic recession and unexpected softness in the memory sector (particularly NAND) are already causing semiconductor watchers to rethink their expectations for the IC industry in 2008, although there’s still debate over when to sound the alarms.

Silicon Valley was once the center of the silicon-based IC manufacturing world, and although IC fabs are now located globally, the valley maintains momentum as the center of IC R&D.

Liquid phase chromatography is undoubtedly the most powerful technique to separate and identify molecules present in a given sample mixture.

The VMP electronic variable displacement metering pump dispenses UV-sensitive fluids such as UV-curable adhesives, UV coatings, and photolithography chemicals.

These sputtering targets are available in 62 different metals and alloys, as well as compounds such as borides, carbides, fluorides, nitrides, oxides, selenides, silicides, sulphides, and tellurides.

Stepping into the sub-180nm world creates a new reality far different from what we have known and relied on in the past.

There are no insurmountable obstacles foreseen for scaling high-volume manufacturing to the 32nm node for logic in 2009.

Although CVD-grown nanowires are good for demonstration purposes, getting them into manufacturing calls for the utilization of CMOS fabrication methods.

Future generations of cellular RF transceivers require higher degrees of integration, preferably using the third dimension.