Issue

Some time ago, a group of chip industry veterans pointed to a quandary facing the industry as we moved toward a billion transistors on a chip and beyond.

There is considerable value in identifying optimum surface-finishing techniques for 316L stainless steel used in ultrahigh purity gas applications in the semiconductor industry.

Immersion arrived on the lithography roadmap shortly after the first immersion images became available in the fall of 2003.

Today, the errors associated with modeling the lithography process constitute one of the largest error sources in IC manufacturing, according to the modeling and simulation section of the 2005 International Technology Roadmap for Semiconductors.

Different manufacturing requirements for major IC device types call for different thin-film material requirements.

One of the most exciting areas in the flat panel display industry is the emergence of flexible displays.

Various p+ extension implantation dopant species and annealing techniques (spike, flash, laser, and SPE) were investigated to achieve high dopant activation and low damage ultra-shallow junctions (USJ) 15-20nm deep for 45nm-node applications.