Table of Contents
Solid State Technology
Year 2006 Issue 1
| DEPARTMENTS
Editorial Nanotech: It’s not a bubble
After the recent dot-com fiasco, it’s no wonder the industry regards with skepticism any claims about a revolutionary technology with limitless growth potential.
World News World News
Tech News Technology News
Chemicals Chemical Handl Differentiating tools and techniques for liquid flow control
Semiconductor manufacturing has always used aqueous processes. Process control in an aqueous batch tool can often be achieved by controlling reaction temperature and time, assuming proper uniformity within the batch, typically without requiring control over “second- and third-order” parameters such as flow rate and response-time-to-setpoint.
Product News Product News
Industry Forum New tools needed for improving cost-of-ownership
In its listing of the Top Technical Challenges facing the industry in 2006, Sematech recently included several aspects of metrology and fault detection.
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ITRS-SPECIAL-REPORT
Emerging Devices CMOS future involves new materials and devices
The relentless scaling of CMOS, having paced the microelectronics industry at the speed of Moore’s Law for the past 30 years, is rapidly approaching fundamental limits imposed by discrete atomic dimensions of critical materials and the quantum effects in conventional MOSFET structures.
Emerging Materials Roadmap requirements for emerging materials
A significant section of the ITRS is written by the Starting Materials sub-Technology Working Group.
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FEATURES
Materials Building engineered substrates for GaN HEMT applications
Compound semiconductors such as gallium arsenide (GaAs) and indium phosphide (InP) are key materials in high-frequency and optoelectronic devices.
Metrology Improving statistical validity with Macro CD-SEM imaging
A new image processing technology being added to current-generation CD-SEMs allows CD measurements to be made from multiple features from the same SEM image.
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ASIA-PACIFIC
Korea Using the same line for processing Cu and Al
Aluminum has served as an excellent interconnect metal for 40 years, but its limitations become evident at chip geometries in the sub-0.18μm range.
China Singapore How the road to Singapore accelerated manufacturing in China
With China offering the semiconductor industry new levels of manufacturing cost efficiencies and strong domestic market growth opportunities, many integrated device manufacturers (IDM), material suppliers, and chip-packaging equipment companies are moving operations to the Chinese mainland at unprecedented rates.
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