Table of Contents
Solid State Technology
Year 2007
Issue 9
 | DEPARTMENTS
Editorial
450mm wafers: How to scratch that seven-year itch
Every seven years or so the semiconductor industry shifts to a larger wafer size.
World News
BUSINESS TRENDS
Tech News
Technology news
Contamination Control
Enabling yield in automated material handling systems
The future of the semiconductor industry will depend on the ability of companies to introduce new solutions that improve fab productivity and maximize the return on investment in existing wafer fabs.
Emerging Technology
Silicon remains a contender in flexible electronics
As discussed in “High interest in low-end printable electronics” (SST, July 07, p. 34), a number of flexible electronics researchers are focusing on organic semiconductors, and in particular on ink-jet and other printing technologies.
Products
PRODUCT NEWS
Industry Forum
Enabling yield at 45nm: Managing process variability
With the industry moving toward manufacturing at the 45nm half-pitch, new strategies that go beyond the Bossung curve, first introduced in 1977, are required to ensure manufacturability.
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FEATURES
Cover Article
Step-and-flash imprint lithography for patterning interconnect dielectrics
Nanoimprint lithography provides sub-5nm patterning resolution and may replace photolithography in semiconductor device manufacturing.
Gate Stack Engineering
Strain-enhanced scaling of HK+MG CMOSFETs
As CMOS devices scale down below L = 100nm, improvements in performance deviate from conventional scaling rules mainly because of carrier velocity saturation and limited gate oxide scaling.
Resists
Creating 193nm immersion resists with embedded top barriers
Immersion technology helps extend the capability of ArF (193nm wavelength) photoresist to 45nm and smaller nodes by increasing the refractive index (n) of the medium between the photoresist and the projection lens, effectively increasing the numerical aperture (NA) and resolution of the optical system.
Dfm
Addressable array technology for systematic yield monitoring at 65nm
Random yield loss is caused predominantly by process- and equipment-generated particulates, which are monitored in the fab using inline defect-inspection tools.
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ATTENDEES-CHOICE-AWARDS
Attendees Choose Lsquobe
Attendees choose ‘best-in-show’ products
Solid State Technology and sister magazine Advanced Packaging have named the winners of the fifth annual Attendees’ Choice Awards competition at SEMICON West 2007.
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SUPPLEMENT
The Great Race Flash Vs
The great race: Flash vs. magnetic storage
Probably one of the most exciting technology races of all time is now underway, and all of us will benefit from the super efforts of both contenders.
What Challenges Remain T
What challenges remain to achieve heat-assisted magnetic recording?
Magnetic recording technology in HDDs has advanced remarkably since the invention of this computer peripheral device in 1956.
Will The Hdd Market Be S
Will the HDD market be swept by hybrid hard drives?
Suddenly PC purchasers have four choices when buying mass storage for their PC: standard hard-disk drive (HDD), a hybrid HDD, a solid-state drive (SSD), and Intel’s new Turbo Memory, combined with either.
Fab Wide Process Control
Fab-wide process control needed for reduced disk drive magnetic spacing
Even as areal data densities grow toward 350 Gb/in2 by 2009, the magnetic hard-disk drive remains predominantly a mechanical device.
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