Issue



Table of Contents

Solid State Technology

Year 2004
Issue 5

DEPARTMENTS

Editorial


How can companies foster innovation?

Corporate executives load up on stock options, especially in high-tech companies, hoping that future sales of their companies' products — or the company itself — will make them super rich.


World News


World News


Tech News


Technology News


Feol


Creating a better mass flow meter

The mass flow meter (MFM), in its current design, is good but has limitations — especially as process requirements change.


Flat Panel Displays


A vacuum roll-to-roll process for manufacturing OLEDs

There is a transformation brewing in the world of flat-panel displays driven by a new solid-state device called organic light-emitting diode (OLED).


Product News


Product News


People


People


Perspectives


High-k gate deposition: ALD or CVD?

Solid State Technology asked executives to comment on the advantages and disadvantages of ALD vs. CVD techniques for gate dielectrics.


FEATURES

Cover Article


USJ formation: Annealing beyond 90nm

The formation of ultrashallow junctions (USJ) poses major challenges as device technology approaches the 65nm node.


Lithography


Early results show much promise for immersion

In the past year, a great deal of hope has been placed on immersion lithography technology to extend 193nm optical wavelength step-and-scan systems beyond 65nm processes for IC manufacturing.


Implantation


USJ and strained-Si formation using infusion doping and deposition

Infusion doping is a new technique for doping silicon with a gas-cluster ion beam source.


Contamination Control


Haze control: Reticle/environment interactions at 193nm

Until recently, the sole measure of a reticle's cleanliness prior to use was inspection.


Deposition


HfxAlyOz ALD used to fabricate MIM capacitors

Alternative dielectric materials that would replace silicon dioxide for applications such as gate-dielectric transistor and integrated passive metal-insulator-metal (MIM) capacitors have to pass the stringent and complex requirements of each application.