Table of Contents
Solid State Technology
Year 2004
Issue 2
 | DEPARTMENTS
Editorial
The excellent adventure continues
Creating the foundation for the tools of the Information Age has never been easy, but as the semiconductor industry aims to cross the threshold of billion-transistor chips with features well under 100nm, the challenges grow ever more formidable.
World News
World News
Tech News
Technology News
Conference Report Iedm 0
Conference Report IEDM '03: Production-ready solutions and way-out ideas
Washington, DC, buzzed with clever process tricks, novel device structures, and some potential disruptive technologies for the future at the IEEE's International Electron Device Meeting, held Dec. 8–10.
Feol
Enabling next-generation ICs with photonics tools
Reduction in feature size drives a reduction in the source wavelength as well as an increase in the required illumination uniformity and overall source stability, tighter overlay conditions, and more critical inspection stations.
Advanced Device Applicat
Advanced device applications using single-wafer epitaxy
The enabling capabilities of single-wafer epitaxial technology have quickly emerged since its introduction in the late 1980s.
Perspectives
An uncertain future for EUVL
Solid State Technology asked industry experts to comment on the future status of EUV lithography.
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FEATURES
Cover Article
Today's binary and EAPSMs need advanced mask cleaning methods
The increased demands of high-performance photomasks required for lithography advancement have brought with them a need to tweak and update the various aspects of mask processing.
Automation Robotics
Controlling the margins in 300mm manufacturing
Semiconductor companies converting to 300mm manufacturing will need to implement advanced process control to keep capital investment and operating costs low while maximizing the value of each wafer.
Lithography
S-FIL for sub-80nm contact hole patterning
Reliable printing of sub-80nm contact holes is a challenge that manufacturers of state-of-the-art DRAM and MPU devices must overcome within the next few years.
Metrology
High-frequency capacitance measurements monitor EOT of thin gate dielectrics
Increasing measurement frequency and using a vector network analyzer permits accurate EOT measurements at thicknesses ????0.9nm, aiding the move to smaller device dimensions and thinner gate oxides.
Advanced Process Control
Capabilities and lessons from 10 years of APC success
The current vision for semiconductor manufacturing is that wafer fabs will increasingly use advanced process control — an automated form of tweaking processing on the fly.
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PRODUCTS
Product News.html
Product News
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ASIA-PACIFIC-SUPPLEMENT
Departments
News
Departments
News Briefs
Departments
Conference Preview: Semicon China, Shanghai
Semicon China will be held March 17???19 at the Shanghai New International Expo Centre in Shanghai.
Departments
People
Departments
News from Semicon Japan
Signs of recovery abounded at Semicon Japan, held in December.
Features
Providing outsourced assembly and test in China
The market drivers for assembly and test manufacturing in China start with the region's strong economic growth: the GDP expands about 8% per year.
Features
China is catching up to leading-edge technology
Foundries are developing manufacturing technologies that will allow second-generation products to transition to China, further speeding the rise of semiconductor manufacturing there.
Features
A learning laboratory for China's next generation of talent
With several indigenous companies producing integrated circuits (ICs) to serve the emerging domestic and international consumer-electronics markets, the People's Republic of China (PRC) is fast becoming a semiconductor-manufacturing hub.
Features
The shift to Asia: Cause for concern in the US?
The shift of IC manufacturing to Asia — always an issue — has cropped up recently as a growing concern.
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