Issue

China is on the verge of becoming the world’s largest consumer of semiconductor products, but several dark sides of this economic boom exist, and most have been examined in detail.

Selete has developed methodology for reducing chemical and mechanical damage to ultralow-k films.

Significant improvements in the mid-1990s, including advances in ion source technology and the introduction of reduced path-length beamlines, enabled production-worthy beam currents as low as the 5-10keV range of energies.

Solid State Technology asked industry experts to discuss ramifications and issues concerning ULK dielectrics development.

One of the main challenges of 65nm and 45nm Cu/low-k interconnect integration is the development of processes to accommodate low-k dielectrics with k = 2.

Optical critical-dimension (OCD) metrology or “scatterometry” has experienced rapid growth in sub-0.1µm wafer processes for both CD measurements and line profiling.

In semiconductor processing, the final yield is often a result of intensive interactions between process recipe parameters and manufacturing tool health.

The intriguing concept of ultrasmall, autonomous, intelligent computing devices for wireless sensor networks could open up a wide range of applications, from human-health monitoring to highly distributed tiny systems for safety and environmental data collection.

Optical and electron-beam maskwriters using raster-scanning beams have been workhorses in the semiconductor industry for a long time.