Issue

Conditions have never been better for a surge in innovative chip-based products, perhaps even whole new industry categories.

The industry is seeing a gradual migration from standard silicon (Si) substrates to engineered substrates [1, 2].

Solid State Technology asked industry experts to comment on the proliferation of metrology tools and what, if anything, can be done to mitigate the drawbacks.

Next-generation scaling is translating into more exacting specifications for many processes in semiconductor manufacture.

It is likely the 45nm technology node will see the introduction of new materials and integration schemes.

The selection of high-vacuum gauge technologies for measurements in pressure-dependent semiconductor processes can affect overall cost and manufacturing yields depending on the application and the environment in tool chambers.

Ultraviolet-assisted thermal processing (UVTP) is emerging as a viable film-modification technology for advanced dielectric applications.

Advances in nanoimprint lithography (NIL) are being employed to introduce new manufacturing processes for next-generation thin-film disks, which use patterned substrates for land-and-groove structures that magnetically isolate individual data tracks.

April 11-15, Munich, Germany

Semicon Europa showcases semiconductor equipment, materials, and services in Europe.