Table of Contents
Solid State Technology
Year 2002
Issue 10
 | DEPARTMENTS
Editorial
Chipmakers still seek an edge in fabrication technology
Is all chip manufacturing going to be done in foundries a few years from now? Is there no longer any competitive advantage in chipmaking skills?
World News
N.A. tool bookings drop, billings rise in July
North American toolmakers posted $1.15 billion in orders in July and a book-to-bill ratio of 1.16, according to Semiconductor Equipment and Materials International (Semi).
Tech News
FSI Lithography Breakfast: CD control, throughput, cost
The 9th annual Lithography Breakfast forum sponsored by FSI highlighted the three key issues in production lithography today: CD control, throughput and cost.
Market Watch
Chinese foundries: How much global impact?
After many years of development, the foundry industry in China is growing explosively, with multiple 200mm fabs expected to commence production in 2002 and 2003.
Product News
Integrated ALD/PVD Cu barrier/seed system
This integrated atomic layer deposition/physical vapor deposition (ALD/PVD) product, the Endura iCuB/S Integrated Cu Barrier/Seed system,
Industry Insights
Moore's Law: Recognizing the major contributions of
The success of the semiconductor industry in printing ever-finer features is frequently seen as only a triumph of hardware engineers.
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FEATURES
Ion Implantation
Angle control in high-current ion implanters
The successful fabrication of advanced devices requires maximum reproducibility in the placement of the dopant profile in the silicon.
Etch
Integrating dielectric etching with 193nm resists
Integrating 193nm photoresists is considered to be one of the biggest challenges faced by the etch community.
Metrology
Developing metrology for controlling Cu-electroplating additives
Plating electrolyte for copper (Cu) processing is usually based on either copper sulfate or sulfonic acid [1].
Vacuum Technology
Effect of aggressive gases on capacitance manometers
On an Inconel-diaphragm manometer, all joints are welded without using brazing alloy or lead glass solders (Fig. 1) [1].
Deposition
Using I-PVD for copper-based interconnects
The technology in integrated devices has been changing from conventional Al to Cu metallization.
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