Issue

The dot.com bubble gave technology a bad name. Investors all over the world, but particularly in the US, poured money down what turned out to be a huge black hole.

Your January editorial, "The rocky road to 300mm automated factories," hit the nail on the head with respect to the struggles that the semiconductor industry faces for its data management, consolidation, analysis, and control needs.

January chip sales, tool orders down

Future photolithography applications demand that light sources generate narrower and more stable spectral bandwidths to pattern finer chip features.

Researchers at Infineon Technologies in Munich, Germany, in cooperation with the Max Planck Institute of Biochemistry, have directly connected a new biosensor IC to living nerve cells in snail brains.

Copper interconnects combined with low-k dielectrics pose lithography challenges due to material incompatibilities and large aspect-ratio structures.

Rinsing is a ubiquitous step in wet chemistry wafer cleaning. It affects many aspects of wafer processing, including process performance, cycle time, footprint, and water consumption.

Today, most package proliferation can be attributed to technical and cost demands placed on the package by device and system engineers.

Increasingly, it is a challenge to manage the large volumes of data being captured and stored inside a fab's manufacturing execution software (MES) database.

Mask data preparation has been identified as a severe bottleneck and data volumes are more than doubling each year as the industry pursues the ITRS roadmap.

The pursuit of Moore's Law has been the driving force in the semiconductor industry since the law's formulation in 1965.The pursuit of Moore's Law has been the driving force in the semiconductor industry since the law's formulation in 1965.

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