Table of Contents
Solid State Technology
Year 2003 Issue 1
| DEPARTMENTS
Editorial The rocky road to 300mm automated factories
We've all seen the commercial with the greasy mechanic warning: "You can pay me now, or you can pay me laterU."
Letters Monkeyshines
I enjoyed your November editorial "What will get the monkey off our back?"
World News Chip sales rise, equipment orders still down in October
Chip sales were up month-to-month and year-to-year in October, sign of a healthy industry recovery, according to the Semiconductor Industry Association (SIA), San Jose, CA.
Tech News One nano step toward efficient LED lighting
Engineers at Kopin Corp. (Taunton, MA) are using nanotechnology (patent pending as NanoPockets) to produce "CyberLites" — blue light-emitting diodes (LEDs) smaller than a grain of sand (Fig. 1).
Feol Favorable results without wet chemicals in dry FEOL resist strip-clean
Engineers from LSI Logic, Gresham, OR, and Ulvac Technologies, Methuen, MA, have developed a production process eliminating sulfuric-acid hydrogen-peroxide wet cleans for post high-dose ion implantation.
Interconnect Why we need to rethink copper low-k reliability issues
With the introduction of copper and low-k dielectric interconnects for advanced ICs, the semiconductor industry faces tremendous new challenges because reliability performance and failure mechanisms are not well understood (see figure).
Calendar Calendar
Product News Product News
Perspectives.html Perspectives
SST editors ask ITRS authors about tough roadmap problems
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FEATURES
Ald Special Report Where ALD Special Report: Where's the metal?
ALD promises an exceptionally clean process technology at low temperature that could provide conformal and uniform coatings with extendibility to several nodes — for at least 10 years or more according to some (see table on p. 36 and "The market outlook" on p. 38).
High K Gate Dielectric A High-k gate dielectric applications using ALD Hf-based oxides
The major issue and fundamental limitation for further scaling of the gate dielectric is the tunneling current's exponential increase due to the reduction in thickness.
Thermal Processing Accurate measurements in the DUV PEB process
The chemically amplified resists employed at the 130–70nm technology nodes require post-exposure bake (PEB) steps where the photo-acid catalyst generated by the exposure renders the resist soluble in a developer solution.
Deposition SPA plasma for sub-100nm
Plasma characteristics of a slot plane antenna plasma reactor were investigated — especially the ability of its low electron temperature and high plasma density to achieve damage-free processes.
Automation Robotics OCR strategy for successful 100% single-wafer tracking
Single-wafer tracking in combination with randomizing, which is essential for yield analysis, requires a wafer-ID read at many different process steps.
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