Table of Contents
Solid State Technology
Year 1998
Issue 4
 | DEPARTMENTS
Editorial
Haavind receives Crain Award for
The American Business Press has presented its 1998 Crain Award to Bob Haavind, Solid State Technology`s editor in chief. Bob accepted the award, given "for outstanding career contributions to the development of editorial excellence in the business press," at a ceremony on March 10 in New York City.
Literature
Literature Update
This full-color brochure describes a line of filters available in 3-, 5-, and 11-in. lengths for ultra- high-purity gas filtration requirements. Each housing of the
Tech News
Semi meeting: slow 300-mm plans
IBM announced that it is backing off its 300-mm schedule, and the International 300mm Initiative (I300I) will accelerate equipment demonstrations in 1998, after a slower-than-hoped pace in 1997. The announcement came at a SEMI-sponsored meeting in Burlington, MA.
Tech News
Jet vapor deposition reduces gate leakage
Engineers at Motorola have demonstrated reduction in gate leakage current and strong resistance to boron penetration when jet vapor deposition (JVD) nitride is used as a gate dielectric in an advanced CMOS process. In a paper presented at the recent IEDM meeting, Hsing-Huang Tseng, et al. [1] showed that JVD nitride provides a robust interface and well-behaved bulk properties, MOSFET characteristics, and ring oscillator performance.
Tech News
Patterned wafer defect binning
New tools for patterned-wafer defect inspection may enable the detection of excursions well before a process is out of control. Relying upon databases of defect categories, end-users should be able to more rapidly determine the root causes of problems.
Tech News
Value added from backend drives assembly automation
Today`s semiconductor manufacturing backend is a linear extrapolation of technology in place for 25 years. HC. Scott Kulicke, chairman and CEO of Kulicke & Soffa Industries stated that it has been "predictable progress. We`ve worked hard because, obviously, it is more complex to build a quad flat pack than a dual inline package. But, while today`s factories may be bigger and more efficient, most still run the same old way - discrete lots of a few hundred or a few thousand units carried from stat
Tech News
Laser system personalizes 0.35-um gate array
A newly upgraded laser micromachining system provides rapid personalization of 0.35-?m gate array devices, with improvements of throughput and accuracy.
People
People Update
FSI International Inc., Minneapolis, MN, has named Thomas D. George to its board of directors. He recently retired from Motorola, where he served as president and GM of the Semiconductor Products Group until May 1997. Patricia Hollister has been named CFO and controller. She joined the company in 1995 as corporate controller. Daniel F. Flynn has been appointed CMP business manager for FSI`s Chemical Management Division in Hollister, CA. He was previously with Daniel F. Flynn Dow Chemical Co. in
Services
etch/planarization seminar
This training class is part of a series of courses on advanced wafer processing developed by Integrated Circuit Engineering (ICE) for new and experienced technicians and engineers. Topics to be covered include technology trends; etching chemistries; isotropic vs. anisotropic etch; applications for various etch techniques; the glow discharge process; control of the plasma process; measurement techniques; equipment considerations; process characterization techniques; and SPC applications. The semi
Services
Tubular heater shipment program
This program features quick shipment by a manufacturer for small quantities (1-12 units) of tubular heaters. The equipment can be shipped within 3-6 working days through the Tubular PLUS Program; equipment from other manufacturers requires a 4-6 week waiting period for delivery. In this program, customers may specify the desired heated length, cold length, diameter, heater wattage, voltage, formation, and termination option of a tubular heater. Then, using stocked 0.315-in. or 0.430-in. dia. Inc
Services
The film technology handbook
This book by Aicha Elshabini-Riad and Fred Barlow is a comprehensive resource on the preparation, characterization, and emerging applications of thin film technologies. Featured are extensive new advances in MCMs and the basic principles and applications of thin film deposition techniques. Price: $90 (member), $140 (nonmember). International Microelectronics and Packaging Society and Educational Foundation (IMAPS), Reston, VA; ph 888/464-6277, www.IMAPS.org.
Services
Service support center
This center is designed to provide technical assistance to the customers of a focused ion beam system supplier. The center`s help desk is staffed by trained representatives who assist field service engineers in solving problems. By using a software database that stores common problem-solving scenarios and contains on-line documentation of all of the company`s installed bases, the representatives are able to answer questions and direct field service quickly, with the goal of helping customers in
Services
SIMS profiling
This SIMS depth profiling service is aimed specifically at low-energy implant qualification and thin layered devices. Using impact energies as low as 100 eV, Applied SIMS Profiling offers a depth resolution of better than 1 nm, and can provide this from within 1 nm of the sample surface to more than a micron in depth. This permits accurate dosimetry and profile shape determination on ultrashallow implants as low as 200 eV boron in silicon. Applied SIMS Profiling, Department of Physics, Universit
Services
1998 Semi education catalog
This edition of the SEMI education catalog offers courses on cultural awareness, business marketing, and technology. Specific topics include doing business in Korea, Taiwan, Singapore, Japan, and China; strategic selling and semiconductor account management; competitive marketing strategy; principles of selling; fundamentals of product marketing; semiconductor processing technology; flat panel displays; plasma etching technology, CVD technology; lithography science; and process/device technology
Services
1998 MRS catalog
This catalog provides a listing of books, videotapes, journals, and periodicals available through the Materials Research Society (MRS). Topics in electronic materials and processing include beam processing; graphite; multilayered structures; plasma and plasma processing; semiconductors; superconductors; and thin films and interfaces. Featured publications include the MRS Internet Journal of Nitride Semiconductor Research, a peer-reviewed, archival, electronic journal that features technical pape
Services
IC manufacturers reference
This publication titled Strategic Reviews provides detailed profiles of approximately 200 IC manufacturers and suppliers. Each company review features an account of key management personnel, financial performance, fab facility data (e.g., wafer size used, capacity, feature size, etc.), supplied IC products , strategic alliances, and significant IC product and facility announcements. The volume will be available for release this month, ensuring inclusion of 1997 year-end financial data. Price: $1
Product News
Diesorting and tape/reel output
The DS-7000 T/R features high-speed multisorting capability via wafer mapping or ink dot recognition. An intelligent vision system ensures precise wafer and die alignment. Output is to embossed cavity reel-to-reel tape or sticky-back tape. The standard tape and reel output system can accommodate 8- to 32-mm tapes with tool-less changeover, and offers switch-
Product News
Plasma chip carrier cleaner
n this chip carrier cleaning process, the carriers stay in the magazines for cleaning. Just one cleaning step is required after die bonding because the plasma process has a long-term effect. After cleaning, cost-saving handling of the carriers in air is usual. In addition to higher yield in wire bonding and molding, the system offers several advantages: no sputtering and redeposition; no electronic damage to sensitive chips; no damage to plastic chip carrier material and polyimide; and automat
Product News
Closed ion source gas analyzers
Model C230 high-output, low differential pressure transmitter, designed for wet/wet differential pressure measurements of gases and liquids, has been enhanced to offer pressure ranges from 0-1 psid to 0-100 psid with gases or liquids on both sides. The transmitter contains a fast-response capacitance sensor and an ASIC-based signal conditioning circuit, necessary to provide an accurate linear analog output proportional to pressure. Responding to pressure changes some 20 times faster than convent
Product News
Differential pressure transmitter
This company`s hazardous and toxic gas monitors now interface with Sierra Monitor`s Model 8000 communications bridge, a link that eliminates the need for expensive hardwire interfaces. The bridge reduces setup to monitor for a new gas to a simple software change by converting monitor data to common PLC protocols used throughout the fab. The standard monitor relays can be wired simultaneously with the bridge connections, allowing either signal to trip an automatic shutdown, warn, or alarm. TeloSe
Product News
Toxic gas monitoring
Mass-Trak measures and controls gas mass flow rates at low cost, in analytical, laboratory, and OEM instrument applications. Its on-board display and local setpoint potentiometer allow for adjustment of the command signal from the face of the instrument enclosure and eliminate the need for external readout/setpoint electronics. The instrument also offers a switch-selectable remote setpoint capability from either a 4-20 mA, 0-5 Vdc, or 0-10 Vdc command signal, which can be easily interfaced with
Product News
Mass flow controller
The CIS series closed ion gas analyzers offer better than 1 ppm detection limit for all gases and direct sampling at mtorr pressure. A real-time Windows software package is provided for on-line process monitoring and control, gas purity verification, residual gas analysis, and leak checking applications. The systems have a mass range up to 300 amu, complete programmability, and multiple head operation. Stanford Research Systems Inc., Sunnyvale, CA; ph 408/744-9040, fax 408/744-9049.
Product News
FTIR thin-film in situ monitor
IRon-Line is a compact, robust and fast FTIR spectroscopic reflectometer for rapid, in situ, and real-time measurement of thin-film sample properties. It delivers information on evolving sample properties, such as doping concentration, film thickness, composition, and molecular bond density. The system is designed to be mounted on a process chamber (CVD, MBE, plasma, etc.) equipped with normal or oblique ports, and provides polarized or nonpolarized measuring modes. The monitor consists of an op
Product News
RGA process monitoring
The Vision 1000-P RGA process monitor, which consists of a compact Smart Head RGA with a PVD ion source and close coupled inlet, provides a simple go/no go display. Fault conditions or deviations from a "normal" event generate screen messages explaining the deviation and the likely cause and solution. A key element of the system is Process Eye software, a process control package that lets the engineer characterize known good profiles of baseline and process conditions, for ongoing reference. Pro
Product News
Furnace series
NOBLE wafer-processing furnaces consist of three series. (Single or multiple stacks are available for all diffusion and LPCVD applications.) The IPS Series 26 is a complete furnace processing system with an automated loading bay, gas controls, and process chamber. It provides full dimensioning and specifications for processing wafers from 50 to 150 mm. Series 812 provides small-batch processing for 200- and 300-mm wafers in a fully integrated, small-footprint package. The BT (bench top) furnace
Product News
CO2 snow precision cleaning
The Eco-Snow "dry" cleaning process, with applications ranging from semicon-ductors to FPDs and disk drive media,uses liquid CO2 to remove submicron particulates, thin organic films, and photoresist residues. The liquid is expanded through special nozzles to generate a fast-moving stream of "snow flakes" and carbon dioxide gas. The snow flake impact momentum transfer dislodges particulates, which are then swept away in the gas stream. The system removes photoresist residues and microscopic veils
Product News
Endpoint control for CMP tools
OPTIMA 9300 is designed for real-time, in situ, nonintrusive, layer-independent endpoint control for oxide, STI, and metal semiconductor layers for CMP tools. It incorporates dynamic signal process techniques to compensate for drift and noisy signal conditions, and it can capture data from nonintrusive current sensors that are easily mounted. The 9300 can be integrated easily with current CMP tools and can detect endpoint on eight polishing heads. It includes a user-friendly touchscreen, Windows
Product News
Residue removal buffer
This new option for the PEP Package Solution, which was developed for the strict requirements of critical post-etch residue removal and photoresist removal process steps, is designed for =0.25-?m geometries. The Queue is a buffer station that allows a total of six cassettes to be staged onto the PEP for more than one hour of continuous, steady-state processing. Each of the cassettes can be independently programmed for resist removal or resist removal and post-etch residue removal
Product News
CMP slurry system
The MEGAjet mixing system is designed for correct blending of slurries that are challenging to dispense while maintaining a uniform suspension of the abrasive. Inside the tank, patterned flows are created without mechanical mixing to move the slurry from top to bottom and in a circular motion, creating a cleaning action on the tank walls and reducing the chance of buildup. MEGAjet`s style of mixing eliminates such problems as contamination, air infiltration, vibrations, and high maintenance. The
Product News
Cold cathode gauge controller
The Series 943 digital controller measures from medium to ultrahigh vacuum pressures. It operates the I-Mag gauge or the series 421 cold cathode gauge with a measurement range of 10-2 to 10-10 torr, and it includes an LED digital readout, two adjustable setpoints with LEDs, high-voltage protection, and analog output. Measurement units available are torr, mbar, or Pascal. The cold cathodes are inverted magnetron sensors, whose design includes an isolated collector, making the sensor less suscepti
Product News
Wafer cleaning systems
Omega2000 and Omega4000 advanced wafer cleaning, rinsing, and drying systems are designed to process very large substrates, including 200- and 300-mm wafers and FPDs, while providing particle reduction at geometries =0.25 ?m. The 2000 reduces metal contamination and surface roughness, and eliminates water staining and water spots through use of the CleanPOINT water-cleaning system, which uses electrostatically charged filters to provide ultrapure DI water and remove microscopic particles. The tw
Product News
Recirculating cooler
The benchtop RS33LT recirculating cooler offers a range of temperatures from -40 to 75?C, stable temperature control to ?0.1?C, and an RS232 computer interface. It will recirculate most industry standard fluids and is suitable for semiconductor equipment, lasers, electron microscopes, and many other applications. FTS Systems Inc., Stone Ridge, NY; ph 800/824-0400, fax 914/687-7481, www.ftssystems.com.
Product News
Peltier cooled assemblies
This new series of 2508-T8 assemblies includes a bead-type thermistor (2.2 kW) and a thermoelectric cooler (MC-series) mounted on a TO-8 (TO-5) header. At an active heat load of 0.1 Wt, it provides a cooling object temperature of -30?C. The cooler can be adjusted to customer specifications. The series is suited to semiconductor detectors, CCDs, diode lasers, and other optoelectronic components. For the design of x-ray semiconductor detectors, the series is supplied with a cap containing a 13- or
Product News
200-nm process tank
This 200-mm process tank is injection-molded from very high-purity material; single and dual capacity tanks are available. Features include a smooth surface finish that is nonabrasive and easy to clean; strong and seamless construction; and PFA, PVDF, or polypropylene material options. It joins a line consisting of 75-, 100-, 125-, and 150-mm injection-molded tanks. Fluoroware Inc., Chaska, MN; ph 612/448-8193, fax 612/368-4078.
Product News
SMIF wafer sorter
The MVT 7080 SMIF wafer sorter quickly and safely sorts, splits, merges, or randomizes 75- to 200-mm-wafer lots at rates up to 300 wafers/hour. The system features: a four-axis robotic handler with an integrated laser mapping system and a dual-paddle design for high throughput; a high-speed aligner and integrated wafer ID reader with advanced illumination for accurate and repeatable optical character recognition; a state-of-the-art SMIF enclosure and particle filtration (=0.128 ?m, =1/wafer); a
Product News
Surface profiler
The WYKO SP3000 surface profiler expedites process control of large-format samples with accurate, noncontact 3-D data. Designed to enhance yield and improve in-line process monitoring of flip-chip packaging, the gauge-capable profiler enables users to control critical dimensions and determine the electrical/mechanical performance and reliability of advanced packaging substrates. Combining vertical scanning interference microscopy with proven, extensive analysis software, the system measures surf
Eurofocus
Fab for lease
In a joint effort, engineering and construction firm Meissner + Wurst and the Flanders foreign investment office (FFIO) are planning to build a $1.5 billion chipmaking complex in the northern Belgian province of Limburg, with a view to leasing the facility to one or more chipmakers. Roger De Keersmaecker, director of FFIO`s IC project, said that talks are under way with various chipmaking firms interested in the leasing proposal, but no official technology partner has yet signed up. The prelimin
Eurofocus
Semi in russia
This summer, Semiconductor Equipment and Materials International (SEMI) will again host the Commonwealth of Independent States (CIS) Executive Mission and Exhibit. This mission, running June 1-4, will bring together leaders from the semiconductor equipment and materials industry and leaders of local government and companies in the CIS to exchange ideas on the development of high technology.
Eurofocus
Applied materials to equip dresden fab
Semiconductor 300, the recently announced Siemens-Motorola 300-mm fab in Dresden, Germany, has placed a large, multi-technology order with Applied Materials, the semiconductor equipment supplier based in Santa Clara, CA. The order, expected to begin shipping early in 1998, includes a number of plasma etch, chemical vapor deposition, physical vapor deposition, and high-temperature film products, as well as wafer inspection equipment and critical dimension scanning electron microscopes.
Asiafocus
Asian Capital spending cuts seen
The Asian financial crisis is evolving on several fronts, with semiconductor capital spending plans in South Korea and Japan coming under heavy pressure even as stock markets in the two nations start to show signs of life.
Asiafocus
Llucent and chartered from joint venture in singapore
Lucent Technologies Microelectronics Pte. Ltd. and Chartered Semiconductor Manufacturing Ltd. have formed wafer manufacturing company Silicon Manufacturing Partners Pte. Ltd., a $1 billion joint venture in Singapore. Lucent owns 51%of the venture, with Chartered owning 49%.
Asiafocus
Japans 300-mm Plans evolve
The advent of 300-mm wafers in Japan hit hard. Toshiba announced that it will postpone construction of its 150 billion yen fab in Oita, Kyushu, until 2000. NEC is still planning a 300-mm wafer pilot production line in Sagamihara, Kanagawa Prefecture, though sources within the chip giant suggested that high 300-mm equipment costs are dampening the firm`s enthusiasm for the larger substrates. Fujitsu has reportedly also delayed by a year or more the advent of its 300-mm line, and (according to the
Asiafocus
daewoo and SGS-Thompson open design center
Daewoo Electronics, Seoul, South Korea, and SGS-THOMSON Microelectronics, Paris, France, have agreed to establish a joint design center company in Seoul. The center will be used to develop ICs for existing consumer electronics applications and future products for digital and high definition TV, digital VCR and DVD, telecommunications, computer, and other products. The center will be staffed initially by 20 people, and when fully operational, will have 60 design engineers.
World News
worldwide highlights
Worldwide semiconductor sales took a hit in December, dropping 5.2% on a month-to-month basis to $11.48 billion, from $12.11 billion in November, with all of the world`s regional markets showing declines (see table). The figures come from the Semiconductor Industry Association World Semiconductor Trade Statistics monthly Global Sales Report. The month-to-month decline is the first significant drop in the sales indicator since February 1997. Sales since then have been either flat or increasing mo
World News
USA
Veeco Instruments has agreed in principle to acquire Digital Instruments Inc., a Santa Barbara, CA, producer of scanning probe microscopes and atomic force microscopes. The deal is for 5.5 million shares of Veeco common stock, worth about $162 million. Digital`s existing management and technical staff will remain in place, with Veeco Process Metrology Group head Dave Perloff having oversight of the 120-employee wholly owned subsidiary. Digital Instruments had been under agreement to be acquired
World News
Japan
Fujitsu and Sony will share the costs of a new 100 billion yen ($787 million), 18-nm system LSI fabrication line to be built at Fujitsu`s Mie Plant, Mie Prefecture, near Nagoya. The facility is scheduled to begin operations in the fall of 1999. Under the deal, Fujitsu will provide Sony with an 18-nm manufacturing process for use on system LSI devices. The firms will establish a cooperative environment for design of 18-nm generation circuits, and will share a basic cell library. Costs of the fab
World News
Asia Pacific
LG Semicon has entered a co-development project with Pohang University for its x-ray litho development program. The company completed the X-Ray Lithography Center in 1995, and thus far has invested 12 billion won (made when the won was trading at 900 to the dollar or less) in the university overall. A spokesperson for LG said, "The current economic turmoil has not affected the center at all as R&D is moving ahead at full steam." Last year, work at the center led to LG `s development of 12-nm des
World News
Europe
Solid State Measurements Inc., Pittsburgh, PA, a designer and manufacturer of electrical testing equipment for the semiconductor industry, has formed SSM GmbH, a wholly owned subsidiary in Dresden, Germany. SSM will provide application, sales, and service support to customers throughout Europe.
Market Watch
Test structure design: An opportunity for fab outsourcing
Fabs are becoming more comfortable with collaboration in certain, isolated areas, such as the growing field of test structure design. This field has evolved to become an essential tool for process engineers. Test structures are used to measure key performance characteristics of semiconductors, in turn driving processing improvements that result in yield and product performance improvements.
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