Issue

The product spotlight is an exhibition of innovative equipment and tools to be presented at the show.

Migrating to low-k dielectrics for interconnects will dramatically alter CMP requirements, even when the new material is buried in a stack.

The industry has made significant moves toward commercializing scattering with angular limitation projection electron-beam lithography, one of International Sematech's next-generation lithography methods funded in 1999.

The clever combination of several new process technologies allows for interconnect formation using one-third of the steps needed by conventional methods.

Improvements in ozone generation and the use of additives that prevent early decomposition of ozone have facilitated ozonated DI water resist stripping and surface cleaning of metallized wafers

Software analysis enables optimization of wire-bonder capillary selection, leading to improved wire bond quality and stronger bonds, particular for <100um pad pitches or applications at reduced temperatures.

The process control achieved by a susceptor-based RTP tool improves the process window for cobalt silicide formation.

Two new approaches for sputter depostion of uniform low-stress chromium involve post-eposition film treatment by RF Plasma and a multistep process that alternates depostion and surface plasma and a multistep process that alternates deposition and surface plasma treatment.

Automated individual wafer tracking can eliminate misprocession and lower material costs by detection and correction wafer-handling errors, and can check test wafer contamination levels. Both processes provide manufacturing cost savings.

Appropriate standards are necessary to deliver products and services efficiently to a global market. While traditional standards bodies have served the industry well in the past, new mechanisms for setting some standards are being forged to keep pace with today's rapidly changing technology.

TEOS LPCVD processes tend to clog the vacuum pumping foreline with effluent byproducts that can increase particle levels, impede gas flow, and cause catastrophic pump failure.

Over its first half century, the semiconductor industry has gone through constant change. Now it is moving toward perhaps the most dramatic shift of all -- toward system-on-a chip (SOC).

300mm plans from Intel, TSMC; SIA, SEMI market numbers; acquisitions by Applied, BOC Edwards and more.

Wafer-level CSPs; TSMC's 300mm fab; SID'99 report; 157nm activities; and more

Taiwan's Wafer Work seeks niche in smaller wafers; SubMicron sets up Singapore-based subsidiary

Although a majority of industry observers are predicting rapid growth in microelectromechanical systems (MEMS) sales over the next five years, well-established MEMS product lines - airbag accelerometers, automotive engine manifold absolute pressure sensors, blood pressure sensors, and thermal inkjet printer heads - are expected to grow only moderately, due to high levels of market penetration.

Philips Semiconductors, Eindhoven, The Netherlands, has named Rick Goeld senior VP of the company's MultiMarket Products business unit, based in Sunnyvale, CA. Prior to joining Philips, Goeld was VP of strategic business research at Motorola Semiconductor.

The Marseille-Provence region in France has become the home of a number of microelectronics companies during the past 10 years. Together they account for more than 25% of France's semiconductor production.