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Table of Contents Solid State Technology Year 1997 Issue 12	FEATURES Industry Insights Environmental responsibility and sustainable development This is an edited version of Mr. Pistorio`s presentation to the 4th International Safety & Health conference of the Semiconductor Industry on June 24, 1997. Feature Products Epoxy die attach system The EasyLine 8002 epoxy die attach system features a new leadframe feeding and indexing system that makes possible a machine layout (for wafers up to 200 mm) with a footprint of 1 m2. Air bearing technology allows UPH of up to 6500, with high accuracy and no wear. The die place position in the y axis is freely programmable in a large range, avoiding the need for movement of the leadframe in the indexer. The bondhead module features linear motor technology for up/down movement of the pick tool an Feature Products Transparent film metrology SpectraLASER 300 XL is a 300-mm transparent film metrology tool that employs multidomain production ellipsometry (Multi-Domain PE), which capitalizes on both multiple angle of incidence and multiple wavelength data to characterize 300-mm wafer processes and monitor them on a routine basis. Multi-Domain PE, with UV reflectance, provides the analytical capabilities of research-grade spectroscopic ellipsometry, the accuracy of laser ellipsometry, and the throughput and spot size required for produc Feature Products FIB/SEM workstation The DualBeam XL830 FIB/SEM workstation`s SEM column provides 3-nm resolution from 1-30 kV. The new electron column offers balanced-field, in-lens detection to give good topographical detail, down-hole visibility, and enhanced grain boundary imaging. Rapid FIB milling for cross-sectioning, and imaging with the SEM at very high resolution are completely simultaneous operations. The Predictive User Interface keeps the sub-?m defect in the field of view during various operations and while viewing fr

DEPARTMENTS Market Watch Semiconductor Industry Association Roadmap: Blueprint for tomorrow Solid State Technology spoke with Owen P. Williams, chairman of SEMATECH`s Roadmap Coordinating Group, about the Semiconductor Manufacturing Roadmap published last month by the Semiconductor Industry Association. World News Worldwide highlights Equipment and chip book-to-bills healthy. Orders for both capital equipment and chips show month-to-month improvement. Orders for semiconductor equipment at North American companies rose again in September to $1.747 billion, with shipments also climbing to $1.633 billion, according to preliminary figures released by SEMI. The resulting book-to-bill ratio for the month was 1.07, dipping from August`s revised ratio of 1.09. This is the seventh consecutive monthly increase in equipment bookings sin World News USA In a move that will boost its optical capabilities, Silicon Valley Group (SVG), San Jose, CA, is planning to acquire precision optics manufacturer Tinsley Laboratories Inc. in a stock pooling worth about $39.5 million at recent share prices. Under the proposed agreement, SVG will acquire Tinsley`s facilities, including operations in Richmond and North Hollywood, CA. Pending regulatory and stockholder approval, Tinsley - a public company with 1996 revenues of $17.4 million - will be operated as a World News Japan Sales of Japan-produced silicon were down during the first half of calendar 1997, but will pick up during the rest of the year, according to the Japan Society of New Metals (JSNM). JSNM has been forced to revise its current-year sales forecast downward. Epi wafer sales are rising smartly, and the group also reports that silicon vendors in Japan had a fine year for the period ending in March 1997, despite the shipment downturn. The JSNM figures show unit shipments from the organization`s nine mem World News Asia/Pacific Taiwan chipmaker Mosel Vitelic has begun work on its NT$200 billion ($6.9 billion) plan to build two 300-mm fabs and four packaging/testing facilities in the Tainan Science-based Industrial Park. Mosel has established a joint venture agreement with Siliconware Precision Co. to build the packaging and test facilities. The entire project, which includes plans to build R&D facilities and dormitories, is expected to take seven years to complete. Together, the new fabs are expected to have capacity o World News Europe Under a new contract, Siemens Semiconductor, Munich, will deliver 50% of its DRAM output from its newly opened North Tyneside, England, plant to Mosel-Vitelic, Taipei. The agreement, to be carried out over a 10-year period, is based on a monthly manufacturing capacity of 20,000, 200-mm wafers. Deliveries began with 16-Mbit DRAMs, and next year will be switched to 0.25-?m-based 64-Mbit products. The deal also includes test and assembly licensing. Product News Thin film characterization Iris 200 is a data analysis review station for thin film characterization that simultaneously generates film thickness and n and k spectra (from 190 to 900 nm) from raw ellipsometric data and/or from raw reflectance data. It has an operating system with intuitive GUI software for easy data processing and transfer, and takes only seconds to characterize even multilayer thin film structures. n&k Technology Inc., Santa Clara, CA; ph 408/982-0840, fax 408/982-0252, e-mail [email protected]. Product News Thin film measurement system This low-cost, thin film measurement system, the F20, measures the thickness, refractive index (n), and extinction coefficient (k) of dielectric or semiconductor thin films. Applications include table-top and in situ measurement of optical coatings, plastic films, and semiconductor process-related materials such as resist and oxide layers. The F20 measures virtually any film from 10 nm to 50 ?m in thickness. Film thickness and wavelength-dependent optical constants are determined by analyzing a Product News Noncontact thickness measurement station The ? 9600EC is a compact, stand-alone instrument for precise thickness measurement of fragile, soft, brittle, or polished material. It is simple to operate, does not require any calibration, and provides measurement with an accuracy of ? 1 ?m without contacting the target. Thickness is displayed on a five-digit LED directly on the fixture. The station is insensitive to the target material, has unlimited target thickness range, and needs no recalibration for thickness and/or material variation. Product News Scanning probe microscope The Dimension 3000 SPM has been enhanced to provide easier operation and CE certification. The new Dimension 3100 includes an x-y stage that provides better bidirectional repeatability and speed, as well as improved trackball response. The illuminator is now computer-controlled for easier focusing and zooming for optical location of features for high-resolution scanning. Video image capture capability is also included, as well as more efficient packaging for a reduced footprint. Digital Instrume Product News Deep ultraviolet coating This DUV, high-reflectance coating, #1900, is optimized for 190-195 nm, with good average reflectance throughout the UV and visible to near infrared wavelengths. Reflectance specifications for the coating are =88% reflectance for 190-195 nm and =85% reflectance for 200-600 nm at normal incidence. Applications for #1900 include use in DUV spectroscopic ellipsometry thin film measurement systems. Also available are other enhanced aluminum broadband high-reflectance coatings optimized for wavelengt Product News Chemical pump series The Maxim series high-purity chemical pumps incorporate a removable and interchangeable air logic control base. They contain no metal parts in either the pump or control base, for high-purity, high-temperature applications. All wetted parts are constructed from PTFE or PFA. The removable air logic control base allows for servicing without the need to disconnect the chemical plumbing, and through the use of an interchangeable control base and pump options, the Maxim can be specifically configured Product News Chemical delivery module The ChemFill 1200 series - chemical delivery and purification systems providing mid-range flow rates - uses an application-specific platform that can be configured with one of four delivery engines, and it features advanced particle-removing technologies. Two models in the series are available: the ChemFill 1210 module dispenses chemical via pressure-vacuum vessels; ChemFill 1230 features pump pulse-dampener technology. Both provide continuous filtered recirculation of chemical. All critical pr Product News Accurate gas testing Mini-Lab is a benchtop quadrupole mass spectrometer system that offers detection limits of <1 ppm for most gases and down to <50 ppb for some noninterfering species. The system can even be used to measure water concentrations down to <500 ppb. This performance is made possible by a combination of optimized analyzer features, a low background vacuum system, and a low-volume, inert sample gas inlet. The gas inlet allows the sample to be taken from a stream that is regulated just above atmospheric Product News Particle deposition system The PDS-80 particle deposition system is configured for 150-, 200-, and 300-mm wafers and other substrates. The Class 1 cleanroom-compatible system features a standard deposition range of 0.8-2 ?m, and optional capabilities extend the range to 5 ?m. The PDS-80 can automatically perform full and half depositions. The system will help fabs and instrument manufacturers to conform to the requirements of SEMI Standard E14-93 for meeting particles/wafer pass specifications. VLSI Standards Inc., San Jo Product News Edgebead exposure system The 2000E exposure system is designed for both full flood exposure and optical edge bead removal. It can be used for wafers of diameters up to 200 mm or rectangular substrates up to 200 ? 200 mm; an expanded version, Model 2000EX will handle 300-mm wafers and larger rectangular substrates. The system can be configured for deep-UV or near UV. The tool can provide up to 2000 W exposure intensities, and throughput can thus be matched to the user`s requirements; the system comes complete with exposu Product News Ion milling probe IMP is an ion milling probe for endpoint detection in thin-film etching applications. It features a high-performance quadrupole mass spectrometer, energy analyzer, and pulse ion counting detector for direct analysis of etch process secondary ions. Operating under the control of MASsoft software, the IMP provides for automatic selection of the etch products from an internal library of device structures. During analysis, IMP`s rapid response to step changes in etch product signal provides for prec Product News MES software PROMIS Version 5.4 manufacturing execution system (MES) software is compatible with two new modules, the Advanced Equipment Module (AEM) and Real Time Integrator (RTI). The RTI module publishes or broadcasts PROMIS transactions to other manufacturing software systems that need PROMIS over a meassage bus, reducing the time and cost of integration with other components of a comprehensive computer manufacturing solution. AEM is designed to improve equipment utilization and manufacturing productivit Product News Data collection architecture These enhancements to the architecture of ModelWare/RT software improve its data collection speed and flexibility with a powerful scripting and configuration engine. The new architecture includes abilities for: more flexible configuration for a wide range of tools; enhanced support for cluster tools for up to 12 chambers; multiple data collection sessions; a configurable event-response engine; application of functions to incoming equipment data values such as multiplying, adding, and more comple Product News Productivity analysis software The AutoSched Productivity Family (APF) is a flexible suite of simulation, scheduling, and productivity analysis tools for semiconductor manufacturing. The family consists of three major components: the Real Time Dispatcher allows manufacturers to address setup, priority, and complex batching logic and develop custom, multi-criteria rules and operating policies specific to their fabs; the ISS Reporter transforms raw data from the MES to useful information, allowing for analysis of data stored in Product News Data mining software The Q-YIELD stand-alone data mining software module, integrated with YieldManager software through structured query language, helps engineers to identify critical variables that affect yield. Its capabilities include: finding complex relationships to both nonlinear and interaction effects; handling large data files with no limitations on file size; analyzing hundreds of variables in minutes on a PC; providing nonparametric analysis and making no data distribution assumptions; working with all da Product News photoresist developer AZ 915 MIF is a high-purity, high-performance, metal-ion-free photoresist developer that meets the requirements of sub-0.5-?m technology. Its specifications include: maximum of 2 ppb of sodium, iron, potassium, and calcium; 0.2610 ? 0.0005 normality; maximum of 200 particles >0.2 ?m/milliliter. The developer offers wide processing latitude, high contrast, and high throughput, and is formulated in the industry standard 2.38 weight percent TMAH. AZ Electronic Materials/Clariant Corp., Somerville, Product News DUV excimer laser This new 248-nm excimer laser, designed for next-generation DUV steppers and scanners using high NA projection lenses, has a linewidth of <0.6 pm FWHM, and 95% of the laser energy is contained within a bandwidth of <2 pm. NovaLine LITHO/S has a polarization coupled resonator design that improves both spectral purity and laser operating efficiency. PowerLok is a real-time exposure control system that delivers an accuracy of Product News Thermally conductive adhesive Supertherm 2005 ultra-thermally conductive epoxy is a high-performance, solvent-free, diamond-filled adhesive. It is designed for die attach, sensor assembly, optoelectronics, clip-free heat sink attach, or module assembly where temperature-sensitive components/substrates are incorporated. Thermal conductivity is >1.0 W/mK, with good adhesion to die (>11 Kg). This low CTE epoxy absorbs stresses that develop during thermal cycling due to CTE mismatch between die and substrate. Supertherm 2005 bon Product News Dual-head bracket for rotary pumps This dual-head bracket for rotary positive displacement pumps increases throughput by allowing the use of two valves or pumps on the same dispense head. One pump is designated the master, and micron adjustments are used to make any adjustments mechanically that may be necessary on the x, y, and z axes for the second pump. X-axis mechanical adjustment is also possible on the master to position the optimum distance between pumps for the application. Adjustments are easily made, and once positioned Product News Sputtering targets UNIPHASE high-density, high-purity titanium aluminide sputtering targets feature highly uniform microstructures and fine grain size, as well as low gas levels and low alkali contamination. The targets are highly uniform, both radially and through the target cross section. They are produced using a vacuum hot processing technique in which controlled compression, temperatures, time, and vacuum aid in target densification and volatilization of low vapor pressure elements such as sodium, potassium, Product News Thru-transmission scanning This high-frequency thru-transmission scanning kit provides high-speed inspection that reveals delaminations at all interfaces. It uses a small beam spot to generate sharp, high-resolution images. These images show small defects, making the kit suitable for use with thicker packages such as BGAs. Sonix, Springfield, VA; ph 703/440-0222, fax 703/440-9512, e-mail [email protected]. Product News High-precision x-y stages Suitable for such applications as wafer inspection, the AA12 and AA15 X-Y stages are based on low mass and high stiffness by incorporating the MRC 15 series monorail guideways. The tables are manufactured from aluminum. The stages are driven by a 5-mm pitch ballscrew with a low-profile flange nut and very stiff axial bearings to hold the screw in place. The drive interface is the motor coupling and coupling housing, which has a standard size of 60 ? 60 mm. The AA12 and AA15 are equipped with lin Product News Water/nitrogen guns The A-1000XP TOC analyzer is designed for demanding TOC measurements in semiconductor ultrapure water. The instrument`s stability and repeatability allow changes as small as 0.001 ppb TOC to be reported reliably. Typical data show repeatability to 0.001 ppb over a range of 0.05 ppb during a 24-hour period on a typical water system. The A-1000XP performs equally well on normal and low dissolved oxygen (<5 ppb) water systems. Analysis times are typically 70 sec ? 5 sec at 1 ppb TOC. Anatel Corp., Product News HEPA filter HEPAir is a single unit that fits into a standard 2 ? 4-ft T-bar ceiling and combines all the features of the fan-powered filter module with a completely self-contained air conditioner. This delivers the conditioned air needed for cleanroom applications, including positive or negative pressurization and humidity control. In one unitary package, HEPAir contains filter, blower, cooling coil, cooling (make-up air) fan, condenser coil, condenser fan, compresser, refrigerant piping, controls, and wir Product News TOC analysis system The A-1000XP TOC analyzer is designed for demanding TOC measurements in semiconductor ultrapure water. The instrument`s stability and repeatability allow changes as small as 0.001 ppb TOC to be reported reliably. Typical data show repeatability to 0.001 ppb over a range of 0.05 ppb during a 24-hour period on a typical water system. The A-1000XP performs equally well on normal and low dissolved oxygen (<5 ppb) water systems. Analysis times are typically 70 sec ? 5 sec at 1 ppb TOC. Anatel Corp., Eurofocus Nikon in Scotland This low-cost, thin film measurement system, the F20, measures the thickness, refractive index (n), and extinction coefficient (k) of dielectric or semiconductor thin films. Applications include table-top and in situ measurement of optical coatings, plastic films, and semiconductor process-related materials such as resist and oxide layers. The F20 measures virtually any film from 10 nm to 50 ?m in thickness. Film thickness and wavelength-dependent optical constants are determined by analyzing a Eurofocus Soitec deal with SHE The ? 9600EC is a compact, stand-alone instrument for precise thickness measurement of fragile, soft, brittle, or polished material. It is simple to operate, does not require any calibration, and provides measurement with an accuracy of ? 1 ?m without contacting the target. Thickness is displayed on a five-digit LED directly on the fixture. The station is insensitive to the target material, has unlimited target thickness range, and needs no recalibration for thickness and/or material variation. Services 1997-1998 continuing education catalog This 88-page catalog contains a section on live, video, and in-company courses available in microelectronic manufacturing, microlithography, and photochemical coatings, interconnects, and MEMS. Courses cover such subjects as the physics of metrology instruments; plasma processing; advanced silicon wafer cleaning; semiconductor materials and device characterization; chip reliability; advanced stepper modeling, characterization, control, and matching; resist thickness bake, exposure, and developme Services Japanese FPD report This publication titled The Future Prospects for the Liquid Crystal and Related Display Markets Report was developed by the Japanese research organization, The Fuji Chimera Research Institute, for the Japanese display industry, and has been translated into English. It contains information gathered through extensive interviews with Asian industry leaders, and covers application trends; trends in the demand for materials and components; technology trend projections; pricing projections; market sha Services Testing and failure analysis proceedings This volume contains the proceedings from the 23rd International Symposium on Testing and Failure Analysis held October 27-31, 1997, in Santa Clara, CA. More than 50 papers by authors from around the world examine such topics as the tools and techniques that provide the basis for characterizing microelectronic devices; the latest advances in failure analysis; fault isolation techniques; and diagnostic and screening tests for discrete components, ICs, and microelectronic systems. ISBN 0-87170-619 Services Materials constitution volume This 8500-page introductory compilation of the annual "Red Book" series produced by Materials Science International Services and the Russian information service VINITI extracts data, phase diagrams, and text on materials constitution from world literature. Covering the years from 1990-1995, the volume contains information from all foreign language publications translated into English, and uniformly structured, detailed summaries of binary, ternary, etc., multicomponent systems. The 5300 summarie Services Memory IC market trends report This volume titled Memory 1997 is an in-depth reference publication that provides technology and market research trends for memory ICs through the year 2002. The report gives the reader an historical and forecast study of the four major memory products - DRAMs, SRAMs, EPROMs, and flash memory ICs. Each segment is examined in detail by dollar volume, unit shipments, ASP, market leaders, and price/mbit. Also included are production and consumption trends spanning the 1992-2002 time period. Followi Services Optical lithography simulation guide This 175-page book titled Inside PROLITH: A Comprehensive Guide to Optical Lithography Simulation by Chris A. Mack provides a description of the physical models that are found in a group of lithography simulation products, PROLITH/2, PROLITH/3D, and PROXLITH/2, including derivations of most of the mathematical equations and physical descriptions of their basis. Chapters cover topics like introduction to lithography modeling; aerial image formation; standing waves; diffraction for contact and pro Services IC training course This 45-min video training course titled Making the Microchip: At the Limits II describes the IC manufacturing process. The program is a revision of At the Limits, which has been used by universities, IC manufacturers, and suppliers as an introduction to wafer fabrication, and is based on the text Microchip Fabrication by Peter Van Zant. Topics covered include support technologies, maskmaking, and contamination control; IC manufacturing described as a series of layering, patterning, and doping p Services Semiconductor precursors market study This volume titled Semiconductor Building Block Materials: Growing Markets for Material Precursors (GB-206) analyzes the worldwide materials and devices market. The study points out that the principal single-crystal-wafer material precursor polycrystalline silicon dominates total sales in the available market, and was valued at $430 million in 1996. It is forecasted to grow to $655 million in 2002, at an average annual growth rate (AAGR) of 7.3%. Compound semiconductor substrate precursors inclu Services Pure water handbook This detailed handbook explores the overall problems of water purity, identifies common impurities, and discusses methods of water purification. A revised edition of the 1991 original, it includes information on new technologies and research, and is designed as a reference guide for those desiring a broad understanding of pure water technologies and applications. Price: $9.95. Osmonics, Minnetonka, MN; ph 800/848-1750, fax 612/933-0141, qqq.oamonixa.xom. Services Semiconductor surface preparation book This 545-page volume titled Science and Technology of Semiconductor Surface Preparation documents symposium proceedings from the 1997 MRS Spring Meeting in San Francisco, California. Its focus is to bring researchers and manufacturing and development engineers together to report new findings and to discuss surface preparation with an emphasis on gaining a mechanistic understanding of the underlying science on which the technology is based. Topics include megasonic cleaning; SC1 technology; surfa

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