Issue

Table of Contents Solid State Technology Year 1997 Issue 10	DEPARTMENTS Editorial Serving a diverse customer base The greatest trap editors can get into is to lose track of their audience. Ergo, readership studies. Letters Letters World News World News Tech News Technology News Eurofocus EuroFocus Asiafocus AsiaFocus Market Watch CSPs: Hot new packages for cool portable products Until recently, fine-pitch leaded packages such as QFPs and TSOPs were the only packages available for high-density mounting in portable products. Industry Links ESPRIT's Semiconductor Equipment Assessment Initiative The European Union's Semiconductor Equipment Assessment (SEA) initiative has established strategic links between European equipment manufacturers and semiconductor manufacturers worldwide. Product News New Products New Literature New Literature People People Services Services

SPECIAL-SECTION-300MM-RE Editorial The 300-mm transition redefines industry cooperation At one of the earliest industry-wide forums detailing the results of Semi's survey of global device manufacturers regarding their plans for 300-mm conversion, I was taken to task by an executive from a Semi member company who asked, "Why are you guys cramming 300 mm down our throats when we've got our hands full with 200 mm?" 300 Mm Factory Trends.ht 300-mm factory trends The opportunity to minimize the cost of 300-mm factories through standardization is being pursued by a number of global organizations. The I300i J300 Joint Gui The I300I/J300 Joint Guidance Agreement: Its impact on the 300-mm transition It's exciting news, historic in content as well as in context. After a year of diligent cooperation, I300I and J300 have united to present a detailed roadmap guiding standards for semiconductor equipment and materials used in 300-mm wafer production.

FEATURES Rtp Fixing hidden problems with thermal budget Kinetic effects in rapid thermal processing (RTP) are often assessed using the concept of thermal budget. Rtp Rapid photothermal processing The differences between the radiation spectra emitted by the heating elements in furnaces and rapid thermal processing (RTP) systems result in fundamental differences in the operating mechanisms of these two methods. Deposition Low-k dielectric integration cost modelling The wide variety of low-k dielectric materials and processes for ULSI interconnection were sorted to create generic process flows. Mass Flow Converters Manifold destiny: Gas systems go modular Several modular gas distribution system designs are currently available, all promising reduced cost of ownership (COO). Contamination Control A moving-zone Marangoni drying process for critical cleaning and wet processing A moving-zone Marangoni drying process can be integrated into an aqueous processing track to allow processing, rinsing, and drying of a single surface of a large flat substrate in one consolidated application. Vacuum Technology Pressure measurement and control in loadlocks A process tool's loadlock serves to isolate the high vacuum/low contamination environment of the process chamber from the atmospheric pressure environment of the cleanroom. Furnaces Analyzing the furnace area: How equipment and scheduling affect cycle time, COO Wafer fab owners strive for minimal cycle time and lowest cost of ownership (COO). Test Metrology Avoiding the pitfalls of surface analysis A variety of surface analytical tools are available to the process engineer, but data from these tools may be misleading because of hidden pitfalls in the surface analysis technique. Plasma Processing Probing plasma/surface interactions Understanding plasma-surface interactions in plasma etching, deposition, and cleaning is a prerequisite for achieving process goals. Process Integration Integration of ferroelectric nonvolatile memories Ferroelectric nonvolatile memories are especially attractive because of their low-voltage, high-speed write. Industry Insights Marketing novel technology: An historical lesson Semiconductor manufacturing continues to rely on new technologies to produce ever more challenging device structures.

SEMICON-SOUTHWEST Editorial Semicon/Southwest drops the other shoe I think it is obvious that the industry downturn last year is well on its way to a complete recovery buoyed up by an extremely healthy economy. Locale Chipmakers choose Phoenix desert as home Sunswept deserts, wind-sculpted mesas, and sandstone towers of every shape compete with ancient towering saguaros. In stark contrast, an emerging desert of silicon, an impatient semiconductor industry, grows to exceed even the most optimistic predictions. Resources Water conservation through the use of recirculating chillers The SIA National Technology Roadmap for Semiconductors cites water conservation as a key goal for future circuit manufacturing. Products Semicon/Southwest Products

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