Table of Contents
Solid State Technology
Year 1997
Issue 8
 | DEPARTMENTS
Eurofocus
Flanders Hoping to attract Chipmakers
The foreign investment office of Flanders (a region of Belgium) is calling on top chipmakers to bring their fab projects there, and is offering a competitive incentive package. Roger De Keersmaecker, director of the foreign investment office`s IC project, said his agency has located several sites appropriate for fabs in the Province of Limburg, about an hour east of Brussels. Two of them are suitable for megafabs capable of producing 20,000 wafers/month in three modules.
Eurofocus
Asecos WED Purchase
Shortly after its $6 million acquisition of Western Equipment Development (WED), Aseco Corp., of Marlboro, MA, has said that it will expand the operations of its new wafer-handling equipment manufacturing subsidiary. Work has already begun to expand WED operations, according to Sebastian Sicari, Aseco vice president and CFO. The move is being driven by the debut of a new high-speed sorter, which was introduced last month at SEMICON/West.
Services
Electronic Packaging Materials software database
This software database provides engineers and scientists with a library of physical, mechanical, thermal, and electrical properties of materials useful in the analysis of various packaging solutions. EPMatLib software also provides a repository for properties of materials unique to a particular company and is organized into 13 classes. Network installation of the software enables an entire enterprise access to the same data with changes controlled by knowledgeable personnel. EPMatLib can be run
Services
LCD market analysis
These reports on liquid crystal display (LCD) analysis have been prepared by a market research firm specializing in the global electronic display industry, and include forecasting information and data collected from interviews with LCD manufacturers, users, distributors, and product end-users. In addition, the reports feature background material essential to objective analysis, including historical patterns, econometric changes, cost models, price/volume relationships, and the advantages and dis
Services
Forty-eight hour teos Shipment Program
This program, offered by a supplier of high-purity liquid chemicals and chemical delivery systems, guarantees to clean, refill, and ship canisters of high-purity TEOS within 48 hr of receipt of a customer`s empty canister. Should the supplier take longer to ship, the customer would receive a 10% price reduction. The service is effective Monday through Friday, excludes weekends, is available upon request to all customers under contract with the supplier, and covers all orders of up to 10 canister
Services
Thermal Design Book
This 336-page book titled Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach contains information on the effects of operating temperatures on microelectronic devices, and provides a scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package consider
Services
RTP processing Book
This 353-page, illustrated text titled Rapid Thermal Processing of Semiconductors reviews theoretical and experimental progress in the field. Based on the work of Victor E. Borisenko at the Minsk Radio-engineering Institute and the Physics Institute of Aarhus University, the book discusses a range of materials, processes, and conditions, and summarizes the results of research by international investigators. Contents include: transient heating of semiconductors by radiation; recrystallization of
Services
Variable area Flowmeter delivery Program
This program guarantees two-week delivery of a line of standard variable area flowmeters to US destinations or the customer receives a free flowmeter. The Warp Speed Delivery Program applies to commonly placed orders for models GT 1000 (sizes 1/2-1 in., 10 units or fewer), MT 3809, and MT 3810 (sizes 1/2-1 in., 5 units or fewer); Sho-Rates, model 1350E (all sizes, 50 units or fewer); and Ar-Mites, model 1350A (all sizes, 25 units or fewer). The program started June 16 and ends September 16. In a
Services
1997 Vacuum Services report
This report titled AVEM Directory of Products and Services for the Vacuum Industry provides industry-related information to users of vacuum and vacuum-related equipment and processes. Topics covered include deposition supplies; gas control; ion/plasma sources; plasma/sputtering/arc components; reclamation services; repair/rebuild equipment; supplies/accessories; system monitoring and control; vacuum deposition components; vacuum systems; and vacuum system components. Price: $10. Association of V
Services
Electronic Materials Defects Book
This 710-page volume titled Defects in Electronic Materials II is a collection of research papers from the 1996 Materials Research Society (MRS) meeting in Boston, MA, on problems, progress, and methods in defect studies in electronic materials. Topics include: new techniques in defect studies; processing induced defects - plasma-induced point defects, defects and gate oxide integrity, and point detects and reaction; point defects and interactions in Si; impurity diffusion and hydrogen in Si; di
Services
Global Equipment
A newly formed company provides global equipment management services to the semiconductor industry. The company will buy, sell, refurbish, install, and service surplus chipmaking equipment, a single piece or an entire fab, through a network of 21 sales and service offices in North America, Europe, and Asia. Integrated Solutions International, Austin, TX; ph 512/719-1600, fax 512/833-7072.
Services
Total Chemical Management Lease Program
This program is designed to help microelectronics producers stretch their resources through affordable investment in chemical distribution equipment. Providing guidance and assistance through every step of the process, representatives of The Total Chemical Management Capital Lease Program will aid microelectronics manufacturers in analyzing their chemical distribution equipment needs, and then help to design, select, finance, and deploy the technology and equipment needed to achieve their produc
Services
Compound Semiconductor Book
This 1051-page volume titled Compound Semiconductors 1996 contains the proceedings of the 23rd International Symposium on Compound Semiconductors held in St. Petersburg, Russia, September 23-27, 1996. Topics covered include: nanoelectronics and nanophotonics; epitaxy and in-situ processing; visible emitters; heterostructure photocells and photodetectors; heterostructure transistors; optoelectronic integrated circuits; high-power, high-temperature devices; modelling and simulation; quantum effect
Services
Packaging technology book
This book titled Roadmaps of Packaging Technology covers basic to state-of-the-art packaging technologies, including BGAs, chip-scale packages, flip chip, MCMs, chip on board, fine-line substrates, build-up multilayer boards, thin-film substrates, heat pipes, switching noise, transmission lines, interconnect density, solder joint reliability, 3-D packaging, cryogenic processors, and quantum computing. The source also provides a complete explanation of terms and technologies, maps out future tech
Product News
Presure Transducer
Model 214 is an ultrahigh-purity pressure transducer that is bakeable to 125?C without affecting calibration and is mass spectrometer helium leak tested to 1 ? 10-10 atm.cc/sec. It is virtually EMI/RFI immune, available with a full scale output of 4-20 mA and 0.2-5.2 Vdc, offers ?0.25% FS accuracy, and measures pressure ranges from 0-50 to 0-3000 psig, as well as -14.7-50 to -14.7 to 3000 psig. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, fax 508/264-0292, e-mail [email protected].
Product News
gas detection ad monitoring
The GM-V series and GM-PL series use advanced sensor technology to offer real-time diagnostics and fully integrated alarm and control capabilities. The systems can detect combustible and toxic gases in concentrations as low as 10 ppb. Sensors are stable and have a high threshold to poisoning. Nine sensing technologies are integrated into the system to provide chemical monitoring at various concentrations, depending on the application. GM series diagnostics continuously monitor sensors, suction p
Product News
Simultaneous Purge/isolation valve
EZ Valve 1400 is designed to allow continuous, uninterrupted closed-loop flow of fluid/gas from a source, while isolating and purging fluid/gas from the lines and components on the load side. The valve is installed between the source and load lines. The pneumatic control box is then used to switch between normal, bypass, and purge modes. This design reduces or eliminates downtime associated with the disconnection of the cooling/heating lines typically found in most etch, sputter, and CVD equipme
Product News
Flow Switch
The 125-T all-Teflon flow switch, designed for gases and liquids, operates best where the normal flow to set point ratio is =10:1. When no flow is present, a free magnetic piston is suspended in the upper portion of the valve bore due to magnetic repulsion between the lower fixed magnet and the piston. As soon as flow is established, the piston is displaced downward and actuates the reed switch at set point. Set point is adjustable. Flow range is 30-16,000 cc/m air, or 1-500 cc/m water; repeatab
Product News
Thermal Mass Flow Controller
The Sierra 800 series capillary tube-type thermal mass flow meter and controller, suitable for use with all clean gases, measures and controls in flow ranges from 10 sccm to 2000 slpm. The straight sensor is designed to resist clogging and contamination. Instrument advantages include accuracy from 1 to 1.5% of full scale; fast response of 1 sec to within 2% of final flow with no overshoot or undershoot; and repeatability of -0.15%. Sierra Instruments Inc., Monterey, CA; ph 800/866-0200, fax 408/
Product News
Thin Film stres tool
Model 214 is an ultrahigh-purity pressure transducer that is bakeable to 125?C without affecting calibration and is mass spectrometer helium leak tested to 1 ? 10-10 atm.cc/sec. It is virtually EMI/RFI immune, available with a full scale output of 4-20 mA and 0.2-5.2 Vdc, offers ?0.25% FS accuracy, and measures pressure ranges from 0-50 to 0-3000 psig, as well as -14.7-50 to -14.7 to 3000 psig. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, fax 508/264-0292, e-mail [email protected].
Product News
Scanning Electron microscopes
The S-4700 FE SEM and the S-3500N Variable Pressure SEM incorporate high-density frame memories with maximum pixel counts of 2560 ? 1920. Both instruments include Rapid Image Shift Movement capability for fast, accurate navigation around the specimen. The S-4700`s objective lens contributes to superior resolution (25? at 1 kV), which is maintained
Product News
Optical Wafer and Die inspection System
Post probe/2nd optical inspection is currently performed manually at microscope-based review stations, where operators make a pass/fail decision that can be slow and inconsistent. The NSX-80 inspection tool performs automated post probe/2nd optical wafer and die inspection, giving fast, accurate results. Automated inspection can lead to higher yields through automated data collection and reporting, wafer mapping and identification, and complete integration with the automated manufacturing proces
Product News
300-mm Wafer Edge Profile Comparator
Model 102C edge profile comparator allows nondestructive inspection of 300-mm wafer edge profiles. Control of edge contour can greatly reduce chipping and fracture, slip generation in furnace processes, particle generation, epitaxial edge crown, and photoresist edge bead. A correct edge profile improves gripping of the wafer in many handling processes, especially RTP and ion implantation. The 102C creates a shadow profile image, magnifies it 100 times, and displays it on a 12-in. monitor. Precis
Product News
Plug-and-pump Turbopump
Model 102C edge profile comparator allows nondestructive inspection of 300-mm wafer edge profiles. Control of edge contour can greatly reduce chipping and fracture, slip generation in furnace processes, particle generation, epitaxial edge crown, and photoresist edge bead. A correct edge profile improves gripping of the wafer in many handling processes, especially RTP and ion implantation. The 102C creates a shadow profile image, magnifies it 100 times, and displays it on a 12-in. monitor. Precis
Product News
In-line carrier lifetime Measurement
The Turbo-V141 Navigator is a fully integrated, turbomolecular vacuum pumping system that combines the pump, electronics, and cooling fan into a single unit. The result is a compact tool that is easily integrated into vacuum systems. Only one connection point is required, further easing integration and reducing installation costs. An enhanced version of the MacroTorr pump provides Navigator with high throughput capacity and high inlet pressure (>10-3 mbar); a high compression ratio for light gas
Product News
CO2 Blasting
The JANUS 300 is a fully automatic carrier lifetime measuring system for processing 300-mm wafers, using the ?-PCD technique. Designed for Class 1 cleanroom environments with robotic cassette-to-cassette handling, the system is best suited to metal contamination control in thermal or plasma processes. JANUS features the use of the low injection level technique for lifetime measurements, giving accurate, high-resolution mapping of iron and other metal contaminants in a short space of time. Amecon
Product News
Post-ash reducer
The BMC200 chemical vapor sensor provides real-time measurement of airborne chemical concentrations. It contains a silicon MEMS chip (approx. 0.5 cm2) that detects vapor-induced mass changes in an absorbent polymer film. The benchtop electronic unit powers the sensor chip and transmits sensor data to a PC running Windows. Berkeley MicroInstruments, Richmond, CA; ph 510/231-5710, fax 510/231-5711, e-mail [email protected], www.BerkeleyMicro.com.
Product News
Extended range of silicon wafers
ST-200 is an inorganic stripper that removes high-density, post-ash plasma etch residues. It removes residues containing oxides and fluorides of aluminum and/or titanium from sub-0.5-?m vias and metal lines at low processing temperatures, without corrosion of aluminum/copper, 100% copper, titanium, titanium/tungsten, titanium nitride, or silicon oxide films. ST-200 contains no SARA-reportable components and no hydroxylamine, catechol, phenol, or chlorinated hydrocarbons. It is formulated to oper
Product News
BGA Die Bonder
These Cz-silicon wafers include prime polished, double-side polished, and epitaxial wafers with orientations of 1-0-0 and 1-1-1. Also, an optional polyback and/or LTO seal can be provided. Substrate dopants include boron, phosphorous, antimony, and arsenic (resistivity 0.001 to 100 Ohmcm). The epi layers are produced with single-wafer reactors with As, P, and B as dopants. Okmetic Ltd., Espoo, Finland; ph 358/9502-800, fax 358/9502-80300.
Product News
UV Curing Systems
Model 2007 BGA`s clamp feeder system is driven by linear motor technology that ensures accurate leadframe transportation. Vision systems measure the real bond pad position and provide high bond accuracy. A fully programmable dispenser system, using a true volumetric piston pump, provides control of bond line thickness and die tilt. An integrated quality control system automatically controls bond quality, and the flexible wafer handler allows the use of wafer sizes up to 8 in., with a fast exchan
Product News
Dry Process silicon dicing
Models UH101 and UH201 UV curing systems provide a highly controlled environment to ensure uniform exposure of wafers up to 200 mm in diameter. The UV adhesion reducing curing process offers several improvements over traditional irradiation methods; these include easier post-saw die removal
Product News
RTP System
The eXtended Test Station (XTS) tests devices of up to 576 I/O pins at speeds up to 200 MHz. Testers in the XTS series support mix-and-match of parallel, scan, and memory test modules within a single system. The XTS also provides DC Parametric measurements and is expandable for mixed-signal and MCM testing. Additional features of the XTS FT include odd and fractional clocks up to 400 MHz. Flex Time architecture provides timing-on-the-fly control of the delay, period, and individual sub-cycles. I
Product News
Instrumented wafers
Starfire is a 200-mm-wafer rapid thermal processing (RTP) system designed for 0.18-?m production applications. System features include: open architecture to allow future process integration; throughput approaching 80 wafers/hour; atmospheric wafer transfer; a Brooks Automation wafer-handling platform and robotics; MESC-compatible interface; uniform/repeatable processing, independent of wafer backside emissivity; purged wafer I/O loadlocks; and NO, N2O process capability. AG Associates, San Jose,
Product News
Small-footprint Furnace
Process Probe 1840 instrumented silicon wafers, with up to 31 integrated resistance temperature detectors, measure wafer process temperatures from 0-230?C to <0.1?C absolute accuracy, and uniformities to <0.05?C point-to-point precision at the wafer, in situ, under process conditions. Developed for DUV chemically amplified resist processes, they also meet the needs of i-line lithography and high-temperature wafer processing. By measuring wafer temperature directly, in situ, the influences of exh
Product News
Argon Ion Lasers
The PEO-603 is a small-batch production furnace that is suitable for all thermal processes up to 1100?C, including LPCVD. The ultraclean, hermetically sealed quartz tube (9 in. dia, 16 in. depth) accepts up to 50 eight-in. wafers and allows vacuum down to 10-6 torr, as well as programmable injection of up to six process gases, controlled by flowmeters or mass flow controllers. The furnace has fast response, due to its very low thermal mass and IR heating, with ramp up/down better than 100?C/min.
Product News
Step-and-Repeat Scanning stepper
This line of CE certified Omnichrome argon ion lasers is suitable for semiconductor applications. The air-cooled lasers feature internal mirror construction for ultimate long-term beam and power stability, with long lifetime reliability. At 14 in. long, they are well-suited to space-limited OEM systems. A selection of beam delivery systems is available, with single- or multiline output from 455 to 514 nm. Melles Griot Laser Group, Carlsbad, CA; ph 760/438-2131, fax 760/438-5208, e-mail sales@car
Product News
Pattern Generation tool
The NSR-S202A step-and-repeat scanning stepper is designed for the mass-production of 256-Mbit DRAMs. Based on a KrF excimer laser (248 nm) exposure light source, it provides a resolution of 0.25 ?m or better, uses a wide exposure area of 25 ? 33 mm, and incorporates an air-bearing stage for increased throughput and reduced lens distortion values. Nikon Precision Inc., Belmont, CA; ph 415/882-9494.
Product News
Global Positioning robot
The MEBES 4500S 0.25-?m pattern generation tool creates four levels of gray by making four passes over the substrate with a writing address that is four times the size of the data address. This allows placement of edges at the original design address. In addition to higher throughput for small addresses, the Multipass Gray writing strategy improves print quality by reducing errors through multipass averaging, and delivers a higher (8 ?C/cm2) dose to support high-contrast processes. A robotic loa
Product News
Spin Coater
This global positioning robot (GPR) system enables the transport robot to interact compliantly with misaligned cassettes and process modules, as well as deliver deflection compensation, even during transport. The system is a six degrees of freedom, servo-controlled robot that dynamically eliminates the alignment variance between the transported material and the workstations. The yaw-axis feature of the GPR enables the robot to replace track systems in the in-line equipment layout, reducing the c
Product News
High-Purity ammonia
Model P6712 is a programmable desktop spin coating system for the application of photoresists, polyimides, metallo-organics, dopants, silica films, and most organic and aqueous solutions. The system executes one of three fully automated, user-determined coating sequences under the supervision of a programmable logic controller. Each recipe consists of multiple ramp up, hold, and ramp down steps in the range 500-8000 rpm. Acceleration and deceleration rates are computer-calculated, based on the d
Product News
Dissolved ozone analyzer
The Model dFFOZ sensor module provides continuous, in-line measurement of ozone over the concentration range 0-100 milligrams/liter in a full-flow recirculating
People
Chemical Vapor Sensor
Dry ice blasting is useful in such areas as coater cups, teos valves, ammonium nitride, etch parts, and implant parts. The CO2 EconoBlast model PT-110 (14 in. wide and weighing just over 100 pounds) employs rice-sized dry ice pellets that disappear on impact with the targeted surface. It is available with a variety of guns and has a storage capacity of 110 pounds. Alpheus Cleaning Technologies Corp., Rancho Cucamonga, CA; ph 800/445-6131.
People
People Update
Genus Inc., Sunnyvale, CA, has named John E. Aldeborgh COO. He joined Genus in 1989 as director of operations, and was promoted to executive VP and GM of the company`s Ion Technology Products division, Newburyport, MA, in 1993. Before that, he was director of manufacturing at LTX Corp., a semiconductor test equipment company.
Editorial
Vocational Education VS. the Ivory Tower
There seems to be a conflict between the business world`s measures of success and its prescriptions for education, between what we value ourselves and what we offer the next generation. It worries me that universities and their corporate partners seem to be prescribing a drug that they themselves don`t value. Universities, all agree, need to "prepare students to compete in the global economy." The arguments happen when we try to define what that means for curricula.
Literature
Literature
This eight-page catalog features O-ring seals for the semiconductor industry made of high-performance, elastomer materials. It provides a description of the chemical environments used in the fabrication of ICs that demand chemically resistant o-ring seals: epitaxial silicon, coater developer, crystal growth, LPCVD/
Asia Pacific
Why capital doesnt venture in Japan
Paul Dali is managing general partner of Convergence Partners, a Silicon Valley-based venture capital firm assisting entrepreneurs in high-technology products and services. Convergence was founded in April with US$60 million from major limited partners NEC and Sumitomo Bank. Dali was recently interviewed by Ed Korczynski, Solid State Technology`s West Coast Editor.
World News
USA
Under a joint product development agreement, Dow Corning, Midland, MI, and Tessera, San Jose, CA, will develop silicone-based products for the die attach and encapsulation of Tessera`s ?BGA chip-scale package. The companies did not disclose specific terms or the duration of the agreement. However, the deal is said to include a wide-ranging technology transfer, with reciprocal visits to both firms. Separately, Tessera said Hitachi Cable Ltd., Tokyo, has licensed the ?BGA technology, and will prod
World News
Japan
Japan wafer fab spending to dip 2%. Japan`s top chipmakers are expecting an average 12.7% increase in semiconductor sales during the current fiscal year, which began April 1, but capital investment is seen shrinking by about 2% year-to-year, to 1,114 billion yen or about $9.6 billion (see table). Despite the slight dropoff, the largest companies will keep spending flat with last year, with the exception of Toshiba and Fujitsu, both of whom suffered losses in their semiconductor business in FY96.
World News
Asia/Pacific
The Singapore Institute of Technical Education, with sponsorship from Chartered Semiconductor, Hewlett-Packard, SGS-Thomson, and TECH Semiconductor, will offer an 18-month on-the-job training course to about 140 students seeking positions in the wafer fabrication industry. To be eligible, students must have completed one year of study, according to reports in the Singapore Straits Times; they will get an $850 monthly allowance during training, and will be required to work for an additional 18 mo
World News
Europe
BE Semiconductor Industries (BESI), Zevenaar, The Netherlands, L. Possehl & Co., and Mr. Ho Hun Tak have finalized an agreement to form Possehl BESI Electronics NV (PBE), a new joint venture for lead frame production and plating. Under the agreement, Possehl, BESI, and Ho will have 50.1%, 30%, and 19.9% ownership of the company, respectively, and the management board will consist of executive officers from each party. The new company will employ about 1250 people with 14 production facilities in
World News
Worldwide Highlights
SEMI book-to-bill shows positive growth. Orders for North American semiconductor equipment surged again in May to $1.44 billion, while shipments rose to $1.32 billion, resulting in a book-to-bill ratio of 1.09 (see table), according to SEMI. The order level was 4.8% better than April`s revised figure of 1.10. Bookings are now some 20% ahead of year-ago levels, while shipments are only 3% below those logged in May 1996, during the height of the last boom. Bookings have been on the increase since
Market Watch
The equipment industry: Are we bouncing along the bottom?
Every new beginning requires an ending. The havoc caused by over-capacity in the memory markets will come to a close some time in 1998. Whether this occurs in the beginning of the year or near the end does not really matter. The industry is detailing the blueprints for future expansion. We are optimistic, but one must acknowledge the relationship between the growth of worldwide semiconductor revenues and the revenue growth for capital equipment expenditures. Until the semiconductor industry begi
Market Watch
DRAM fab strategies in Asia
Current trends in DRAM outsourcing strategies employed by Japanese companies parallel similar strategies employed by US companies 10 years ago. In both cases, emerging companies in countries eager to gain design and production experience are used for low-margin production. Current business strategies focus on establishing dominance in embedded DRAMs.
Lithography
EUV lithography
During the past seven years, extreme ultraviolet lithography (EUVL) has evolved from a simple concept into a possible candidate for mass production of future integrated circuits. Part 1 of this article (in Solid State Technology, July 1997, p.151) reviewed the history of EUV lithography and discussed critical challenges in EUV optics. This part looks at the other pieces of the EUV puzzle - reticle, resist, and source technologies.
Tech News
Technique images picosecond switching in CMOS circuits
A nondestructive technique could help manufacturers debug timing problems in chips, allowing faster CPUs. The technique, hot-electron luminescence, detects the switching of logic gates in large CMOS circuits using images obtained from either the front or back of a chip. The technique was presented at the recent Conference on Lasers and Electro-Optics in Baltimore, MD.
Tech News
Dual-layer low-k dielectrics, FLARE at AlliedSignal conference
Challenges in integrating low-k dielectric spin-on polymers (SOPs) into IC production were explored at Planar `97, in Santa Clara, CA, a dielectrics conference sponsored by AlliedSignal Inc.
Tech News
X-ray microdiffraction examines stress distributions
Researchers at Columbia University and IBM Research report that they have used white beam x-ray radiation to study thermal and electromigration strain distributions in real time. According to authors P.C. Wang, et al., in a paper for the TMS Outstanding Student Paper contest, the microdiffraction technique uses broad spectrum synchrotron radiation, concentrated through borosilicate glass capillaries. The sample can be heated, and current applied, while it is scanned under the x-ray beam. Thus, t
Tech News
PSI developing atom beam processing
Under a small contract from the Ballistic Missile Defense Organization, Physical Sciences Inc. (PSI), Andover, MA, will develop a high flux, high fluence neutral atom beam tool for next-generation etching, cleaning, and deposition applications.
Tech News
Harris uses SMIF without Class 1 conditions
Harris Semiconductor has achieved rapid rampup of its Mountaintop, PA, power MOS wafer fab, and is using SMIF technology without Class 1 cleanrooms to hold down costs.
Tech News
Texas Instruments reports 0.06-?m gates
Researchers from Texas Instruments, in a presentation at the recent VLSI Symposium in Kyoto, Japan, reported fabrication of 0.06-?m polysilicon gates using DUV lithography. According to authors Wei W. Lee, et al., the process uses an optimized PECVD SixOyNz layer as both ARC and hardmask.
Tech News
Intel, NEC outline 300-mm fab intentions
Several leading chipmakers, including Intel and NEC, have begun to disclose plans for pilot production on 300-mm wafers. Their timelines indicate a relatively aggressive adoption path, with the first 300-mm production facilities coming on line during the 0.18-?m generation. The news is something of a confirmation of abstract figures collected by George Lee of SEMI`s 300-mm Initiative, which indicate that some nine 300-mm pilot lines will begin operation in 1998 to 1999.
Tech News
X-ray: Singapore synchrotron, Mitsubishi steppers
X-ray lithography has received two recent boosts, with disclosure of a decision to install a synchrotron beam line in a Singapore research program, and Mitsubishi reportedly deciding to install x-ray steppers at a new 256-Mbit DRAM fab.
Letters
Production commendation
This is a short note to tell you I think the content and the physical appearance of Solid State Technology has improved remarkably over the past few months.
Letters
Invention contention
Your 1957 milestone (Timeline featured in May, p. 38) is in error. Fairchild Semiconductor was formed by Robert Noyce, Gordon Moore, and six others from Shockley Semiconductor. Kilby was only at Texas Instruments.
Letters
Equation correlation
n the article "193-nm lithographic systems lifetimes as limited by UV compaction" (April, p. 95), Eqn. 2 fails in the dimensional analysis. As it follows from the article:
Letters
Insertion appreciation
Thank you for allowing us to insert into reprints of the article "Ultrasonic multilayer metal film metrology" (June, p. 85) credit to Lucent Technologies for making the TiN/Ti/Al-Cu/TiN/Ti/SiO2/Si samples that produced the data we showed in Figures 5a and 6a. We wish to extend full credit and appreciation to Lucent Technologies.
Letters
Projection correction
I enjoyed reading both the interview with Gordon Moore ("Moore`s Law extended: The return of cleverness," p. 364) and your editorial ("Billions and billions of transistors," p. 18) in your July issue.
Letters
Clarifications
The background image on the cover of the July issue is courtesy of Tom Way, IBM. In Calendar, May, p. 205, Solid State Technology was provided with an incorrect web address for the 23rd MNE conference in Athens, Greece. It should be www.im.ariadne-t.gr/welcome.html.
News
Varian Associates Inc.
Varian Associates Inc., Palo Alto, CA, has reached an agreement to purchase the remainder of its 60% owned Korean semiconductor joint venture, Varian Korea Ltd. (VKL), from the unit`s president and managing director S.K. Suh. The amount of the transaction was not disclosed. VKL was formed in 1985 after Suh, who founded his own semiconductor equipment sales and service company in 1979, had served as Varian`s representative for a number of years. VKL`s role was later expanded to include manufactur
News
SpeedFam Co. Ltd., SpeedFam International Inc.
SpeedFam Co. Ltd. and SpeedFam International Inc., makers of CMP systems, have opened a new technology center in Ayase City, Japan. The center will handle all research and development, tool demonstration, and training for its operations in the Pacific Rim. The 1300-m2 facility is equipped with a Class 10 cleanroom designed for advanced technology development, including a complete lab for analyzing SpeedFam`s CMP equipment; customer demonstrations; and training. SpeedFam`s Far East Joint Venture
News
Reedholm Instruments, Hitachi-ULSI, Engineering Corp. Inabata & Co. Ltd.
Reedholm Instruments, Georgetown, TX, a maker of semiconductor test equipment, has partnered with Hitachi-ULSI Engineering Corp. to provide technical support for Reedholm`s parametric testers in Japan. Reedholm products are distributed in Japan by Inabata & Co. Ltd. Reedholm trained Hitachi-ULSI personnel to provide support on Reedholm products, which are located in advanced Japanese semiconductor facilities. Japanese customers receive support from representatives in their own language and in th
News
Ion Systems
Ion Systems, Berkeley, CA, is expanding its Singapore operations, including the relocation of its regional office to a larger facility. The 103-m2 facility will include the installation of a repair and service center for local ionizer service and calibration. The company is also adding customer support, sales, and service personnel. Ion Systems opened its Singapore office in 1994.
News
Tokyo Ohka Kogyo Co. Ltd.
Tokyo Ohka Kogyo Co. Ltd. (TOK) has completed a new photoresist production facility at its Hillsboro, OR, plant. Until now, TOK has manufactured its photoresists only in Japan and exported to US customers, while subsidiary OHKA America Inc. produced developer liquids for US semiconductor customers. The new 21,000-ft2 facility is an integrated manufacturing plant that produces i-line photoresists from raw materials. The expansion increases TOK`s production of photoresist by 10%.
News
Caesar Technology Inc., Kulicke & Soffa Industries Inc.
Caesar Technology Inc. has ordered 120 model 1488 gold ball bonders from Kulicke & Soffa Industries Inc., Willow Grove, PA, for a major expansion of its Taiwan semiconductor assembly facility. The order, which is scheduled to begin delivery in September, is in addition to an earlier order for 100 bonders to be delivered this quarter. The bonders will be used to manufacture fine pitch ball grid array packages.n
News
Japans flat panel display companies announce investment plans
Japan`s flat panel display companies announce investment plans. With LCD sales expected to soar 41% to 1022 billion yen (about $8.9 billion) this fiscal year, Japan`s top nine LCD suppliers will invest some 246 billion yen (about $2.15 billion) in production facilities this fiscal year (see table). The growth is being fueled by large
News
Chinas bid to join the submicron era
Although China still faces challenges to an active IC sector, the country is investing in the future with its recent launch of Hua Hong Microelectronics and is setting development goals to last through the country`s Ninth Five-Year Plan. Despite certain restrictions, China is welcoming influxes of foreign technology and capital.
Asiafocus
Japans chipmakers still struggling with the difficulties of the 1990s
Japan`s semiconductor industry has had a difficult time during the 1990s. The collapse of the bubble economy in the early part of the decade brought fab building and expansion to a virtual halt, giving competitors elsewhere in Asia an opportunity to attack in DRAM production. Chipmakers and their suppliers got back on their feet in 1994 and 1995, only to run headlong into the unexpectedly sharp declines in DRAM prices that arrived in 1996.
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