Table of Contents
Solid State Technology
Year 1997
Issue 4
 | DEPARTMENTS
Eurofocus
ASML and IMEC to train work force
To address the critical shortage of technical personnel trained in deep UV lithography, stepper manufacturer ASM Lithography and Belgian R&D organization IMEC have formed a strategic alliance to train the work force that will be needed to operate and maintain 0.25 micron fabs using DUV lithography.
Eurofocus
Phillips expands nijmegen
To support volume production of its fifth-generation RF wideband transistors, Philips Semiconductors is investing US$15 million in its state-of-the-art discrete products wafer fab at Nijmegen, which is already the largest semiconductor plant in Europe.
Eurofocus
Siemens plans 300-mm pilot line
Ulrich Schumacher, group president of Siemens, announced recently that the company intends to build a 300-mm wafer processing pilot line in Dresden. If Siemens goes ahead without a partner, the line will definitely be located there, he said; but even if a partner is found, Dresden is still likely to be the choice. Siemens estimates that a pilot line running 400 wafers/week will cost $220 million.
Letters
Letters to the editor
I am a new reader of Solid State Technology and I found the article, "Slow traps studied in MOS dielectrics" in the Technology News section (p. 56, November 1996), very interesting. Could you give me the address of the research group working at Griffith University in Australia.
Literature
Literature Update
This catalog provides information on metrology standards products for the semiconductor industry. Topics covered are certification services, including an explanation of traceability, the calibration certificate, and recertification procedures, and product guidelines for contamination, dimensional, electrical, and film-thickness products. Also included are a section on worldwide sales offices, standards organizations, and the 1997
People
People Update
Norman Schumaker, chairman and CEO of EMCORE Corp., Somerset, NJ, has retired. A founder of the company, he was CEO since 1984. Reuben Richards, president and COO, will assume the CEO position. In addition, Thomas Russell, chairman of Jesup & Lamont Merchant Partners, was elected nonexecutive chairman of the board of directors. Richard Stall was also elected to the board of directors. He is chief technical officer and cofounder of EMCORE.
Product News
Linewidth and overlay measurement
This linewidth and overlay measurement tool, the LWS3000, is a video-based system with image processing capabilities. It has wafer inspection and defect review options for process monitoring, a statistical process control software option, and confocal capabilities for inspection of geometries as small as 0.25 ?m. An integrated robot handling system provides automatic wafer handling of 100- to 200-mm wafers. The operating software is Windows-based and designed for easy job setups, calibration, an
Product News
Interferometric sensor head
Precision Optical Displacement Sensor (PODS) 0-16 is a fiber pigtailed mini-interferometer that can measure displacement over a 16-cm range with 0.3-nm accuracy, and is suited to vibration and velocity measurements due to its high 7 MHz output bandwidth. Up to four PODS sensor heads can be powered by a single HeNe laser. PODS is supplied with a laser source, signal processing electronics, and customizable GUI-based software. MPB Technologies Inc., Pointe Claire, Quebec, Canada; ph 514/694-8751,
Product News
Multisurface recticle inspection
The STARlight inspection system is used to detect contamination defects on the patterned chrome surface of a photomask. URSA (unpatterned reticle surface analysis), a product extension for STARlight, inspects the pellicles and unpatterned glass surfaces of the reticle for contaminants and imperfections. This single-step system reduces cycle time and lowers the risk of contamination from excessive handling. KLA Instruments Corp., San Jose, CA; ph 408/468-5334, e-mail [email protected], URL http://
Product News
Trace metal monitoring
MicroSample X-Ray Florescence (MSXRF), for monitoring of process equipment, extends the range of XRF to the parts-per-billion sensitivity level, allowing monitoring of trace element contamination in chemical baths or monitoring of process-induced metallic contaminants in such equipment as implanters, plasma etchers, furnaces, RTA, TEOS, CVD, and other high-energy deposition or etch systems. Because MSXRF`s preparation techniques eliminate the complexities associated with ICP-MS and GFAAS, this n
Product News
Raman spectroscopy imaging
The Raman imaging microscope combines scanning spectroscopy and 2-D imaging in a single system. The microscope scans to a spatial resolution of 1 ?m and a spectral resolution down to 0.2 cm-1, providing 2D images, and 2D and 3D spectral plots. The scan is performed using a 25 mW laser. While the standard microscope scans across the full range from 200 to 4000 cm-1, optional extensions provide ranges of 100 to 4000 cm-1 and 5000 to 7000 cm-1. The instrument can also be customized for remote anal
Product News
Maskless lithography process
The HLS System 1000 is a manufacturing tool and process that effectively uses holographic - or interferometric - lithography, a technology proven capable of producing sub-0.5-?m structures. Features such as lines, holes, tips, cones, vias, mesas, grids, and microlenses can be generated. Using proprietary techniques, the system incorporates holographic lithography in a maskless, high-throughput, production-environment process featuring large-field-size, high-resolution patterning. The HLS Syste
Product News
Toxic gas detection
Gas Plus simplifies operation and maintenance of toxic gas detection systems.. The universal transmitter configures automatically when coupled with this company`s 22 gas-specific, intrinsically safe sensors, so only a few spares need to be stocked. Calibrated sensors can be stored off-line for up to nine months, due to an internally powered microprocessor that allows retention of configuration data and elimination of warm-up time. A selectable output inhibit feature permits easy removal of sens
Product News
Exhaust abatement system
Model 4214 TPU is an exhaust abatement system that removes all PFC gases, including the most stable of them, CF4. Destruction efficiencies (DREs) of 96-99% have been recorded for C2F6 and averaged 99.53% in a leading single-wafer, multichamber production tool. An oxygen inject facilitates the destruction of CF4 at a DRE of >95%. Edwards High Vacuum International, Crawley, UK; ph 44/1293-528844, fax 44/1293-407451.
Product News
Continuous mini gas detector
The MD-16 is a single-gas, wall-mounted, continuous detector of low levels of chlorine and several other hazardous gases. Built-in audio and visual alarms, activated in <8 sec, can be tested, silenced, or reset remotely by shining a light on the front panel. Auxiliary outputs and LED lights indicate cell failure, power failure, and warning alarm. CEA Instruments Inc., Emerson, NJ; ph 201/967-5660, fax 201/967-8450.
Product News
UV epoxies
Formulated to provide ultrahigh resistance to moisture, the Emcast 1820 series of UV epoxies are 100% solids epoxy systems designed for use as adhesives, coatings, and sealants. They contain no solvents and cure, with minimum shrinkage upon exposure to long-wave UV light, to tough, solvent- and chemical-resistant adhesives. The series consists of four products, which vary slightly in hardness and Tg. Electronic Materials Inc., Breckenridge, CO; ph 970/547-0807
Product News
Etch chamber parts
These Vespel polyimide etch-chamber parts, including clamp rings, screws, and covers, are produced with a five-step cleaning process that results in very low particle generation and long life. Enhanced designs speed the installation process. This company also offers a clamp ring recycling program for Applied Materials` P5000 tool users, reducing the cost of spare parts. M.E.C. Technology Inc., Toms River, NJ; ph 908/505-0308, fax 908/505-2151.
Product News
Vision system for wire bonders
An improved Cognex vision system has been added to the 2460-V and 2470-V automatic wire bonders. The system processes 64 gray-level patterns with sub-pixel calculation and fast repeatable capture of low-contrast reference fiducials, pin-outs, gold-on-glass patterns, and other substrate metallizations. A look-down camera with autofocus lens and zoom optics allows clear, sharp imaging of a wide range of devices at various bonding levels. Both systems feature precise loop control and wire length c
Product News
In-line dispensing
The CAM/ALOT 3600 in-line liquid dispensing system uses a combination of convection and quartz heating for flip-chip assembly to maintain the substrate at 80-100?C during pre-dispense, dispense, and post-dispense stages of underfill. The 3600 is designed with an integrated oven for consistent noncontact heating of FR4, ceramic, or flex circuits; it can complete up to 700 units/hr on a maximum effective dispense area of 250 ? 300 mm. System features include automatic vision for exact die alignme
Product News
Uninterruptable power and vacuum supply
UPVS provides continuous back-up power and wafer-handling vacuum for wafer process tools and handling equipment, preventing wafer breakage. The vacuum section has a high-reliability vacuum pump with a supply reservoir. Both power and vacuum are true zero transfer time. The front panel displays various real-time power and vacuum conditions in a flow chart fashion. Conditions can also be monitored through the unit`s communication ports. Q Systems Inc., Bronxville, NY; ph 914/237-6728, fax 914/967-
Product News
Recirculating chillers
Designed for high-performance applications where tight temperature control is required, the RC006AG01 and RC006AH01 recirculating chillers achieve ?0.1?C temperature stability. Both models provide up to 600 W of cooling in a 14 ? 14 ? 22-in. cabinet. The chillers keep the cooling fluid clean and pure; the liquid circuit is made from noncontaminating materials, and special filters maintain coolant quality. Standard features include hot gas bypass, digital temperature display, low level indicator,
Product News
Centrifugal pump
The KM-Series is a horizontal, magnetic drive centrifugal pump whose major wetted components consist of Tefon/PFA fluoroplastic for the casing and impeller, and silicon carbide for the shaft and bushing, to resist a wide range of the corrosive chemicals used in semiconductor manufacturing and etching processes. Mold-in-one technology provides a heavy-duty performance at elevated temperatures as high as 250?F. The pump achieves 100 gpm (max.), 110 ft (max.) with a 5-hp motor. Ansimag Inc., Elk G
Product News
Motorized mapping stage
With a travel range of 1 ? 3 in., the Advantage motorized mapping stage is suited to spectral mapping and sequenced sampling via FT-IR microscopy. The stage is controlled via joystick, keypad, or software command. For microscopes that are coupled to FT-IR spectrometers operating with OMNIC 3.0 or higher software, the stage is available with OMNIC Atlus Microscope Software. This program improves ease of use through unattended sample analysis of line and area maps, as well as random points, and of
Product News
Solder-bumped wafer reflow furnace
The Falcon 8/C solder-bumped wafer reflow furnace is a bottom-up conduction and top-down convection system designed to handle 4-, 5-, 6-, and 8-in. wafers. It has automated on/off loaders for integration into fully automated production lines. Optional ADE automated wafer handlers are available (one for each end of the reflow machine) that accommodate 25-wafer-capacity Fluoroware cassettes. Special platen and sweeper bar designs help to cradle the wafer and protect the delicate bumps as the wafer
Product News
PLD multitarget manipulator
Designed for use in pulsed laser deposition systems, these multiple-target manipulators are valuable tools for depositing multiple-layer films. They can be configured for as many as six 1-in.-dia. targets or four 3-in. targets. A coaxial, magnetically coupled, rotary feedthrough avoids the failure problems associated with bellows seals in demanding environments. A water-cooled shield protects all targets from backscattered vapor. Computer automation is optional. PVD Products, Bedford, MA; ph 617
Product News
All-plastic pump
The DP-20F nonmetallic pump is made entirely from plastic, eliminating the potential for metallic contamination in the event of a diaphragm leak or failure. The pump can handle liquid temperatures up to 176?F (80?C) and has a flow rate of up to 10 gal/min. Assembled in a Class 1000 cleanroom, the DP-20F has 0.75-in. intake and discharge valves, with a 0.25-in. air inlet. Yamada America Inc., Elgin, IL; ph 800/990-7867 or 847/697-1878, fax 847/697-2794.
Product News
Simulation software
ProModel Optimization Suite 3.5 software allows users to decrease costs, improve throughput, and determine efficiency through sequencing. Applications include throughput prediction, control system analysis, traffic control adjustment, and fab sub-level layout. With its easy-to-learn GUI, the software permits rapid model development and modification. Proposed changes to systems are implemented and tested on PCs. Optimization capability, or SimRunner, is a feature that runs hundreds of simulation
Editorial
Packaging- more than meets the eye
The semiconductor industry will face numerous challenges as we push further into the submicron regions in terms of lithography, CMP, CVD, etching, ion-implantation, and the like. Materials and gases, as well as cleanroom science and measurement, will pose inscrutable problems as new standards and rules apply. Additionally, the move to 300-mm wafers will impact these technologies and create further demands on both wafer-handling equipment and the development of new materials and processes. Not le
Market Watch
Toxic gas monitoring: Trends, training, and safety
A recent focus group on toxic gas monitoring promoted discussion of important industry issues. The forum, sponsored by Zellweger Analytics Inc. (producers of the MDA series of toxic gas monitoring systems) and moderated by Solid State Technology, highlighted concern for safety standards, fire code compliance, bulk delivery, training, and network standardization (see table).
World News
Worldwide highlights
International alliance for 1-Gbit DRAM development. Hitachi Ltd., Mitsubishi Electric, and Texas Instruments will begin joint work to develop 1-Gbit DRAM chips. The three companies will share an estimated 100 billion yen (about $814 million) in development and patent costs, and hope to bring the memory chips to the commercial prototype stage by 1999. This is the first time the three companies have worked together on a DRAM development project. The tri-company effort will help defray costs of dev
World News
USA
Intel leads funding of EUV lithography project. Intel has led the formation of a private corporation, called EUV Limited Liability Corp., to oversee and fund cooperative development of extreme UV (EUV) lithography for the 0.13-?m generation of ICs. EUV LLC hopes to have an alpha-level machine built within 36 months; process development could then begin in about five years. In addition, Intel Corp. is investing in Samsung Electronics Co.`s $1.3 billion memory fab now under construction in Austin,
World News
Japan
Survey predicts slower year for tool buying in Japan. Japanese purchases of semiconductor manufacturing equipment are expected to resume growth in 1998 and 1999, according to a new sales outlook survey by the Semiconductor Equipment Association of Japan. The survey also suggested that Japan`s equipment makers will see a similar pattern, with domestic and export sales both heating up in fiscal 1998. The DRAM recession in Japan is blamed as the prime culprit in declining sales for fiscal 1996 and
World News
Asia/Pacific
Korean chipmakers eye 64-Mbit. South Korean chipmakers are curtailing their production of 16-Mbit DRAMs and compensating for the move with plans to ramp up nonmemory and 64-Mbit production. DRAM giant Samsung, which claims 17% DRAM market share, has been cutting back production of 16-Mbit DRAM chips since 3Q96. LG Semicon plans to move away from 16-Mbit and is hoping to ramp up SRAMs, flash, ASIC, and media processor production as well as 64-Mbit.
World News
Europe
Philips Electronics will sell off about a third of its stock in ASM Lithography, with shares of the stepper maker trading near their 52-week high. In addition, ASML sees strengthening demand for equipment in the second half of the year, and will propose a 2-for-1 stock split at its annual meeting in April. According to company statements from Holland, Philips will retain a 23.9% ownership stake (8.25 million ordinary shares) in ASML after the sell-off of 3.95 million shares. Philips, a major fin
Lithography
193-nm lithographic system lifetimes as limited by UV compaction
Next-generation lithography tools will operate with 193-nm UV light (ArF excimer laser) to print device features with resolutions of ?0.18 ?m. Throughput comparable to current lithography systems will require in excess of 2 million laser pulses/hour (20 billion/year) to pass through the half-meter or so of optical material in the system. Yet today, compaction can be observed in state-of-the art fused silicas after only about 1 million pulses of 193-nm radiation at an intensity level of 1 mJ/cm2.
Asiafocus
Taiwans Tainan soon ready for fabs
Sony has announced plans to turn an employee parking lot into a 300-mm fab. According to the current timetable, initial production at Sony`s 300-mm fab will begin in 1999. The Tokyo-based company has already purchased land adjacent to its subsidiary, Sony Nagasaki, in Nagasaki Prefecture for the project, and is now using the site as a parking area for its employees.
Asiafocus
Sony to build 300-mm facility in Nagasaki
Sony has announced plans to turn an employee parking lot into a 300-mm fab. According to the current timetable, initial production at Sony`s 300-mm fab will begin in 1999. The Tokyo-based company has already purchased land adjacent to its subsidiary, Sony Nagasaki, in Nagasaki Prefecture for the project, and is now using the site as a parking area for its employees.
Tech News
Solid-state UV laser to improve step-and-scan
Aculight Corp., Bellevue, WA, has been awarded a $560,000 contract from the Air Force Wright Laboratory in Dayton, OH, to develop a solid-state 10 kHz pulse repetition rate, multiwatt output power, 193-nm ultraviolet (UV) laser. The laser is intended to be used in 0.18-micron microlithography equipment to fabricate advanced microcircuits. Other possible applications include jet engine combustion diagnostics and short range optical communication.
Tech News
X-ray use
X-ray lithography is "very likely to be used" for second- and third-generation shrinks of the 256-Mbit DRAM generation, according to a Mitsubishi Electric Corp. researcher who spoke at a recent seminar in Japan. Kiyoshi Demizu of Mitsubishi`s ULSI Laboratory, speaking at the Ultra Clean
Tech News
Remote clean improves Applied HDP-CVD
Applied Materials has produced a new remote plasma chamber as part of the company`s new production worthy Ultima HDP-CVD Centura system. The remote chamber is reportedly 100% efficient in dissociating NF3 into atomic fluorine gas for dry chamber cleans. Conventional chamber cleans create the plasma in the deposition chamber, which is less efficient and degrades chamber surfaces through exposure to harshly energetic ions and electrons.
Tech News
Deep alumninum via process
Researchers at Fujitsu have developed a novel approach to aluminum plug fill that relies on the same driving force that causes aluminum junction spiking. Called polysilicon-aluminum substitution (PAS), the process creates single-crystal aluminum in vias with aspect ratios up to 10:1. Other aluminum via-fill processes, including CVD, high-temperature reflow, and high-pressure aluminum extrusion, have reported aspect ratio limitations of less than 7:1. Hiroshi Horie, et al., from Fujitsu Labs firs
Tech News
Intel is prime mover to fund EUV litho project
A newly formed private corporation, led by Intel, has been formed to oversee and fund cooperative development of extreme UV (EUV) lithography for the 0.13-micron generation of ICs. Known as the EUV Limited Liability Corp., the company hopes to have an alpha-level machine built within 36 months; process development could then begin about five years from now.
Tech News
DUMIC 97: Beyond glass
Some 500 dielectricians gathered in Santa Clara, CA, recently to hear presentations on a wide variety of competing processes to replace SiO2 as the inter-metal dielectric of choice for deep-sub-micron process generations. The Dielectrics for ULSI Multilevel Interconnection Conference (DUMIC) explored integration issues in known processes and unveiled several radically new approaches that may be needed below 0.25 micron.
Tech News
Japanese manufacturers work out their CMP processes
A new report due out this month on the use of chemical mechanical planarization found only four out of Japan`s top 10 semiconductor manufacturers using the high-profile process in their facilities. Of the six other firms surveyed, five are evaluating CMP in pilot phases or development lines; one company is still in the research stage.
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