Table of Contents
Solid State Technology
Year 1997
Issue 2
 | DEPARTMENTS
Product News
High-tempature probe holders
Model 79-H probe holder, for applications where the holders must be above a high-temperature chuck while maintaining low electrical leakage characteristics, has been tested in applications up to 400?C. It is available with coaxial or triaxial characteristics, with either the set screw or pinjack method of holding the probe tip. At 500 Vdc, the electrical isolation characteristics of the 79-H are >5 Tera ohms with <40 fa leakage, with a >10 Tera ohm and <10 fa leakage model available. Micromanipu
Editorial
New Frontiers: beyond silicon CMOS
Predicting the future is risky. Thomas Edison said that alternating current was a waste of time. One micron was supposed to be the limit of optical lithography. The year 1996 was supposed to be another fantastic year for the industry. So when, a few months ago, someone asked me to predict the next "Big Thing," I was reluctant.
Letters
Agreement for back to basics
I could not agree more with Feng Jin`s comments (November, Letters, p. 19) about back to basics articles. This was a suggestion I had, but unfortunately never stated. I just came from the optics industry where I relied heavily on the Back to Basics articles in Laser Focus World to keep me fresh on the basics of my industry and to keep me up-to-date with the latest changes.
Letters
Vacuum topics
The "Design challenges in vacuum robotics" article by Ed Korczynski (October, p. 62) is excellent. I have a better understanding now of the history of materials selection, vacuum seal evolution, and magnetic coupling. It will be very useful in my upcoming robot reliability test work on our Centura platform. I believe UHV robots will eventually become popular. Mr. Korczynski revealed a lot of interesting areas for research.
Letters
Training is available
Letters to the editor over the past year (in various trade journals) leave the reader with the impression that there is (1) a great need for training/retraining/upgrading skills of current workers, and (2) no one providing such training. I can say from first-hand experience that this is not entirely true. Our organization and several others have been providing in-house training, in a variety of generic (semiconductor processing overview, math/physics/chemistry) and process specific areas (etch,
Letters
The root of company success
I liked your analogies for the current industry climate that you expressd in the November SST issue ("For everything there is a season," p. 14). Well, some of them anyway. I`m going to continue the trend of asking you the questions, with the following. You include downward pressure on stock prices as a "dark side" factor of a downturn, and then in the following paragraph appear to be criticizing financial short-termism. Are the two statements not contradictory? Surely a poorly-traded company wit
Eurofocus
European Update
Texas Instruments (TI) has signed a four-year, $1.2 billion agreement with the Italian government to build a second wafer fab at Avezzano, where TI already has a DRAM facility. Under the agreement, TI will construct a manufacturing plant and develop capabilities for semiconductor production on 300-mm wafers, with geometries of 0.28 ?m and below. TI will expand its R&D facilities and will also increase its existing DRAM production capacity as market conditions require.
Literature
Literature Update
A 128-page, four-color catalog describes a line of compressed air filter products. Featured are in-line filters, ASME coded vessels, instrumentation filters, high-pressure filters, FRLs, filter accessories, and Fine Fit conversion elements. The catalog includes specs, dimensions, and ordering information, as well as a section on coalescing filtration theory. Parker Hannifin Corp., Oxford, MI; ph 216/531-3000, fax 216/531-0618, URL http://www.parker.com.
People
People Update
Novellus Systems Inc., San Jose, CA, has named Sheila Vaidya group VP of its newly formed Metals Business Group. Prior to joining Novellus, Vaidya served as director of the Advanced CVD Metals Product Unit of Applied Materials, and was supervisor in three research groups at AT&T Bell Labs.
Asia Pacific
Transferring technology to China via joint ventures
Since China opened up to foreign investment in 1979, it has attracted approximately US$26.7 billion direct foreign investment, with a total of 37,000 approved enterprises by 1991. Equity joint ventures accounted for about one-third of the country`s total direct foreign investment, and were favored by foreign investors during the period 1979-1988 [1]. In spite of various difficulties, many equity joint ventures have thrived in China. With a realistic plan and good preparation, one can reasonably
News
Taiwan semiconductor association promotes industry cooperation
The newly established Taiwan Semiconductor Industry Association (TSIA) will promote cooperation among Taiwan semiconductor industry participants and elevate overall competitiveness of the industry, according to Dr. Wenbin Hsu, chairman of the preparatory committee of the association.
News
Samsung Electronics?
Samsung Electronics has renewed its patent contract with Texas Instruments (TI) of the US and will pay 30% of existing patent fees. Samsung`s payment to TI for using its technology for the next 10 years will amount to $1 billion. With the new contract, various law suits between the two companies ended.
News
Actel Corp?
Actel Corp., Sunnyvale, CA, will donate 10 of its Designer Series 3.1 systems to the University of Fudan in Shanghai, China, for use in the university`s electrical engineering curriculum. The system is an EDA tool for use in the ASIC and field programmable gate arrays design courses. Each system includes a direct time package, auto place and route, ACTGEN (MacroBuilder), and ACTMAP (VHDL and retargeting tool).
News
Daido Hoxan Inc.
Daido Hoxan Inc., Tokyo, and Air Products and Chemicals Inc., Allentown, PA, have formed a joint venture to provide gases and related chemicals, environmental systems, equipment, and services to the electronics industry in Japan. The new company, Daido Air Products Electronics Inc., will draw on Daido`s product lines and Japanese customer base, as well as on Air Products` technology, marketing, and worldwide infrastructure.
News
Varian Associates Inc.
Varian Associates Inc., Palo Alto, CA, and Tokyo Electron Ltd. (TEL) are revising their long working relationship to enable Japanese customers to have more direct access to Varian`s product, engineering, and support organizations worldwide. Under the arrangement, Varian will directly market its semiconductor equipment products in Japan, and will service the products. TEL will continue to provide service for the installed base of over 1100 Varian systems sold previously through the TEL-Varian all
News
Micron technology
Micron Technology Inc., Boise, ID, a maker of DRAMs, SRAMs, and FLASH components, has formed the subsidiary Micron Technology Japan, K.K. The subsidiary, located in Minato-ku, Tokyo, will provide sales and technical support to major Japanese personal computer and module manufacturers.
News
ASM Lithography
ASM Lithography, Veldhoven, The Netherlands, has opened a 4500-ft2 training center in Hsinchu Science Park, Taiwan. The center will provide hands-on instruction for stepper operators and service and process engineers. The center includes a PAS 2500 stepper and a PAS 5500 system in a Class 10 or better cleanroom environment. Two full-time instructors will conduct training sessions in Mandarin Chinese.
News
Therma-Wave Inc.
Therma-Wave Inc., Fremont, CA, a metrology company in the semiconductor capital equipment industry, has appointed Seki Technotron Corp., Tokyo, as the company`s exclusive sales representative in Japan. Seki will distribute the Opti-Probe film thickness measurement and the Therma-Probe ion implant monitoring systems. Twenty percent of Therma-Wave sales originate in Japan.
News
Electroglas Inc.
Electroglas Inc., Santa Clara, CA, a supplier of automatic wafer probing systems, has expanded operations in Asia by moving its Asian (excluding Japan) headquarters from Hong Kong to its existing Singapore facility. The new headquarters will provide regional chip manufacturers direct access to localized customer support. In addition, the company has established a customer service center in Shanghai, China. The facility will provide in-depth, local technical assistance and long-term resources for
Services
rapid thermal and integrated processing volume
A 580-page volume titled Advances in Rapid Thermal and Integrated Processing details the proceedings of the NATO Advanced Study Institute, Acquafredda di Maratea, Italy, July 3-14, 1995. Topics covered include the thermophysics of photon-induced annealing of semiconductor and related materials; the modeling of reactor designs and processes; process integration, which treats advances in basic equipment design, scale-up, and integrated cluster-tool equipment, including wafer cleaning and integrate
Services
Wafer analysis samples
An analytical technique has been developed to test for trace metals and implant cross-contamination at E11 levels in silicon dioxide layers. Initially developed on implanters that can sputter metals during implant, the procedure is equally applicable to plasma etch, RTA, TEOS, CVD, and standard furnace oxidations. The technique is useful to qualify maintenance procedures and new equipment. Sample results are available showing cross-dopant contamination and trace metals contamination during impla
Services
1997 photolithography seminar
This seminar offers a detailed analysis of the entire photolithography process for phototechnicians, including an overview of the basic principles of optics as they apply to photolithography. The seminar will last two-and-a-half days, and will be presented throughout the year in various locations in California, Arizona, Colorado, Texas, and Massachusetts. Price: $675. Integrated Circuit Engineering Corp., Scottsdale, AZ; ph 602/998-9780, fax 602/948-1925, e-mail [email protected], URL http://www.
Services
International semiconductor industry standards
A collection of more than 450 international standards for the semiconductor industry, including 38 new and 54 revised, is available. Titles include "Specification for Developmental 300-mm Diameter Polished Single Crystal Silicon Wafers"; "Cost of Ownership for Semiconductor Manufacturing Equipment Metrics"; "Safety Guidelines for Semiconductor Manufacturing Equipment"; and "Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages." Price: Ind
Services
Thin-film process technology resource
A version of the Handbook of Thin-film Process Technology edited by David A. Glocker and S. Ismat Shah is available on CD-ROM. The handbook provides a database for the international thin-film community, including information on physical and chemical deposition techniques, processing technologies, real-time diagnostics, surface modification in vacuum, and materials. The CD-ROM format features simple and Boolean searching; compatibility with Macintosh and Windows platforms; search relevance rankin
Services
1997 RF and microwave semiconductor market report
This report examines the semiconductor market for RF and microwave systems through a series of producer and distributor profiles. Information for more than 50 companies is included regarding employees, product line, packages employed, processes, facilities, ownership, distribution channels, sales, strategy, promotional tools, key personnel, competitors, and recent developments. Products examined include all front-end transmit/receive semiconductor-based components that are employed in such appli
Services
Laboratory services
This brochure describes surface chemical and microanalysis services, including measurement, R & D, process design, troubleshooting, quality assurance, and failure analysis, offered at an independent laboratory. Principles of operation, performance, and applications of the instrumental techniques available are detailed. The brochure also describes the laboratory`s research objectives, reporting system, and Beam Time service. A fee schedule is included. Rocky Mountain Laboratories Inc., Golden, CO
Services
Compound semiconductor electronics and photonics volume
A 450-page volume titled Compound Semiconductor Electronics and Photonics documents 60 symposium reports from the 1996 Materials Research Society (MRS) Spring Meeting in San Francisco, CA. Featuring the wide bandgap nitrides GaN, AlN, InN, and their alloys, the proceedings cover growth and characterization of these materials, photonics and processing, electronics and processing, wide bandgap semiconductors, and novel devices and processing. The book is Vol. 421 in the MRS Symposium Proceedings
Services
Back-end process video
This 35-min film titled Silicon Run II describes back-end processes used in IC manufacturing. It also illustrates how processed wafers are made into the chips used in microcomputers and the multichip units of high-end computers. Other topics covered include testing and packaging, PC board assembly, system assembly, software, computer structure, signal integrity, and multichip technology. Price: $225 (SEMI member), $295 (nonmember). SEMI, Dept. 05229, P.O. Box 39000, San Francisco, CA 94139-5229;
Services
PCB fabrication/electronics assembly training catalog
This 25-page catalog offers video and computer-based programs that detail basic processes for printed circuit fabrication and electronics assembly. Component identification, introduction to surface mount assembly, and basic multilayer fabrication are among the topics covered. IPC, Northbrook, IL; ph 847/509-9700, fax 847/509-9798, URL http://www.ipc.org.
Services
Electronic component catalog system
This CD-ROM catalog contains software, product, and technical information on a line of electronic components. Described are MLC and tantalum capacitors, resistor chips, arrays and networks, integrated passive components, thin-film inductors, SMT fuses, transient suppressors, filters, piezos, and timing devices. The catalog also includes SpiCap software that helps access circuit modeling information for MLC chip capacitors; a CALCI program that aids in choosing ceramic capacitors for power supply
Asiafocus
Research programs at Japanese ASET consortium
Japan`s government-funded electronics research cooperative - the Association of Super-Advanced Electronics Technologies (ASET) - has begun work on several projects at its two research centers and at member company facilities. ASET has 22 member companies, including the top ten Japanese semiconductor makers, as well as IBM Japan, Texas Instruments Japan, and Merck. The New Energy and Industrial Technology Development Organization (NEDO), an affiliate of the Ministry of International Trade and Ind
Asiafocus
Semicon/Japan mood?
SEMICON/Japan `96, held in December at Makuhari Messe in Chiba Prefecture outside Tokyo, posted a record of 120,590 attendees. Booths were sold out, with 1326 exhibitors on site, an increase of 16 percent over last year. Show floor
Asiafocus
Highlights of the 10th annual Semicon/Korea
Technical conferences on flat panel display (FPD) technology, 300-mm wafer processing, and environmental health and safety issues were to highlight this year`s SEMICON/Korea show, which celebrated its 10th anniversary February 3-5 at the Korea Exhibition Centre (KOEX). The show will be 50% larger this year, featuring more than 800 exhibit booths representing semiconductor and flat panel display manufacturing equipment and materials makers from more than 10 countries.
Asiafocus
Chartered to ramp Fab 3
Despite the current industry slump, Chartered Semiconductors Ltd. (CDM) of Singapore will start to ramp up its Fab 3 facility in April, and intends to build new fabs at the rate of one every two years. After adding a fab in Singapore, the company plans to establish two facilities across the straits in Malaysia, where it has already purchased land.
Asiafocus
830 X 650-mm LCD production in Japan
Hitachi will launch the industry`s first 830 ? 650-mm TFT-LCD production line, currently under construction at its Mobara plant, by July 1997. It will be able to produce nine 12.1-in. panels from a single glass substrate of this size, compared to six from advanced standard 550 ? 650-mm size panels.
Tech News
300-mm is hot at tokyo semicon; SEMI standards will play in Japan
SEMICON/Japan generated much news related to 300-mm wafer technology, including word that Japanese organizations have agreed to work through the SEMI standards process for 300-mm instead of developing a parallel set of standards, and discussions of cooperation between the Japanese SELETE consortium and the International 300mm Initiative (I300I).
Tech News
Nanoporous silica may hold solution for better dielectrics
AlliedSignal Advanced Microelectronics Materials, Santa Clara, CA, and NanoPore Inc., Albuquerque, NM, announced in September the formation of a new joint venture, Nanoglass. The 50-50 venture combines AlliedSignal`s expertise in thin films, application development, and sales with NanoPore`s nanoporous silica technology. Nanoglass has developed a new process to deposit thin films of nanoporous silica for interlevel dielectrics (ILD) applications. Initial work will focus on optimization and chara
Tech News
MRS: Low-k development, ti/tiN delamination, water, PFCs
The Materials Research Society Fall Meeting, held in Boston in early December, provided insights into several evolving areas of device fabrication, including low-k dielectric materials development, Ti/TiN delamination, water use minimization, and PFC replacement.
Tech News
DW-Mai: Polysilicon metrology
Scientists at Rudolph Technologies and Bruce Technologies are developing dual wavelength multiple-angle-of-incidence (DW-MAI) ellipsometry as a reliable process tool to control the uniformity of polycrystalline silicon. Polycrystalline silicon (polySi) films are widely used in semiconductor processing for gate electrodes and interconnect materials. Controlling the uniformity of these films is critical for consistent, high yield semiconductor production.
World News
World Highlights
SEMI book-to-bill on the rise. The North America semiconductor equipment industry posted a book-to-bill ratio of 0.87 for November, up from October`s revised ratio of 0.77, according to SEMI (see Table 1). Orders received from worldwide customers by North American manufacturers in November were $936.5 million, up about 14% from October. Meanwhile, capital equipment shipments to worldwide customers were $1080.4 million. SEMI analyst Elizabeth Shumann says that the improvement in orders could indi
World News
USA
Applied Materials Inc., Santa Clara, CA, has entered the metrology and inspection equipment market by acquiring Opal Inc., a supplier of CD-SEM systems, and Orbot Instruments Ltd., a supplier of wafer and reticle inspection systems based in Yavne, Israel. Applied commenced a cash tender offer for the outstanding shares of Opal`s common stock at $18.50/share net to the seller in cash. Proceeds to the shareholders of Opal were approximately $175 million, while the net cash cost of the transaction
World News
Asia/Pacific
The US Trade Representative`s office has finalized an Information Technology Agreement (ITA) during the first meetings of the World Trade Organization in Singapore. The ITA will eliminate tariffs on information technology products including semiconductor, semiconductor equipment, and parts among all producing countries by the year 2000. Building on the endorsement reached by the leaders of the Asia-Pacific Economic Cooperation Forum in Manila, the ITA sets the major trading countries on a course
World News
Japan
Japanese equipment market could reach 1 trillion yen. In a SEMI survey of members in North America, Europe, and Asia, the Japanese semiconductor equipment market is expected to top 1 trillion yen by 1999. The Japanese market is expected to increase 4.4% this year to 810.7 billion yen, decline slightly, then rise again to reach 1.05 trillion by 1999. The demand is expected to come from the acceleration of 64-Mbit DRAM device production by Japanese semiconductor makers, sparked by the recent marke
World News
Europe
France Telecom-CNET and SGS-Thomson Microelectronics have successfully processed the first wafers in their next generation of technology, using a 0.25-micron CMOS process with 0.20-micron effective gate length. The process was developed at SGS-Thomson`s advanced 200-mm wafer fabrication plant in Crolles, near Grenoble, France. The first prototypes of customer designs using the process will start production in 2Q97.
World News
Rest Of the World
Orbotech Ltd., Yavne, Israel, a manufacturer of flat panel display (FPD) inspection systems, has completed field tests of its LC-3090S, a system for automated optical inspection of FPDs. The company is releasing the LC-3090S as the first in a series of complementary products that comprise its yield enhancement system due for unveiling in 1997. By applying image processing techniques to the inspection results, the system can identify the source of a failure in the production line, eliminating the
Market Watch
How hot is the thermal equipment Market
This discussion of the thermal market will focus on basic thermal applications - equipment applied for heating without deposition. Furnaces used for diffusion, oxidation, annealing, and the like are included, but not when used for deposition. Similarly, rapid thermal processors (RTP) are included when employed in diffusion, oxidation, nitridation, annealing, silicidation, glass reflow, etc., but not in CVD or epitaxy.
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