This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning processes. To Improve the Cu loss under via bottom, effective approaches are proposed. The modified actions for via bottom improve not only wafer yield but also reliability of the device.
This article is the first in a five-part series on semiconductors in the automotive industry. In this article, we introduce some of the challenges involved in the automotive supply chain. Future articles in the series will address specific process control solutions to those challenges.
There are many different situations in which special attention to color choices provide the potential to improve the manufacturing results of multi-patterned masks.
Construction will be completed in the second half of 2019 and ready for production in 2020 Samsung aims to maintain its leadership in cutting-edge process technology under 7nm.
To be able to guarantee the reliability of transistors, we have been conducting research for some years now at imec to see what happens when transistors operate properly and when they fail.
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