Optimized stepping, based on parallel analysis of die placement errors and prediction of overlay errors, can increase lithography throughput by more than an order of magnitude and deliver commensurate reductions in cost of ownership. The productivity benefits of optimized stepping are demonstrated using a test reticle with known die placement errors.
The development of a new class of materials with superior functionalities is essential to enable emerging process schemes for wafer- or panel-level FO packaging.
Process-induced overlay errors from outside the litho cell have become a significant contributor to the overlay error budget including non-uniform wafer stress.
Increasingly, the ability to stay on the path defined my Moore\\\'s Law will depend on advanced packaging and heterogeneous integration, including photonics integration.
The semiconductor industry is facing key challenges. In recent years, M&A mega deals have led to consolidations within the market, while the industry continues to mature.
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