Issue



Table of Contents

Solid State Technology

Year 2018
Issue 4

FEATURES

Advanced Packaging


Optimized stepping for fan-out wafer and panel packaging

Optimized stepping, based on parallel analysis of die placement errors and prediction of overlay errors, can increase lithography throughput by more than an order of magnitude and deliver commensurate reductions in cost of ownership. The productivity benefits of optimized stepping are demonstrated using a test reticle with known die placement errors.


Advanced Packaging


Material innovations for advancements in fan-out packaging

The development of a new class of materials with superior functionalities is essential to enable emerging process schemes for wafer- or panel-level FO packaging.


Advanced Packaging


Void control in die attach joint

To eliminate voids, it is important to control the process to minimize moisture absorption and optimize a curing profile for die attach materials.


Metrology


Patterned wafer geometry grouping for improved overlay control

Process-induced overlay errors from outside the litho cell have become a significant contributor to the overlay error budget including non-uniform wafer stress.


NEWS


TI expands lead among top analog suppliers in 2017

Top 10 suppliers held 59% of analog market last year with ON Semi showing strongest growth.



TSMC continues to dominate the worldwide foundry market

Top eight companies held 88% of global foundry market last year.



Sales increase 20% year-to-year in April; double-digit annual growth projected for 2018

Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019.



Applied Materials breakthrough accelerates chip performance in the big data and AI era

Applied Materials, Inc. today announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.


COLUMNS

Editorial


Photonics integration coming

Increasingly, the ability to stay on the path defined my Moore\\\'s Law will depend on advanced packaging and heterogeneous integration, including photonics integration.


Industry Forum


Capturing future sources of profitable growth

The semiconductor industry is facing key challenges. In recent years, M&A mega deals have led to consolidations within the market, while the industry continues to mature.