Tag Archives: New Products

Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater, a compact solution used to provide precise and uniform heat to gases flowing into the chamber.

This new heating solution is designed as an integrated solution that replaces multiple components in a system. Space in the tool is prime real estate and design engineers are seeking solutions that are not only compact but better performing. Watlow’s new fluid delivery heater features Watlow’s patented thermal spray technology. The heater makes use of its entire surface to optimize heat transfer and temperature uniformity at temperatures up to 450°C. This design enables a high performance heater to also be small and lightweight, helping to reduce overall system size, complexity and costs.

The heater’s patented circuit patterning process offers many benefits including customizable heating profiles, distributed wattage and/or multiple zones of control and precise and repeatable power distribution.

The point-of-use fluid delivery heater is a high watt density, low mass heater, which contributes to fast response times, efficient heat transfer and enables on-demand process start up.

“At Watlow, we are striving to bring innovation to the industry to meet the needs of advanced process tools,” said Ray Derler, semiconductor business unit marketing director. “We listen to our customers. We understand the issues they face and we design and manufacture solutions to not only meet their needs, but delight them as well. This new fluid delivery heater is a perfect example. We have engineered a solution that can mounted close to the chamber, where space is tight, to deliver process gases with high temperature accuracy.”

Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature measurement system, a compact sensing and control solution ideal for plasma environments.

Temperature sensors that transmit electrical signals, such as thermocouples and RTDs, are often compromised when exposed to the electromagnetic environments found in plasma chambers where the RF noise couples onto the sensor and distorts the signal. Fiber optic temperature sensing, using the principles of fluorescence, enables operation in plasma environments providing stability, repeatability and cost effectiveness. As such they are ideal for determining the temperature of chamber components such as chamber lids, chamber baffles, electrostatic chucks, edge rings and showerheads.

Leveraging its strength in control systems, Watlow has combined advances in fluorescent sensing with its powerful EZ-ZONE RM control platform, creating an integrated solution for the latest semiconductor processing tools. Two versions make the system adaptable to all system requirements.

The EZ-ZONE RMZ integrates fiber optics, PID temperature control and EtherCAT communication capabilities into a single package. It features up to 48 loops of input and control with all EZ-ZONE RM temperature control features including I/O, logic, current measurement, power switching and more.

For those without the need to implement EtherCAT, the EZ-ZONE RMF module is a dedicated fiber optic input module integrating the power of the EZ-ZONE control system with one to eight channels of fiber optic temperature sensing. It can be used as either an expansion module or configured with built-in temperature control loops. These two modules provide system designers with an integrated solution with the flexibility to expand the number of sensing/control zones as required. The EZ-ZONE RMF can be used independently when only sensing is required.

Real estate associated with a plasma chamber is expensive. Watlow’s fiber optic temperature measurement system is compact at just 144 cubic inches, and can be mounted on a DIN-rail, minimizing the size of the installed footprint. Integration of the fiber optic probes (sensing head) are customized based on many factors including application environment, temperature regime, size constraints and material compatibilities.

Other system benefits include faster temperature sampling rates with high resolution, highly accurate fluorescent signal processing electronics and a highly reliable LED light source, designed to run at low currents for maximum life.

“The introduction of our fiber optic temperature measurement and control system marks a major advancement in this technology arena,” said Ray Derler, semiconductor business unit marketing director. “While the sensing technology has been markedly improved to advance both performance and reliability, this product moves beyond the sensor as a component and brings new, system-level, advantages to equipment designers. We are proud to introduce our fiber optic temperature measurement system because of the benefits the system will provide. Our customers have been telling us that they need a better solution that addresses reliability, accuracy and system level packaging. Our new system is the innovation desired for temperature sensing and control in plasma chambers.”

Tanaka Holdings Co., Ltd. today announced that Electroplating Engineers of Japan, Limited, which operates the Tanaka Precious Metals’ plating business, has developed, and launched from July 15, the RAD-Plater cup-type ultra-compact plating laboratory equipment for semiconductor wafers, which achieves equivalent films to mass-production machines.

The RAD-Plater is ultra-compact laboratory equipment for manufacturing 2 to 8 inch semiconductor wafers. Measuring 800 mm wide and 700 mm deep, it is smaller than mass production machines and can operate on only compressed air and the 100 volt power of general equipment. In addition to gold, silver, palladium, copper and nickel, it can use a wide variety of plating solutions including alloys and lead-free solutions, and at 10 liters or less of solution, it uses about half the plating solution required by dip-type machines, which also reduces experimentation costs. The RAD-Plater uses an EEJA-manufactured Stir Cup and delivers mass-production level plating quality through uniform and bubble-less film thickness and superior filling of deep vias. It also enables reduced plating time by using a high current density achieved with an increased ion supply. Even though the RAD-Plater is laboratory equipment, it achieves a level of plating equivalent to that of mass-production machines, which enables early problem-solving in the development stage for mass production issues such as expected yield, and enables trouble-free rollout to the mass-production line. This is the world’s first cup-type plating laboratory equipment for manufacturing semiconductor wafers, using 10 liters or less of plating solution and handling 8-inch wafers.

Many development divisions of manufacturers with mass-production plating lines would have previously contracted out the plating solution experimentation work to equipment manufacturers and others for evaluation, but purchasing a RAD-Plater and conducting experiments in-house now enables a considerable reduction in development lead times. Other customers would have previously purchased mass-production machines to conduct their own experiments, but because the RAD-Plater comes at a cost that is one third to one quarter that of the mass-production machines, they can now achieve considerable cost reductions. EEJA provides samples of plating solution together with the RAD-Plater to research, development and trial manufacture divisions of manufacturers, universities and other education and research institutes, material manufacturers and others to improve sales of plating equipment and plating solutions for mass production. It aims to achieve RAD-Plater sales of 500 million yen per year by 2017.

RAD plater

RAD plater

Tanaka Precious Metals will be exhibiting at SEMICON West 2015 from July 14th to July 16th at the Moscone Center in San Francisco. Our engineers will be available to answer questions anytime at Booth No. 1628, South Hall.

HORIBA Semiconductor, global leader in process metrology and control components, introduces its new HD-960L for sub-parts-per-billion level monitoring of DO in chemicals with a low sample-consumption rate. The HD-960L is specifically designed to enable processes that require ultra-low or controlled levels of DO.

The HD-960L uses an innovative polarographic sensor and an auto-ranging feature to give users real-time trace DO data from ppb level to saturation in critical process chemistries.  The technology allows users to monitor DO levels, avoid process excursions due to oxidation and more effectively control silicon etch rates.

“The HD-960L’s low detection limit, high accuracy, low sample consumption and wide range make it the perfect choice for critical next-generation processes that require low levels of DO,” said Mark Mahoney, Business Development Manager for Wet Products at HORIBA Semiconductor.

HORIBA technologies for wet process monitoring are used globally for critical process monitoring and control and the new HD-960L represents the latest in applications-driven technology development that supports the semiconductor industry.

HORIBA Semiconductor, part of HORIBA INSTRUMENTS, INC., headquartered in the United States, provides an array of instruments and solutions for applications across a broad range of semiconductor processes.

 

 

Semiconductor equipment manufacturer ClassOne Technology today announced a configuration for optimizing Through Silicon Via (TSV) and Through Wafer Via (TWV) processes on its affordable Solstice electroplating systems. The Solstice family, introduced last year, is designed to provide advanced yet cost-efficient plating for MEMS, Sensors, RF, Interposers and other emerging technologies for ≤200mm wafers.  Flexibly configurable, the Solstice for TSV/TWV combines chambers for the critical blind via pre-wet operation with advanced copper plating on the robust and reliable automation frame that is the heart of the Solstice.

“In recent months customer requests have skyrocketed for TWV, whether alone or in combination with forming redistribution layers (RDL),” said Kevin Witt, ClassOne’s Chief Technology Officer. “Many of our smaller-wafer customers seek the advantages of 2.5 and 3D packaging needed for their next generation products; and cost-effective TSV or TWV processing is mission critical. The new Solstice configuration addresses their needs effectively and elegantly with a plating tool that is affordably priced for 200mm and smaller substrates.”

Witt explained that the new Solstice TSV configuration, which has already been sold to customers, employs a unique, high-efficiency but simple vacuum pre-wet chamber followed by copper via electroplating. This combination of capabilities enables the ClassOne tool to routinely produce fully-filled or lined vias with widths ranging from 5 to 250 micron having aspect ratios as high as 9:1. Traditionally, this level of performance has been challenging even for plating systems costing twice as much as Solstice. The Solstice can also be configured to perform additional downstream processing such as resist strip and seed layer etch making it a cluster tool that delivers a suite of critical processes, reducing cycle time and saving money. This technology makes it possible to process TSV alone or TSV and redistribution layers simultaneously to provide a complete solution on a single tool.

“New customers always have the same reaction when they first see our Solstice platers in action,” said Byron Exarcos, President of ClassOne. “They’re always amazed that tools this affordable deliver such advanced processing. The new Solstice TSV configuration is one more example of what is making Solstice the preferred solution for electroplating on smaller wafers!”

Designed for high-performance, cost-efficient ≤200mm electroplating, Solstice systems are priced at less than half of what similarly configured plating tools from the larger manufacturers would cost — which is why Solstice has been described as delivering “Advanced Plating for the Rest of Us.” Solstice can electroplate many different metals and alloys in a spectrum of processes, on transparent or opaque substrates. ClassOne now offers three Solstice models: the LT for plating process development, the S4 for mid-volume production, and the S8 for high-volume, cassette-to-cassette production, with throughput of up to 75 wph.

Solstice S8 Plating System

Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice family of ≤200mm wafer electroplaters. The fully-automated, cassette-to-cassette Solstice S4 is available with up to 4 chambers and can deliver up to 75wph throughput. In footprint, capacity and cost, the S4 is positioned between the manual-load, development-oriented Solstice LT, with 1 or 2 chambers, and the fully-automated Solstice S8 electroplater with up to 8 chambers.

“Certain users had been asking for a smaller version of our S8,” said Kevin Witt, ClassOne’s Chief Technology Officer. “Others wanted a smaller incremental step up from our LT development tool. The new S4 was a natural answer to both requests. It provides cassette-to-cassette automation but has a 28 percent smaller footprint than the S8. Also, S4 pricing starts at $700k, compared with $1.5M for the S8.”

“It’s about giving customers more options,” said Byron Exarcos, President of ClassOne Technology. “With the new Solstice S4 we’re providing more ways for budget-constrained users to get exactly what they need to improve their processes. For some, the S4 will provide an affordable way to replace wet benches, automate production and gain significant improvements in uniformity, consistency and productivity. For others, the S4 will be a natural replacement for aging Equinox systems.”

All Solstice models share the same advanced-performance chambers, software controls, electronics and processing results — enabling users to move easily from process development on the LT, to mid-volume production on the S4, to high-volume production automation on the S8.

The Solstice S4 was also just named by Solid State Technology magazine and the SEMI organization as one of three finalists in the BEST OF WEST AWARD competition associated with the SEMICON West 2015 Conference.

ClassOne Technology introduced the Solstice family in 2014 to provide high-performance yet cost-efficient electroplating solutions for users of ≤200mm wafers, in MEMS, LEDs, RF, Power, Sensors and other emerging markets. All Solstice systems are priced at less than half of what similarly configured plating systems from the larger manufacturers would cost — which is why Solstice has been described as “Advanced Plating for the Rest of Us.” The tools are designed for a broad spectrum of electroplating processes using many different metals and alloys on opaque or transparent substrates. ClassOne also supports plating customers with process development, deployment and service around the globe.

Solstice S4 -sml

Nanoscience Instruments is pleased to offer the new Nano-Observer atomic force microscope (AFM). The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications. Advanced and unique electrical measurements highlight the AFM’s key strengths. High Definition single-pass Kelvin Probe Force Microscopy (KFM) provides high resolution surface potential mapping. Electrical measurements, like Conductive AFM, can be performed with the ResiScope covering 10 orders of magnitude.

“The Nano Observer applies new technologies for atomic force microscopy. In combination with the ResiScope, the Nano-Observer takes AFM well beyond imaging,” explains Sebastian Kossek, co-founder of Nanoscience Instruments. “This technology allows for quantitative electrical characterization of a wide range of materials including semiconductors, conductive polymers or thin films.”

The Nano-Observer delivers new technology well-suited to solve challenges in advanced materials research and development. Research in materials science, thin films, semiconductors, data storage and nanomaterials will all benefit from using a Nano-Observer AFM. The user interface is intuitive yet flexible and can be customized for a range of applications.

“We are very pleased to announce the new Nano-Observer AFM. The instrument greatly adds to our capabilities at Nanoscience Instruments,” says Mark Flowers, co-founder of Nanoscience Instruments, “These innovative techniques allow us to provide a more comprehensive solution to our customers developing new, advanced engineered materials.”

The ResiScope, an award-winning innovative module, can be combined with the Nano-Observer to measure resistance over 10 orders of magnitude using atomic force microscopy. Resistance measurements can be coupled with magnetic force microscopy, electric force microscopy or single-pass Kelvin probe force microscopy imaging modes to acquire multiple properties in the same scan area.

nano observer AFM

Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device wafer to carrier wafer. Leveraging its expertise manufacturing film adhesives for the semiconductor industry over the last 30 plus years, AIT offers Wafer Processing Adhesives (WPA) from 5 to 80 micron film adhesives for device wafer processing up to 450mm with and without topography. AIT high temperature capable WPA removes easily with laser assisted and solvent assisted release separation de-bonding besides traditional heat-sliding processes.

AI Technology, Inc. (AIT)’s temporary bonding Wafer Processing Adhesives (WPA) are thermally stable to 320- 330°C and the bonded compound wafers are compatible with standard WLP process equipment and for backside processing of 3D-TSV wafers. High integrity in bond strength enables easy back grinding to a thickness of 50 μm. AIT’s thermally and chemically stable polymers can withstand multiple device wafer processes, such as dry etching, wet etching, CMP, PVD, solvent based spin coating of resists and polymers, lithography, electro plating and extended elevated temperature processing up to 320-330°C for at least 60 minutes under high vacuum.

In comparison to traditional wax based and polyimide based temporary handling solutions, AI Technology, Inc. (AIT)’s WPA-TS 320 and WPA-TL 330 demonstrate some of the highest temperature capabilities for thin wafer processing as well as easy removal and cleaning.

thin wafer bonding

ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cleaving and drilling of glass up to 10mm thickness. Using less than 100 watts of laser power, most transparent, hard and brittle materials, like sapphire, quartz or heat- and chemically-strengthened glass, can be cut at speeds of up to 1 meter per second. The resulting kerf width is about 1 micron and the edges are smooth with a measurable surface roughness of less than 1 micron.  Cutting interior features like holes, slots and other shapes down to 2 mm is possible without damage to the surrounding material. The process is silent, non-contact, produces minimal debris and has low consumable costs. Stack glass sheets can also be cut without damage to individual layers.

The ROFIN SmartCleave FI laser process eliminates conventional, mechanical methods with their inherent and significant drawbacks (low scribing quality, micro-cracks, chipping, accuracy limitations, additional time-consuming and labor-intensive processing steps, etc.) and results in fast processing and higher yields.

This unique, IP-protected laser cutting process opens the door to huge application areas, and is of particular interest to manufacturers of consumer electronics, medical devices, integrated circuits, architectural, automotive, aerospace, and a variety of other market segments.

ROFIN

ROFIN will debut this new technology at SEMICON WEST 2015.

MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirrus 3-XD Atmospheric gas analysis system in both benchtop and rack mounted models. These quadrupole mass spectrometer (QMS) based systems provide a step-change in performance and ‘eXtreme Detection’ capability to advance atmospheric gas analysis in a wide range of analytical applications and environments. The Cirrus 3-XD system features new, patented V-lens Ion Optics Technology that eliminates baseline noise associated with the effects of metastable neutrals (a by-product of bulk gas ionization), a common issue in conventional QMS instruments. This unique performance attribute enables users, for the first time, to achieve consistently low ppb level detection limits, irrespective of the bulk gas present. The compact system includes new software to streamline the process of carrying out accurate quantitation of trace and bulk gases, and a unique capillary inlet and oven design that ensures a rapid and ultra-stable response.

The Cirrus 3-XD system also incorporates a unique internal oven and capillary inlet design that provides high temperature uniformity and ultra-stable response for qualitative and quantitative applications. The oven design eliminates cold spots and features advanced insulating properties and convection heating characteristics that are optimized for temperature uniformity across the entire inlet and analyzer. The heated inlet assembly employs a low volume, low surface area and inert silica-lined capillary to maximize response speed (250 data points per second) while minimizing memory effects.

As in earlier models, the Cirrus 3-XD system is controlled by the proven and versatile ProcessEye Professional software, which now features a new ‘Multipoint Calibration’ methodology to enable users to confidently generate accurate gas concentrations (in %) from raw partial pressure measurements. The new workflow provides facile calculation and implementation of sensitivity and normalization factors that are essential for accurate gas quantitation in applications such as identification of trace gases in bulk gas or profiling simple or complex gas mixtures.

mks-cirrus3xd-rgb