Tag Archives: Top Story Left

IC Insights has just released its new Global Wafer Capacity 2017-2021—Detailed Analysis and Forecast of the IC Industry’s Wafer Fab Capacity report.  Shown below is a brief excerpt from that report.

Prior to 2008, the 200mm wafer was used in more cases for manufacturing ICs than any other wafer size.  However, since 2008, the majority of IC fabrication has taken place on 300mm wafers.  Rankings of IC manufacturers by installed capacity for each of the wafer sizes are shown in Figure 1.  The chart also compares in a relative manner the amounts of capacity held by the top 10 leaders.

installed capacity

Figure 1

Looking at the ranking for 300mm wafers, it is not surprising that the list includes only DRAM and NAND flash memory suppliers like Samsung, Micron, SK Hynix, and Toshiba/Western Digital; the world’s five largest pure-play foundries TSMC, GlobalFoundries, UMC, Powerchip, and SMIC; and Intel, the industry’s biggest IC manufacturer (in terms of revenue). These companies offer the types of ICs that benefit most from using the largest wafer size available to best amortize the manufacturing cost per die, and have the means to continue investing large sums of money in new and improved 300mm fab capacity.

The leaders in the 200mm size category consist of pure-play foundries and manufacturers of analog/mixed-signal ICs and microcontrollers.

The ranking for the smaller wafer sizes (i.e., ≤150mm) includes a more diversified group of companies. STMicroelectronics has a huge amount of 150mm wafer capacity at its fab site in Singapore, but the company has been busy converting this production to 200mm wafers. Another STMicroelectronics 150mm fab in Catania, Italy, is also undergoing a conversion to 200mm wafers, with plans for that project to be completed in 2017.

A significant trend regarding the industry’s IC manufacturing base, and a challenging one from the perspective of companies that supply equipment and materials to chip makers, is that as the industry moves IC fabrication onto larger wafers in bigger fabs, the group of IC manufacturers continues to shrink in number (Figure 2).

Today, there are less than half the number of companies that own and operate 300mm wafer fabs than 200mm fabs. Moreover, the distribution of worldwide 300mm wafer capacity among those manufacturers is becoming increasingly top-heavy.

installed capacity 2

Figure 2

 

As more smartphone manufacturers build designs using flexible display technology, shipments of flexible displays are expected to reach 139 million units in 2017, an increase of 135 percent compared to 2016. According to IHS Markit (NASDAQ: INFO), flexible displays are expected to comprise 3.8 percent of total display unit shipments in 2017.

Vivo and Xiaomi launched their first smartphones with flexible active-matrix organic light-emitting diode (AMOLED) displays in 2016, while many other manufacturers have plans to develop their own foldable (or bendable, dual-edge curved) smartphone designs. In particular, Apple is expected to launch its new iPhone using flexible AMOLED display in 2017, which would dramatically drive up expected demand for flexible AMOLED panels. Flexible AMOLEDs are expected to comprise 20 percent of total OLED display unit shipments in 2017.

IHS_Markit_Flexible_display_shipments_forecast

“During 2016, many smartphone manufacturers have pressured display panel makers to supply them with more flexible AMOLEDs for their new smartphone designs, however, due to limited production capacity only a few players had their orders met in quantity,” said Jerry Kang, principal analyst of display research for IHS Markit.

However, tight supply conditions are expected to change in 2017 once Samsung Display and LG Display start operating their new fabs to increase supply capacity for flexible displays, resulting in earlier availability of new smartphone entrants in the market.

“With new form factors entering the marketplace next year to entice consumers, smartphone manufacturers will find themselves locked in a fierce battle with one another as they jostle to win marketshare for their new smartphone models featuring dual-edge curved and foldable AMOLED displays,” Kang said.

According to the latest IHS Markit Flexible Display Market Tracker report, smartphones took up 76 percent of the total flexible display supply in 2016 with the remainder taken up by smartwatches. However, flexible display supply for other applications, including tablet PCs, near-eye virtual reality devices, automotive monitors and OLED TVs, is not expected to be significant until 2023.

“Consumer device manufacturers will eventually move from conventionally designed flat and rectangular form factors to the latest curved, foldable or rollable screens, but only once their product roadmap for newer, innovative devices becomes more mature,” Kang said.

The semi-annual IHS Markit Flexible Display Market Tracker covers the latest flexible display market forecast, and panel manufacturer’s strategies, technologies and patent trends.

Vigorous M&A activity in 2015 and 2016 has reshaped the landscape of the semiconductor industry, with the top companies now controlling a much greater percentage of marketshare.  Not including foundries, IC Insights forecasts to top five semiconductor suppliers—Intel, Samsung, Qualcomm, Broadcom, and SK Hynix— will account for 41% marketshare in 2016 (Figure 1).  This represents a nine-point increase from the 32% marketshare held by the top five suppliers ten years ago. Furthermore, the top 10 semiconductor suppliers are forecast to account for 56% marketshare in 2016, an 11-point swing from 45% in 2006, and the top 25 companies are forecast to account for more than three-quarters of all semiconductor sales this year.

semiconductor sales leaders

Figure 1

Following an historic surge in semiconductor merger and acquisition agreements in 2015, the torrid pace of transactions eased a bit in the first half of 2016.  However, 2016 is now forecast to be the second-largest year ever for chip industry M&A announcements, thanks to three major deals struck in 3Q16 that have a combined total value of $51.0 billion.  These deals were SoftBank’s purchase of ARM, Analog Devices’ intended purchase of Linear Technology, and Renesas’ potential acquisition of Intersil. With the surge in mergers and acquisitions expected to continue over the next few years, IC Insights believes that the consolidation will raise the shares of the top suppliers to even loftier levels.

A simple solution-based electrical doping technique could help reduce the cost of polymer solar cells and organic electronic devices, potentially expanding the applications for these technologies. By enabling production of efficient single-layer solar cells, the new process could help move organic photovoltaics into a new generation of wearable devices and enable small-scale distributed power generation.

polymer-solar_2021

Developed by researchers at the Georgia Institute of Technology and colleagues from three other institutions, the technique provides a new way of inducing p-type electrical doping in organic semiconductor films. The process involves briefly immersing the films in a solution at room temperature, and would replace a more complex technique that requires vacuum processing.

“Our hope is that this will be a game-changer for organic photovoltaics by further simplifying the process for fabricating polymer-based solar cells,” said Bernard Kippelen, director of Georgia Tech’s Center for Organic Photonics and Electronics and a professor in the School of Electrical and Computer Engineering. “We believe this technique is likely to impact many other device platforms in areas such as organic printed electronics, sensors, photodetectors and light-emitting diodes.”

Sponsored by the Office of Naval Research, the work was reported December 5 in the journal Nature Materials. The research also involved scientists from the University of California at Santa Barbara, Kyushu University in Japan, and the Eindhoven University of Technology in The Netherlands.

The technique consists of immersing thin films of organic semiconductors and their blends in polyoxometalate (PMA and PTA) solutions in nitromethane for a brief time – on the order of minutes. The diffusion of the dopant molecules into the films during immersion leads to efficient p-type electrical doping over a limited depth of 10 to 20 nanometers from the surface of the film. The p-doped regions show increased electrical conductivity and high work function, reduced solubility in the processing solvent, and improved photo-oxidation stability in air.

This new method provides a simpler alternative to air-sensitive molybdenum oxide layers used in the most efficient polymer solar cells that are generally processed using expensive vacuum equipment. When applied to polymer solar cells, the new doping method provided efficient hole collection. For the first time, single-layer polymer solar cells were demonstrated by combining this new method with spontaneous vertical phase separation of amine-containing polymers that leads to efficient electron collection at the opposing electrode. The geometry of these new devices is unique as the functions of hole and electron collection are built into the light-absorbing active layer, resulting in the simplest single-layer geometry with few interfaces.

“The realization of single-layer photovoltaics with our approach enables both electrodes in the device to be made out of low-cost conductive materials,” said Canek Fuentes-Hernandez, a senior research scientist in Kippelen’s research group. “This offers a dramatic simplification of a device geometry, and it improves the photo-oxidation stability of the donor polymer. Although lifetime and cost analysis studies are needed to assess the full impact of these innovations, they are certainly very exciting developments on the road to transform organic photovoltaics into a commercial technology.”

By simplifying the production of organic solar cells, the new processing technique could allow fabrication of solar cells in areas of Africa and Latin America that lack capital-intensive manufacturing capabilities, said Felipe Larrain, a Ph.D. student in Kippelen’s lab.

“Our goal is to further simplify the fabrication of organic solar cells to the point at which every material required to fabricate them may be included in a single kit that is offered to the public,” Larrain said. “The solar cell product may be different if you are able to provide people with a solution that would allow them to make their own solar cells. It could one day enable people to power themselves and be independent of the grid.”

Organic solar cells have been studied in many academic and industrial laboratories for several decades, and have experienced a continuous and steady improvement in their power conversion efficiency with laboratory values reaching 13 percent – compared to around 20 percent for commercial silicon-based cells. Though polymer-based cells are currently less efficient, they require less energy to produce than silicon cells and can be more easily recycled at the end of their lifetime.

“Being able to process solar cells entirely at room temperature using this simple solution-based technique could pave the way for a scalable and vacuum-free method of device fabrication, while significantly reducing the time and cost associated with it,” said Vladimir Kolesov, a Ph.D. researcher and the paper’s lead author.

Beyond solar cells, the doping technique could be more broadly used in other areas of organic electronics, noted Ph.D. researcher Wen-Fang Chou. “With its simplicity, this is truly a promising technology offering adjustable conductivity of semiconductors that could be applied to various organic electronics, and could have huge impact on the industry for mass production.”

Also at Georgia Tech, the research involved professors Samuel Graham and Seth Marder, both from the Center for Organic Photonics and Electronics. Beyond Georgia Tech, the project also involved Naoya Aizawa from Kyushu University; Ming Wang, Guillermo Bazan and Thuc-Quyen Nguyen from the University of California Santa Barbara, and Alberto Perrotta from Eindhoven University of Technology.

Integrated circuit sales for connections to the Internet of Things are forecast to grow more than three times faster than total IC revenues during the last half of this decade, according to IC Insights’ new 2017 Integrated Circuit Market Drivers report.  ICs used to embed Internet of Things (IoT) functionality into a wide range of systems, sensors, and objects are expected to generate sales of $12.8 billion in 2016, says the new report, which becomes available this week.

Between 2015 and 2020, IoT integrated circuit sales are projected to rise by a compound annual growth rate (CAGR) of 13.3% compared to 4.3% for the entire IC market, which is projected to reach $354.7 billion in four years versus $287.1 billion last year, based on the forecast in the 492-page report.  As shown in Figure 1, strong five-year IC sales growth rates are also expected in automotive (a CAGR of 10.3%), medical electronics (a CAGR of 7.3%), digital TVs (a CAGR of 5.9%), and server computers (a CAGR of 5.4%).

Cellphone IC sales—the biggest end-use market application for integrated circuits—are expected to grow by a CAGR of 4.8% in the 2015-2020 period.  Saturation in smartphone markets and economic weakness in some developing regions are expected to curb cellphone IC market growth in the next four years after sales increased by a CAGR of 10.8% between 2010 and 2015.  Meanwhile, weak and negative IC sales growth rates are expected to continue in standard personal computers, set-top boxes, touchscreen tablets, and video game consoles.

The new 2017 IC Market Drivers report shows 2016 integrated circuit sales for IoT applications climbing nearly 19% compared to 2015 to an estimated $12.8 billion, followed by the automotive segment increasing about 12% to $22.9 billion, medical electronics rising 9% to $4.9 billion, and digital TV systems growing 4% to $12.9 billion this year.  The report estimates IC sales growth in server computers being about 3% in 2016 to $15.1 billion, cellphones being 2% to $74.2 billion, and set-top boxes being 2% to $5.7 billion.  Meanwhile, standard PC integrated circuit sales are estimated to be down 5% in 2016 to $54.6 billion while video game console IC revenues are expected to finish this year with a 4% drop to $8.9 billion and tablet IC sales are on track to decline 10% to $12.1 billion in 2016, according to IC Insights’ new report.

Figure 1

Figure 1

Samsung Electronics Co. Ltd. announced today that it is expanding its advanced foundry process technology offerings with the fourth-generation 14-nanometer (nm) process (14LPU) and the third-generation 10nm process (10LPU) to meet the requirements of next generation products ranging from mobile and consumer electronics to data centers and automotives.

Samsung presented these new technology offerings at the Samsung Foundry Forum to foundry customers and partners. The event was held at its Device Solutions America headquarters today, where the company elaborated on the details of new technology offerings including 14LPU and 10LPU.

Samsung’s fourth-generation 14nm process technology, 14LPU, delivers higher performance at the same power and design rules compared to its third-generation 14nm process (14LPC). 14LPU will be optimally suited for high-performance and compute-intensive applications.

Samsung’s third-generation 10nm process, 10LPU, will provide area reduction compared to its previous generations (10LPE and 10LPP). Due to limitations of current lithography technologies, 10LPU is expected to be the most cost-effective cutting-edge process technology in the industry. Together with the second-generation 10nm process (10LPP) that offers an extra performance boost from 10LPE, 10LPU is positioned to meet the needs of an extended range of applications that can benefit from the advanced 10nm process.

On top of the new process offerings, Samsung also updated its 7nm EUV process development status and showcased its 7nm EUV wafer.

“After we announced the industry’s first 10nm mass production in mid-October, we have now also expanded our lineup with new foundry offerings, 14LPU and 10LPU,” said Ben Suh, Senior Vice President of foundry marketing at Samsung Electronics. “Samsung is very confident with our technology definitions that provide design advantages on an aggressive process with manufacturability considerations. We have received tremendous positive market feedback and are looking forward to expanding our leadership in the advanced process technology space.”

Process design kits (PDK) for 14LPU and 10LPU process technologies will be available during the second quarter of 2017.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $88.3 billion for the third quarter of 2016, marking the industry’s highest-ever quarterly sales and an increase of 11.5 percent compared to the previous quarter. Sales for the month of September 2016 were $29.4 billion, an increase of 3.6 percent over the September 2015 total of $28.4 billion and 4.2 percent more than the previous month’s total of $28.2 billion. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor market has rebounded markedly in recent months, with September showing the clearest evidence yet of resurgent sales,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The industry posted its highest-ever quarterly sales total, with most regional markets and semiconductor product categories contributing to the gains. Indications are positive for increased sales in the coming months, but it remains to be seen whether the global market will surpass annual sales from last year.”

Regionally, month-to-month sales increased in September across all markets: China (5.4 percent), the Americas (4.6 percent), Asia Pacific/All Other (4.2 percent), Japan (2.3 percent), and Europe (1.6 percent). Compared to the same month last year, sales in September increased in China (12.0 percent), Japan (4.2 percent), and Asia Pacific/All Other (1.7 percent), but decreased in the Americas (-2.4 percent) and Europe (-4.0 percent).

China stood out in September, leading all regional markets with growth of 5 percent month-to-month and 12 percent year-to-year,” Neuffer said. “Standouts among semiconductor product categories included NAND flash and microprocessors, both of which posted solid month-to-month growth in September.”

September 2016

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.43

5.68

4.6%

Europe

2.71

2.76

1.6%

Japan

2.74

2.80

2.3%

China

8.99

9.47

5.4%

Asia Pacific/All Other

8.37

8.73

4.2%

Total

28.24

29.43

4.2%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.82

5.68

-2.4%

Europe

2.87

2.76

-4.0%

Japan

2.69

2.80

4.2%

China

8.45

9.47

12.0%

Asia Pacific/All Other

8.58

8.73

1.7%

Total

28.41

29.43

3.6%

Three-Month-Moving Average Sales

Market

Apr/May/Jun

Jul/Aug/Sept

% Change

Americas

4.94

5.68

15.0%

Europe

2.68

2.76

3.0%

Japan

2.53

2.80

10.8%

China

8.29

9.47

14.2%

Asia Pacific/All Other

7.97

8.73

9.5%

Total

26.41

29.43

11.5%

Qualcomm to acquire NXP


October 27, 2016

Qualcomm Incorporated (NASDAQ:  QCOM) and NXP Semiconductors N.V. (NASDAQ:  NXPI) today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.  According to Qualcomm’s official press release, a subsidiary of Qualcomm will commence a tender offer to acquire all of the issued and outstanding common shares of NXP for $110.00 per share in cash, representing a total enterprise value of approximately $47 billion.

NXP is a developer of high-performance, mixed-signal semiconductor electronics, with products and solutions and leadership positions in automotive, broad-based microcontrollers, secure identification, network processing and RF power.  As a semiconductor solutions supplier to the automotive industry, NXP also has leading positions in automotive infotainment, networking and safety systems, with solutions designed into 14 of the top 15 infotainment customers in 2016.  NXP has a broad customer base, serving more than 25,000 customers through its direct sales channel and global network of distribution channel partners.

“With innovation and invention at our core, Qualcomm has played a critical role in driving the evolution of the mobile industry.  The NXP acquisition accelerates our strategy to extend our leading mobile technology into robust new opportunities, where we will be well positioned to lead by delivering integrated semiconductor solutions at scale,” said Steve Mollenkopf, CEO of Qualcomm Incorporated.  “By joining Qualcomm’s leading SoC capabilities and technology roadmap with NXP’s leading industry sales channels and positions in automotive, security and IoT, we will be even better positioned to empower customers and consumers to realize all the benefits of the intelligently connected world.”

The combined company is expected to have annual revenues of more than $30 billion, serviceable addressable markets of $138 billionin 2020 and leadership positions across mobile, automotive, IoT, security, RF and networking.  The transaction has substantial strategic and financial benefits:

  • Complementary technology leadership in strategically important areas: The transaction combines leadership in general purpose and automotive grade processing, security, automotive safety sensors and RF; enabling more complete system solutions.
    • Mobile: A leader in mobile SoCs, 3G/4G modems and security.
    • Automotive: A leader in global automotive semiconductors, including ADAS, infotainment, safety systems, body and networking, powertrain and chassis, secure access, telematics and connectivity.
    • IoT and Security: A leader in broad-based microcontrollers, secure identification, mobile transactions, payment cards and transit; strength in application processors and connectivity systems.
    • Networking: A leader in network processors for wired and wireless communications and RF sub-segments, Wave-2 11ac/11ad, RF power and BTS systems.
  • Enhanced go-to-market capabilities to serve our customers:  The combination of Qualcomm’s and NXP’s deep customer and ecosystem relationships and distribution channels enables the ability to deliver leading products and platforms at scale in mobile, automotive, IoT, industrial, security and networking.
  • Shared track record of innovation and commitment to operational discipline: Both companies have demonstrated a strong commitment to technology leadership and best-in-class product portfolios with focused investments in R&D.  Qualcomm and NXP have both taken action to position themselves for profitable growth, while maintaining financial and operational discipline.  
  • Substantial financial benefits: Qualcomm expects the transaction to be significantly accretive to non-GAAP EPS immediately upon close.  Qualcomm expects to generate $500 million of annualized run-rate cost synergies within two years after the transaction closes.  The transaction utilizes Qualcomm’s strong balance sheet and will be efficiently financed with offshore cash and new debt. The transaction structure allows tax efficient use of offshore cash flow and enables Qualcomm to reduce leverage rapidly.

Mollenkopf continued, “We have taken significant action to build a foundation for profitable growth and the acquisition of NXP is strongly aligned with our strategy.  Our companies both have substantial expertise in delivering industry-leading solutions to our global customers, built upon a shared commitment to technology innovation, focused R&D investments and strong financial and operational discipline.”

“The combination of Qualcomm and NXP will bring together all technologies required to realize our vision of secure connections for the smarter world, combining advanced computing and ubiquitous connectivity with security and high performance mixed-signal solutions including microcontrollers. Jointly we will be able to provide more complete solutions which will allow us to further enhance our leadership positions, and expand the already strong partnerships with our broad customer base, especially in automotive, consumer and industrial IoT and device level security,” said Rick Clemmer, NXP Chief Executive Officer. “United in a common strategy, the complementary nature of our technologies and the scale of our portfolios will give us the ability to drive an accelerated level of innovation and value for the whole ecosystem. Such a strong fit will bring opportunities for our employees and customers, as well as provide immediate attractive value for our shareholders, in creating the semiconductor industry powerhouse.”

Sir Peter Bonfield, Chairman of NXP’s Board of Directors, said, “This is a major step in my ten years’ Chairmanship of NXP, and I am very pleased to see that the board of NXP has unanimously approved the proposed transaction and fully supports and recommends the offer for acceptance to NXP shareholders.”

Gigaphoton Inc., a manufacturer of light sources used in lithography, has announced success in achieving a world record 5% conversion efficiency with 100W of average output in stable operation and a high duty rate of 95%. This comes as a result of perfecting a pilot light source1 designed for operation in semiconductor mass production lines that utilize Laser-Produced Plasma (LPP) light sources for EUV scanners, which the company is currently engaged in developing.

To date, Gigaphoton has developed a number of innovative technologies and improvements, which include sub 20 μm micro droplet supply technology; a high luminous-quality main pulse beam that combines an improved solid-state pre-pulse laser with a newly introduced Mitsubishi Electric product designated as a high frequency discharge excitation-type three-axis orthogonal CO2 laser amplifier; improvements in energy control technology; and a debris removal technology developed by Gigaphoton that operates via magnetic fields. These advancements have all contributed to accomplishing 130W or better continuous operation on a prototype machine, an achievement announced earlier this year in July. This latest pilot light source incorporates these new technologies in a system designed based on the assumption of integrating an EUV scanner.

The pilot light source has successfully achieved 5% conversion efficiency with 105W of average output in stable operation and a high duty rate of 95% (a rate that measures light emission time versus operating time), which is a more demanding workload than the prototype underwent. This is in line with the 100W average output that governs throughput in semiconductor production, and is considered a performance level that exceeds the requirements of users today. The success achieved in this operational demonstration confirms that the realization of cutting edge semiconductor production lines is just around the corner.

Hakaru Mizoguchi, Vice President & CTO of Gigaphoton says, ”Our success in achieving a world record 5% conversion efficiency while attaining a 100W average output in stable operation and high duty rate of 95% with our pilot light source―which is designed to operate in state-of-the-art semiconductor mass production lines―shows that we are very close to the market introduction stage for EUV light sources that will be capable of delivering stable operation, high output, and low running costs. We are confident that Gigaphoton’s advanced technological capabilities and development efforts will not only accelerate the development of EUV scanners for mass production, which is the next generation of technology in lithography, but will also support overall development in the semiconductor industry and contribute to the realization of an IoT based society.”

Less than a micrometre thin, bendable and giving all the colours that a regular LED display does, it still needs ten times less energy than a Kindle tablet. Researchers at Chalmers University of Technology have developed the basis for a new electronic “paper”. Their results were recently published in the high impact journal Advanced Materials.

Chalmers' e-paper contains gold, silver and PET plastic. The layer that produces the colours is less than a micrometre thin. Credit: Mats Tiborn

Chalmers’ e-paper contains gold, silver and PET plastic. The layer that produces the colours is less than a micrometre thin. Credit: Mats Tiborn

When Chalmers researcher Andreas Dahlin and his PhD student Kunli Xiong were working on placing conductive polymers on nanostructures, they discovered that the combination would be perfectly suited to creating electronic displays as thin as paper. A year later the results were ready for publication. A material that is less than a micrometre thin, flexible and giving all the colours that a standard LED display does.

“The ‘paper’ is similar to the Kindle tablet”, says Andreas Dahlin. “It isn’t lit up like a standard display, but rather reflects the external light which illuminates it. Therefore it works very well where there is bright light, such as out in the sun, in contrast to standard LED displays that work best in darkness. At the same time it needs only a tenth of the energy that a Kindle tablet uses, which itself uses much less energy than a tablet LED display”.

It all depends on the polymers’ ability to control how light is absorbed and reflected. The polymers that cover the whole surface lead the electric signals throughout the full display and create images in high resolution. The material is not yet ready for application, but the basis is there. The team has tested and built a few pixels. These use the same red, green and blue (RGB) colours that together can create all the colours in standard LED displays. The results so far have been positive, what remains now is to build pixels that cover an area as large as a display.

“We are working at a fundamental level but even so, the step to manufacturing a product out of it shouldn’t be too far away. What we need now are engineers”.

One obstacle today is that there is gold and silver in the display, which makes the manufacturing expensive.

“The gold surface is 20 nanometres thick so there is not that much gold in it”, says Andreas Dahlin. “But at present there is a lot of gold wasted in manufacturing it. Either we reduce the waste or we find another way to decrease the manufacturing cost”.

Andreas Dahlin thinks the best application for the displays will be well-lit places such as outside or in public places to display information. This could reduce the energy consumption and at the same time replace signs and information screens that aren’t currently electronic today with more flexible ones.