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carbon nanotube UCRThe atom-sized world of carbon nanotubes holds great promise for a future demanding smaller and faster electronic components. Nanotubes are stronger than steel and smaller than any element of silicon-based electronics—the ubiquitous component of today’s electrical devices—and have better conductivity, which means they can potentially process information faster while using less energy.

The challenge has been figuring out how to incorporate all those great properties into useful electronic devices. A new discovery by four scientists at the University of California, Riverside has brought us closer to the goal. They discovered that by adding ionic liquid—a kind of liquid salt—they can modify the optical transparency of single-walled carbon nanotube films in a controlled pattern.

“It was a discovery, not something we were looking for,” said Robert Haddon, director of UC Riverside’s Center for Nanoscale Science and Engineering. Scientists Feihu Wang, Mikhail Itkis and Elena Bekyarova were looking at ways to improve the electrical behavior of carbon nanotubes, and as part of their research they also looked at whether they could modulate the transparency of the films. An article about their findings was published online in April in Nature Photonics.

The scientists spent some time trying to affect the optical properties of carbon nanotube films with an electric field, with little success, said Itkis, a research scientist at the Center for Nanoscale Science and Engineering.

“But when we applied a thin layer of an ionic liquid on top of the nanotube film we noticed that the change of transparency is amplified 100 times and that the change in transparency occurs in the vicinity of one of the electrodes, so we started studying what causes these drastic changes and how to create transparency in controlled patterns,” Itkis said.

An ionic liquid contains negative and positive ions which can interact with the nanotubes, dramatically influencing their ability to store an electrical charge. That increases or decreases their transparency, similar to the way that glasses darken in sunlight. By learning how to manipulate the transparency, scientists may be able to start incorporating nanotube films into products that now rely on slower or heavier components, such as metal oxide.

For instance, using nanotube films meshed with a film of ionic liquid, scientists could create more cost effective Smart Windows, that darken when it’s hot outside and become lighter when it’s cold.

“Smart Windows are a new industry that has been shown to save 50 percent of your energy costs,” said Itkis. “On a very hot day you can shade your window just by turning a switch, so you don’t have to use as much air conditioning. And on a winter day, you can make a window more transparent to let in more light.”

The scientists still need to study the economic viability of using nanotube film, but Bekyarova said one possible advantage would be that carbon nanotubes are ultra thin—about 1,000 times smaller than a single strand of hair—so you would need very little to cover a large area, such as the windows of a large building.

Itkis said nanotube films also hold great promise in building lighter and more compact analytical instruments such as spectrometers, which are used to analyze the properties of light.

In this application, a nanotube film with an array of electrodes can be used as an electrically configurable diffraction grating for an infrared spectrometer, allowing the wavelength of light to be scanned without moving parts.

Furthermore, by using addressable electrodes, the spatial pattern of the induced transparency in the nanotube film can be modified in a controlled way and used as an electrically configurable optical media for storage and transfer of information via patterns of light.

Carbon nanotubes have great potential, but there is still plenty of work to be done to make them useful in electronics and optoelectronics, Haddon said.

“The challenge is to harness their outstanding properties,” he said.  “They won’t be available at Home Depot next week, but there is continuing progress in the field.”

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.

Intel low-power, high-performance Silvermont

The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company’s leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

The Silvermont microarchitecture delivers industry-leading performance-per-watt efficiency. The highly balanced design brings increased support for a wider dynamic range and seamlessly scales up and down in performance and power efficiency. On a variety of standard metrics, Silvermont also enables ~3x peak performance or the same performance at ~5x lower power over the current-generation Intel Atom processor core.

Intel’s Silvermont microarchitecture was designed and co-optimized with Intel’s 22nm SoC process using revolutionary 3-D Tri-gate transistors. By taking advantage of this industry-leading technology, Intel is able to provide a significant performance increase and improved energy efficiency.

Additional highlights of the Silvermont microarchitecture include:

  • A new multi-core and system fabric architecture scalable up to eight cores and enabling greater performance for higher bandwidth, lower latency and more efficient out-of-order support for a more balanced and responsive system.
  • New IA instructions and technologies bringing enhanced performance, virtualization and security management capabilities to support a wide range of products. These instructions build on Intel’s existing support for 64-bit and the breadth of the IA software installed base.
  • Enhanced power management capabilities including a new intelligent burst technology, low- power C states and a wider dynamic range of operation taking advantage of Intel’s 3-D transistors. Intel Burst Technology 2.0 support for single- and multi-core offers great responsiveness scaled for power efficiency.

"Through our design and process technology co-optimization we exceeded our goals for Silvermont," said Belli Kuttanna, Intel Fellow and chief architect. "By taking advantage of our strengths in microarchitecture development and leading-edge process technology, we delivered a technology package that enables significantly improved performance and power efficiency – all while delivering higher frequencies. We’re proud of this accomplishment and believe that Silvermont will offer a strong and flexible foundation for a range of new, low-power Intel SoCs."

Architecting across a spectrum of computing

Silvermont will serve as the foundation for a breadth of 22nm products expected in market later this year. The performance-per-watt improvements with the new microarchitecture will enable a significant difference in performance and responsiveness for the compute devices built around these products.

Intel’s quad-core "Bay Trail" SoC is scheduled for holiday 2013 tablets and will more than double the compute performance capability of Intel’s current-generation tablet offering1. Due to the flexibility of Silvermont, variants of the "Bay Trail" platform will also be used in market segments including entry laptop and desktop computers in innovative form factors.

Intel’s "Merrifield" is scheduled to ship to customers by the end of this year. It will enable increased performance and battery life over current-generation products1 and brings support for context aware and personal services, ultra-fast connections for Web streaming, and increased data, device and privacy protection.

Intel’s "Avoton" will enable energy efficiency and performance-per-watt for microservers2, storage and scale out workloads in the data center. "Avoton" is Intel’s second-generation Intel Atom processor SoC to provide full server product capability that customers require including 64-bit, integrated fabric, error code correction, Intel virtualization technologies and software compatibility. "Rangeley" is aimed at the network and communication infrastructure, specifically for entry-level to mid-range routers, switches and security appliances. Both products are scheduled for the second half of this year.

Concurrently, Intel is delivering industry-leading advancements on its next-generation, 22nm Haswell microarchitecture for Intel Core processors to enable full-PC performance at lower power levels for innovative "2-in-1" form factors, and other mobile devices available later this year. Intel also plans to refresh its line of Intel Xeon processor families across the data center on 22nm technology, delivering better performance-per-watt and other features.

"By taking advantage of both the Silvermont and Haswell microarchitectures, Intel is well positioned to enable great products and experiences across the full spectrum of computing," Perlmutter said.

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.

Suppliers that had significant sales to Apple occupied the Top 4 MEMS microphone ranks in 2012, according to an IHS iSuppli MEMS and Sensors Special Report from information and analytics provider IHS. These companies were No. 1 Knowles Electronics from Illinois, AAC of China in second place, Massachusetts-based Analog Devices in the third spot, and Goertek of China in fourth. Together the Top 4 players last year commanded combined revenue of $513 million, equivalent to 88 percent of total MEMS microphone industry revenue of $583 million, as shown in the table below.

top MEMS microphone suppliers

 Apple gets on the mic

“Microphones continue to be one of the best success stories in MEMS, with mobile device manufacturers adding increasing numbers of these devices to their phones to support advanced features, such as voice command and noise suppression,” said Jérémie Bouchaud, director and senior principal analyst for MEMS and sensors at IHS. “Multiple microphones now are being adopted in smartphones to cancel ambient sounds—crucial for handsets when carrying out voice command systems, such as Apple’s Siri. Apple has led the way in the adoption of MEMS microphone technology and has steadily added the number of devices used in each of its mobile products, compelling competitors to follow suit.”

While midrange to high-end smartphones mostly used two microphones in 2010 and 2011, three microphones are fast becoming standard ever since Apple introduced a third device on the back of the iPhone 5 for high-definition video recording, Bouchaud noted.

Noise suppression and voice commands also are seeing increased adoption in tablets and Ultrabooks, resulting in the use of multiple microphones as ultrasonic transducers for hand-gesture commands.

Aside from handsets, MEMS microphones are used in other important applications such as headsets, gaming, cameras, televisions and hearing aids.

The top suppliers, in a nutshell

Knowles continued to dominate the MEMS microphone sphere, outflanking all other suppliers with revenue last year of $291 million—practically half of the industry total. But while it has the most comprehensive product portfolio and ships to virtually every original equipment manufacturer, Knowles has seen its MEMS microphone market share tumble by 16 percentage points from 2011 to 2012 because of erosion in its business with Apple. Knowles is still the first supplier for the iPad mini, but has slipped to second place behind AAC in providing MEMS microphones for the iPhone.

Knowles, however, has exerted efforts to remain competitive, reducing the size of its MEMS die and most likely migrating soon to larger wafer sizes from 6 to 8 inches as it engages with new foundry partners.

No. 2 and No. 4 AAC and Goertek share similar profiles, both being Chinese electret condenser microphone (ECM) suppliers that now rely almost exclusively on MEMS die technology from Germany’s Infineon Technologies. AAC is the top source for the iPhone and iPad 3 with revenue last year of $98 million, while Goertek is No. 1 for iPhone headsets with $46 million in revenue. Apple was the biggest client in both cases, supplying more than 40 percent of MEMS microphone revenue in 2012 for each company.

Third-ranked Analog Devices basked in revenue of approximately $78 million, thanks to its role as lone supplier of the third microphone for the iPhone 5 and the iPad. The company focuses on high-performance parts and sells at significantly higher prices than other suppliers, accounting for its third-place finish overall.

Infineon’s strategy

Also in a notable development, Infineon has hit upon a successful formula for operating in the market. The German manufacturer focuses only on silicon, developing and then selling MEMS microphone dies as well as application-specific integrated circuits to traditional ECM companies, which then package the chips into MEMS microphones that are sold afterward under their individual brands. Infineon’s customers include AAC and Goertek, as well as two other Top 12 MEMS microphone suppliers—sixth-ranked Hosiden of Japan; and No. 7 BSE of South Korea.

STMicroelectronics on the rise

Rounding out the Top 5 and becoming a serious challenger last year to the incumbents was French-Italian manufacturer STMicroelectronics, which sold 60 million MEMS microphone units in 2012, up from zero in 2010.

Unlike AAC and Goertek that buy their MEMS dies from Infineon, STM sources from Omron Electronics in Japan and also relies on its own application-specific integrated circuit, producing innovatively assembled MEMS microphones that enable a high signal-to-noise ratio. Nokia is STM’s top customer, but STM also supplies product to HTC, Amazon’s Kindle tablet as well as laptops from HP, Dell, Lenovo and Asus.

The other ranking suppliers in the Top 12 provided MEMS microphones for a range of other electronic devices made by companies besides Apple. Hosiden supplied to Nintendo handheld game players and Sony handsets; BSE provided for Samsung and LG smartphones; Germany’s Bosch played mostly in the laptop segment for HP and Dell; and Scotland-based Wolfson Microelectronics broke through at the end of last year by supplying to the Microsoft Surface tablet.

New kids on the MEMS block

The newcomers to watch included a clutch of Chinese companies. Among them were startups NeoMEMS and MEMSensing, as well as ECM manufacturers Gettop, XingGang and Kingstate. Other new entrants of note besides the Chinese included TDK-EPC from Germany, Solid State Systems from Taiwan, and Tokyo-based New Japan Radio.

Panasonic of Japan shipped MEMS microphones in 2007 for a limited time like fellow Japanese maker Yamaha, but then exited the market due to high costs. While the company had planned to return in 2011 with new product offerings, IHS believes that Panasonic has given up altogether on the MEMS microphone market.

China rose to the top of the PC market for the first time ever on an annual basis last year, relegating the United States to second place with a lead of more than 3 million units, according to an IHS iSuppli PC Dynamics Market Brief from information and analytics provider IHS.

PC shipments in 2012 to China amounted to 69 million units, exceeding the 66 million total reached by the United States. Only a year earlier in 2011, the United States was the leading global destination for PCs.

Beyond its large size, China’s PC market exhibits distinct characteristics that set it apart from the computer trade elsewhere, possessing a vast untapped rural market and unique consumer-purchasing patterns. While desktop PC shipments lagged notebooks around the world, the two PC segments were on par in China in 2012, with an even 50-50 split, as shown in the table below.

China PC shipments

“The equal share of shipments for desktops and notebooks in China is unusual, since consumers in most regions today tend to prefer more agile mobile PCs, rather than the bulky, stationary desktops,” said Peter Lin, senior analyst for compute platforms at IHS. “The relatively large percentage of desktop PC shipments in China is due to huge demand in the country’s rural areas, which account for a major segment of the country’s 1.34 billion citizens. These consumers tend to prefer the desktop form factor.”

The market will change gradually as desktop PCs face rising competition from the high value proposition presented by notebooks. Notebooks will then surpass desktops in the country by 2014, tracking more closely with the worldwide desktop-to-notebook PC ratio of 36 to 64 percent.

The desktop vs. notebook pattern of consumption in China is only one example of the distinctive hallmarks of the country’s dynamic PC market. In another indicator, China also has approximately a 50-50 proportion in consumer vs. commercial PCs, compared to the 65-35 percent ratio for the rest of the world.

A third pattern unique to the China PC market is the preferred notebook display size of 14 inches, which accounts for more than 70 percent of notebook PC shipments in the country. For the rest of the world, the 14-inch makes up less than 30 percent.

A fourth pattern of note is the attach rate of PCs with a pre-installed operating system, especially for notebooks. While mature PC markets in other parts of the world claim a 90 percent attach rate, the proportion for China comes out to lower than 50 percent, with the ratio even lower in the desktop PC market.

Despite such exclusive behavior, the China PC space shares one common trait with the worldwide PC market. Like the rest of the world, demand in China remains weak as consumers migrate to using mobile devices like cellphones. China’s PC market is projected to grow only by 3 to 4 percent this year.

Even so, a vast market opportunity continues to exist for PCs in the country, in the form of potential first-time buyers mostly residing in the countryside. The government already plans this year to invest some 40 trillion yuan—equivalent to some $6.4 trillion—to build rural infrastructure in the next 10 years, and PC original equipment manufacturers can take advantage of the initiative to build out and expand from the cities, IHS believes.

China is also on track to retain its position as the largest PC market in the world for the foreseeable future unchallenged and alone—further providing PC brands a rare opportunity for expansion, counter to the myriad travails they face in the rest of the world.

The emerging market for Silicon Carbide (SiC) and Gallium Nitride (GaN) power semiconductors is forecast to grow a remarkable factor of 18 during the next 10 years, energized by demand from power supplies, photovoltaic (PV) inverters and industrial motor drives.

Worldwide revenue from sales of SiC and GaN power semiconductors is projected to rise to $2.8 billion in 2012, up from just $143 million in 2012, according to a new report entitled “The World Market for SiC & GaN Power Semiconductors – 2013 Edition” from IMS Research, now part of IHS. Market revenue is expected to rise by the double digits annually for the next decade, as shown in the figure below.

SiC and GaN power semiconductors

SiC Schottky diodes have been around for more than 10 years, with SiC metal-oxide semiconductor field-effect transistors (MOSFET), junction-gate field-effect transistors (JFET) and bipolar junction transistors (BJT) appearing in recent years. In contrast, GaN power semiconductors are only just appearing in the market.

GaN is a wide bandgap material that offers similar performance benefits to SiC but has greater cost-reduction potential. This price/performance advantage is possible because GaN power devices can be grown on silicon substrates that are larger and lower in cost compared to SiC.

“The key factor determining market growth will be how quickly GaN-on-silicon (Si) devices can achieve price parity and equivalent performance as silicon MOSFETs, insulated-gate bipolar transistors (IGBT) or rectifiers,” said Richard Eden, senior market analyst for power semiconductor discretes and modules at IHS. “IHS expects this will be achieved in 2019, driving the GaN power market to pass the $1 billion mark in 2022.”

SiC Schottky diode revenue exceeded $100 million in 2012, making it the best-selling SiC or GaN device currently. But even though SiC Schottky diode revenue is forecast to grow until 2015, it will decline when lower-priced 600-V GaN diodes become available. Still revenue will recover to approach $200 million by 2022, with sales concentrated at voltage ratings of 1200V and above.

By then, SiC MOSFETs are forecast to generate revenue approaching $400 million, overtaking Schottky diodes to become the best-selling SiC discrete power device type. Meanwhile, SiC JFETs and SiC BJTs are each forecast to generate less than half of SiC MOSFET revenues at that time, despite their likelihood of achieving good reliability, price and performance. End users now strongly prefer SiC MOSFETs, so vendors of SiC JFETs and BJTs have a major task ahead in educating their potential customers on the benefits of these technologies.

While IHS predicts strong growth for the SiC and GaN power semiconductor market in the years ahead, the forecast has been significantly reduced compared to the outlook from one year ago.

The main reason for the change is the reduced forecasts for shipments of equipment that use power components, resulting from today’s gloomier view of the global economy. SiC adoption forecasts also have been slashed because device prices are not falling as fast as originally assumed a year ago.

In contrast, industry confidence in GaN technology has increased, with more semiconductor companies announcing GaN development projects. For instance, Transphorm has become the first company to achieve JEDEC qualification for its GaN-on-Si devices.

Reinventing Intel


April 19, 2013

Intel logoIntel is looking to reinvent itself.

With PC shipments reportedly in free fall, the company reported a sharp decline in its quarterly profits last week, which isn’t surprising, given that the company’s PC chip division accounted for 64 percent of its total revenue and 89 percent of its operating income in 2012. The company reported net income to $2.05 billion, a decline of 25 percent from $2.74 billion in the period last year.  However, analysts at IHS believes Intel has the innovation to stay on top this year, but other reports from decision makers at the semiconductor chip giant have indicated that Intel might have something new up its sleeves.

Uncertain environment at Intel

Intel became the world’s largest semiconductor maker after developing a partnership with Microsoft, and together the two companies have dominated the PC industry for 25 years. But 2013 is proving to be treacherous for the PC industry. The previous IHS forecast predicted global PC shipments would rise by 3.4 percent in 2013. However, given the dismal results in the first quarter, it appears that shipments are unlikely to achieve growth for the year. IHS downgraded its forecast for worldwide PC shipments to be flat at best, but the market is more likely to suffer a 1 percent to 2 percent decline. This follows a dismal 2012, when global PC shipments decreased by 3.3 percent, the first decline in 12 years.

“The PC Industry is facing major challenges as it struggles to find a place in the consumer’s budget amid the rising popularity of the lower-priced media tablet,” said Craig Stice, senior principal analyst for compute platforms at IHS. “Windows 8 has yet to trigger a new PC replacement cycle. While there have been many new product introductions intended to revitalize the market, like the ultrathin mobile PCs and convertibles with touch screens, it seems consumers have yet to discover the return on investment for these higher-priced systems.”

For the most part, Intel reacted with great agility to weakening demand for its products, cutting down its inventories very rapidly in the fourth quarter of 2012 to avoid being stuck with excess stockpiles, according to IHS. The company in the fourth quarter was the most aggressive of all semiconductor suppliers in reducing its inventories, cutting them by 11 percent, or $585 million, compared to the third quarter of 2012—the largest decrease on a dollar basis of any chipmaker during the quarter. Intel’s inventory liquidation partly was due to a reduction in production as the company migrated to a new process technology for manufacturing its chips: 14nm lithography.

Sales of netbooks, a product Intel dominated with its Atom family of low-end processors, have been badly impacted by the downturn in the PC market as well as the growth in the media tablet.  Netbook shipments this year are forecast to amount to just 3.97 million units, down a gut-wrenching 72 percent from 14.1 million units in 2012.

The demand for Intel’s other big source of revenue, chips for computer servers, is evolving, too. Basic servers are relying more and more on cloud computing, creating opportunities for new competitors to develop cheaper designs as the simpler method drives down prices (and, ultimately and unfortunately, profit margins).

Mobile devices and an unexpected move: The surprising bet that could save Intel

Despite Intel’s travails, IHS says the company is expected to continue to maintain its leadership in the global semiconductor market at least through 2013. However, Intel is betting on investments in the mobile market and, surprisingly, pay-TV to carry it even further than that.

According to the New York Times, Intel had been criticized for its lethargic reaction to the rise in the mobile market. Intel in 2012 held a 5 percent share of the market for digital baseband and applications processors used in mobile phones and other mobile devices. Intel is pushing to expand this product line this year. Aside from its legacy Infineon business, Intel had seen some design win activity from its Atom product line in smartphones from Lenovo, Motorola and various Chinese brand OEMs. Furthermore, Intel has introduced its LTE platform.

“IHS expects Intel to continue to attempt to build off these early wins and ramp penetration in the mobile platform market—specifically in smartphones,” said Francis Sideco, senior director for consumer electronics and communications technologies at IHS. “However, even if Intel is successful in this area in 2013, it won’t enjoy rapid growth, but rather slow and steady progress. The company faces significant challenges because of the momentum and positioning of strong incumbents such as Qualcomm, which holds a market share in the mobile-phone semiconductor business that is currently seven times larger than Intel’s.”

However, its greatest departure is its plans for selling a television set-top box and subscription service, which Intel officials say will offer enough regular television content to serve as a substitute for a cable subscription. Variety magazine’s Andrew Wallenstein recently spoke with Erik Huggers, head of Intel Media, the company’s most secretive division, to get the inside scoop on what Intel plans to offer.  Huggers didn’t reveal much to Wallenstein, but here’s what we know:

  • Intel intends to allow subscribers to purchase a package of broadcast and cable channels that will be supplemented by various VOD options. The package will also be available across mobile devices.
  • Intel will not be offering a la carte channels. The programming partners (such as Time Warner, News Corp., Disney, Viacom, etc.) will never go for that. But Intel has also hinted there might be more flexibility in the bundles of channels offered, as opposed to what consumers get with basic cable.
  • Intel has also made clear that its new device is not expected to come in at a lower price point than most other pay-TV services. Instead, what will make Intel’s device unique is a user experience that is “touted as a quantum leap over the traditional multichannel set-ups that have been rendered anachronistic by innovators like Apple and Netflix.”
  • Intel has confirmed that the device will come with a camera that will recognize which viewer in a household is watching so as to personalize the programming (and presumably advertising) to individual tastes. But don’t worry, the company made clear the feature can be turned off.

New Intel leadership could also play a role in its reinvention

And in the midst of the chaotic and uncertain technological revolution, Intel is also scrambling to find a new leader. In November, Paul Otellini, who had been CEO since 2005, caught everyone off guard when he announced his resignation, saying that it is time to transfer Intel’s helm to a new generation of leadership. Otellini declined to provide further information on why he was leaving just three years short of retirement age.

While Intel has yet to indicate a main candidate for the role, Chairman Andy Bryant may offer insight into what Intel is looking for. The New York Times reported that Bryant tells employees at meetings that Intel must fundamentally change, even if the computer chip maker still has what it takes to succeed in engineering and manufacturing.

BeSpoon, a fabless semiconductor company, and CEA-Leti have demonstrated an IR-UWB integrated circuit able to measure distances within a few centimeters’ accuracy, and have established a world-record operating range at 880m (standard regulation) and 3,641m (emergency situations).

IC world-record distance measurement

Impulse radio ultra-wideband (IR-UWB) is recognized as an ideal technology for indoor applications, both in terms of accuracy and robustness. It measures distances within a few centimeters’ precision and is not affected by walls or people passing by.

The BeSpoon and Leti collaboration overcame two challenges sometimes associated with this technology: the difficulty integrating it on a single chip and its perceived limited operating range.

The chip jointly designed by BeSpoon and Leti features a full-blown IR-UWB CMOS-integrated transceiver that is able to perform accurate distance measurements. The standalone chip (RF front-end and digital base band) is designed for a straightforward integration within smartphones or set-top boxes.

Furthermore, BeSpoon has demonstrated the capability to comply with the strict regulation of IR-UWB, and yet operate up to 880m in line of sight. A world record distance measurement has been established at 3,641 meters, in compliance with the regulation for emergency situations.

“Indoor location is only beginning and, very soon, robustness and precision will be key to offering great new services,” said Jean-Marie André, BeSpoon CEO. “Mobile geofencing is another exciting development of our technology.”

“This achievement capitalizes on the UWB expertise Leti has developed over the past 12 years,” said Laurent Malier, CEO of Leti. “The world record distance measurement is a major milestone in our partnership with BeSpoon, and a source of great satisfaction for the people involved in this collaboration.”

Leti is an institute of CEA, a French research-and-technology organization with activities in energy, IT, healthcare, defence and security. NEMS and MEMS are at the core of its activities. CEA-Leti operates 8,000-m² of state-of-the-art clean room space on 200mm and 300mm wafer platforms. It employs 1,700 scientists and engineers including 320 Ph.D. students and 200 assignees from partner companies. CEA-Leti owns more than 2,200 patent families.

 BeSpoon is a fabless semiconductor company, responsible for cracking the individual positioning problem. BeSpoon chips can track items or individuals within a few centimeters.

IBM announced plans on Thursday to invest $1 billion in flash memory research and development and launch a series of systems that will use solid state drives.

solid state drives and flash memory IBM

At an event in New York, IBM’s Steve Mills, head of IBM’s software and systems division, said Flash is at a key tipping point and IT will see all-solid state data centers sooner than later. 

Corporate servers have struggled to keep up with the substantial growth in data use from smartphones and tablets. IBM believes there is a solution in flash memory, which is faster, more reliable, and uses less power than a traditional hard disk drive. The $1 billion investment will be put to use in research and development to design, create and integrate new flash-based products in its expanding portfolio of servers, storage systems and middleware.

"The economics and performance of flash are at a point where the technology can have a revolutionary impact on enterprises, especially for transaction-intensive applications," said Ambuj Goyal, IBM’s general manager of systems storage. "The confluence of Big Data, social, mobile and cloud technologies is creating an environment in the enterprise that demands faster, more efficient, access to business insights, and flash can provide that access quickly."

IBM also announced the availability of the FlashSystem line of all-flash storage appliances. Sprint Nextel will be installing nine of these storage systems at its data center, becoming one of the first companies to adopt IBM’s flash-based model.

As part of its commitment to flash development, IBM said it plans to open 12 Centers of Competency around the globe, which will allow customers to run proof-of-concept scenarios with real-world data to measure the projected performance gains that can be achieved with IBM flash products.

"Clients will see first-hand how IBM flash solutions can provide real-time decision support for operational information, and help improve the performance of mission-critical workloads, such as credit card processing, stock exchange transactions, manufacturing and order processing systems," IBM said in a news release.

PC shipments fall, post worst quarter on recordIn another sign of the worldwide shift in preferred personal devices, PC shipments posted the steepest decline ever in a single quarter, according to the International Data Corporation Worldwide Quarterly PC Tracker (IDC).

Worldwide PC shipments totaled 76.3 million units in the first quarter of 2013, down -13.9 percent compared to the same quarter in 2012 and worse than the forecast decline of -7.7 percent, according to the IDC. Despite some mild improvements in the economic environment, PC shipments were down significantly across all regions compared to a year ago, marking the worst quarter reported since IDC began tracking the PC market in 1994. The results also marked the fourth consecutive quarter of year-on-year shipment declines.

The reduction in shipments isn’t entirely shocking, given the obvious cannibalization from tablets and smartphones. Smartphones shipments are expected to continue their historic rise at a rate of 24 percent CAGR from 2011 to 2016, according to Andy Oberst, Strategic Vice President of Qualcomm, and PC makers are collectively bracing for the change, as other indicators have risen throughout the past year. DRAM content growth is reported slowing, as slim notebooks have limited space for it, and tablets and smartphones have no use for it at all. Instead, its low-power variant, mobile DRAM, is seeing an increase. Additionally, the chip market outlook was downgraded in 2012, with the weak PC market mostly to blame.

"Although the reduction in shipments was not a surprise, the magnitude of the contraction is both surprising and worrisome," said David Daoud, IDC Research Director, Personal Computing. "The industry is going through a critical crossroads, and strategic choices will have to be made as to how to compete with the proliferation of alternative devices and remain relevant to the consumer. Vendors will have to revisit their organizational structures and go to market strategies, as well as their supply chain, distribution, and product portfolios in the face of shrinking demand and looming consolidation."

PC makers had pinned their hopes on the launch of Microsoft’s Windows 8 OS, which is a complete overhaul of the operating system with touch-screen capabilities. Unfortunately, these new shipment trends are indicating that the upgraded operating system has not had the desired effect on consumers.

Bob O’Donnell, IDC Program Vice President, believes it is clear that Windows 8 not only failed to provide a positive boost, but also appears to have slowed the market.

"While some consumers appreciate the new form factors and touch capabilities of Windows 8, the radical changes to the UI, removal of the familiar Start button, and the costs associated with touch have made PCs a less attractive alternative to dedicated tablets and other competitive devices,” said O’Donnell. “Microsoft will have to make some very tough decisions moving forward if it wants to help reinvigorate the PC market."

Microsoft, at least in public, does not appear to be on the verge of making tough decisions at the moment, however. A Microsoft spokesperson told the Wall Street Journal that, along with their partners, they planned “to continue to bring even more innovation to market across tablets and PCs.”

Veredus Laboratories today announced that the current version of VereFlu detects the current subtype of H7N9 (Avian Flu) that is responsible for the flu outbreak in China. H7N9 is the latest mutation to cause concern and increased surveillance in the region. Launched in 2008 and built on the STMicroelectronics lab-on-chip platform, VereFlu run on Veredus’ VerePLEXTM biosystem is the market’s first test to integrate two powerful molecular biological applications, Polymerase Chain Reaction (PCR) and a microarray, onto a Lab-on-Chip platform.

Detect avian flu
Veredus uses STMicroelectronics’ lab-on-chip platform to detect avian flu.

VereFlu is a portable lab-on-chip application for rapid detection of all major influenza types at the point of need. Unlike existing diagnostic methods, VereFlu is a breakthrough molecular diagnostic test that can detect infection with high accuracy and sensitivity, within two hours, providing genetic information on the infection that traditionally could take days to weeks to learn. With its high level of automation, users outside the traditional lab environment can easily perform the tests at the point of need. In addition to the current H7N9 Avian Flu, VereFlu is proven to identify and differentiate human subtypes of Influenza A (H1, H3, H5, H7, H9) and B viruses, including the Avian Flu subtype H5N1, and the 2009 pandemic H1N1/2009, all in a single test.

“After learning of the outbreak in China, we have confirmed that our current VereFlu influenza panel is able to detect the subtype of H7N9 responsible for this outbreak in addition to other human flu A and B infections,” said Rosemary Tan, chief executive officer of Veredus. “This confirms our vision when we designed the panel for the need to have a multiplexed molecular test to detect not only the typical seasonal influenza subtypes but also novel emerging subtypes, including the current H7N9 subtype, capable of making the jump from animals to humans.”

Veredus specializes in the development, manufacture, and marketing of innovative multiplexed molecular solutions in the clinical, specialty, and custom testing markets based on STMicroelectronics’ proprietary Lab-on-Chip platform. The Lab-on-Chip platform, marketed as the VerePLEXTM biosystem, combines Micro-Electro-Mechanical-Systems (MEMS) with micro-fluidics to integrate multiplexed DNA amplification with microarray detection for rapid, cost-effective, and accurate analysis of biological materials.