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Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI. More than 26,000 professionals from the electronics manufacturing supply chain attend SEMICON West and the co-located Intersolar. The “Best of West” award was established to recognize new products moving the industry forward with technological developments in the electronics supply chain.

Selected from over 600 exhibitors, SEMI announced today that the following Best of West 2018 Finalists will be displaying their products on the show floor at Moscone Center from July 10-12:

  • Advantest: T5503HS2 Memory Tester— The T5503HS2 memory tester is the industry’s most productive test solution for the fastest memory devices available today as well as next-generation, super-high-speed DRAMs.  The new system’s flexibility extends the capabilities of the T5503 product family in the current “super cycle,” in which global demand for memories is skyrocketing. (South Hall Booth #1105)
  • BISTel: Dynamic Fault Detection (DFD®) – The DFD system offers full trace data coverage and eliminating the need for timely and costly modeling and set up. DFD® is also a bridge to smart factory manufacturing because it integrates seamlessly to legacy FDC systems meaning customers can access the most comprehensive, and accurate fault detection system on the market. (South Hall Booth 1811)
  • Rudolph Technologies: Dragonfly System with Truebump Technology– Rudolph’s Dragonfly System with Truebump Technology was designed to provide a complete solution for “total bump process control.” Using a unique approach, Truebump Technology combines 2D inspection and measurement information from image-based techniques with 3D data from separate high-precision and high-throughput laser-based techniques to deliver accurate and complete characterization at production-capable throughputs. (North Hall Booth #6170)

Congratulations to each of the Finalists. The Best of West Award winner will be announced during SEMICON West (www.semiconwest.org) on Wednesday, July 11, 2018.

About SEMI

SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

About Extension Media

Extension Media is a publisher of over 20 business-to-business magazines (including Solid State Technology), resource catalogs, newsletters and web sites that address high-technology industry platforms and emerging technologies such as chip design, embedded systems, software and infrastructure, intellectual property, architectures, operating systems and industry standards. Extension Media publications serve several markets including Electronics, Software/IT and Mobile/Wireless. Extension Media is a privately held company based in San Francisco, Calif. For more information, visit www.extensionmedia.com

IC Insights recently released its Update to its 2018 IC Market Drivers Report.  The Update includes IC Insights’ latest outlooks on the smartphone, automotive, PC/tablet and Internet of Things (IoT) markets.

The Update shows a final 2017 ranking of the top smartphone leaders in terms of unit shipments.  As shown in Figure 1, 9 of the top 12 smartphone suppliers were headquartered in China.  Two South Korean companies (Samsung and LG) and one U.S. supplier (Apple) were the other leaders.

Figure 1

Samsung and Apple dominated the smartphone market from 2015 through 2017.  In total, these two companies shipped 526 million smartphones and held a combined 35% share of the total smartphone market in 2016. Moreover, these two companies shipped over one-half billion smartphones (533 million) in 2017 with their combined smartphone unit marketshare increasing one point to 36%.

Samsung’s total smartphone unit sales were up by 2% in 2017 to 317 million units, slightly outpacing the total smartphone market that grew by 1%.  Meanwhile, orders for new Apple iPhones fell 7% in 2016, much worse than the 4% growth rate exhibited for the worldwide smartphone market.  However, Apple rebounded somewhat in 2017 with its total smartphone unit shipments being flat last year.

It appears that the up-and-coming Chinese producers like Huawei, OPPO, Vivo, and Xiaomi are giving a serious challenge to Samsung and Apple for smartphone marketshare.  It should be noted, however, that Samsung and Apple still hold a commanding share of the high-end smartphone segment—that is, smartphones priced more than $200.

The number four and five ranked smartphone suppliers on the list are owned by the same China-based parent company—BBK Electronics.  Combined handset unit shipments from these two companies were 213.1 million in 2017, just 2.7 million less than second-ranked Apple.

Overall, there was very little middle ground with regard to smartphone shipment growth rates among the top 12 suppliers in 2017.  As shown, four of the top 12 companies registered double-digit unit growth while the other eight companies logged 2% or less increases and four of those displayed a double-digit decline.  Three Chinese smartphone suppliers (Xiaomi, OPPO, and Vivo) saw their shipments surge at least 24% in 2017.  Xiaomi displayed the highest growth rate of any of the top-12 smartphone suppliers (73%). Meanwhile, another three Chinese suppliers (LeEco/Coolpad, ZTE, and TCL) saw their smartphone shipments fall by more than 20% last year.

Combined, the nine leading smartphone suppliers based in China shipped 626 million smartphones in 2017, an 11% increase from 565 million smartphones that these nine companies shipped in 2016. The top nine Chinese smartphone suppliers together held a 42% share of the worldwide smartphone market in 2017, up four points from the 38% share these companies held in 2016 and eight points better than the 34% combined share these companies held in 2015.

IC Insights projects smartphone shipments in 2018 will rise 2%, to 1.53 billion units.  Moreover, smartphone unit shipments are forecast to grow at low single-digit annual rates through 2021.

Cautious optimism


June 15, 2018

By Walt Custer

Updated global GDP forecast

The World Bank just updated its multiyear forecast for GDP growth both globally and by country (Chart 1).

It noted: “Despite recent softening, global economic growth will remain robust at 3.1 percent in 2018 before slowing gradually over the next two years, as advanced-economy growth decelerates and the recovery in major commodity-exporting emerging market and developing economies levels off.

“This outlook is subject to considerable downside risks. The possibility of disorderly financial market volatility has increased, and the vulnerability of some emerging market and developing economies to such disruption has risen. Trade protectionist sentiment has also mounted, while policy uncertainty and geopolitical risks remain elevated.”

Chart 1

Semiconductor growth outlook strong (Chart 2)

The WSTS updated its world semiconductor shipment forecast. This new forecast (endorsed by SIA) projects worldwide semiconductor sales will be a record $463 billion in 2018, a 12.4 percent increase from 2017. WSTS projects year-to-year increases across all regional markets for 2018.

Chart 2

This revised semiconductor forecast coupled with very robust global semiconductor capital equipment sales (Chart 3) paint a positive outlook for 2018.

Chart 3

Very strong end market growth in first quarter (Chart 4)

Based upon the combined 1Q’18 financial reports of 213 large, global OEMs, electronic equipment sales (consolidated into U.S. dollars) increased globally an estimated (and very robust) 10.6 percent in 1Q’18 vs. 1Q’17. While this world growth result is very heartening it was significantly inflated by exchange rate effects as stronger non-dollar currencies were converted into weaker dollars.

Chart 4

Looking at world electronic equipment sales consolidated into both dollars and euros, 1Q’18 growth rates are MUCH different (Chart 5). 1Q’18 vs.1Q’17 electronic equipment sales grew 10.6 percent in dollars but declined 4.3 percent in euros!

Chart 5

Certainly the first quarter was strong globally but the currency chosen for analysis can have a BIG effect.

U.S. supply chain expansion continues

Looking at the U.S. market (in dollars – therefore not distorted by exchange rates) domestic electronic equipment orders rose 6.7 percent in February-April 2018 versus the same three-month period in 2017. The U.S. electronic industry is doing reasonably well at present.

www.census.gov/manufacturing/m3/

Expect the recent exchange rate based amplification of dollar denominated global growth to taper off quickly.

Keep a careful watch on the geopolitical situation.

Walt Custer of Custer Consulting Group is an analyst focused on the global electronics industry.

Originally published on the SEMI blog.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $37.6 billion for the month of April 2018, an increase of 20.2 percent from the April 2017 total of $31.3 billion and 1.4 percent more than last month’s total of $37.1 billion. Monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, a newly released WSTS industry forecast projects annual global market growth of 12.4 percent in 2018 and 4.4 percent in 2019.

“The global semiconductor industry has posted consistently strong sales so far in 2018, and the global market has now experienced year-to-year growth of greater than 20 percent for 13 consecutive months,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Although boosted in part by impressive growth in the memory market, sales of non-memory products also grew by double digits in April on a year-to-year basis, and all major regional markets posted double-digit year-to-year gains. The global market is projected to experience significant annual growth this year, with more modest growth expected next year.”

Regionally, year-to-year sales increased in the Americas (34.1 percent), China (22.1 percent), Europe(21.4 percent), Japan (14.6 percent), and Asia Pacific/All Other (10.2 percent). Compared with last month, sales were up in China (3.2 percent), Japan (2.7 percent), Europe (1.4 percent), and the Americas (0.8 percent), but down slightly in Asia Pacific/All Other (-0.8 percent).

Additionally, SIA today endorsed the WSTS Spring 2018 global semiconductor sales forecast, which projects the industry’s worldwide sales will be $463.4 billion in 2018. This would mark the industry’s highest-ever annual sales, a 12.4 percent increase from the 2017 sales total. WSTS projects year-to-year increases across all regional markets for 2018: the Americas (14.0 percent), Europe (13.4 percent), Asia Pacific (including China) (12.3 percent), and Japan (8.6 percent). In 2019, growth in the semiconductor market is expected to moderate, with sales increases of between 4-5 percent expected across each of the regions. WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

For comprehensive monthly semiconductor sales data and detailed WSTS Forecasts, consider purchasing the WSTS Subscription Package. For information about the global semiconductor industry and market, check out SIA’s free 2018 Factbook.

Apr 2018

Billions

Month-to-Month Sales                              

Market

Last Month

Current Month

% Change

Americas

8.10

8.16

0.8%

Europe

3.58

3.63

1.4%

Japan

3.21

3.30

2.7%

China

11.98

12.36

3.2%

Asia Pacific/All Other

10.23

10.15

-0.8%

Total

37.09

37.59

1.4%

Year-to-Year Sales

Market

Last Year

Current Month

% Change

Americas

6.08

8.16

34.1%

Europe

2.99

3.63

21.4%

Japan

2.88

3.30

14.6%

China

10.12

12.36

22.1%

Asia Pacific/All Other

9.21

10.15

10.2%

Total

31.28

37.59

20.2%

Three-Month-Moving Average Sales

Market

Nov/Dec/Jan

Feb/Mar/Apr

% Change

Americas

8.63

8.16

-5.5%

Europe

3.40

3.63

6.6%

Japan

3.21

3.30

2.8%

China

12.01

12.36

2.9%

Asia Pacific/All Other

10.35

10.15

-1.9%

Total

37.60

37.59

0.0%

Applied Materials, Inc. today announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.

In the past, classic Moore’s Law scaling of a small number of easy-to-integrate materials simultaneously improved chip performance, power and area/cost (PPAC). Today, materials such as tungsten and copper are no longer scalable beyond the 10nm foundry node because their electrical performance has reached physical limits for transistor contacts and local interconnects. This has created a major bottleneck in achieving the full performance potential of FinFET transistors. Cobalt removes this bottleneck but also requires a change in process system strategy. As the industry scales structures to extreme dimensions, the materials behave differently and must be systematically engineered at the atomic scale, often under vacuum.

To enable the use of cobalt as a new conducting material in the transistor contact and interconnect, Applied has combined several materials engineering steps – pre-clean, PVD, ALD and CVD – on the Endura® platform. Moreover, Applied has defined an integrated cobalt suite that includes anneal on the Producer® platform, planarization on the Reflexion® LK Prime CMP platform and e-beam inspection on the PROVision platform. Customers can use this proven, Integrated Materials Solution to speed time-to-market and increase chip performance at the 7nm foundry node and beyond.

“Five years ago, Applied anticipated an inflection in the transistor contact and interconnect, and we began developing an alternative materials solution that could take us beyond the 10nm node,” said Dr. Prabu Raja, senior vice president of Applied’s Semiconductor Products Group. “Applied brought together its experts in chemistry, physics, engineering and data science to explore the broad portfolio of Applied’s technologies and create a breakthrough Integrated Materials Solution for the industry. As we enter the big data and AI era, there will be more of these inflections, and we are excited to be having earlier and deeper collaborations with our customers to accelerate their roadmaps and enable devices we never dreamed possible.”

While challenging to integrate, cobalt brings significant benefits to chips and chip making: lower resistance and variability at small dimensions; improved gapfill at very fine dimensions; and improved reliability. Applied’s integrated cobalt suite is now shipping to foundry/logic customers worldwide.

Applied Materials, Inc. (Nasdaq:AMAT) is a leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world.

Organic light-emitting diodes (OLEDs) truly have matured enough to allow for first commercial products in form of small and large displays. In order to compete in further markets and even open new possibilities (automotive lighting, head-mounted-displays, micro displays, etc.), OLEDs need to see further improvements in device lifetime while operating at their best possible efficiency. Currently, intrinsic performance progress is solely driven by material development.

This is a graphic about improving OLEDS on the nanoscale. Credit: Joan Rafols Ribé (UAB) and Paul Anton Will (TU Dresden)To

Now researchers from the Universitat Autònoma de Barcelona and Technische Universität Dresden demonstrate the possibility of using ultrastable film formation to improve the performance of state-of-the-art OLEDs. In their joint paper published in Science Advances with the title ‘High-performance organic light-emitting diodes comprising ultrastable glass layers’, the researchers show in a detailed study significant increases of efficiency and operational stability (> 15% for both parameters and all cases, significantly higher for individual samples) are achieved for four different phosphorescent emitters. To achieve these results, the emission layers of the respective OLEDs were grown as ultrastable glasses – a growth condition that allows for thermodynamically most stable amorphous solids.

This finding is significant, because it is an optimization which does neither involve a change of materials used nor changes to the device architecture. Both are the typical levers for improvements in the field of OLEDs. This concept can universally be explored in every given specific OLED stack, which will be equally appreciated by leading industry. This in particular includes thermally activated delayed fluorescence (TADF) OLEDs, which see a tremendous research and development interest at the moment. Furthermore, the improvements that, as shown by the researchers, can be tracked back to differences on the exciton dynamics on the nanoscale suggest that also other fundamental properties of organic semiconductors (e.g. transport, charge separation, energy transfer) can be equally affected.

A new class of adsorbent materials offer high capacity storage and safe delivery of dopant gases

BY J. ARNÓ, O.K. FARHA, W. MORRIS, P. SIU, G.M. TOM, M.H. WESTON, and P.E. FULLER, NuMat Technologies, Skokie, USA J. MCCABE, M. S. AMEEN, Axcelis Technologies, Beverly, MA

Metal-Organic Framework (MOF) materials are a new class of crystalline adsorbents with broad applicability in electronics materials storage, delivery, purification, and abatement. The adsorbents have unprecedented surface areas and uniform pore sizes that can be precisely customized to the specific properties of electronic gases. ION-X® is a sub-atmospheric dopant gas delivery system designed for ion implantation, and the first commercial product that uses MOFs (ION-X® is commercially available through an agreement between NuMat Technologies and Versum Materials). The performance of ION-X deliv- ering arsine (AsH3), phosphine (PH3), and boron triflu- oride (BF3) was evaluated in high current implanters at the Axcelis Advanced Technology Center and compared to the incumbent delivery systems. In-process and on-wafer results of the MOF-based dopant gases compared positively to conventional source gases. Flow, pressure, and beam stability were undistinguishable from conven- tional gas sources throughout the lifetime of the cylinder. Beam and wafer contamination levels (both surface and energetic) were below specification limits, matching the performance of the reference qualified products.

Dopant gas safety challenges

The storage and delivery of hazardous gases creates signif- icant environmental, health, and safety challenges. Their usage requires implementation of stringent safety control systems to minimize the risks of exposure to humans and the environment. The dangers associated with handling toxic gases are the result of both the inherent chemical hazard of the molecule and the kinetic energy stored in the vessel in the form of compression. In essence, the lethality of a toxic release is magnified exponentially by the energetic force of the high-pressure storage. Historically, one way to mitigate these risks was to dilute the hazardous material with inert gases in an effort to attenuate the toxicity effects. Depending on the concentration, this solution provides a safety factor improvement of 10 or 100 by virtue of reducing the molecular density of the hazardous gas to 10% or 1% mixtures, respectively. This approach is commonly used in the electronics manufacturing industry for gases that are known to have extreme toxicity. Hydride gases (i.e. arsine, phosphine, germane, or diborane) are examples of such highly toxic gases used as source materials in a number of electronic manufacturing processes. While this dilution method is effective at reducing the toxicity levels, these mixtures are typically produced at cylinder pressures significantly higher than the pressures of the pure toxic gases. In a release event, this solution reduces the lethality of the dose at the expense of a higher release rate.

In 1993, ATMI (now an Entegris company) introduced a different approach to reduce the toxic gas storage hazards [1]. The technology involves using nano-porous adsor- bents to condense the gas molecules onto their surfaces. This process effectively reduces the kinetic energy of the gas, thus reducing the pressure in the gas cylinder. The large available surface areas within these materials result in gas storage capacities comparable to the high-pressure cylinders. The intrinsic safety advantages of adsorbed gas cylinders are derived from the reduction in pressure within the cylinder. Typically, these vessels are filled to sub-atmospheric pressures (measured at room temperature) in order to inhibit an outward gas release in the event of a leak.

The first sub-atmospheric dopant gas delivery systems used zeolites (SDS® 1) while the second and third genera- tions (SDS® 2 and SDS® 3) evolved to activated carbon adsorbent materials. These gas cylinders store and deliver dopant precursor gases (primarily arsine, phosphine, and boron trifuoride) predominantly for ion implantation processes. In its third generation, and in order to further improve gas storage capacities, SDS 3 evolved by creating a highly dense monolithic adsorbent that nearly eliminated void volumes in the cylinder.

In this paper, we describe a new sub-atmospheric gas delivery system (ION-X ®) that uses a novel ultra-high surface area class of materials called metal-organic frame- works (MOFs). In addition, the implant process perfor- mance using the new product delivering arsine, phosphine, and boron trifluoride was evaluated in a major ion implant OEM facility will be described.

MOF overview: The next generation in nano- porous adsorbents

MOF are three-dimensional crystalline structures assembled with metal-containing nodes connected by organic links (FIGURE 1). The resulting highly organized molecular structures generate nano-pores with record surface areas [2-4]. In addition, the large number of available metal nodes and organic linkers provide unpar- alleled molecular design flexibility to tailor the chemical and physical properties of the adsorbent material to fit the application. Since their discovery in the early 1990’s, MOFs have evolved from an academic curiosity to a widely recognized new class of materials with practical applications in energy, specialty chemicals, military, medical, pharmaceutical, and electronics industries. MOFs are one of the fastest growing classes of materials, with thousands of experimental structures now being reported.

For gas storage and delivery applications, MOFs’ design flexibility provides advantages over traditional adsorbents (FIGURE 2). Pore size, surface area, and chemical stability can be tailored to the specific properties of the adsorbed gases. Compared to zeolites and activated carbon adsorbents, MOFs have significantly larger surface areas (up to 7,000m2/g has been reported[5]. This property, combined with bulk density, is critical in gas storage applications where capacity is measured in terms of vessel volume rather than adsorbent mass. Pore size tunability is also an important parameter in efforts to match the dimensions of the MOF cavities to the molecular sizes of the target adsorbates. This parameter impacts adsorption capacities (how much gas can be loaded) and desorption characteristics (how much can be delivered as a function of pressure). Unlike the broad pore size distributions found in activated carbon adsorbents, MOFs’ crystallinity results in more “usable” pores. This pore size uniformity also results in higher gas quality, as impurities are selectively size excluded.

Preventing reactions between the adsorbent and the target gas is extremely important in electronics applications. Adsorbent/gas interactions will contribute to gas decomposition, leading to impurities and unwanted dopant gas composition changes that could affect the process. The molecular composition of zeolites and carbon adsor- bents are limited to a few elements (typically carbon, aluminum, and silicon) and their oxides. MOFs, on the other hand, can be synthetized from a large range of organic and inorganic constituents, offering more options for creating stable gas/ adsorbent interactions.

MOF-based gas delivery system for ion implant gases ION-X (FIGURE 3) is a sub-atmospheric dopant gas storage and delivery system designed for ion implantation [6]. ION-X uses individual MOF structures with tailored pore sizes to effectively and reversibly adsorb arsine, phosphine, and boron trifluoride gases. The pressure in filled ION-X cylinders is below one atmosphere, significantly reducing the health and environmental impact of an accidental gas release. Furthermore, MOFs’ ultra-high surface areas and uniform structures provide capacity and deliverable advantages compared to existing carbon adsorbent-based products (FIGURE 4). It is important to note that the first-generation ION-X cylinders utilize granulated MOFs with similar adsorbent bulk density to the first-generation carbon product: for the same mass of adsorbent, MOFs provide 40% to 55% higher gas delivery by virtue of their superior surface area and pose size uniformity. Analogous to the evolution of SDS®2, MOF densification inside the cylinder will further increase the gas capacity in next-generation ION-X products.

Implant performance characterization

The performances of ION-X dopant delivery systems were recently evaluated using a PurionH 300 mm high current ion implanter at Axcelis’ Advanced Technology Center (Beverly, MA, USA). The test plan included flow, mass spectral, and metal contamination analyses (both at the surface and at implanted depth). The experiments were repeated using commercially available and well-estab- lished sub-atmospheric dopant gas sources in order to provide a basis for comparison.

Cylinder installation and setup was seamless, requiring no modifications to the existing gas box hardware or software. Flow rate stability for all three gases (AsH3, PH3, and BF3) was demonstrated in the 3.5 to 8 sccm ranges down to cylinder pressures of 20 torr (spec limit). For arsine, the flow experiment continued through a full cylinder depletion, showing a stable flow rate down to cylinder pressure below 3 torr.

The beam energy, purity, and stability were evaluated by analyzing the mass spectra generated during the implantation processes. In all cases, the target dose was 5 x 1015 at/cm2 with beam energies of 40 keV, 20 keV and 15 keV for As+, P+, and BF¬2+ ion implants respectively. The stability and purity of the target doping ion beams were within specifications and very similar to the ones produced by the reference gas sources. Based on the mass spectra, ION-X did not generate any impurities derived from either gas or MOF decomposition.

Neutral and energetic metal contamination levels were thoroughly investigated in this study. All metal analyses were performed by sampling wafers produced using the recipes described in the previous paragraph. Vapor Phase Decomposition-inductively coupled Plasma-Mass Spectrometry (VPD-ICP-MS) was used to monitor the contamination from key trace metals at the wafer surface. Particular attention was placed on monitoring zinc and iron, metals used in the hydride and BF3 ION-X MOF adsorbents respectively. Results show that all metal levels were within specification limits and compared well to the levels detected in control wafers. In all cases, zinc and iron surface contamination levels were below their corresponding detection limits of 0.03 and 0.05 x 1010 atoms/cm2.

Energetic metal contamination is of special interest in ion implantation as even low levels of impurities could affect the performance of the electronic devices. The depth profile of the metals used in ION-X’s MOFs composition were measured using Secondary Ion Mass Spectrometry (SIMS). Wafers used for SIMs analyses were doped using both ION-X and incumbent gas sources using the same ion implant tool and previously stated recipes. The zinc and iron metal concentration profiles for the hydride and boron implants were well within specifications and show no discernable differences between the incumbent and the MOF-based gas sources (FIGURE 5). These results, combined with the previous surface contamination tests, conclusively establish the gas and ion purity of the dopant species extracted from ION-X adsorbents. Moreover, the results are consistent with extensive gas analyses performed at NuMat after subjecting the MOF adsorbent materials to accelerated aging, vibration, and cycle testing.

Summary

This article provides process and on-wafer performance of ION-X, a new MOF-based dopant gas delivery system. The adsorbents used in these cylinders have surface areas, stability, purity, and pore sizes ideal for the storage and delivery of ion implant dopant gases. In-process and on-wafer performance of boron trifluoride, arsine, and phosphine dopant sources compared positively to conven- tional source gas cylinders. The issue of contamination was investigated in detail, demonstrating that the new adsorbents do not contribute to surface or energetic metal impurities. The results published in this article provide independent evaluation of the new product, supporting the safe use of this product in mainstream ion implant applications. To that end, ION-X is already qualified and being used at an electronics manufacturing site with confirmed high stability and purity performance.

References

  1. Olander, K. and Avila, A., “Subatmospheric Has Storage and Delivery: Past, Present, and Future”, Solid State Technology, Volume 57 (2014), pp 27-302.
  2. Y. Cui, B. Li, H. He, W. Zhou, B. Chen, and G. Qian, “Metal–Organic Frameworks as Platforms for Functional Materials,” Accounts of Chemical Research, vol. 49, pp. 483-493, 2016/03/15 2016.
  3. H. Furukawa, K. E. Cordova, M. O’Keeffe, and O. M. Yaghi, “The Chemistry and Applications of Metal-Organic Frameworks,” Science, vol. 341, 2013.
  4. P. Silva, S. M. F. Vilela, J. P. C. Tome, and F. A. Almeida Paz, “Multifunc- tional metal-organic frameworks: from academia to industrial applications,” Chemical Society Reviews, vol. 44, pp. 6774-6803, 2015.
  5. Omar K Farha et al., “Metal-Organic Framework Materials with Ultrahigh Surface Areas: Is the Sky the Limit?” J. Am. Chem. Soc. (2012), Vol. 134, pp 15016−15021
  6. G. M. Tom et al., “Utilization of Metal-Organic Frameworks for the Management of Gases Used in Ion Implantation”, 2016 21st International Conference on Ion ImplantationTechnology (IIT),Tainan, 2016, pp. 1-4.

IC Insights recently released its May Update to the 2018 McClean Report.  This Update included a look at the top-25 1Q18 semiconductor suppliers, a discussion of the 1Q18 IC industry market results, and an update of the 2018 capital spending forecast by company.

Overall, the capital spending story for 2018 is becoming much more positive as compared with the forecast presented in IC Insights’ March Update to The McClean Report 2018 (MR18).  In the March Update, IC Insights forecast an 8% increase in semiconductor industry capital spending for this year. However, as shown in Figure 1, IC Insights has raised its expectations for 2018 capital spending by six percentage points to a 14% increase.  If this increase occurs, it would be the first time that semiconductor industry capital outlays exceeded $100 billion.  The worldwide 2018 capital spending forecast figure is 53% higher than the spending just two years earlier in 2016.

Although Samsung says it still does not have a full-year capital spending forecast for this year it did say it will spend “less” in semiconductor capital outlays in 2018 as compared to 2017, when it spent $24.2 billion.  However, as of 1Q18, with regard to its capex, its “foot is still on the gas!”  Samsung spent $6.72 billion in capex for its semiconductor division in 1Q18, slightly higher than the average of the previous three quarters.  This figure is almost 4x the amount the company spent just two years earlier in 1Q16!  Over the past four quarters, Samsung has spent an incredible $26.6 billion in capital outlays for its semiconductor group. Wow!

IC Insights has estimated Samsung’s semiconductor group capital spending will be $20.0 billion this year, $4.2 billion less than it spent in 2017.  However, given the strong start to its spending this year, it appears there is currently more upside than downside potential to this forecast.

With the DRAM and NAND flash memory markets still very strong, SK Hynix is expected to ramp up its capital spending this year to $11.5 billion, 42% greater than the $8.1 billion it spent in 2017. The increased spending by SK Hynix this year will primarily focus on bringing on-line two large memory fabs—M15, a 3D NAND flash fab in Cheongju, South Korea and its expansion of its huge DRAM fab in Wuxi, China.  The Cheongju fab is being pushed to open before the end of this year.  The Wuxi fab is also targeted to open by the end of this year, a few months earlier than its original planned start date of early 2019.

Figure 1

By Walt Custer, Custer Consulting Group

Broad global & U.S. electronic supply chain growth

The first quarter of this year was very strong globally, with growth across the entire electronics supply chain. Although Chart 1 is based on preliminary data, every electronics sector expanded –  with many in double digits. The U.S. dollar-denominated growth estimates in Chart 1 have effectively been amplified by about 5 percent by exchange rates (as stronger non-dollar currencies were consolidated to weaker U.S. dollars), but the first quarter global rates are very impressive nonetheless.

Walt Custer Chart 1

U.S. growth was also good (Chart 2) with Quarter 1 2018 total electronics equipment shipments up 7.2 percent over the same period last year. Since all the Chart 2 values are based on domestic (US$) sales, there is no growth amplification due to exchange rates.

Walt Custer Chart 2

We expect continued growth in Quarter 2 but not at the robust pace as the first quarter.

Chip foundry growth resumes

Taiwan-listed companies report their monthly revenues on a timely basis – about 10 days after month end. We track a composite of 14 Taiwan Stock Exchange listed chip foundries to maintain a “pulse” of this industry (Chart 3).

Walt Custer Chart 3

Chip foundry sales have been a leading indicator for global semiconductor and semiconductor capital equipment shipments. After dropping to near zero in mid-2017, foundry growth is now rebounding.

Chart 4 compares 3/12 (3-month) growth rates of global semiconductor and semiconductor equipment sales to chip foundry sales. The foundry 3/12 has historically led semiconductors and SEMI equipment and is pointing to a coming cyclical upturn. It will be interesting to see how China’s semiconductor industry buildup impacts this historical foundry leading indicator’s performance.

Walt Custer Chart 4

Passive Component Shortages and Price Increases

Passive component availability and pricing are currently major issues. Per Chart 5, Quarter 1 2018 passive component revenues increased almost 25 percent over the same period last year. Inadequate component supplies are hampering many board assemblers with no short-term relief in sight.

Walt Custer Chart 5

Peeking into the Future

Looking forward, the global purchasing managers index (a broad leading indicator) has moderated but is still well in growth territory.

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The world business outlook remains positive but requires continuous watching!

Walt Custer of Custer Consulting Group is an  analyst focused on the global electronics industry.

Originally published on the SEMI blog.

Despite the low seasonality factor and brands turning their focus away from volume growth, the demand for large display panels showed better-than-expected results in the first quarter of 2018, albeit still weak, according to IHS Markit (Nasdaq: INFO).

First quarter of each year is typically a slow season for the display market as set brands try to clear out carried inventories before they launch new models in a new year. In addition, particularly this year, top-tier brands were expected to stop focusing on volume growth, which lowered market expectation on the panel demand.

However, shipments of large display panels posted better-than-expected results in the first quarter of 2018, according to Large Area Display Market Tracker by IHS Markit. Compared to a year ago, shipments of large displays — larger than 9 inches — increased by 6 percent in unit and by 10 percent in area.

LG Display retained its lead in the large display panel market in terms of area shipments with a stake of 22 percent, followed by Samsung Display with 17 percent, while, in terms of unit shipments, BOE led the market with a 22 percent share.

“In area shipments, South Korean panel makers keep their leading position in the large display market as they are strong in the TV display market,” said Robin Wu, principal analyst at IHS Markit.

Shipments of TV displays increased by 12 percent in unit and by 11 percent in area in the first quarter of 2018 compared to a year ago, leading to the better-than-expected trend. In particular, unit shipments of 55-inch and larger TV panels jumped 20 percent year on year in the first quarter. 4K TV display unit shipment also increased by 19 percent during the same period to 24.6 million units, and OLED TV display shipments reached some 600,000 units with 110 percent year-on-year growth.

051518_Large_area_display_unit_shipment_share_by_maker_in_Q1_2018 051518_Large_area_display_area_shipment_share_by_maker_in_Q1_2018

“Increases in large display panel production capacity, particularly in China, helped the year-on-year shipment growth, which was somewhat expected,” Wu said. “But, if you look at the shipment growth in a quarter-on-quarter term, it is quite interesting.”

For the past three years from 2015 to 2017, on average, unit shipments of large display declined 10 percent in the first quarters compared to the previous quarter, and area shipments were down 8 percent.

“This year also shows declines in the first quarter with a 4 percent drop in unit shipments and 7 percent down in area shipments, but the contraction is narrower than the previous years,” Wu said. “This indicates the shipment trend in first quarter 2018 was better than expected.”

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Wu noted, however, that shipments dropped 10 percent in value due to continued erosion in panel price, which began in mid- 2017.

“The major concerns to the panel makers is how to achieve a turnaround in panel prices and when,” Wu said. “Trends in TV display panels that are shifting to larger sizes and heading to higher-end products can be the key to overcome the challenge.”Wu noted, however, that shipments dropped 10 percent in value due to continued erosion in panel price, which began in mid- 2017.

The Large Area Display Market Tracker by IHS Markit provides information about the entire range of large display panels shipped worldwide and regionally, including monthly and quarterly revenues and shipments by display area, application, size and aspect ratio for each supplier.