May 30, 2012 – ACN Newswire — New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK
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May 29, 2012 — Growth in handheld, Internet-connected electronic devices — smartphones and tablets — and resurgent automotive demand are increasing IC demand. In turn, increased demand for product functionality is driving up IC packaging revenue faster — a 9.8% compound annual growth rate (CAGR) — than IC unit growth — 7.3% CAGR 2010-2016, says New Venture Research (NVR).
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Figure. IC device and packaging revenue forecast ($M), 2010-2016. SOURCE: New Venture Research. |
Handheld electronics will boost the growth of special purpose logic (SPL) communications chips by 16.7% CAGR revenue through 2016, versus 3.5% CAGR in units. Packages for mobile components are dominated by field-programmable gate array (FPGA) and quad flat-pack no-lead (QFN) designs. These 2 package structures are at opposite ends of the pricing structure. The third most popular packaging type, quad flat pack (QFP), is decreasing in usage over time. These devices are expected to have a 14.8% CAGR in revenue through 2016.
Wireless infrastructure products are also in high demand, which is helping boost consumption for standard cell and programmable logic device (PLD) chips. These devices will grow at a CAGR of 16.1% in terms of revenue through 2016, while the device units are projected at 15%. High I/O BGAs are the package of choice over the forecast period — package revenue growth is projected to be slightly higher, at 16.3% CAGR through 2016.
Logic chips are in demand for a host of products, pushing 32-bit MCUs to an 11.1% CAGR unit demand, although only 4.7% device revenue CAGR, through 2016. QFPs and ball grid arrays (BGAs) are the highest-demand package designs for these chips, although the QFP is waning in favor of the BGA. Thus, the package revenue is growing at a CAGR of 12.8% through 2016 for 32-bit MCUs.
This information is included in the newly released report
May 29, 2012 — Ricoh Company, Ltd. developed an ink-jet printing (IJP) technique that can produce lead zirconate titanate (PZT) piezoelectric material in a voluntary pattern shape at 2µm film thickness. Ricoh made PZT material into an ink. Ricoh simultaneously developed a lead-free piezoelectric material, bearing the same deformation properties as the PZT material on a silicon substrate.
Combining both technologies will allow users to manufacture a lead-free piezoelectric device that is functionally equivalent to PZT at a low cost, on a silicon substrate using the additive IJP fab process. (PZT contains lead but is exempted from the EU RoHS Directive banning lead in electronics.)
The IJP technique was used to create an actuator. IJP makes more efficient use of materials and labor than traditional semiconductor manufacturing processes, and can be configured to make diverse products in small lot sizes. It also reduces manufacturing costs and environmental impact, the company reports.
Ricoh controlled ink ejection for drawing precise patterns, modifying hydrophilicity and hydrophobicity of a substrate surface, and eliminated discards during firing thick film. This enabled 2µm film thickness, about 50 times that of the film formed with the usual IJP method. There are unique devisals on the nature of a solvent and drying speed control, which are needed to prepare film at a uniform thickness.
Ricoh’s lead-free material has about the same deformation properties (deformation amount when applied voltage) as PZT and could be used as a replacement. It is a system of materials of lead-free barium titanate with tin added (BSnT). This material needs to be fired at high temperature to form a high-quality film. To do so, Ricoh raised the thermal stability of the under layer (electrode layer provided under the piezoelectric material) of the substrate and enabled film formation of BSnT with properties at a practical level on the silicon substrate. Ricoh has adopted a method to use the precursor of BSnT in liquid form, for ink, unlike the conventional powder method. The lead-free material can therefore be used to make micro electro mechanical system (MEMS).
Ricoh will first manufacture a prototype of an actuator, then work on technical solutions, targeting commercialization. Piezo MEMS are used to monitor seismic activity, in information technology, and in other fields.
Ricoh announced both technologies at "The 29th Meeting on Ferroelectric Materials and Their Applications (FMA29)," in Kyoto, Japan, this past week.
Ricoh makes printing technologies. Learn more at http://www.ricoh.com/.
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Below: Surface morphology of the BSnT films fired at different temperatures. The one on the right fired at higher temperature shows larger grain size, indicating better film properties.
May 28, 2012 — Transparent displays will hit the market this year, and create an $87.2 billion market by 2025, according to Displaybank.
The displays show a background through a degree of transparency in the display panel. They are made with transparent organic light emitting diode (OLEDs), liquid crystal displays (LCDs) and plasma display panel (PDP) technologies.
Transparent displays will help grow the overall display market size as they grow new display applications: windows, automobile panels, building-integrated advertising, etc. It offers huge opportunities for information sharing.
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Figure. Display Market Forecast – Revenue Base ($B). SOURCE: Displaybank, Transparent Display Technology and Market Forecast. |
Design and functional performance must be elevated to create transparent displays, which will have an effect on traditional displays as well.
Displaybank’s "Transparent Display Technology and Market Forecast" report addresses the industry trend and product feasibility in future applications through already launched transparent display products and also addresses trends in makers, technical issues, and the market forecast. Access “Transparent Display Technology and Market Forecast” at http://www.displaybank.com/_eng/research/report_view.html?id=768&cate=
May 28, 2012 — Stanford University researchers, sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, have created contact hole patterns for logic and memory semiconductors using a next-generation directed self-assembly (DSA) lithography process. “This is the first time that the critical contact holes have been placed with DSA for standard cell libraries of VLSI chips,” said H.-S. Philip Wong, lead researcher at Stanford for the SRC-guided research.
Applying a relatively simple combination of chemical and thermal processes to create their DSA method for making circuits at 22nm, the nanofabrication technique could enable pattern etching for next-generation chips down to 14nm.
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Figure. Researchers first use a layout for 22nm SRAM contacts in the top layer. Through conventional lithography, a guiding template is fabricated, shown on the second layer. Application of a block copolymer solution leads to a self-assembled circuit contact pattern in the third layer. |
Traditional lithography methods lose accuracy as transistor nodes get smaller. This new work is reportedly a more affordable and environmentally friendly path to fabricating leading-edge semiconductor devices, and possibly other nano technologies. DSA created a composed pattern of real circuits, not test structures, Wong reported. The irregular nature of Stanford’s DSA could heal imperfections in the pattern and maintain higher resolution and finer features on the wafer than by any other viable alternative, Wong added. The new DSA process starts with covering a wafer surface with a block copolymer film. Common lithographic techniques were used to carve impressions into the wafer surface, producing a pattern of irregularly placed indentations that serve as templates to guide movement of molecules of the block copolymer into self-assembled configurations. By varying the shape and size of the guiding templates, manufacturers can space holes more closely.
In order to provide the safest solvents for use in the coating and etching process, the researchers selected polyethylene glycol monomethyl ether acetate (PGMEA) as a healthier and more effective alternative compared to other options.
Important next steps remain for the research. Among those is engagement with electronic design automation experts for the purpose of developing software and tools that will enable circuit designers to specify where the holes are to be located on the wafer. This resource for chip designers will allow them to plan without the distraction of where to place the guiding templates, providing the industry with another advantage in addition to the delay of investment in next-generation lithography tools.
Further details about the research and its conclusions are available at http://onlinelibrary.wiley.com/doi/10.1002/adma.201200265/pdf.
SRC defines industry needs, invests in and manages the research that gives its members a competitive advantage in the dynamic global marketplace. For more information, visit www.src.org.
This work is additionally sponsored by the Division of Civil, Mechanical and Manufacturing Innovation (CMMI) of the National Science Foundation.
May 25, 2012 — VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.
Large suppliers of chip-making equipment |
Rating |
Focused suppliers of chip-making equipment |
Rating |
1 Novellus |
8.95 |
1 F&K Delvotec |
8.51 |
2 Advantest |
8.37 |
2 Oerlikon |
8.19 |
3 Teradyne |
8.35 |
3 Plasma-Therm |
8.18 |
4 Hitachi High-Technologies |
8.09 |
4 EV Group |
8.14† |
5 ASML |
8.07 |
5 LTX – Credence |
8.14† |
6 Applied Materials |
8.02 |
6 Nanometrics |
8.10 |
7 Tokyo Electron |
7.84 |
7 Delta Design |
7.62 |
8 Kulicke & Soffa |
7.70 |
8 Agilent Technologies |
7.60 |
9 Hitachi Kokusai Electric |
7.58 |
9 Seiko Epson |
7.56 |
10 Nikon |
7.48 |
10 ACCRETECH – Tokyo Seimitsu |
7.45 |
Source: VLSIresearch 2012 Customer Satisfaction Survey. | |||
† Rankings for the #4 and 5 positions were determined on ratings carried out to three decimal places. |
For the first time in the history of the survey more than half of the suppliers in each category had greater than an 8.0 average rating, compared to two suppliers last year. As a result the average rating for these 10 BEST suppliers was 8.0, an increase of 0.35 points over last year. “This year’s ratings reflect new supplier initiatives to focus on their customers’ satisfaction, with better service and products,” commented G. Dan Hutcheson, Chairman and CEO of VLSIresearch.
Large Suppliers of Chip Making Equipment
Novellus retained its #1 spot this year with an increase of 0.77 points to 8.95. The company’s dedication to customer satisfaction paid off this year by earning the highest ratings among all Large Suppliers in 14 of the 15 rating categories. Advantest and Teradyne improved ranking positions substantially this year while competing for the 2nd and 3rd positions, with Advantest slightly exceeding Teradyne by a mere 0.02 points. Teradyne leaped from the 9th spot and Advantest from 7th, with point increases of 1.35 and 1.01 respectively. Advantest achieved its highest rating in trust in supplier at 8.7; Teradyne in would recommend supplier, also at 8.7.
Although both Hitachi High-Technologies and ASML achieved increased ratings this year, they dropped a slot to 4th and 5th positions as a result of Advantest and Teradyne’s jumps. ASML, well-known for its highly-productive lithography tools earned the highest rating of all Large Suppliers in technical leadership. Hitachi High-Technologies’ highest attribute was in quality of results.
Focused Suppliers of Chip Making Equipment
F&K Delvotec, a supplier of wire bonders, rose to the top spot for the first time this year with a rating of 8.51. The company garnered the highest rating of all Focused Suppliers in nine categories, with its highest rating of 9.0 earned in both field engineering support and support after sales.
Oerlikon retained its #2 rank with a rating of 8.19. This PVD supplier achieved its highest rating of 8.4 in five categories: would recommend supplier, trust in supplier, product performance, usable performance, and uptime.
Plasma-Therm moved up five slots to the 3rd position with a rating of 8.18. Customers applauded this etch & clean supplier as the highest in commitment of all Focused Suppliers as well as a tying for spares support with F&K Delvotec.
Most Improved Suppliers
In Large Suppliers, Teradyne showed the most improvement with its movement up from 9th to 3rd position and a 19% surge in its rating. Teradyne is followed by Applied Materials with a 17% jump in its rating. Nikon closed out this race with an increased rating of 16%.
Nanometrics deserves particular notice in Focused Suppliers with a remarkable 47% climb in its ratings, leaping from the 36th to the 6th slot. LTX-Credence’s significant increase of 33% moved it up from the 31st to the 5th slot. EV Group also showed a notable improvement with a 16% rise from the 15th to the 4th spot.
Stay tuned for additional rankings from VLSIresearch’s survey!
The VLSIresearch annual Customer Satisfaction Survey on Chip Making Equipment allows chip manufacturers to provide feedback on their suppliers. VLSIresearch is a leading provider of market research and economic analysis on the technical, business, and economic aspects within nanotechnology and related industries. Website: www.vlsiresearch.com.
May 24, 2012 — Mobile phones and tablet PCs each integrate about 5-10 micro electro mechanical systems (MEMS) per device. These “New MEMS” — consumer and mobility use MEMS — will benefit from the growth in smartphones and tablets, which will hit 2.9 billion units in 2017, said Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies, Yole Développement.
“MEMS in cellphones and tablets will grow 19.8% to reach a $5.4 billion value in 2017,” said Robin. The MEMS industry will be largely impacted by global trends in mobile devices: connected devices, video and music consumption, social networking, diversity of users and usages, mobile advertising. This booming demand for smartphones and media tablets can be partly explained by the integration of MEMS sensors, which provide new functionalities, Yole notes.
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Figure. Maturity of cell phone MEMS devices in 2012. SOURCE: MEMS for Cell phones & Tablets, Yole Développement, May 2012. |
10 new MEMS applications will to be worth more than $100 million in 2017, versus 3 categories of MEMS devices in high-volume production today, Yole says. These include motion sensors, microphones, and BAW filters and duplexers.
Motion sensors include accelerometers, magnetometers and gyroscopes. They are the hottest market segment of MEMS currently, growing quickly with multiple business and technical evolutions. Combo sensors are being introduced, increasing MEMS integration and adding sensor fusion algorithms. Also read: Bosch Sensortec debuts 6DoF MEMS IMU with sensor fusion software
MEMS microphones are replacing electret condenser microphones (ECM), and are enabling new user functionality when multiple MEMS microphones are used per device.
BAW has been popular for many years, Band 2 in particular. New opportunities will appear with some of the bands that will be used in 4G standards
Novel applications will bring more MEMS opportunities in the market — pressure sensors + inertial sensors for location based services, RF MEMS switches for antenna tuning, oscillators to replace TCXO quartz oscillators and for resonators, MEMS auto-focus to replace voice-coil motor (VCM) technology, microdisplays, microspeakers, environmental sensors, touchscreen, joystick, etc., etc. Also read: MEMS alternatives for miniature auto-focus cameras
Top MEMS players have evolved as the market has grown — tripling from 2009 to 2011. STMicroelectronics (ST, STM) was #3 in cell phone applications in 2009 and is now by far the #1 supplier with $477 million cellphone and tablet revenue in 2011. ST dominates the MEMS accelerometer market and had an impressive start with MEMS gyroscopes. InvenSense is challenging ST, and the companies recently became involved in a legal dispute over patents.
ST will become a one-stop supplier as it expands into different MEMS architectures. It lists Apple, Samsung, Nokia, RIM, and HP among its clients. Other large players are very focused on their core markets: AKM is the #2 with $260 million sales of magnetometers for electronics compass solution, Avago is leading the BAW filters and duplexers market with $244 million sales, and Knowles is #4 with $233 million revenues from MEMS microphones.
Many start-ups are about to introduce disruptive technologies for emerging markets (RF MEMS switches and variable capacitors, scanning mirrors for picoprojectors, silicon timing devices, speakers, auto-focus) and current large markets (MCube for inertial sensors, 3S for microphones).
Large semiconductor companies are now eyeing MEMS as well: Fairchild and Maxim already made the move through acquisitions, and others should follow.
As new business models are developing, with some players specializing on a specific part of the value chain (MEMS manufacturing, signal processing) and others offering complete solutions (e.g. combo sensors that integrate MCU and software).
“MEMS for Cell Phones & Tablets” is a new report from Yole Développement, by Laurent Robin, head of MEMS & Sensors market research.
Companies cited in the report:
3M, 3S, AAC Acoustics, Acutronic, ADI, Aichi MI, AKM, Akustica, Amazon, Amkor, Anadigics, APM, Apple, ASE, ASG, ASMC, ASTRI, Asus, Atmel, Audience, AudioPixel, Avago, Bambook, Baolab, Barnes, & Noble, Bluechiip, Bosch Sensortec, BSAC, BSE, Btendo, Carsem, Casio Micronics, Cavendish Kinetics, CEA Leti, Cheng Uei Precision Industry Co, CSR, Dalsa, DelfMEMS, Discera, DXO, EoSemi, EpiCrystals, Fairchild, etc.
Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media, and finance services. Learn more at www.yole.fr.
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The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.” Registered attendance was ~230.
The conference opened with a keynote address by Prof. Kristofer Pister, UC Berkeley speaking on sensory swarms. Inexpensive, wireless sensor networks have moved out of the lab and are being implemented in myriad applications. A refinery in Richmond, CA has methane gas sensors at every valve to monitor emissions. Parking spaces in San Francisco and Hollywood are tagged with car sensors to provide dynamic signage directing drivers to open spaces; this system also communicates with a smart phone app (“Parker”) to take you to specific open spaces. Rail cars have temperature and vibration sensors on every truck for predictive and preventive maintenance. Wireless sensors in the field are projected to top 1.1 billion units by 2015, up from 168 million units in 2010.
Janusz Bryzek, VP Fairchild Semiconductor, revisited his theme of accelerating the MEMS market to $1 Trillion and 1 trillion units. A $1 wireless sensor unit will require a 20¢ internet access module. The HP notion of a central nervous system for the earth will call for an average of ~1,000 sensors for every person. Smart phones have spurred the initial growth burst for MEMS, but the internet of things represents the “largest growth opportunity in the history of business.” Factors slowing MEMS market development include relatively slow MEMS process R&D cycles, and a lack of industry standards for manufacturing, packaging and testing. The fusion of computing, communication and sensing has been characterized as the third industrial revolution by Vijay Ullal of Maxim. While manufacturing jobs continue to be outsourced, the profitability and job creation potential at the innovation, design and marketing end remains a lucrative economic driver for the US.
Robert Haak of MANCEF described the implementation of the $1T MEMS roadmap. The key technologies needed for success include RF, chemical measurements, energy sourcing, inertial measurements, pressure measurements, acoustic sensors and displays. The industry roadmap infrastructure needs to evolve to a 3rd generation that focuses on products that are conceived at the interface of more than one technology. Specific roadmaps proposed are sensors, data transfer and data processing equipment. These are proposed to have a 15 year outlook with a 5 year review cycle.
Richard Friedrich of HP Labs spoke of the aforementioned central nervous system for the earth, CeNSE: awareness through a trillion MEMS sensors. The subtitle of his talk proclaimed this as the decade of sensing and sense-making. True more for technology than for politics. The infrastructure behind this enterprise will require about 1,000x more bandwidth than today’s internet has available. His vision projects ~150 sensors for every person on the planet, fewer than the second speaker but with a focus specifically on CeNSE applications. A MEMS nanofinger substrate for surface enhanced Raman scattering (SERS) provides a signal enhancement factor of 1011, enabling a detection sensitivity of 0.02 parts per trillion. The use of people as sensors is manifest in real time analysis of Tweets for regional tuning of marketing campaigns. The HP Social Computing Lab claims 97% accuracy in predicting movie revenues based on the response to pre-release advertising. Work is underway to simulate the human brain visual cortex using a system with 64,512 cores that has demonstrated the ability to learn without being taught. The root objective of a CeNSE network is to convert the flood of data into insight that leads to action. Skynet?
Greg Galvin, CEO of Kionix, presented another perspective of sensing the future on the road to a $1T market. They focus solely on inertial sensors, which had a 2004-2011 unit CAGR of ~100%. Unit prices of accelerometers, compasses and pressure sensors are already well below $1, with gyroscopes to follow by 2015. MEMS components have been averaging 2% of the end cost of products that use them. His conclusion was that a $1T market for MEMS over the next 10 years is unlikely, even though a 1T unit market is probably, and a $1T market for MEMS-enabled devices is a given.
Jérémie Bouchaud of IHS iSuppli couched his perspective as a “MEMS revolution: from billions to trillions?” The 5 year MEMS CAGR is presently running at 9.7% for revenue overall and 20.7% for shipments. Smart phones by themselves have a 17.8% revenue CAGR, and are a significant market driver. MEMS microphones are another beneficiary of smart phones, which now include multiple microphones for both speaking and for background noise suppression. Despite the myriad growth opportunities, he believes the prospect of a $1T MEMS market will require price points ≤5¢ per unit, and an expansion of the market definition to include sensors for temperature, light, humidity, UV and others.
The afternoon keynote was delivered by Steve Nasiri, founder of InvenSense, a big player in the motion interface MEMS market. Just 3 applications, mobile handsets, media tablets and gaming represent a $2.4B market by 2015. The gyro market was slow to get started until Apple put one in the iPhone in 2010. Within a year, over 70 other models were on the market with gyros, even though some didn’t seem to know what to do with them. The wearable sensor market for remote patient monitoring, home monitoring, sports & fitness will push to $150M by 2015. Does your mother live too far away to tell you not to slouch? A shirt with an embedded posture sensor can handle that for her. InvenSense has just announced an open platform infrastructure to facilitate rapid MEMS applications development.
Jean-Christophe Eloy of Yole Développement provided a status of the MEMS industry with a focus on new drivers and the path to new opportunities. The overall MEMS market is ~$10B now, growing to ~$21B by 2017. While the MEMS markets continue to grow, they are still only ~10% of the value of the end markets they enable. Accelerometer / gyroscope systems with 6 degrees of freedom (DOF) have largely been displaced by newer systems with 9 or 10 DOF. All of the growth notwithstanding, he remains skeptical of a $1T MEMS device market.
Stephen Breit of Coventor took us to the software design side of the business with his comments on realizing the full potential of MEMS design automation. If invention is the first wave, and manufacturing differentiation is the second wave, then the third wave is going to be innovation in design and integration. This is the catalyst that will be needed and has the potential to drive the hyper growth if the industry is to hit the $1T mark. Simulation of the integrated MEMS system will make it possible to compress the development cycle from the 2009 benchmark of 4-5 years. This vision includes process design kits and MEMS design kits (modules) similar to the design efficiencies achieved in ASICs. Coventor has a partnership with IMEC that was facilitated by IMEC’s integrated SiGe CMOS + MEMS integration scheme.
Russell Shumway of Amkor took us to the end of the production line with a discussion of high volume assembly and test solutions to support a rapidly growing MEMS market. He anticipates that there will be a greater tendency toward package standardization over the next 10-20 years, but the variety of packaging options is so large that the diversity will still be formidable.
Tristan Joo, Co-Chair of Mobile SIG of the Wireless Communications Alliance reviewed a few case studies of fusing sensors into mobile operating systems. Current smart phones already contain 12-18 sensors, including inertial, optical, touch, audio, magnetic, geo-positional and environmental. The future has a context-aware sensory data cloud in store for us. Smart phone apps that take full advantage of these sensors amount to less than a 0.5% share of apps downloads across all iPhone, Android and Windows OS platforms. I myself can use my smart phone as a bubble level, an audio dB sound meter, a thermometer, a compass, a ruler, a document scanner and a mechanical energy harvester to recharge my battery. But I’m a geek.
The remaining scheduled time comprised six brief presentations by companies showcasing new applications under the banner of “MEMS for the Rest of Us.”
Hillcrest Labs provides motion control systems for consumer electronics and other markets. Their flagship platform is the Freespace® MotionEngine™ that includes a gesture recognition engine and a variety of mobile, gaming and TV applications.
Movea develops data fusion software for processing sensor data into usable information. It is a spin-off of CEA-Leti in France. Fundamental elements of human motion have been compiled into a periodic table, cleverly presented as the Chemistry of Motion.
Sensor Platforms provides data fusion software in their FreeMotion™ library with the objective of being hardware agnostic. He favors mobile devices that respond to human action and context, not in the sense of obeying gestures and commands, but more in the sense of recognizing what’s going on and acting accordingly. For example, when your smart phone calendar says you’re in a meeting, a really smart phone will silence most calls and allow vibration only for a select short list of callers. The end result is to use the available data and context to anticipate intent.
Syride makes a rugged sports-oriented GPS device for tracking speed, elevation and location for hobbies such as surfing, sailing, skiing, skydiving and hang gliding. I use “Map My Walk,” which I will henceforth think of as the couch potato analog of Syride.
VectorNav Technologies is a hardware and software company that takes consumer level motion systems and upgrades them to industrial strength using established aerospace technology. Applications include human exoskeletons for the handicapped, and human motion capture for movies and medical applications. I’m pretty sure I misunderstood when I heard something about a home Cruise missile.
Xsens specializes in sensor fusion software for smart phones, tablets and sports applications. On-body MEMS sensors enable a new paradigm for body motion capture, embodied in a 17 sensor system integrated in a Lycra body suit. The system has already been used in developing video games.
May 23, 2012 — Active matrix small/medium displays, less than 9”, recorded 2 billion worldwide shipments (units) in 2011, up 6% over 2010, said NPD Displaysearch.
Mobile phones saw highest growth, from 1.4 billion to 1.5 billion, largely due to use of active-matrix small/medium displays in smartphones. Smartphones cannibalized digital still camera (DSC) and portable media player (PMP) demand, which tempered the by-unit growth rate of these displays to 6%. Smartphone demand also pushed displays into larger and wider screen form factors, higher resolutions, and wider viewing angles. More active-matrix small-medium displays are touchscreens because of smartphone requirements.
Active-matrix small/medium displays are made of active-matrix organic light-emitting diodes (AMOLED), electrophoretic (AMEPD), and thin-film transistor liquid crystal display (TFT LCD) technologies — all had double-digit revenue growth in 2011. AMOLED had 182% Y/Y growth. AMEPD rode e-reader demand to 43% Y/Y growth. TFT LCD revenues grew 19%, with the low-temperature polysilicon (LTPS) form of TFT LCD used in smart phones growing at 36% Y/Y.
For the whole active-matrix small/medium displays sector, revenue went up 29% to $28 billion in 2011, reflecting a shift to higher-performance/price displays. Consumers in general, and smartphone buyers in particular, will pay a premium for better displays, said Hiroshi Hayase, NPD DisplaySearch VP of small/medium display research.
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Figure 1. Active-matrix small/medium displays, shipment by application. SOURCE: NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report. |
As expected, Samsung Mobile Display (SMD) retained the top position for the second year in a row, claiming 17.2% of the market share for active-matrix small/medium displays in 2011, primarily due to increased AMOLED in smartphones. Following SMD, Sharp and Chimei Innolux kept the second and third positions in 2011, securing 13.5% and 9.5% of the market share, respectively.
Toshiba, Sony, and Hitachi all entered the small/medium AMFPD market, under a venture named Japan Display Inc. (JDI). Although the company started operations in April 2012, a review of 2011 figures indicates that a combination of Toshiba, Sony and Hitachi market shares total 17.2%, the exact same percentage as the 2011 share held by marketplace leader SMD. JDI could emerge as a new leading company in the small/medium FPD marketplace in 2012.
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Figure 2. Revenue share of small/medium AMFPD by FPD maker in 2011. SOURCE: NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report. |
The NPD DisplaySearch Quarterly Small/Medium Shipment and Forecast Report covers the entire range of small/medium (<9.0”) displays shipped worldwide and regionally. The report analyzes historical shipments and projects forecasts. The Quarterly Small/Medium Shipment and Forecast Report now offers advanced features that allow users to track data by viewing-angle and 3D capabilities. NPD DisplaySearch is a global market research and consulting firm specializing in the display supply chain, as well as the emerging photovoltaic/solar cell industries.
May 23, 2012 — North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 (three-month average basis) for a book-to-bill ratio of 1.10, according to SEMI.
The three-month average of $1.60 billion in worldwide bookings is 10.7% higher than the final March 2012 level of $1.45 billion, and is flat compared to April 2011.
The three-month average of $1.45 billion in worldwide billings shows 13.0% growth from the final March 2012 level of $1.29 billion, though it is 11.0% below the April 2011 billings level of $1.64 billion.
The steady increase in book-to-bill ratios may receive an even bigger boost as 2012 progresses, with “indications of increased spending” coming from foundries and packaging subcontractors, noted Dan Tracy, senior director of Industry Research & Statistics at SEMI.
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.
|
Billings |
Bookings |
Book-to- |
|
|
|
|
1,176.7 |
977.2 |
0.83 |
|
1,300.0 |
1,102.9 |
0.85 |
|
1,239.9 |
1,187.5 |
0.96 |
|
1,322.8 |
1,336.9 |
1.01 |
|
1,287.6 |
1,445.7 |
1.12 |
|
April 2012 (prelim) |
1,454.7 |
1,600.7 |
1.10 |
Source: SEMI May 2012
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS).
SEMI is a global industry association serving the nano- and microelectronics manufacturing supply chains. For more information, visit www.semi.org.