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Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, today announced the latest generation of silicon-on-insulator (SOI) substrates in its Imager-SOI product line designed specifically for fabricating front-side imagers for near-infrared (NIR) applications including advanced 3D image sensors. The new SOI wafers from Soitec are now available in large volumes with high maturity to meet the needs of customers in the growing market for 3D cameras used in augmented reality (AR) and virtual reality (VR), facial-recognition security systems, advanced human/machine interfaces and other emerging applications.

“Our newest Imager-SOI substrates represent a major achievement for our company and a smart way to increase performance in NIR spectrum domain, accelerating new applications in the growing 3D imaging and sensing markets,” said Christophe Maleville, executive vice president of the Digital Electronics Business Unit at Soitec. “Innovative sensor design on SOI is achieved by leveraging our advanced know-how in ultrathin material layer transfer and our extensive manufacturing experience.”

The new SOI substrate makes it possible to simply extend the operating range of high resolution silicon based CMOS image sensors into the NIR spectrum. This optimized version of SOI substrate greatly improves the signal to noise ratio in the NIR spectrum.

The market for 3D imaging and sensing devices is forecast to grow at a CAGR of 37.7 percent over the next five years and reach US$9 billion in sales by 2022, according to Yole Développement. The market research and consulting firm predicts that 2018 will likely see a massive influx of products, with the first applications in mobile electronics and computing.*

A transfer technique based on thin sacrificial layers of boron nitride could allow high-performance gallium nitride gas sensors to be grown on sapphire substrates and then transferred to metallic or flexible polymer support materials. The technique could facilitate the production of low-cost wearable, mobile and disposable sensing devices for a wide range of environmental applications.

Transferring the gallium nitride sensors to metallic foils and flexible polymers doubles their sensitivity to nitrogen dioxide gas, and boosts response time by a factor of six. The simple production steps, based on metal organic vapor phase epitaxy (MOVPE), could also lower the cost of producing the sensors and other optoelectronic devices.

Sensors produced with the new process can detect ammonia at parts-per-billion levels and differentiate between nitrogen-containing gases. The gas sensor fabrication technique was reported November 9 in the journal Scientific Reports.

Abdallah Ougazzaden, director of Georgia Tech Lorraine in Metz, France and Chris Bishop, a researcher at Institut Lafayette, example a sample being processed in a lab at Georgia Tech Lorraine. (Credit: Rob Felt, Georgia Tech).

Abdallah Ougazzaden, director of Georgia Tech Lorraine in Metz, France and Chris Bishop, a researcher at Institut Lafayette, example a sample being processed in a lab at Georgia Tech Lorraine. (Credit: Rob Felt, Georgia Tech).

“Mechanically, we just peel the devices off the substrate, like peeling the layers of an onion,” explained Abdallah Ougazzaden, director of Georgia Tech Lorraine in Metz, France and a professor in Georgia Tech’s School of Electrical and Computer Engineering (ECE). “We can put the layer on another support that could be flexible, metallic or plastic. This technique really opens up a lot of opportunity for new functionality, new devices – and commercializing them.”

The researchers begin the process by growing monolayers of boron nitride on two-inch sapphire wafers using an MOVPE process at approximately 1,300 degrees Celsius. The boron nitride surface coating is only a few nanometers thick, and produces crystalline structures that have strong planar surface connections, but weak vertical connections.

Image shows wafer-scale processed AlGaN/GaN sensors being tested. (Credit: Georgia Tech Lorraine).

Image shows wafer-scale processed AlGaN/GaN sensors being tested. (Credit: Georgia Tech Lorraine).

Aluminum gallium nitride (AlGaN/GaN) devices are then grown atop the monolayers at a temperature of about 1,100 degrees Celsius, also using an MOVPE process. Because of the boron nitride crystalline properties, the devices are attached to the substrate only by weak Van der Waals forces, which can be overcome mechanically. The devices can be transferred to other substrates without inducing cracks or other defects. The sapphire wafers can be reused for additional device growth.

“This approach for engineering GaN-based sensors is a key step in the pathway towards economically viable, flexible sensors with improved performances that could be integrated into wearable applications,” the authors wrote in their paper.

So far, the researchers have transferred the sensors to copper foil, aluminum foil and polymeric materials. In operation, the devices can differentiate between nitrogen oxide, nitrogen dioxide, and ammonia. Because the devices are approximately 100 by 100 microns, sensors for multiple gases can be produced on a single integrated device.

“Not only can we differentiate between these gases, but because the sensor is very small, we can detect them all at the same time with an array of sensors,” said Ougazzaden, who expects that the devices could be modified to also detect ozone, carbon dioxide and other gases.

The gallium nitride sensors could have a wide range of applications from industry to vehicle engines – and for wearable sensing devices. The devices are attractive because of their advantageous materials properties, which include high thermal and chemical stability.

“The devices are small and flexible, which will allow us to put them onto many different types of support,” said Ougazzaden, who also directs the International Joint Research Lab at Georgia Tech CNRS.

To assess the effects of transferring the devices to a different substrate, the researchers measured device performance on the original sapphire wafer and compared that to performance on the new metallic and polymer substrates. They were surprised to see a doubling of the sensor sensitivity and a six-fold increase in response time, changes beyond what could be expected by a simple thermal change in the devices.

“Not only can we have flexibility in the substrate, but we can also improve the performance of the devices just by moving them to a different support with appropriate properties,” he said. “Properties of the substrate alone makes the different in the performance.”

In future work, the researchers hope to boost the quality of the devices and demonstrate other sensing applications. “One of the challenges ahead is to improve the quality of the materials so we can extend this to other applications that are very sensitive to the substrates, such as high-performance electronics.”

The Georgia Tech researchers have previously used a similar technique to produce light-emitting diodes and ultraviolet detectors that were transferred to different substrates, and they believe the process could also be used to produce high-power electronics. For those applications, transferring the devices from sapphire to substrates with better thermal conductivity could provide a significant advantage in device operation.

Ougazzaden and his research team have been working on boron-based semiconductors since 2005. Their work has attracted visits from several industrial companies interested in exploring the technology, he said.

“I am very excited and lucky to work on such hot topic and top-notch technology at GT-Lorraine,” said Taha Ayari, a Ph.D. student in the Georgia Tech School of ECE and the paper’s first author.

In addition to Ougazzaden, the research team includes Georgia Tech Ph.D. students Taha Ayari, Matthew Jordan, Xin Li and Saiful Alam; Chris Bishop and Youssef ElGmili, researchers at Institut Lafayette; Suresh Sundaram, a researcher at Georgia Tech Lorraine; Gilles Patriarche, a researcher at the Centre de Nanosciences et de Nanotechnologies (C2N) at CNRS; Paul Voss, an associate professor in the Georgia Tech School of ECE; and Jean Paul Salvestrini, a professor at Georgia Tech Lorraine and adjunct professor in the Georgia Tech School of ECE.

The research was supported by ANR (Agence Nationale de Recherche), the National Agency of Research in France through the “GANEX” Project.

CITATION: Taha Ayari, et al., “Gas sensors boosted by two-dimensional h-BN enabled transfer on thin substrate foils: towards wearable and portable applications,” (Scientific Reports, 2017). http://dx.doi.org/10.1038/s41598-017-15065-6

By Ajit Manocha, president and CEO, SEMI

Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding. Early in SEMI’s history, SEMI’s always intelligent members worked together to introduce International Standards that enabled different pieces of equipment to collect and later pass data.  At first, it was for basic interoperability and equipment state analysis.  Later, SEMI data protocol Standards allowed process and metrology data to be used locally and across the fab to approach the goals of Smart Manufacturing and AI – for the equipment itself to make adjustments based on incoming wafer data.

Ajit--photo 1--sample.e.XL3A5483 (from pdg)As a part of this evolution, SEMI members developed the latest sensors and computational hardware that could ever better sense, analyze and act on the environment. Often first to use its own newly developed hardware, progress in this area was critical toward improving the likelihood of success for one of the world’s most complicated production processes – and coping with the breakneck speed of Moore’s Law – by accelerating capabilities that would later be regarded as the basis for machine learning and “thinking” systems.

Since then, process steps have increased from about 175 to as many as 1,000 for the leading technology nodes. By the time 300mm wafers were introduced, manufacturing intelligence and automation sharply increased productivity while reducing fab labor by more than 25 percent. Employing adaptive models, modern leading-edge factories are fully automated and operate at nearly 60 percent autonomous control.

Today, AI is akin to where IoT was yesterday in the hype cycle – popping up everywhere as a major consideration for the future. Neither IoT nor AI is hype, though – they’re the future.  There is ever more at stake for SEMI members with AI.  AI appears to be the next wave helping to maintain double-digit growth for the foreseeable future.

As part of its appeal for the global supply chain, AI can be a key silicon driver for three inflections that should benefit society. First, there is a massive increase in the amount of compute needed. Half of all the compute architectures shipping in 2021 will be supporting and processing AI.

Second, the Cloud will flourish and the Edge will bloom. By 2021, 50 percent of enterprise infrastructure will employ cognitive and artificial intelligence.

Third, new species of chips will emerge, such as the devices fueling IC content and electronics for the rapid growth of disruptive capabilities in vehicles and autonomous cars (as well as medical and agricultural applications, for example). There are also many more advantages created with and for AI as SEMI members enable new materials and advanced packaging.

What results can be measured from these changes for the global electronics manufacturing supply chain? More apps, more electronics, more silicon and more manufacturing.

On the other hand, the technologies alone create relatively little business value if the problems in our factories and markets are not well understood. There’s a great need to anticipate and guide AI. This requires a new kind of collaboration.

To address this need, SEMI’s vertical application platforms have been created for Smart Data (which is all about AI), and also for Smart MedTech, Smart Transportation, Smart Manufacturing and IoT. This higher degree of facilitated collaboration serves to cultivate multiple “smart communities” that accelerate progress for AI, better directing how connected networks and data mining can step up the pace for advancement of global prosperity. This process also provides members with access to untapped business opportunities and new players.​​

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We at SEMI are learning right along with our members. If you attended SEMICON West in July, several lessons about AI were presented by the Executive Panel (“Meeting the Challenges of the 4th Industrial Revolutions along the Microelectronics Supply Chain”) with Mary Puma (Axcelis), Shaheen Dayal (Intel), Lori Ciano (Brooks Automation) and Regenia Sanders (Ernst & Young). This very timely and excellent panel discussed how and where predictive analytics can have the biggest impact and the implications of sharing (and not sharing) data for problem solving and process optimization.

Ensuring that the SEMI staff gleans everything possible from the experts, we hosted an “encore” of the Executive Panel in October in our headquarters for an even more in-depth discussion about how to enhance collaboration across the supply chain in support of AI.

Going forward, these SEMI vertical platform communities will help to simplify and accelerate supply chain engagement for member value. Collaboration will play an ever greater role for using AI to master the making of advanced node semiconductor devices and enabling limitless cognitive computing. As a result, AI as we know it today, has a big head start over the previous pace of evolution for one of our great trendsetters, Moore’s Law.

Join the conversation.  Find out how you can work with SEMI to advance the AI – and especially AI in semiconductor manufacturing.  Frank Shemansky Jr., Ph.D., is heading up SEMI’s formation of SEMI’s Smart Data vertical application platform.  Let Frank know ([email protected]) you’re interested and he’ll give you more information on what’s to come.  As always, please let me know your thoughts.

 

Broadcom Limited (NASDAQ: AVGO) (“Broadcom”), a semiconductor device supplier to the wired, wireless, enterprise storage, and industrial end markets, today announced a proposal to acquire all of the outstanding shares of Qualcomm Incorporated (NASDAQ: QCOM) (“Qualcomm”) for per share consideration of $70.00 in cash and stock.

Under Broadcom’s proposal, the $70.00 per share to be received by Qualcomm stockholders would consist of $60.00 in cash and $10.00 per share in Broadcom shares. Broadcom’s proposal represents a 28% premium over the closing price of Qualcomm common stock on November 2, 2017, the last unaffected trading day prior to media speculation regarding a potential transaction, and a premium of 33% to Qualcomm’s unaffected 30-day volume-weighted average price. The Broadcom proposal stands whether Qualcomm’s pending acquisition of NXP Semiconductors N.V. (“NXP”) is consummated on the currently disclosed terms of $110 per NXP share or the transaction is terminated. The proposed transaction is valued at approximately $130 billion on a pro forma basis, including $25 billion of net debt, giving effect to Qualcomm’s pending acquisition of NXP on its currently disclosed terms.

“Broadcom’s proposal is compelling for stockholders and stakeholders in both companies. Our proposal provides Qualcomm stockholders with a substantial and immediate premium in cash for their shares, as well as the opportunity to participate in the upside potential of the combined company,” said Hock Tan, President and Chief Executive Officer of Broadcom. “This complementary transaction will position the combined company as a global communications leader with an impressive portfolio of technologies and products. We would not make this offer if we were not confident that our common global customers would embrace the proposed combination. With greater scale and broader product diversification, the combined company will be positioned to deliver more advanced semiconductor solutions for our global customers and drive enhanced stockholder value.”

Tan continued, “We have great respect for the company founded 32 years ago by Irwin Jacobs, Andrew Viterbi and their colleagues, and the revolutionary technologies they developed. Following the combination, Qualcomm will be best positioned to build on its legacy of innovation and invention. Given the common strengths of our businesses and our shared heritage of, and continued focus on, technology innovation, we are confident we can quickly realize the benefits of this compelling transaction for all stakeholders. Importantly, we believe that Qualcommand Broadcom employees will benefit from substantial opportunities for growth and development as part of a larger company.”

Thomas Krause, Broadcom Chief Financial Officer, added, “The Broadcom business continues to perform very well. Broadcom has completed five major acquisitions since 2013, and has a proven track record of rapidly deleveraging and successfully integrating companies to create value for our stockholders, employees and customers. Given the complementary nature of our products, we are confident that any regulatory requirements necessary to complete a combination with Qualcomm will be met in a timely manner. We look forward to engaging immediately in discussions with Qualcomm so that we can sign a definitive agreement and complete this transaction expeditiously.”

 

“The combined Qualcomm/Broadcom operation would represent the third largest global semiconductor supplier. The Qualcomm shareholders are likely to be split with many viewing this opportunity as a solution to the worsening relations with Apple, whom Broadcom has a good relationship with. The potential merger raises significant questions surrounding the difficult takeover of NXP by Qualcomm and much is still to be discerned regarding the value of the Qualcomm patent holdings and its associated lucrative high-margin revenue stream,” said Stuart Carlaw, Chief Research Officer at ABI Research.

More than a dozen product categories in optoelectronics, sensors and actuators, and discretes semiconductors (O-S-D) are on track to set record-high annual sales this year, according to a new update of IC Insights’ 2017 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators, and Discrete Semiconductors.  Driven by the expansion of the Internet of Things (IoT), increasing levels of intelligent embedded controls, and some inventory replenishment in commodity discretes, the diverse O-S-D marketplace is having a banner year with combined sales across all three semiconductor segments expected to grow 10.5% in 2017 to a record-high $75.0 billion, says the O-S-D Report update.

In 2017, above average sales growth rates are being achieved in all but one major O-S-D product category—lamp devices, which are now expected to be flat in 2017 because of continued price erosion in light-emitting diodes (LEDs) for solid-state lighting applications.  Figure 1 compares annual growth rates in five major O-S-D product categories, based on the updated 2017 sales projection.

Figure 1

Figure 1

For the first time since 2014, all three O-S-D market segments are on pace to see sales growth in 2017. Moreover, 2017 is expected to be the first year since 2011 when all three O-S-D market segments set record-high annual sales volumes, according to IC Insights’ update.

The 2017 double-digit percent increase will be the highest growth rate for combined O-S-D sales since the strong 2010 recovery from the 2009 semiconductor downturn that coincided with the 2008-2009 financial crisis and global economic recession.  Total O-S-D revenues are now forecast to reach a ninth consecutive annual record high level of $80.5 billion in 2018, which will be a 7.4% increase from 2017 sales, says the O-S-D Report update.

After a rare decline of 3.6% in 2016, optoelectronics is recovering this year with sales now projected to grow 8.1% in 2017 to an all-time high of $36.7 billion, thanks to strong double-digit sales increases in CMOS image sensors (+22%), light sensors (+19%), optical-network laser transmitters (+15%), and infrared devices (+14%).

Meanwhile, record-high revenues for sensors and actuators are being fueled by the expansion of IoT and new automated controls in a wide range of systems—including more self-driving features in cars. Sensors/actuator sales are now expected to climb 17.5% in 2017 to $13.9 billion, marking the strongest growth year for this market segment since 2010.  Sales of sensors and actuators made with microelectromechanical systems (MEMS) technology are forecast to rise by 18.5% in 2017 to a record-high $11.6 billion.  The O-S-D Report update shows all-time high sales being reached in 2017 with strong double-digit growth in actuators (+20%), pressure sensor, including MEMS microphone chips (+18%), and acceleration/yaw sensors (+17%).

Even the commodity-filled discretes market is thriving in 2017 with worldwide sales projected to rise 10.3% to $24.1 billion, which will finally surpass the current peak of $23.4 billion set in 2011.  Sales of power transistors, which account for more than half of the discretes market segment, are forecast to grow 9.0% in 2017 to a record-high $14.0 billion, according to the new O-S-D Report update.

Scientists at the University of Sussex may have found a solution to the long-standing problem of brittle smart phone screens.

Professor Alan Dalton and his team have developed a new way to make smart phone touch screens that are cheaper, less brittle, and more environmentally friendly. On top of that, the new approach also promises devices that use less energy, are more responsive, and do not tarnish in the air.

Dr. Matthew Large, University of Sussex, flexes a screen made from acrylic plastic coated in silver nanowires and grapheme to illustrate the kind of touch screens that can potentially be produced using the new approach Credit: Dr. Matthew Large

Dr. Matthew Large, University of Sussex, flexes a screen made from acrylic plastic coated in silver nanowires and grapheme to illustrate the kind of touch screens that can potentially be produced using the new approach Credit: Dr. Matthew Large

The problem has been that indium tin oxide, which is currently used to make smart phone screens, is brittle and expensive. The primary constituent, indium, is also a rare metal and is ecologically damaging to extract. Silver, which has been shown to be the best alternative to indium tin oxide, is also expensive. The breakthrough from physicists at the University of Sussex has been to combine silver nanowires with graphene – a two dimensional carbon material. The new hybrid material matches the performance of the existing technologies at a fraction of the cost.

In particular, the way in which these materials are assembled is new. Graphene is a single layer of atoms, and can float on water. By creating a stamp – a bit like a potato stamp a child might make – the scientists can pick up the layer of atoms and lay it on top of the silver nanowire film in a pattern. The stamp itself is made from poly(dimethyl siloxane); the same kind of silicone rubber used in kitchen utensils and medical implants.

Professor Alan Dalton from the school of Maths and Physical Science at the University of Sussex, says:

“While silver nanowires have been used in touch screens before, no one has tried to combine them with graphene. What’s exciting about what we’re doing is the way we put the graphene layer down. We float the graphene particles on the surface of water, then pick them up with a rubber stamp, a bit like a potato stamp, and lay it on top of the silver nanowire film in whatever pattern we like. “And this breakthrough technique is inherently scalable. It would be relatively simple to combine silver nanowires and graphene in this way on a large scale using spraying machines and patterned rollers. This means that brittle mobile phone screens might soon be a thing of the past.

“The addition of graphene to the silver nanowire network also increases its ability to conduct electricity by around a factor of ten thousand. This means we can use a fraction of the amount of silver to get the same, or better, performance. As a result screens will be more responsive and use less power.”

Dr Matthew Large, lead researcher on the project within the school of Maths and Physical Science at the University of Sussex, says:

“Although silver is also a rare metal, like indium, the amount we need to coat a given area is very small when combined with graphene. Since graphene is produced from natural graphite – which is relatively abundant – the cost for making a touch sensor drops dramatically.

“One of the issues with using silver is that it tarnishes in air. What we’ve found is that the graphene layer prevents this from happening by stopping contaminants in the air from attacking the silver. “What we’ve also seen is that when we bend the hybrid films repeatedly the electrical properties don’t change, whereas you see a drift in the films without graphene that people have developed previously. This paves the way towards one day developing completely flexible devices.”

The 2017 GLOBALFOUNDRIES Technology Conference (GTC) was held today in Shanghai, with GF executives, customers, partners and leaders in the Chinese semiconductor industry gathering to discuss the technologies that will enable a new era of connected intelligence. At the event, GF senior executives shed light on the company’s technologies, design solutions, and manufacturing services. The company also highlighted growing momentum around its differentiated 22FDX® technology, including customer adoption by several leading Chinese chip designers.

Mike Cadigan, GF’s senior vice president for global sales and business development, delivered a keynote speech, emphasizing GF’s expectations to become a strong leader in the Chinese semiconductor market. “Along with the rapid growth of customers, markets and applications in this region of the world, we are also continuously developing new technologies for enabling connected intelligence,” Cadigan said. “China is definitely one of our most important markets, and we will keep bringing advanced and differentiated technologies here to help our customers grow and succeed.”

At the event, GF revealed three Chinese customers that will be adopting its new 22FDX technology for next-generation wireless, battery-powered applications. Shanghai Fudan Microelectronics Group will adopt the 22FDX platform to design and develop highly reliable servers, AI and smart IoT intelligent products in 2018. Rockchip will apply 22FDX technology in the design of ultra-low power WiFi smart hardware SoC and high-performance AI processers. Hunan Goke Microelectronics is planning to adopt 22FDX in its next generation of IoT chips.

China is a key region for GF’s future growth plans. The company is building an advanced 300mm semiconductor fab in Chengdu, where a “truss-hoisting” ceremony was recently held to commemorate a major milestone in the construction of the facility, which will be called Fab 11. The construction of the fab is progressing at a fast pace and is on track to be completed in early 2018.

The company is also working closely with the Chengdu municipality to expand the FD-SOI ecosystem, with an investment of more than $100 million to make Chengdu a center of excellence for FDX IC design and IP development. Several leading semiconductor companies have already committed to supporting the ecosystem initiative, including Invecas, GF’s advanced IP development partner. Invecas has established a strong presence in China, including a recently expanded engineering team in Shanghai and Shenzhen and a commitment to set up an R&D center in Chengdu to develop and support advanced IP and designs for FD-SOI systems.

With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The number of 300mm wafer production-class fabs in operation worldwide is expected to increase each year between now and 2021 to reach 123 compared to 98 in 2016, according to the forecast in IC Insights’ Global Wafer Capacity 2017-2021 report.

As shown in Figure 1, 300mm wafers represented 63.6% of worldwide IC fab capacity at the end of 2016 and are projected to reach 71.2% by the end of 2021, which translates into a compound annual growth rate (CAGR) of 8.1% in terms of silicon area for processing by plant equipment in the five-year period.

capacity install

Figure 1

The report’s count of 98 production-class 300mm fabs in use worldwide at the end of 2016 excludes numerous R&D front-end lines and a few high-volume 300mm plants that make non-IC semiconductors (such as power transistors).  Currently, there are eight 300mm wafer fabs that have opened or are scheduled to open in 2017, which is the highest number in one year since 2014 when seven were added, says the Global Wafer Capacity report.  Another nine are scheduled to open in 2018.   Virtually all these new fabs will be for DRAM, flash memory, or foundry capacity, according to the report.

Even though 300mm wafers are now the majority wafer size in use, both in terms of total surface area and in actual quantity of wafers, there is still much life remaining in 200mm fabs, the capacity report concludes.  IC production capacity on 200mm wafers is expected to increase every year through 2021, growing at a CAGR of 1.1% in terms of total available silicon area. However, the share of the IC industry’s monthly wafer capacity represented by 200mm wafers is forecast to drop from 28.4% in 2016 to 22.8% in 2021.

IC Insights believes there is still much life left in 200mm fabs because not all semiconductor devices are able to take advantage of the cost savings 300mm wafers can provide.  Fabs running 200mm wafers will continue to be profitable for many more years for the fabrication of numerous types of ICs, such as specialty memories, display drivers, microcontrollers, and RF and analog products.  In addition, 200mm fabs are also used for manufacturing MEMS-based “non-IC” products such as accelerometers, pressure sensors, and actuators, including acoustic-wave RF filtering devices and micro-mirror chips for digital projectors and displays, as well as power discrete semiconductors and some high-brightness LEDs.

A wide variety of laser technologies is today available to semiconductor manufacturers and enable the development of innovative semiconductor manufacturing processes. According to Yole Développement (Yole), the laser equipment market will grow at a 15% CAGR between 2016 and 2022 and should reach more than US$4 billion by 2022 (excluding marking). Those figures are showing the massive adoption of laser technologies for semiconductor manufacturing processes.
In its latest report titled Laser Technologies for Semiconductor Manufacturing, the market research and strategy consulting company details the status of this industry, mainly driven by dicing, via drilling and patterning in PCB flex and PCB HDI, IC substrates and semiconductor device processing.

The Laser Technologies for Semiconductor Manufacturing report from Yole provides a thorough analysis of the different existing laser equipment and laser source solutions developed for semiconductor process steps. It is a comprehensive analysis highlighting the maturity level of each laser type, based on a technical roadmap until 2022. With this new report, Yole’s analysts offer a clear understanding of the laser technologies’ benefits and added value for each manufacturing process.

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The Laser Technologies for Semiconductor Manufacturing report is the first of a wide collection of reports that will be released by Yole during the next months. Further its 1st Executive Forum on Laser Technologies taking place in Shenzhen, China, welcoming more than 100 attendees, the “More than Moore” market research and strategy consulting company Yole confirms the expansion of its activities towards the laser-based solutions. Technologies, roadmaps, market metrics, supply chain, competitive landscape, market shares and more. All these topics will be described and deeply analyzed in Yole’s laser technology & market reports.

Today, laser applications in the semiconductor industry are broad and diversified. Various laser technologies have started integrating into major semiconductor processes, including laser cutting, drilling, welding/bonding, debonding, marking, patterning, marking, measurement, deposition, driven by motherboards. They are used to process semiconductor devices, flexible and HDI PCBs , and in IC packaging applications.

Drivers of laser methods differ from one process step to another. However, there are similar and common drivers for applicability of lasers to semiconductor and PCB processing applications. The key trends driving laser applicability and contributing to its growth are:

   •  The desire for die size reduction and thus further miniaturization of devices driven by computers, hand-held electronic devices such as mobile phones, tablets and electronic book readers, wearable devices and consumer electronics.
•  Demand for increased yield and throughput.
•  Better die quality.
•  The need to inspect voids and particles through a transparent material such as glass, which requires the use of laser methods.
•  Laser annealing for very high flexibility.
However, the choice of the most suitable laser processing type depends strongly on the material to be processed, processing parameters, and the manufacturing process step.

Laser type is defined by parameters such as wavelength, emitting UV, green, or IR light, for example, as well as the duration of pulse, for example nanosecond, picosecond or femtosecond. Users must consider which pulse length and wavelength is right for their semiconductor process step and application.

Nanosecond lasers are the most commonly used type of laser applied in semiconductor manufacturing and PCB processing, with more than 60% market share. They are followed by picosecond, CO2 and femtosecond lasers. In the case of dicing step, the choice of laser type also depends on the material and substrate to be diced. For low dielectric constant (low-k) materials, nanosecond and picosecond UV lasers are used to optimize optical absorption. Picosecond and femtosecond IR lasers are typically used for cutting glass and sapphire substrates but not singulating SiC substrates.

In drilling, the type of laser employed depends on the substrate. Nanosecond UV lasers are usually employed in flexible PCBs, while CO2 lasers are largely applied for PCB HDI and IC substrates. However, for IC substrates, the choice between CO2 and nanosecond or picosecond UV lasers depends on via diameters. Below 20μm diameters, the industry tends to go to picosecond UV lasers which are much more expensive than nanosecond UV lasers but offer superior quality.

Generally speaking, CO2 is the cheapest and fastest laser solution and used in preference to nanosecond, picosecond or femtosecond solid state lasers for dicing, drilling, patterning, marking for applications that require high power and do not care about heat damage or dicing width. However, CO2 is limited when small features are needed. Nanosecond lasers are currently the dominant technology, but picosecond and femtosecond lasers could move ahead in the laser dicing equipment market. However, femtosecond laser implementation is more complex and expensive.

Yole’s laser report will provide a comprehensive overview of the laser equipment and laser sources used for each semiconductor process step application, along with a detailed analysis of laser technology trends and a market forecast. It will also offer a detailed analysis of the laser equipment market by volume and value, its growth for the 2016-2022 timeframe, and breakdown by laser type and process step application.

IC Insights recently released its September Update to The McClean Report.  This 32-page Update included a detailed look at the pure-play foundry market.  Shown below is an excerpt from the Update.

With the rise of fabless IC companies in China, demand for foundry services in that country has also increased.  Figure 1 shows IC Insights’ listing of the top pure-play foundries and their sales to China in 2016 and a forecast for 2017.  In total, pure-play foundry sales in China are expected to jump by 16% this year to about $7.0 billion, more than double the rate of increase for the total pure-play foundry market.  As shown, only about 10% of TSMC’s sales are forecast to go into China in 2017, yet the company is expected to hold the largest share of the China foundry market this year with a 46% share, up two percentage points from 2016.

Figure 1

Figure 1

The Chinese foundry market represented 11% of the total pure-play foundry market in 2015, 12% in 2016, and is forecast to hold a 13% share this year.  As a result of this growth, most pure-play foundries have made plans to locate or expand IC production in mainland China over the next few years. TSMC, GlobalFoundries, UMC, Powerchip, and, most recently, TowerJazz have announced plans to boost their China-based wafer fabrication production.  Most of these new China-based foundry wafer fabs are scheduled to come online in late 2017 or in 2018.  UMC began 40nm production at its 300mm joint venture China fab in November of 2016 and the company is planning to introduce 28nm technology into the fab in the second half of this year with additional expansion plans to come through the end of the decade.

It is well known that China is striving to develop an indigenous semiconductor industry but gaining access to the manufacturing technology has become increasingly difficult.  As a result, many China IC companies and government entities have structured joint ventures or partnerships with foundry companies in order to access leading manufacturing technology.  The partnerships give Chinese companies much needed access to production capacity using first-rate manufacturing technology and provide the foundries with an ongoing market presence and revenue stream within China.

Examples of pure-play foundries that are working to set up new manufacturing plants in China include,

•    UMC is working with Fujian Jin Hua IC Company to construct a 300mm wafer fab in Fujian, China to manufacture DRAM using 32nm process technology developed by UMC.

•    GlobalFoundries joined with the Chengdu Government in 1Q17 to begin building a 300mm wafer fab that will manufacture ICs using mainstream 130nm and 180nm processes.  Completion is set for early 2018.

•    TSMC started construction on a wholly owned $3 billion fab in Nanjing, China that will serve as a foundry that manufactures ICs using 16nm technology.  Production is scheduled to begin in 2H18.

•    TowerJazz signed an agreement with Tacoma Semiconductor to construct a 200mm wafer fab, also in Nanjing, China.  TowerJazz will have access to 50% of the capacity.  Tacoma is responsible for the entire investment of the project.