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TECHCET CA—the advisory service firm providing electronic materials information—today announced that specialty chemical precursor market for the deposition of dielectrics and metals in integrated circuit (IC) fabrication is forecasted to increase at ~10% CAGR through the year 2021. TECHCET’s proprietary Wafer Forecast Model (WFM) shows that 3D-NAND devices are expected to grow at a rapid pace from 2016 and become one of the top three market segments by 2020. Logic ICs will continue to evolve, from 3D finFET devices to Gate-All-Around Nano-Wires (GAA-NW), enabled by new critical materials and manufacturing processes as detailed in new reports from TECHCET, “Advanced Insulating Dielectric Precursors,” and “ALD/CVD High-k & Metal Precursors.”

Precursors tracked by TECHCET for ALD/CVD of metal and high-k dielectric films on IC wafers include sources of aluminum, cobalt, hafnium, tantalum, titanium, tungsten, and zirconium. The total market for 2017 is now estimated to be US$435M, growing to US$638M in 2021. The top-2 suppliers are estimated to hold more than half of the total available market, with many players competing to supply the next enabling molecule. In particular, cobalt precursor demand is forecasted to reach >$80M in 2021 as foundries transition to below 14nm-node processing. As a potential conflict mineral, TECHCET tracks the sub-suppliers of cobalt.

“Metal precursors have had double-digit growth over an extended period of time, and we expect that to continue as the IC industry transitions to 10nm- and 7nm-node logic and 3D-NAND fabrication, with an average long term CAGR of 11% over 2013 to 2021,” says Dr. Jonas Sundqvist, lead author of the report, senior technology analyst with TECHCET and researcher with Fraunhofer IKTS. “Dielectric precursors growth today is clearly driven by dielectric PEALD deposition in multiple patterning, and by dielectric CVD in 3D-NAND.”

Precursors tracked by TECHCET for ALD/CVD/SOD of advanced dielectric films on IC wafers include multiple sources of silicon. The total market for 2017 is now estimated to be just over US$400M, growing to US$560M in 2021. Current growth over 10% is expected to slow slightly to be in the 8-10% range over 2019-2021. Anticipated near-term developments include transitions from CVD to ALD for several IC fab modules.

8:30 am –12:30 pm
Get Smart: SEMI/Gartner, Bulls & Bears Industry Outlook
Yerba Buena Theater

10:30 am – 12:30 pm
SMART Automotive
Meet the Expert Theater, Moscone West

10:30 am – 12:30 pm
The Economics of Choosing a Lithography Strategy
Moscone West, TechXPOT West

10:30 am –12:35 pm
5G Communications and the Next-generation Cloud
Moscone North, TechXPOT North

2:00 pm – 4:00 pm
The Economics of Density Scaling
Moscone West, TechXPOT West

2:00 pm – 4:00 pm
Exploring Electronics Requirements & Solutions for Medical Technology
Moscone North, TechXPOT North

Solid State Technology and SEMI today announced the recipient of the 2017 “Best of West” Award — Microtronic Inc.— for its EAGLEview 5. The award recognizes important product and technology developments in the electronics manufacturing supply chain. Held in conjunction with SEMICON West, the largest and most influential electronics manufacturing exposition in North America, the Best of West finalists were selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.

Microtronic’s EAGLEview 5 Macro Defect Management Platform is the new, yield-enhancing, breakthrough macro defect inspection platform that was developed ─ and deployed in production ─ through collaboration with several leading device manufacturers who wanted to standardize and unify wafer defect management throughout their fab. Innovations include: dramatically improved defect detection; level-specific sorting; and integration with manual microscopes. (Process Control, Metrology and Test Category; North Hall Booth #5467)

EAGLEview 5

9:05 am – 9:20 am
Special Guest: James. C. Morgan
Jim talks about his new book, Applied Wisdom
Yerba Buena Theater

9:35 am – 10:05 am
Big Data in Autonomous Driving
Katherine S. Winter, Intel
Yerba Buena Theater

10:30 am – 12:30 pm
Enabling the IoT
Innovative Technologies to Advance the Connected World
Meet the Expert Theater, Moscone West

12:30 am –2:00 pm
Smart Automotive 1
The Future of Smart & Connected Self-driving Cars
Moscone North, TechXPOT North

2:00 pm – 3:00 pm
Executive Panel
Meeting the Challenges of the 4th Industrial Revolution along the Microelectronics Supply Chain
Yerba Buena Theater

2:00 pm – 5:00 pm
Advanced Packaging Technologies Enabling Advanced Applications
Moscone West, TechXPOT West

3:00 pm – 4:30 pm
Smart Manufacturing
Machine learning in design, inspection, process modeling and decision making
Meet the Expert Theater, Moscone West

How low can we go?


July 11, 2017

By Ed Korczynski

In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC). On the day before the opening of SEMICON West 2017, the invitation-only imec Technology Forum provided an update on the emerging opportunities in semiconductor technology and smart electronics systems. An Steegen, Executive VP Semiconductor Technology & Systems, provided the update on how small we can scale CMOS devices over the next 5-10 years. Taller finFETs will likely be used along with nano-wire FETs (NW-FET) by industry, and researchers see ways to cost-effectively combine both in future optimized System-on-Chips (SoC).

“Existing finFET technology can scale to the 5nm-node,” explained An Steegen at ITF 2017 in Antwerp, Belgium. “However, at the 3nm-node it looks like the nano-wire is comparable in performance to the finFET, but it has an additional advantage in that the nanowire is a better electro-statically controlled device so it enables gate-length scaling more than the finFET. So the contacted gate pitch (CGP) of a nano-wire can scale further than a finFET, because below ~40 nm CGP a finFET loses electro-static control which a nano-wire does not.”

While it is given that a nanowire has better electro-static control compared to a finFET, the basic trade-off is that of reduced drive current. The Figure shows that IMEC sees the possibility of System-Technology Co-Optimization (STCO) of future system-on-chip (SoC) designs using hybrid semiconductor technologies. imec’s basic process flow for NW-FETs starts with forming fins and so could be relatively easily integrated with finFETs for co-integrated hybrid CMOS.

System-Technology Co-Optimization (STCO) for future System-on-Chip (SoC) designs could integrate finFETs with Nano-Wire FETs (NW-FET) and Magnetic Random Access Memory (MRAM) for optimized performance. (Source: imec)

System-Technology Co-Optimization (STCO) for future System-on-Chip (SoC) designs could integrate finFETs with Nano-Wire FETs (NW-FET) and Magnetic Random Access Memory (MRAM) for optimized performance. (Source: imec)

“Today, this SoC is processed in one technology which means it’s sub-optimal for certain blocks on the SoC,” explained Steegen. “So imagine a future where you can choose the preferred technology for each block. I would choose finFETs for those blocks that need drive current, while I would choose nano-wire-FETs for those blocks that need more density and lower power. I would for example choose a magnetic RAM to replace my cache memory. I can optimize each sub-block for a preferred technology. Now I can do more, like sprinkle in low-energy devices like tunnel-FETs or spin-devices or 2D-materials as low-energy switches.”

Super-vias and Rutherails

Design-Technology Co-Optimization (DTCO) is imec’s term for new interconnect technologies to allow for simpler or more-compact designs. IDTCO process-scaling boosters are needed to stay with the pace of aggressive design rule targets. “We’re working on super-vias that connect more than one metal to the other and can jump a number of levels, and buried rails to support finFETs in standard-cell libraries,” explained Steegen during ITF2017.

Super-vias could be cobalt plugs that connect more than two metal levels within on-chip multi-level interconnects. The cobalt plugs would be nominally 20nm diameter and 105nm deep, and connected to a dual-damscene upper metal line. Low-k dielectric of k=2.55 uses thin silicon carbon nitride (SiCN) for definition between the damascene levels.

Ruthenium rails (Rutherails) would be buried in a front-end dielectric layer to provide electrical contacts below finFETs for 42nm CGP and 21nm MP needed for imec 3nm-Node (I3N) devices. Ruthenium rails 30nm deep and 10nm wide do not need complex barrier layers and should provide sufficient current flow for either finFETs or NW-FETs.

imec is also working on materials R&D to extend the performance of 3D-NAND. Steegen said,

“At imec we are working on improving the performance of that Flash device by introducing high-mobility channels, also by engineering the dielectric trapping layer with a barrier that can help improve the erase window and also the retention.”

9:05 am – 9:35 am
KEYNOTE: The Semiconductor Industry: Changed and Unchanged
Tetsuro Higashi, TEL
Yerba Buena Theater

9:35 am – 10:05 am
KEYNOTE: Accelerating Innovation: Intelligent is the New Smart
Thomas Caulfield, GLOBALFOUNDRIES

10:30 am – 4:00 pm
World of IoT
Understanding Risks and Opportunities
San Francisco Marriott Marquis

10:30 am – 12:45 pm
What’s next for MEMS & Sensors
Big Growth of Disruptive Applications
Moscone Morth, TechXPOT North

2:00 pm – 5:00 pm
China Strategic Innovation & Investment Forum
The Rise of the China IC Industry
Yerba Buena Theater

3:00 pm – 4:30 pm
Advanced Packaging
Meet the Experts, Day 1
Meet the Expert Theater, Moscone West

5:00 pm – 10:00 pm
Summerfest at AT&T Park
Hors d’oeuvres, beverages and MLB All-Star Game

5:00pm – 9:00pm
Leti Workshop
W Hotel – 181 3rd St., San Francisco

Worldwide industrial semiconductor revenues grew by 3.8 percent year-over-year in 2016, to $43.5 billion, according to the latest analysis from business information provider IHS Markit (Nasdaq: INFO).

Industrial electronics equipment demand was broad-based, with continued growth in commercial and military avionics, digital signage, network video surveillance, HVAC, smart meters, traction, PV inverters, LED lighting and various medical electronics such as cardiac equipment, hearing aids and imaging systems, IHS Markit said.

The U.S. economy continued to boost industrial spending while improved economic conditions in Europe and large emerging countries like China, India and Brazil toward the end of 2016 that propelled growth. These economic conditions are expected to continue thorough 2017, according to the IHS Markit analysis.

Top 20 company ranks: Global industrial semiconductor market share

Texas Instruments (TI) maintained its position as the largest industrial semiconductor supplier in 2016 followed by Intel, STMicroelectronics, Infineon Technologies and Analog Devices. Intel surged to second place, swapping spots with Infineon, which dropped to fourth. The Intel IoT group’s double-digit revenue growth is attributed to strength in factory automation, video surveillance and medical segments.

“Toshiba, ON Semiconductor and Microchip Technology climbed into the top 10 industrial semiconductor supplier ranks in 2016,” said Robbie Galoso, principal analyst, industrial semiconductors for IHS Markit. Toshiba’s industrial market share rank jumped to number six, according to survey feedback. Toshiba’s industrial electronics revenue grew from $1.1 billion in 2015 to $1.4 billion in 2016—a 30.5 percent bounce driven by discretes, microcomponent integrated circuits (ICs), memory and logic IC solutions in manufacturing and process automation, power and energy as well as security and video surveillance.

Mergers and acquisitions make an impact

The semiconductor industry had another cycle of merger and acquisition in 2016 that affected the competitive landscape. The combined ON Semiconductor – Fairchild organization generated $1.3 billion in 2016 industrial revenues, catapulting the consolidated company into seventh place. The acquisition of Fairchild allowed On Semiconductor to leapfrog to the top ranks of the power discrete market, forecast to be one of the higher growth markets over the next five years, IHS Markit said

On Semiconductor has been a relatively small player in the power discrete segment; with the Fairchild acquisition, it now has the scale and product portfolio to compete effectively with the combined Infineon International Rectifier. On Semiconductor’s 2016 revenue grew nearly 60 percent, largely driven by analog and discretes in the manufacturing and process automation and the power and energy sectors, both of which were sizeable segments for Fairchild.

The Microchip Technology – Atmel merger generated $1.2 billion in revenues in 2016, propelling the combined company into 10th place. The acquisition of leading microcontroller supplier, Atmel, positioned Microchip as the third-ranked supplier of microcomponent ICs in the industrial market, after Intel and TI. The combination of Microchip and Atmel created an MCU powerhouse, allowing it to compete effectively against the combined NXP Freescale. Microchip Technology’s 2016 revenue growth of 53 percent was driven by microcomponent ICs in manufacturing and process automation, Atmel’s bread and butter. Toshiba, Micron and ON Semiconductor displaced Nichia, Renesas and Xilinx in the top 10 rankings.

China’s massive investments in light-emitting diode (LED) manufacturing capacity propelled Chinese firm MLS into the 2016 top 20 industrial semiconductor supplier ranks, displacing Maxim. “MLS posted revenue growth of 27 percent, to $640 million, building its share against competition including top-20 firms Nichia, Osram and Cree,” added Galoso.

Strategic acquisitions will continue to play a major role in shaping the overall semiconductor market rankings in key industrial semiconductor segments. IHS Markit expects Analog Devices to increase its lead in 2017 market shares among the top semiconductor suppliers, due to an acquisition of Linear Technology. A joint Analog Devices – Linear Technology would battle for the number four spot and impressive gains in test and measurement, manufacturing and process automation as well as medical electronics.  Among the top 10 semiconductor suppliers, eight companies achieved growth in 2016, with two companies posting double-digit growth due to mergers.

industrial semi growth

Industrial semiconductor key growth drivers

Optical semiconductors delivered solid performance, driven by continued strength in the LED lighting market. IHS Markit expects the LED segment to grow from $9.4 billion in 2016 to $14.3 billion in 2021. With many countries phasing out incandescent bulbs, mass adoption of energy-efficient LED lighting solutions will continue to gain traction as prices for LED lamps fall to affordable levels for average-income households. Discrete power transistors, thyristors, rectifiers and power diodes are expected grow from $5.7 billion in 2015 to $8 billion in 2021 due to policy shifts toward energy efficiency in the factory automation market. IHS Markit projects that the microcontrollers (MCUs) segment  will grow robustly in the long term, expanding from $4.4 billion in 2016 to $7 billion in 2021, attributing this growth to both shipments and average selling price driven by system level cost savings provided by MCUs through advances in power efficiency and integration integrated features supporting connectivity, security, sensors and HMI.

Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI. More than 26,000 professionals from the electronics manufacturing supply chain attend SEMICON West and the co-located Intersolar. The “Best of West” award was established to recognize new products moving the industry forward with technological developments in the electronics supply chain.

Selected from over 600 exhibitors, SEMI announced today that the following Best of West 2017 Finalists will be displaying their products on the show floor at Moscone Center from July 11-13:

  • Mentor, a Siemens Business: Tessent® Cell-Aware Diagnosis – With FinFETs in high volume, finding systematic yield issues at the transistor level is important. The Tessent Cell-Aware Diagnosis technology significantly improves diagnosis of defects beyond the inter-connect and inside the logic cells. (Process Control, Metrology and Test Category; North Hall Booth #6661)
  • Microtronic Inc.: EAGLEview 5 Macro Defect Management Platform – EagleView 5 is the new, yield-enhancing, breakthrough macro defect inspection platform that was developed – and deployed in production — through collaboration with several leading device manufacturers who wanted to standardize and unify wafer defect management throughout their fab. Innovations include: dramatically improved defect detection; level-specific sorting; and integration with manual microscopes. (Process Control, Metrology and Test Category; North Hall Booth #5467)
  • SPTS Technologies Ltd: SentinelTM End-Point Detection System for Plasma Dicing after Grind – The Sentinel™ End-Point Detection System improves the control of plasma dicing processes and protects taped wafers for improved yields.  In addition to signaling exposure of the tape, Sentinel™ also detects loss of active cooling during the process to enable intervention to prevent yield loss. (Process Control, Metrology and Test Category; West Hall Booth #7617)
  • TEL: Stratus P500 – The Stratus P500 system electroplates panel substrates with wafer level processing precision.  As redistribution layers (RDL) reduce to widths below 10 µm line/space, and package sizes increase, conventional plating systems are challenged to meet system-on-package requirements. The P500 makes panel scale fine line RDL and feature filling applications possible. (Assembly/Packaging Solutions Category; North Hall Booth #6168)

Congratulations to each of the Finalists. The Best of West Award winner will be announced during SEMICON West (www.semiconwest.org) on Wednesday, July 12, 2017.

The ongoing slump in shipments of standard personal computers along with the drop-off in tablets are setting the stage for cellphone IC sales to finally surpass integrated circuit revenues in total personal computing systems this year, based on new forecasts in the recently released update of IC Insights’ 2017 IC Market Drivers Report.

IC sales for cellular phone handsets are projected to grow 16% in 2017 to $84.4 billion, as shown in Figure 1, while the integrated circuit market for personal computing systems (desktop and notebook PCs, tablets, and thin-client Internet-centric units) is now forecast to increase 9% to $80.1 billion this year, according to the 150-page update to the 590-page report, originally released in 4Q16.

Fig 1

Fig 1

IC sales for both cellphones and total personal computing systems are strengthening significantly in 2017 primarily because of strong increases in the amount of money being spent on memory, with the average selling price (ASP) of DRAM expected to climb 53% and NAND flash ASP forecast to rise 28% this year. In 2016, IC sales for cellphone handsets grew 2% after rising 1% in 2015, while dollar volume for integrated circuits used in personal computing systems increased just 1% last year after falling 6% in 2015. Cellphone IC sales are also getting a lift from a projected 5% increase in shipments of smartphones, which are being packed with more low-power DRAM and nonvolatile flash storage, while growth in personal computing is expected to be held back by 3% declines in both standard personal computer and tablet unit volumes in 2017.

Shrinking shipments of desktop and notebook computers enabled cellphone IC sales to surpass integrated circuit revenues for standard PCs in 2013.  During 2015 and 2016, cellphone IC sales came close to catching up with integrated circuit sales for total personal computing systems.  In 2017, cellular phone handsets are now forecast to take over as the largest end-use systems category for IC sales.  The gap between IC sales for cellphones and total personal computing systems is projected to widen by the end of this decade.  Cellphone integrated circuit sales are expected to increase by a compound annual growth average (CAGR) of 5.3% in the 2015-2020 forecast period to $92.1 billion versus personal computing IC revenues rising by CAGR of just 2.9% to $83.8 billion in 2020, says the Update of IC Insights’ 2017 IC Market Drivers Report.

The refreshed forecast shows IC sales for standard PCs climbing 11.2% in 2017 to $67.5 billion after increasing about 4% in 2016 to $60.7 billion.  Tablet IC sales are now expected to drop 2% to $11.8 billion in 2017 after falling 11% in 2016 to $12.1 billion, based on the updated outlook.  IC sales for thin-client and Internet/cloud computing centric systems—such as laptops based on Google’s Chromebook platform design—are projected to rise 15% in 2017 to a $838 million after surging 21% in 2016 to $728 million.  Between 2015 and 2020, IC sales for standard PCs are expected to grow by a CAGR of 4.1% to $71.6 billion in the final year of the updated outlook, while table integrated circuit revenues are projected to fall by -3.9% annual rate in the period to about $11.0 billion and ICs in Internet/cloud computing are forecast to rise by CAGR of 13.8% to more than $1.1 billion.

With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

BY DR. JEAN-CHARLES CIGAL and GREG SHUTTLEWORTH, Linde Electronics, Taipei, Taiwan

Large efforts are being deployed in the car industry to transform the driving experience. Electrical vehicles are in vogue and governments are encouraging this market with tax incentives. Cars are becoming smarter, capable of self-diagnostics, and in the near future will be able to connect with each other. Most importantly, the implementation of safety features has greatly reduced the number of accidents and fatal- ities on the roads in the last few decades. Thanks to extensive computing power, vehicles are now nearing autonomous driving capability. This is only possible with a dramatic increase in the amount of electronic devices in new vehicles.

Recent announcements regarding acquisitions of automotive electronics specialists by semiconductor giants and strategic plans from foundries highlight the appetite from a larger spectrum of semiconductor manufacturers for this particular market. Automotive electronics has become a major player in an industrial transformation.

Automotive electronics is, however, very different from the consumer electronics market. The foremost focus is on product quality, and the highest standards are used to ensure the reliability of electronics components in vehicles. This has also an impact on the quality and supply chain of materials such as gases and chemicals used in the manufacturing of these electronics devices.

Automotive electronics market: size and trends

When you include integrated circuits, optoelectronics, sensors, and discrete devices, the automotive electronics market reached around USD 34 billion in 2016 (FIGURE 1). While this represents less than 10% of the total semiconductor market, it is predicted to be one of the fastest growing markets over the next 5 years.

Screen Shot 2017-06-16 at 12.34.08 PM

There are several explanations for such growth potential:

• The vehicle market itself is predicted to steadily grow on an average 3% in the coming 10 years and will be especially driven by China and India, although other developed countries will still experience an increase in sales.
• The semiconductor content in each car is steadily increasing and it is expected that the share of electronic systems in the vehicle cost could reach 50% of the total car cost by 2030 (FIGURE 2).

Screen Shot 2017-06-16 at 12.34.20 PM

While it is clearly challenging to describe what the driving experience will be in 10 to 15 years, some clear trends can be identified:

• Safety: The implementation of integrated vision systems, in connection with dozens of sensors and radars, will allow thorough diagnoses of surrounding areas of the vehicles. Cars will progressively be able to offer, and even take decisions, to prevent accidents.
• Fuel efficiency: The share of vehicles equipped with (hybrid) electrical engines is expected to steadily grow. For such engines, the electronics content is estimated to double in value compared to that of standard combustion engines.
• Comfort and infotainment: Vehicle drivers are constantly demanding a more enhanced driving experience. The digitalization of dashboards, the sound and video capabilities, and the customization of the driving and passenger environment should heighten the pleasure of time spent in the vehicle.

In order to coordinate all these functions, communication systems (within the vehicle, between vehicles, and between vehicles and infrastructures) are critical and large computing systems will be necessary to treat large amount of data.

Quality really makes automotive electronics different

Automotive electronics cannot be defined by specific technologies or applications. They are currently characterized by a very large portfolio of products based on mature technologies, spanning from discrete, optoelectronics, MEMS and sensors, to integrated circuits and memories.

Until now, the automotive electronics market has been the preserve of specialized semiconductor manufacturers with long experience in this field. The reason for this is the specific know-how required for quality management.

A component failure that appears harmless in a consumer product could have major safety consequences for a vehicle in motion. Furthermore, operating conditions of automotive electronics components (temperature, humidity, vibration, acceleration, etc.), their lifetime, and their spare part availability are differentiators to what is common for consumer and industrial devices (FIGURE 3).

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Currently, some of the most technologically advanced vehicles integrate around 450 semiconductor devices. As they become significantly more sophisticated, the semiconductor content will drastically increase, with many components based on the most advanced semiconductor technology available. Introducing artificial intelligence will require advanced processors capable of computing massive amount of data stored in high-performance and high capacity memory devices. This implies that not only the most advanced semicon- ductor devices will be used, but that these will need to achieve the highest degree of reliability to allow a flawless operation of predictive algorithms.

It is expected that smart vehicles capable of fully autonomous driving will employ up to 7,000 chips. In this case, even a failure rate of 1ppm, already very low by any standard today, would lead to 7 out of 1,000 cars with a safety risk. This is simply unacceptable.

The automotive electronics industry has therefore introduced quality excellence programs aimed at a zero defect target. Achieving such a goal requires a lot of effort and all constituents of the supply chain must do their part.

The automotive electronics industry is one of the most conservative in terms of change management. Longestablished standards and documentation procedures ensure traceability of design and manufacturing deviations. Qualification of novel or modified products is generally costly and lengthy. This is where material suppliers can offer competence and expertise to provide material with the highest quality standards.

What does this mean for a material supplier?

As a direct contact to its customer, the material supplier is responsible for the complete supply chain from the source of the raw material to the delivery at the customer’s gate. The material supplier is also accountable for long-term supply in accordance with the customer’s objectives.
There are essentially two fields where the material supplier can support its customer: quality and supply chain (FIGURE 4).

Screen Shot 2017-06-16 at 12.34.53 PM

Given the constraints of the automotive electronics market, material qualification must follow extensive procedures. While a high degree of material purity is a prerequisite, manufacturing processes are actually much more sensitive to deviations of material quality, as they potentially lead to process recalibration. Before qualification starts, it is critical that candidate materials are comprehensively documented. This includes the manufacturing process, the transport, the storage, and, where appropriate, the purifi- cation and transfill operations. Systematic auditing must be regularly performed according to customers’ standards. As a consequence, longer qualification times are expected. Any subsequent change in the material specification, origin, and packaging must be duly documented and is likely to be subject to a requalification process.

Material quality is obviously a critical element that must be demonstrated at all times. This commands the usage of high-quality products with a proven record. Sources already qualified for similar applica- tions are preferred to mitigate risks. These sources must show long-term business continuity planning, with process improvement programs in place. Purity levels must be carefully monitored and documented in databases. State-of-the-art analysis methods must be used. When necessary, containment measures should be deployed systematically. Given the long operating lifetime of automotive electronic compo- nents, failure can be related to a quality event that occurred a long time before.

Because of the necessary long-term availability of the electronics components and the material qualification constraints, manufacturers and suppliers will generally favor a supply contract over several years. Therefore, the source availability and the supply chain must be guaranteed accordingly.

Material suppliers are implementing improved quality management systems for their products in order to fulfill the expectations of their customers, in terms of quality monitoring and trace- ability. Certificate of analysis (COA) or consistency checks are not sufficient anymore; more data is required. In case deviation is detected, the inves- tigation and response time must be drastically reduced and allow intervention before delivery to the customer. Finally, the whole supply chain must be monitored.

Several tools must be implemented in order to maintain a reliable supply chain of high-quality products (FIGURE 5): statistical process and quality controls (SPC/SQC), as well as measurement systems analysis (MSA), allow systematic and reliable measurement and information recording for traceability. Imple- menting these tools particularly at the early stages of the supply chain allows an “in-time” response and correction before the defective material reaches the customer’s premises. Furthermore, some impurities that were ignored before may become critical, even below the current detection limits. Therefore, new measurement techniques must be continuously inves- tigated in order to enhance the detection capabilities.

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Finally, a robust supply chain must be ensured. It is imperative for a material supplier to be prepared to handle critical business functions such as customer orders, overseeing production and deliveries, and other various parts of the supply chain in any situation. Business continuity planning (BCP) was introduced several years ago in order to identify and mitigate any risk of supply chain disruption.

Analyzing the risks to business operations is fundamental to maintaining business continuity. Materials suppliers must work with manufacturers to develop a business continuity plan that facilitates the ability to continue to perform critical functions and/or provide services in the event of an unexpected interruption. The goal is to identify potential risks and weakness in current sourcing strategies and supply chain footprint and then mitigate those risks.

Because of the efforts necessary to qualify materials, second sources must be available and prepared to be shipped in case of crisis. Ideally, different sources should be qualified simultaneously to avoid any further delay in case of unplanned sourcing changes. Material suppliers with global footprint and worldwide sourcing capabilities offer additional security. Multiple shipping routes must be considered and planned in order to avoid disruption in the case, for instance, of a natural disaster or geopolitical issue affecting an entire region.

Material suppliers need to be aware and monitor regulations specific to the automotive electronics industry such as ISO/TS16949 (quality management strategy for automotive industries). This standard goes above and beyond the more familiar ISO 9001 standard, but by understanding the expectations of suppliers to the automotive industry, suppliers can ensure alignment of their quality systems and the documentation requirements for new product development or investigations into non-conformance.

Future of automotive electronics

With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers. These technologies will allow communication and guidance computing. Most of these components (logic or memory) will be built by manufacturers relatively new to the automotive electronics world— either integrated device manufacturers (IDM) or foundries.

In order to comply with the current quality standards of the automotive industry, these manufacturers will need to adhere to more stringent standards imposed by the automobile industry. They will find support from materials suppliers like Linde that are capable of deliv- ering high-quality materials associated with a solid global supply chain who have acquired global experience in automotive electronics.

For more information about this topic or Linde Electronics, visit www.linde.com/electronics or contact Francesca Brava at [email protected].