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The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced worldwide sales of semiconductors reached $28.2 billion for the month of May 2015, an increase of 5.1 percent from May 2014, when sales were $26.8 billion. Global sales from May 2015 were 2.1 percent higher than the April 2015 total of $27.6 billion. Regionally, sales in the Americas increased 11.4 percent compared to last May to lead all regional markets. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry overcame lingering macroeconomic uncertainty to post solid year-to-year growth in May,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Year-to-year sales have now increased for 25 straight months, month-to-month sales increased for the first time in six months, and we expect modest growth to continue for the remainder of 2015 and beyond.”

In addition to the Americas market, year-to-year sales also increased in China (9.5 percent) and Asia Pacific/All Other (8.0 percent), but decreased in Europe (-7.8 percent) and Japan (-11.8 percent). Compared to last month, sales were up in China (4.0 percent), Asia Pacific/All Other (3.3 percent), and the Americas (0.2 percent), but decreased slightly in Europe (-0.6 percent) and held flat in Japan.

“Congress and the President recently gave the U.S. semiconductor industry and other trade-dependent sectors a major boost by enacting Trade Promotion Authority (TPA), which makes it easier for the United States to strike deals on free trade agreements,” said Neuffer. “With TPA, the United States is more likely to get the Trans-Pacific Partnership (TPP) and other critical trade agreements across the finish line, leading to continued growth and innovation in our industry and across the U.S. economy.”

May 2015

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.61

5.62

0.2%

Europe

2.89

2.87

-0.6%

Japan

2.54

2.54

0.0%

China

7.78

8.09

4.0%

Asia Pacific/All Other

8.78

9.07

3.3%

Total

27.61

28.20

2.1%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

5.05

5.62

11.4%

Europe

3.12

2.87

-7.8%

Japan

2.88

2.54

-11.8%

China

7.39

8.09

9.5%

Asia Pacific/All Other

8.40

9.07

8.0%

Total

26.83

28.20

5.1%

Three-Month-Moving Average Sales

Market

Nov/Dec/Jan

Feb/Mar/apr

% Change

Americas

6.23

5.62

-9.7%

Europe

2.88

2.87

-0.2%

Japan

2.55

2.54

-0.6%

China

7.76

8.09

4.4%

Asia Pacific/All Other

8.32

9.07

9.0%

Total

27.74

28.20

1.7%

 

Smartphones first accounted for more than 50 percent of total quarterly cellphone shipments in 1Q13. In 4Q15, smartphones are forecast to reach 435 million units or 80 percent of total cellphones shipped according to data in IC Insights’ newly released Update to its IC Market Drivers Report (Figure 1). On an annual basis, smartphones first surpassed the 50 percent penetration level in 2013 (54 percent) and are forecast to represent 93 percent of total cellphone shipments in 2018.

Figure 1

Figure 1

In contrast, non-smartphone cellphone shipments dropped by 18 percent in 2013 and 23 percent in 2014.  Moreover, IC Insights expects the 2015 non-smartphone cellphone unit shipment decline to be steeper than 2014’s drop with a decline of 27 percent. Total cellphone unit shipments grew by only 5 percent in 2014 and are forecast to grow by only 3 percent in 2015 (Figure 2).

Figure 2

Figure 2

Samsung and Apple dominated the smartphone market in both 2013 and 2014.  In total, these two companies shipped 457 million smartphones and held a combined 47 percent share of the total smartphone market in 2013.  These two companies shipped over 500 million smartphones in 2014 (503.9 million), but their combined smartphone unit marketshare dropped seven percentage points to 40 percent.  It appears that both Samsung and Apple are losing smartphone marketshare to the up-and-coming Chinese producers like Xiaomi, Yulong/Coolpad, and TCL.

In contrast to the weakening fortunes of Nokia, BlackBerry, and HTC, 2013-2014 smartphone sales from China-based Lenovo (which acquired Motorola’s smartphone business from Google in October of 2014), Huawei, Xiaomi, Yulong/Coolpad, and TCL surged.  Combined, the six top-10 China-based smartphone suppliers shipped 359 million smartphones in 2014, a 79 percent increase from the 201 million smartphones these six companies shipped in 2013.  As a result, the top six Chinese smartphone suppliers together held a 29 percent share of the worldwide smartphone market in 2014, up eight points from the 21 percent share these companies held in 2013.

In early 2015, there were numerous reports of slowing in the Chinese smartphone market.  Since most of the Chinese smartphone producer’s sales are to Chinese customers, this slowdown became evident in their 1Q15 smartphone sales figures.  In total, the top six China-based smartphone suppliers shipped 83.4 million smartphones and held a 25 percent share of the 1Q15 worldwide smartphone market, down four points from their 29 percent combined marketshare in 2014.

Chinese smartphone suppliers primarily serve the China and Asia-Pacific marketplaces.  Their smartphones, unlike those from Apple, Sony, and HTC are low-cost low-end handsets that typically sell for less than $200.  In some cases, smartphones sold by the Chinese companies have been known to sell for as little as $50.

With much of the growth in the smartphone market currently taking place in developing countries such as China and India, low-end smartphones are expected to be a driving force in the smartphone market over the next few years.  IC Insights defines low-end smartphones as those that sell for $200 or less and high-end smartphones as those that sell for greater than $200.

Bruno Mourey, chef du Département intégration hétérogène sur siliciumBy Bruno Mourey, Chief Technology Officer, CEA-Leti

As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

Chief among them for designers and chipmakers are the increased complexity and cost of IC design and yield ramp-ups, and wafer costs, said Carlo Reita, strategic marketing manager at CEA-Leti.

“Disruptive architecture and integration technologies are required,” Reita told participants at the 17th annual LetiDays in Grenoble, France, June 24-25. In his talk, “Technologies and architectures for low-power data processing,” Reita noted the spikes in both complexity and cost that accompany the industry’s progression to smaller technology nodes. The spikes are driven primarily by costly new tools and increases in both design manpower and the number of expensive licenses for software-design tools that accompany increasing device complexity.

Reita cited projections from IBS that industry-wide, non-recurring engineering (NRE) costs will total $38 million for IC designs at the 28nm node, $132 million at the 16nm node and $1.34 billion at the 5nm node.

Adding yield ramp-up costs to IC design costs, which include both new designs and specializations, the projected NREs skyrocket from $59 million at 28nm to $176 million at 16nm and $2.24 billion at 5nm. Meanwhile, the average selling price of 300mm wafers grow from $9,885 at 16nm to $19,620 at 5nm.

Reita noted that such projections underscore the pressure that the industry will face to develop new design-implementation approaches that change the cost metrics for advanced-features, so that initial products can generate revenues that justify the design and yield ramp-up costs.

He said that managing data traffic that is increasing exponentially, while maintaining data-center server performance and lowering the centers’ energy consumption, is among the top challenges for the computing industry in the years ahead. Meanwhile, mobile computing and the Internet of Things are adding a different set of challenges that will feed the design-cost escalation, ranging from the requirement for mandatory long battery life to supporting heterogeneous and power-hungry applications and the capability to adjust to process, voltage and temperature variations.

Reita also outlined Leti’s plans and vision for technologies that address these challenges in the short, medium and longer terms.

Like other speakers during the two-day event, he noted FD-SOI’s advantages compared to FinFET as a proven low-power, cost-effective solution that will meet current and mid-term needs for devices down to the 10nm node. In addition, transistor-stacking options, such as Leti’s low-temperature CoolCube technology, support denser and higher-performing CMOS devices. CoolCube also makes it easier for designers to use heterogeneous integration of material and/or functions and provides a greater degree of freedom for design partitioning, Reita said.

Other avenues of exploration include adaptive fine-grain architecture that mitigates local and dynamic PVT variations, and permits either better use of the chip surface or smaller chips

Leti also is working on resistive RAM that can reduce power consumption at the storage level by putting high-density, non-volatile memory closer to logic chips.

On Leti’s roadmap for the medium term, neuromorphic architectures may enable full transfer of successful algorithms into a specific physical system that will achieve power-efficient computation. Deep recurrent networks with spike coding are a likely candidate to best match physical implementation characteristics.

In Leti’s view, this architecture also allows co-localization of memory and computation similar to a biological system, where a synaptic element performs storage, interconnect and non-linear operations. In addition, the architecture takes full advantage of Leti’s advanced RRAM, 3D and low-power CMOS techniques to break memory-bottleneck and synaptic-density issues, while maintaining ultra low power.

Reita also spoke briefly about quantum computing, “a very long-term” technology possibility, whose appeal includes superposition of the quantum bits (qubits) states in an ultimate parallel system and reversible operators that keep power use at a minimum. This architecture, which is probably 20 years down the road, is expected to massively accelerate computation. It will be best suited for tackling complex optimization problems, Reita said.

Leti collaborates with CEA’s fundamental research departments on topics including SiGe nanowire devices, in which electronics states can act as qubits and use Pauli spin blockade for spin-charge conversion and interaction with CMOS and the external world.

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Leti launches new Silicon Impulse FD-SOI Development Program

Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below. The program allows design teams to predict the impact of CMP on both functional yield and parametric yield, and for manufacturing teams to boost planarization performance, which is increasingly critical for advanced FinFET architectures.

The Cadence and Applied Materials joint development program is focused on front end-of-line (FEOL) and wafer-level CMP modeling. Applied Materials can use the Cadence CMP Process Optimizer, a tool that allows silicon calibration of semi-physical models and optimization of CMP material and process parameters such as pressure, polish time and overall CMP uniformity, to enhance the precision performance of its Reflexion LK Prime CMP system.

Once models are calibrated, design teams can leverage Cadence CMP Predictor, a tool that enhances design performance and yield through model-based CMP hotspot detection and CMP-aware RC extraction. It provides full-chip, multi-level CMP thickness and topography predictions for shallow trench isolation (STI) and replacement metal gate (RMG) CMP processes.

Applied Materials is an industry leader in precision CMP technology with its Reflexion LK Prime CMP system that offers high-speed planarization and multi-zone polishing heads to enable superior uniformity and efficiency with low downforce for extendibility to <14nm device generations. The Reflexion LK Prime CMP system also implements a full suite of advanced process control capabilities that ensure excellent within-wafer and wafer-to-wafer process uniformity control and repeatability for all planarization applications.

“Working together with Cadence, we’re driving advances in CMP process performance,” said Derek Witty, vice president and general manager of the CMP Products Group at Applied Materials. “From our collaboration, we expect to more accurately predict gate height, dishing and erosion on each step of the CMP process, which could enable design and manufacturing teams to achieve higher yield and deliver advanced-node designs to market faster.”

“Cadence CMP Predictor helps turn the uncertainty of manufacturing process variation into predictable impacts, and then minimizes these impacts during the design stage,” said Dr. Anirudh Devgan, senior vice president and general manager of the Digital and Signoff Group at Cadence. “The joint development program with Applied Materials can allow us to drive advancements in CMP modeling processes so our design and manufacturing customers can maximize design yield and performance.”

Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers.  From 2009-2014, semiconductor manufacturers have closed or repurposed 83 wafer fabs, according to data compiled, updated, and now available in IC Insights’ Global Wafer Capacity 2015-2019 report.

Figure 1 shows that 41 percent of fab closures since 2009 have been 150mm fabs and 27 percent have been 200mm wafer fabs.  Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009.  More recently, ProMOS and Powerchip closed their respective 300mm wafer fabs in 2013.

IC fabs Fig 1

 

Semiconductor suppliers in Japan have closed 34 wafer fabs since 2009, more than any other country/region over the past six years.   In the 2009-2014 timeframe, 25 fabs were closed in North America and 17 were shuttered in Europe (Figure 2).

IC fabs Fig 2

 

Worldwide fab closures surged in 2009 and 2010 partly as a result of the severe economic recession at the end of the previous decade.  A total of 25 fabs were closed in 2009, followed by 24 being shut down in 2010.  Ten fabs closed in 2012 and 12 were removed from service in 2013.  Six fabs were closed in both 2011 and in 2014, the fewest number of closures per year during the 2009-2014 time span.

Given the flurry of merger and acquisition activity seen in the semiconductor industry recently, the skyrocketing cost of new wafer fabs and manufacturing equipment, and as more IC companies transition to a fab-lite or fabless business model, IC Insights expects the number of fab closures to accelerate in the coming years—a prediction that will likely please foundry suppliers but make semiconductor equipment and material suppliers a little bit nervous.

By Christian G. Dieseldorff, Industry Research & Statistics Group, SEMI

Semiconductor capital expenditures (without fabless and backend) are expected to slow in rate, but continue to grow by 5.8 percent in 2015 (over US$66 billion) and 2.5 percent in 2016 (over $68 billion), according to the May update of the SEMI World Fab Forecast report. A significant part of this capex is fab equipment spending.

Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one year of decline.  Departing from the norm, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016 (see Table 1).

Table 1: Fab Equipment Spending by Wafer Size

Table 1: Fab Equipment Spending by Wafer Size

At the end of May 2015, SEMI published its latest update to the World Fab Forecast report, reporting on more than 200 facilities with equipment spending in 2015, and more than 175 facilities projected to spend in 2016.

The report shows a large increase in spending for DRAM, more than 45 percent in 2015. Also, spending for 3D NAND is expected to increase by more than 60 percent in 2015 and more than 70 percent in 2016. The foundry sector is forecast to show 10 percent higher fab equipment spending in 2015, but may experience a decline in 2016.  Even with this slowdown, the foundry sector is expected to be the second largest in equipment spending, surpassed only by spending in the memory sector.

A weak first quarter of 2015 is dropping spending for the first half of 2015, but a stronger second half of 2015 is expected. Intel and TSMC reduced their capital expenditure plans for 2015, while other companies, especially memory, are expected to increase their spending.

The SEMI data details how this varies by company and fab.  For example, the report predicts increased fab equipment spending in 2015 by TSMC and Samsung. Samsung is the “wild card” on the table, with new fabs in Hwaseong, Line 17 and S3.  The World Fab Forecast report shows how Samsung is likely to ramp these fabs into 2016. In addition, Samsung is currently ramping a large fab in China for 3D NAND (VNAND) production.   Overall, the data show that Samsung is will likely spend a bit more for memory in 2015 and much more in 2016.  After two years of declining spending for System LSI, Samsung is forecast to show an increase in 2015, and especially for 2016.

Figure 1 depicts fab equipment spending by region for 2015.

Figure 1: Fab Equipment Spending in 2015 by Region; SEMI World Fab Forecast Report (May 2015).

Figure 1: Fab Equipment Spending in 2015 by Region; SEMI World Fab Forecast Report (May 2015).

In 2015, fab equipment spending by Taiwan and Korea together are expected to make up over 51 percent of worldwide spending, according to the SEMI report.  In 2011, Taiwan and Korea accounted for just 41 percent, and the highest spending region was the Americas, with 22 percent (now just 16 percent).  China’s fab spending is still dominated by non-Chinese companies such as SK Hynix and Samsung, but the impact of Samsung’s 3D NAND project in Xian is significant. China’s share for fab spending grew from 9 percent in 2011 to a projected 11 percent in 2015; because of Samsung’s fab in Xian, the share will grow to 13 percent in 2016.

Table 2 shows the share of the top two companies drive a region for fab equipment spending:

Table 2: Share of Fab Equipment Spending of Top Two Companies per Region

Table 2: Share of Fab Equipment Spending of Top Two Companies per Region

Over time, fab equipment spending has also shifted by technology node.  See Figure 2, where nodes have been grouped by size:

Figure 2: Fab Equipment Spending by Nodes (Grouped)

Figure 2: Fab Equipment Spending by Nodes (Grouped)

In 2011, most fab equipment spending was for nodes between 25nm to 49nm (accounting for $24 billion) while nodes with 24nm or smaller drove spending less than $7 billion. By 2015, spending flipped, with nodes equal or under 24nm accounting for $27 billion while spending on nodes between 25nm to 49nm dropped to $8 billion.  The SEMI World Fab data also predict more spending on nodes between 38nm to 79nm, due to increases in the 3DNAND sector in 2015 and accelerating in 2016 (not shown in the chart).

When is the next contraction?

As noted above, over the past 15 years the industry has never achieved three consecutive years of positive growth rates for spending.  2016 may be the year which deviates from this historic cycle pattern.  A developing hypothesis is that with more consolidation, fewer players compete for market positions, resulting in a more controlled spending environment with much lower volatility.

Learn more about the SEMI fab databases at: www.semi.org/MarketInfo/FabDatabase.

Different forecasting algorithms are highlighted and a framework is provided on how best to estimate product demand using a combination of qualitative and quantitative approaches.

BY JITESH SHAH, Integrated Device Technology, San Jose, CA

Nothing in the world of forecasting is more complex than predicting demand for semiconductors, but this is one business where accurate forecasting could be a matter of long-term survival. Not only will the process of forecasting help reduce costs for the company by holding the right amount of inventory in the channels and knowing what parts to build when but implementing a robust and self-adaptive system will also keep customers happy by providing them with products they need when they need. Other benefits include improved vendor engagements and optimal resource (labor and capital) allocation.

Talking about approaches…

There are two general approaches to forecasting a time-based event; qualitative approach and quantitative or a more numbers-based approach. If historical time-series data on the variable of interest is sketchy or if the event being forecasted is related to a new product launch, a more subjective or expert-based predictive approach is necessary, but we all intui- tively know that. New product introductions usually involve active customer and vendor engagements, and that allows us to have better control on what to build, when, and in what quantity. Even with that, the Bass Diffusion Model, a technique geared towards helping to predict sales for a new product category could be employed, but that will not be discussed in this context.

Now if data on past information on the forecasted variable is handy and quantifiable and it’s fair to assume that the pattern of the past will likely continue in the future, then a more quant-based, algorithmic and somewhat automated approach is almost a necessity.

But how would one go about deciding whether to use an automated approach to forecasting or a more expert-based approach? A typical semiconductor company’s products could be segmented into four quadrants (FIGURE 1), and deciding whether to automate the process of forecasting will depend on which quadrant the product fits best.

Figure 1

Figure 1

Time series modeling

Past shipment data over time for a product, or a group of products you are trying to forecast demand for is usually readily available, and that is generally the only data you need to design a system to automate the forecasting process. The goal is to discover a pattern in the historical, time-series data and extrapolate that pattern into the future. An ideal system should be built in such a way that it evolves, or self-adapts, and selects the “right” algorithm from the pre-built toolset if shipment pattern changes. A typical time-series forecasting model would have just two variables; an independent time variable and a dependent variable representing an event we are trying to forecast.

That event Qt (order, shipment, etc.) we are trying to forecast is more or less a function of the product’s life-cycle or trend, seasonality or business cycle and randomness, shown in the “white board” style illustration of FIGURE 2.

Figure 2

Figure 2

Trend and seasonality or business cycle are typically associated with longer-range patterns and hence are best suited to be used to make long-term forecasts. A shorter-term or horizontal pattern of past shipment data is usually random and is used to make shorter-term forecasts.

Forecasting near-term events

Past data exhibiting randomness with horizontal patterns can be reasonably forecasted using either a Naïve method or a simple averaging method. The choice between the two will depend on which one gives lower Mean Absolute Error (MAE) and Mean Absolute % Error (MAPE).

Naïve Method The sample table in FIGURE 3 shows 10 weeks’ worth of sales data. Using the Naïve approach, the forecasted value for the 2nd week is just what was shipped in the 1st week. The forecasted value for the 3rd week is the actual sales value in the 2nd week and so on. The difference between the actual value and the forecasted value represents the forecast error and the absolute value of that is used to calculate the total error. MAE is just the mean of total error. A similar approach is used to calculate MAPE, but now each individual error is divided by the actual sales volume to calculate % error, which are then summed and divided by the number of forecasted values to calculate MAPE.

Figure 3

Figure 3

Averaging Instead of using the last observed event and using that to forecast the next event, a better approach would be to use the mean of all past observations and use that as the next period’s forecast. For example, the forecasted value for the 3rd week is the mean of the 1st and 2nd week’s actual sales value. The forecasted value for the 4th week is the mean of the previous three actual sales values, and so on (FIGURE 4).

Figure 4

Figure 4

MAE and MAPE for the Naïve method are 4.56 and 19% respectively, and the same for the averaging method are 3.01 and 13% respectively. Right there, one can conclude that averaging is better than the simple Naïve approach.

Horizontal Pattern with Level Shift But what happens when there is a sudden shift (anticipated or not) in the sales pattern like the one shown in FIGURE 5?

Figure 5

Figure 5

The simple averaging approach needs to be tweaked to account for that, and that is where a moving average approach is better suited. Instead of averaging across the entire time series, only 2 or 3 or 4 recent time events are used to calculate the forecast value. How many time periods to use will depend on which one gives the smallest MAE and MAPE values and that can and should be parameterized and coded. The tables in FIGURE 6 compare the two approaches, and clearly the moving average approach seems to be a better fit in predicting future events.

Figure 6

Figure 6

Exponential Smoothing But oftentimes, there is a better approach, especially when the past data exhibits severe and random level shifts.

This approach is well suited for such situations because over time, the exponentially weighted moving average of the entire time series tends to deemphasize data that is older but still includes them and, at the same time, weighs recent observations more heavily. That relationship between the actual and forecasted value is shown in FIGURE 7.

Figure 7

Figure 7

Again, the lowest MAE and MAPE will help decide the optimal value for the smoothing constant and, as always, this can easily be coded based on the data you already have, and can be automatically updated as new data trickles in.

But based on the smoothing equation above, one must wonder how the entire time series is factored in when only the most recent actual and forecasted values are used as part of the next period’s forecast. The math in FIGURE 8 explains how.

Figure 8

Figure 8

The forecast for the second period is assumed to be the first observed value. The third period is the true derived forecast and with subsequent substitu- tions, one quickly finds out that the forecast for nth period is a weighted average of all previous observed events. And the weight ascribed to later events compared to the earlier events is shown in the plot in FIGURE 9.

Figure 9

Figure 9

Making longer term forecasts

A semiconductor product’s lifecycle is usually measured in months but surprisingly, there are quite a few products with lifespans measured in years, especially when the end applications exhibit long and growing adoption cycles. These products not only exhibit shorter-term randomness in time-series but show a longer-term seasonal / cyclical nature with growing or declining trend over the years.

The first step in estimating the forecast over the longer term is to smooth out some of that short- term randomness using the approaches discussed before. The unsmoothed and smoothed curves might resemble the plot in FIGURE 10.

Figure 10

Figure 10

Clearly, the data exhibits a long-term trend along with a seasonal or cyclical pattern that repeats every year, and Ordinary Least Square or OLS regression is the ideal approach to forming a function that will help estimate that trend and the parameters involved. But before crunching the numbers, the dataset has to be prepped to include a set of dichotomous variables representing the different intervals in that seasonal behavior. Since in this situation, that seasonality is by quarters representing Q1, Q2, Q3 and Q4, only three of them are included in the model. The fourth one, which is Q=2 in this case, forms the basis upon which to measure the significance of the other three quarters (FIGURE 11).

Figure 11

Figure 11

The functional form of the forecasted value by quarter looks something like what’s shown in FIGURE 12.

Figure 12

Figure 12

The intercept b0 moves up or down based on whether the quarter in question is Q2 or not. If b2, b3 and b4 are positive, Q2 will exhibit the lowest expected sales volume. The other three quarters will show increasing expected sales in line with the increase in the respective estimated parameter values. And this equation can be readily used to reasonably forecast an event a few quarters or a few years down the road.

So there you have it. This shows how easy it is to automate some features of the forecasting process, and the importance of building an intelligent, self- aware and adaptive forecasting system. The results will not only reduce cost but help refocus your supply-chain planning efforts on bigger and better challenges.

JITESH SHAH is a principal engineer with Integrated Device Technology, San Jose, CA

Suppliers of MEMS-based devices rode a safety sensing wave in 2014 to reach record turnover in automotive applications, according to analysis from IHS, the global source of critical information and insight.

Mandated safety systems such as Electronic Stability Control (ESC) and Tire Pressure Monitoring Systems (TPMS) – which attained full implementation in new vehicles in major automotive markets last year – are currently driving revenues for MEMS sensors. Those players with strong positions in gyroscopes, accelerometers and pressure sensors needed in these systems grew as well, while companies in established areas like high-g accelerometers for frontal airbags and pressure sensors for side airbags also saw success.

Major suppliers of pressure sensors to engines similarly blossomed – for staple functions like manifold absolute air intake and altitude sensing – but also for fast-growing applications like vacuum brake boosting, gasoline direct injection and fuel system vapor pressure sensing.

Bosch was the overall number one MEMS supplier with US$790 million of devices sold last year, close to three times that of its nearest competitor, Sensata (US$268 million). Bosch has a portfolio of MEMS devices covering pressure, flow, accelerometers and gyroscopes, and also has a leading position in more than 10 key applications. The company grew strongly in ESC and roll-over detection applications, and key engine measurements like manifold absolute pressure (MAP) and mass air flow on the air intake, vacuum brake booster pressure sensing and common rail diesel pressure measurement.

Compared to 2013, Sensata jumped to second place in 2014 ahead of Denso and Freescale, largely on strength in both safety and powertrain pressure sensors, but also through its acquisition of Schrader Electronics, which provides Sensata with a leading position among tire pressure-monitoring sensor suppliers.

While Sensata is dominant in TPMS and ESC pressure sensors, it also leads in harsh applications like exhaust gas pressure measurement. Freescale, on the other hand, is second to Bosch in airbag sensors and has made great strides in its supply of pressure sensors for TPMS applications.

Despite good results in 2014, Denso dropped two places compared to its overall second place in 2013, largely as a result of the weakened Yen. Denso excelled in MAP and barometric pressure measurement in 2014, but also ESC pressure and accelerometers. Denso has leadership in MEMS-based air conditioning sensing and pressure sensors for continuous variable transmission systems, and is also a supplier of exhaust pressure sensors to a major European OEM.

Secure in its fifth place, Analog Devices was again well positioned with its high-g accelerometers and gyroscopes in safety sensing, e.g. for airbag and ESC vehicle dynamics systems, respectively.

The next three players in the top 10, in order, Infineon, Murata and Panasonic, likewise have key sensors to offer for safety. Infineon is among the leading suppliers of pressure sensors to TPMS systems, while Murata and Panasonic serve ESC with gyroscope and accelerometers to major Tier Ones.

The top 10 represents 78 percent of the automotive MEMS market volume, which reached $2.6 billion in 2014. By 2021, this market will grow to $3.4 billion, a CAGR of 3.4 percent, given expected growth for four main sensors — pressure, flow, gyroscopes and accelerometers.  In addition, night-vision microbolometers from FLIR and ULIS and humidity sensors from companies like Sensirion and E+E Elektronik for window defogging will also add to the diversity of the mix in 2021.

Auto_MEMS_H1_2015_Graphic

DLP chips from Texas Instruments for advanced infotainment displays will similarly bolster the market further in future. More details can be found in the IHS Technology H1 2015 report on Automotive MEMS.

Read more: 

What’s next for MEMS?

Growing in maturity, the MEMS industry is getting its second wind

CEA-Leti announced today during the Design Automation Conference that seven partners have joined its new FD-SOI IC development program, Silicon Impulse, launched to provide a comprehensive IC technology platform that offers IC design, advanced intellectual property, emulator and test services along with industrial multi-project wafer (MPW) shuttles.

The collaborative design platform for advanced processes includes a network of design services and facilities focused on accelerating development of products for today’s and tomorrow’s devices that require low-power use. These include energy-efficient computing systems, Ultra-Low-Power (ULP) Internet of Things (IoT) devices and robust and reliable applications in harsh environments. The platform leverages the competencies and expertise of the CEA-Leti and CEA-List institutes and Leti’s industrial partners, which comprise a wide spectrum of technical and application knowledge.

Silicon Impulse partners are major industrial players in the semiconductor ecosystem, world-class research centers and technology providers. Based on this strong foundation, Silicon Impulse will significantly reduce development time and speed industrialization, thus putting innovative companies at the cutting edge of energy-efficient system development and implementation. It will do this through a network of FD-SOI experts and access to a strong industrial supply chain.

Silicon Impulse partners:

CEA-Leti (coordinator)

CEA-List

STMicroelectronics

Dolphin Integration

CMP

Mentor Graphics

Cortus

Presto Engineering

 

In addition, CEA-Leti is planning to use its research & development license from ARM to demonstrate various energy-efficient processor implementations in FD-SOI for its IoT development platform. The FD-SOI ecosystem also includes Synopsys, with its rich portfolio of proven DesignWare IP products and EDA tools for the FD-SOI design community. Silicon Impulse is in discussion with Synopsys to join the program in order to further extend the program’s reach.

Launched by Leti in 2015, Silicon Impulse is designed to help innovative companies deal with the challenge of switching to new technologies and markets by augmenting both their knowledge of the supply chain and their skills to master the entire design process from ideas to products. To that end, Silicon Impulse will provide technical expertise, knowhow and access to advanced industrial, energy-efficient solutions to get innovators up to speed on the ecosystem of energy-efficient products by facilitating access to FD-SOI technology and manufacturing facilities.

“Leti has always concentrated on research that helps our partners adopt technology to become more competitive in their markets. Now with Silicon Impulse we provide a new service in collaboration with our industrial partners to help companies evaluate, design, prototype and launch new products,” said Marie-Noëlle Semeria, CEO of Leti. “From that foundation, Silicon Impulse will leverage the existing ecosystem to bring the full value chain from research, design solutions and industrialization services to high value-added products. This combination will concentrate through a single entry point all the necessary expertise and competencies to provide innovative companies from any sector with a one-stop-shop opportunity to build leading-edge, energy-efficient systems.”

As electronic devices become increasingly integrated into everyday activities, designing for energy efficiency becomes more important than ever for all mainstream sectors of industry. Embedded systems and particularly the IoT are key enablers in the market, and new entrants (startups, SMEs, large companies) drive innovation. By enabling integration of advanced processes – 28nm FD-SOI technology today – into IoT design and helping companies develop innovative products more rapidly, Silicon Impulse will foster leading-edge technologies and facilitate their adoption for manufacturing.

With the program’s flexible format, Silicon Impulse’s involvement can be limited to architectural consulting or extended to developing and delivering the whole system or anything in between. It can help innovators with their projects from concept through production hand-off. Companies can receive architectural advice and have their products shaped from a very high level, including a feasibility study and recommendations on how to implement the system. Leti and its partners also can provide unique IP and/or technology components such as foundation IP or more complex system level IP blocks, RF, NVM, N/MEMS, 3D components and any other advanced technology to shape a unique and advanced, yet manufacturable, product. At another level, Leti and List could provide embedded software to complete the whole product.

One key goal of the Silicon Impulse platform is to provide and ease silicon access. MPW shuttles are provided to open the doors to a wider set of users and projects. The goal is to enable innovators to test their ideas, especially mixed-signal, analog or RF technologies or any new IP that would require silicon validation in FD-SOI. This also provides an affordable platform for startups and other small companies to build their prototypes and run small volumes until they receive financing and/or demonstrate market traction to build their own mask set. The first 28nm FD-SOI MPW is planned for February 2016 to be processed at STMicroelectronics’ site in Crolles, which is near Grenoble.

The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.6 billion for the month of April 2015, 4.8 percent higher than the April 2014 total of $26.3 billion and 0.4 percent lower than last month’s total of $27.7 billion. The Americas market posted double-digit growth compared to last year, leading all regions. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, a new WSTS industry forecast projects steady market growth for the next three years.

“Year-to-year semiconductor sales increased for the 24th straight month in April, thanks largely to continued growth in the Americas and Asia Pacific regional markets,” said John Neuffer, president and CEO, Semiconductor Industry Association. “The global industry has posted higher sales through April than at the same point in 2014, and we expect continued growth for the rest of 2015 and beyond.”

Regionally, year-to-year sales increased in the Americas (12.2 percent), China (9.9 percent), and Asia Pacific/All Other (5.2 percent), while sales decreased compared with last year in Europe (-5.6 percent) and Japan (-10.7 percent). Compared with last month, sales were up in the Asia Pacific/All Other (2.3 percent) category, but down in Japan (-0.2 percent), China (-0.7 percent), Europe (-2.3 percent), and the Americas (-3.4 percent).

Additionally, SIA today endorsed the WSTS Spring 2015 global semiconductor sales forecast, which projects the industry’s worldwide sales will reach $347.2 billion in 2015, a 3.4 percent increase from the 2014 sales total. WSTS projects year-to-year increases for 2015 in Asia Pacific (7.0 percent) and the Americas (3.7 percent), with decreases projected for Europe (-3.6 percent) and Japan (-9.5 percent).

Beyond 2015, the industry is expected to grow at a modest pace across all regions. WSTS forecasts 3.4 percent growth globally for 2016 ($358.9 billion in total sales) and 3.0 percent growth for 2017 ($369.6 billion). WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

April 2015
Billions
Month-to-Month Sales
Market Last Month Current Month % Change
Americas 5.81 5.61 -3.4%
Europe 2.96 2.89 -2.3%
Japan 2.54 2.54 -0.2%
China 7.83 7.78 -0.7%
Asia Pacific/All Other 8.58 8.78 2.3%
Total 27.72 27.60 -0.4%
Year-to-Year Sales
Market Last Year Current Month % Change
Americas 5.00 5.61 12.2%
Europe 3.06 2.89 -5.6%
Japan 2.84 2.54 -10.7%
China 7.08 7.78 9.9%
Asia Pacific/All Other 8.35 8.78 5.2%
Total 26.34 27.60 4.8%
Three-Month-Moving Average Sales
Market Nov/Dec/Jan Feb/Mar/Apr % Change
Americas 6.51 5.61 -13.8%
Europe 2.95 2.89 -2.0%
Japan 2.62 2.54 -3.0%
China 8.07 7.78 -3.6%
Asia Pacific/All Other 8.40 8.78 4.5%
Total 28.54 27.60 -3.3%