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PARC, a Xerox Company, is a pioneer in the development and commercialization of thin film transistors, circuits, and sensors. With a 40 year history of commercial innovation, PARC scientists have a deep knowledge of printing technology applied in domains such as displays, image sensors, and medical sensors, PARC’s technical expertise and facility support printed dielectrics, nanoparticle metals, organic, oxide, and silicon (amorphous, polycrystalline, printed nanowire) semiconductors.

Solid State Technology editor Pete Singer caught up with Janos Veres, area manager for printed electronics in the electronic materials and devices laboratory at PARC. Veres’ current interests are in combining disruptive material, process, and device technologies — for printed, flexible circuits; sensor and memory arrays; batteries and display devices — all with a focus on early commercialization opportunities. Janos has experience in components such as novel printed circuits, organic transistors, and printable semiconductors; applications such as OLEDs, displays, and RFID; as well as printing/coating technologies including electrophotography, flexography, and offset printing.

Before joining PARC, Veres was the CTO at PolyPhotonix, where he developed radically new process technologies for OLED devices. Prior to that, he worked at Eastman Kodak as their Program Manager of Printed Electronics, and was a Business Research Associate at Merck Chemicals (formerly Avecia) where he led several of the world’s first demonstrators built using novel electronic materials. Janos also set up unique pilot production lines for solution coating when he was responsible for Organic Photoreceptor development at Gestetner Byfleet. Dr. Veres holds a Ph.D. in Solid State Electronics from Imperial College in London and an MSc in Physical Electronics with distinction from Lviv Technical University in Ukraine.

Veres said described printed electronics as a relatively new field, with the “early years” being only 10-12 years ago. The focus is on materials that can be formulated as inks and deposited over large areas. This is quite useful for applications such as flexible displays, which was the original focus of the work, and more recently on smart cards and printed tags.  Recent progress has printed electronic transistors inching closer to those produced in polysilicon.

“We never believed that they might one day compete with amorphous silicon,” Veres notes. “That’s happened and probably 4-5 years ago, we saw that barrier broken. That means we can now take organic materials and achieve the same kind of performance that you see in displays. That progress is carrying on and at the lab level, you can build devices that are now performing better than what amorphous silicon offers. The progress will not stop there. We might see a significant improvement in mobilities at which point devices we build might be competing with polysilicon.”

This kind of progress could disrupt conventional microelectronics manufacturing. “A factory might look very different than the conventional microelectronics factory. It might look more like a printing press than a microelectronics fab,” Veres said.

Listen to the podcast interview with Veres below:

 

Last year has been an outstanding one for LED-related equipment sales. However, this former bright sky overclouds for capital expenditures in 2012, and many market analysts project around 18% decay for this years’ equipment sales. But to keep things straight, this number is mainly related to MOCVD sales, making up for about 50% of the LED equipment pie in one fab. In fact, downstream processes — including lithography, bonding, testing or packaging — are expected to further increase in capex for 2012.

Changing requirements

Traditionally, the most important factor for LED manufacturers has been tool cost. This was especially true for any downstream process after MOCVD growth. Today, these requirements are changing. More complex chip layouts for higher lumen output and increased LED efficiencies demand more sophisticated processes and equipments. Having said that, the focus of LED makers is shifted to more traditional values of equipment requirements, such as higher automation, enhanced yield and increased throughput.

It’s all about efficiency

Based on the Department of Energy LED manufacturing roadmap, costs are still a factor of 5-8 too high to trigger mass adoption of solid state lighting technology and efficiently compete with alternative technologies. This cost target directly rolls back to LED manufacturers and hence the equipment supplier, demanding for more efficient manufacturing technologies. Therefore, three general decision factors have been established, namely capital efficiency, footprint efficiency and cost of ownership. Capital efficiency basically tells the number of processed wafers per unit time for any capital dollar spent. Footprint efficiency gives the wafer output per unit time for any square-metre of fab space. Efficient use of precious fab space is very closely linked to how profitable a LED fab can be operated. Combining these factors lead to cost of ownership, being traditionally used in semiconductor industry rather than the LED industry.

Applying the above metrics to any process step illustrates their importance. As an example, optical lithography is the general applied patterning technique for LED manufacturing. With three to seven lithography layers – depending on application and LED complexity – any advantage in these metrics is multiplied several times. Thus, mask aligners can considerably leverage manufacturing cost. The newly developed EVG620HBL has been optimized according to these metrics. The system delivers industry-leading throughput and more than 20% increased capital efficiency as well as footprint efficiency.

Upcoming technical challenges

Another hot topic is patterned sapphire substrates (PSS), which enable higher light extraction and a reduced defect density. Looking into the future, feature sizes of PSS will be further minimized into the sub-micrometer range, leading to so-called nanometer PSS (NPSS). These NPSS substrates show considerable advantages, including further reduced defect density and increased extraction efficiency compared to micron-sized PSS. In this way, the overall LED efficiency is improved. Even a comparatively small increase in overall LED efficiency can considerably reduce the required chip area for a certain lumen output. Hence, LED efficiency is an important lever for cost reduction. Furthermore, when using NPSS, cost reduction is enabled by shortened sapphire etching and shortened growth time in the MOCVD, due to reduced feature size of NPSS substrates. On the other hand, manufacturing cost of NPSS is the same as standard PSS. With nano imprint lithography (NIL) and PHABLE, EVG has two different, cost-efficient technologies implemented in its portfolio.

In conclusion, with MOCVD market saturation, the focus of the LED industry is shifted to downstream processes. Increasing process yield and cost efficiency will be a central aspect for future equipment decisions of LED manufacturers. Advanced manufacturing technologies, to increase overall LED efficiency, are generating added value to current process flows.

Thomas Uhrmann (left) is Business Development Manager, EV Group, and Thorsten Matthias (right), is Business Development Director, EV Group.

 

This article was originally published in the DisplaySearch Monitor, January 2012, by Charles Annis, DisplaySearch.

Annis shares 10 trends in liquid crystal display (LCD) manufacturing, covering LTPS, IGZO, alignment technologies, metallization techs, 2µm resolution lithograhy patterns on Gen 8 glass, and more.

The LCD industry faces heady challenges. Pure play LCD makers have lost money 5 quarters in a row and it looks to continue. The equipment market is expected to drop a record 63% in 2012. Fab utilization remains stuck in the 70% range. However, LCD makers have continuously improved manufacturing technology, and are applying revolutionary new technologies. Adoption of new manufacturing technology in 2012 will make the highest-quality, lowest-cost flat panel displays (FPDs) available to consumers worldwide, especially in smartphones and tablets.

Figure 1. Top 10 LCD manufacturing technology trends of 2012. Source: DisplaySearch TFT LCD Process Roadmap Report.

1: Most LCDs are produced using amorphous silicon thin-film transitors (a-Si TFTs). Although a-Si suffers from poor mobility, it is a low-cost semiconductor material acceptable for many applications. However, as FPD performance has continued to increase over time, the need for higher mobility backplanes has grown. The main reasons for this are to reduce TFT size for super-high resolution small/medium LCDs to increase transmission and battery life as well as to provide sufficient current to drive active-matrix organic light emitting diode (AMOLED) devices.

Low-temperature polysilicon (LTPS) has been in mass production for more than 10 years, a great technology in need of appropriate applications. High-resolution LCDs and AMOLEDs are a substantial growth opportunity for LTPS. In 2012, LTPS manufacturing will take off as SMD, Sharp, and Toshiba all ramp up new Gen 5.5/6 LTPS fabs and as SMD begins production on its Gen 8 LTPS pilot line.

2: Indium gallium zinc oxide (IGZO) offers mobility performance somewhere between a-Si and LTPS. Although it is a less mature technology than LTPS, IGZO processes are quite similar to conventional a-Si, with only a marginal capital cost add (around 20%) compared to 2X the additional capital required to produce high-performance LTPS panels. Sharp started IGZO pilot production late in 2011, and LG Display and Samsung are expected to follow in 2012.

Figure 2. Equipment spending by technology. Source: DisplaySearch Q4’11 Quarterly FPD Supply/Demand and Capital Spending Report.

3: Polymer stabilized alignment (PSA) and optical alignment (OA) are the two main technologies to improve performance of the alignment process. Both simultaneously improve image quality — mainly by improving contrast — and lower costs by improving transmission. Production of OA will increase significantly in 2012, as Sharp applies it to FFS-type panels and licenses its VA technology to other manufacturers.

4: Advanced resolution exposure refers to the pattering of very fine features in the FPD array. Conventional photolithography for Gen 5 and larger substrates has historically been limited to 3µm at best. In 2012, leading FPD lithography tool vendors are expected to release next-generation tools that enable 2µm resolution on glass sizes up to Gen 8. Market forces are driving the push to higher resolution pattering:

  • Increase aperture ratio for super high resolution displays
  • Complicated AMOLED pixel designs
  • Narrow pixel electrode patterns for PSA and FFS to increase transmission 
  • Novel pixel designs such as short channel TFTs

5: The most important trend in liquid crystal is the continuous shift towards FFS as the LC mode of choice for mobile applications, particularly for those that adopt touch. FFS, only a few years ago, seemed like it would become a niche technology compared to conventional IPS and VA. However, because it offers superior transmission, off-axis viewing, and resistance to touch mura, FFS continues to gain share not only in mobile applications but also in some large-area applications.

Figure 3. LC Mode by TFT Capacity (000 m²). Source: DisplaySearch TFT LCD Process Roadmap Report.

6: Super high aperture (SHA) ratio pixel designs typically use an extra organic planarization layer in the array process to planarize the device and increase the vertical gap between the pixel ITO and bus lines. This reduces unwanted capacitive coupling and enables the pixel electrode to be extended over the gate and data lines without causing cross-talk or affecting image quality — thus increasing aperture area. Higher transmission can lower backlight costs by reducing LEDs, brightness enhancement film, etc. Despite a yield trade-off and additional costs to implement, SHA has grown rapidly since 2009. It is now commonly applied to higher resolution mobile products and also, in many cases, to large-area LCDs. About 25% of all LCDs now adopt an SHA process.

7: Low resistance metallization now refers to copper. Cu has the lowest resistivity of any of the other bus line metals that have been used historically to manufacture LCDs, with several benefits:

  • Thinner gate and source line, which can help increase transmission
  • Reduces RC delay issues
  • May reduce costs by eliminating dual-scan driver drivers 
  • The major trade-off is reduced yield. LG Display implemented it for large-scale commercial production in Gen 6.

Its IP position has made it difficult for other manufacturers to adopt. Regardless, Cu adoption has grown rapidly since 2009 as various alternatives have been developed. Several top-tier LCD manufacturers are now using copper, though some are still in the development stage.

8: Color filter on array (COA) is a technology that was developed many years ago, but has been widely adopted only since 2009. COA moves the RGB color patterns from the opposite glass to the array glass, with several benefits:

  • Improved contrast
  • Increased aperture ratio (the thick organic color resist enables the same sort of high aperture pixel designs as SHA by allowing the pixel electrode to be extended over the bus line)
  • Reduced BM width
  • Reduced alignment errors between array and opposite glass issue
  • Possible improvement in cell process curing performance 
  • Like many new manufacturing technologies, the trade-off in implementing is yield. In 2011, LG Display became the third top-tier manufacturer to implement COA in mass production of large-area LCDs, and further growth is expected in 2012.
Figure 4. COA concept. Source: DisplaySearch TFT LCD Process Roadmap Report, and Samsung.

9: The key trend related to glass is no longer size increases — it is reducing thickness. Historically, glass substrate size growth was the most important trend in LCD manufacturing. Through Gen 8, a new glass size was introduced every one or two years. However, this trend has slowed significantly due to endemic over-supply and high capital costs of larger fabs. Motivations to adopt thin glass vary by small/medium and large-area applications. For small/medium, reducing thickness enables a thinner, lighter LCD required for mobile applications. For large-area LCDs, reducing glass costs has been an important target for panel makers. In 2012, 0.4mm glass for =Gen 5 and 0.5mm for +Gen 8 is expected to grow dramatically.

10: Black matrix (BM) width reduction has been an ongoing trend for several years and is forecast to continue in 2012. The main benefit is an improvement in transmission by increasing the pixel aperture area. Here are some examples:

  • 25µm BM width = 60% aperture
  • 15µm BM width = 75% aperture 
  • 10µm BM width = 80% aperture
Figure 5. BM width reduction. Source: DisplaySearch TFT LCD Process Roadmap Report.

An increase in brightness is the most common target for manufacturing technologies. This is not due to panel makers trying to increase device brightness, but because brightness can be traded off to lower costs or power consumption. Resolution is the second most common target, mainly because both smartphones and tablets are rapidly driving the mobile market. These applications are also pushing reduced weight and thickness. Also read: Mobile drives display materials development in 2012  

More information about current LCD manufacturing trends can be found in the newly released TFT LCD Process Roadmap Report. The report focuses on key current industry trends such as LTPS, oxide semiconductors like IGZO, super high resolution displays, FFS, optical alignment, and other technologies related to smart phones, tablets, and Apple, as well as large-area displays for TVs and other applications. Learn more about the report from DisplaySearch LLC, an NPD Group Company, at www.displaysearch.com.

Visit the new Displays Manufacturing Channel on ElectroIQ.com!

January 23, 2012 — The LCD TV market saw a rapid shift toward sizes larger than 40" at the end of 2011, as consumers, particularly in North America and China, took advantage of new sizes and more affordable prices. As larger sizes such as 46”, 47”, 55”, 60” and 65” are being adopted by consumers, display panel makers are also developing other new large size TV panels, including 43”, 48”, 50”, 70”, 75”, 80” and even larger.

In light of this strong end-market adoption, NPD DisplaySearch increased its forecast for LCD TV area demand. According to the NPD DisplaySearch Quarterly Worldwide FPD Shipment and Forecast Report, LCD TV panel demand will reach 85 million square meters in 2012, nearly 2% higher than the previous forecast. NPD DisplaySearch has also increased the area demand forecast from 2013 to 2018 to account for increased 40"+ LCD TV demand. Market share for 40"+ panels is also growing; in 2015, 40"+ sizes are expected to account for 38% of total LCD TV panel demand (previously forecasted at 34%).

Figure 1. LCD TV Demand Area – Q3’11 and Q4’11 (Millions m²). Source: NPD DisplaySearch Quarterly Worldwide FPD Shipment and Forecast Report.

North America and China are the 2 largest global LCD TV markets, and consumers in these locations are adopting 40"+ LCD TVs robustly, said David Hsieh, VP, NPD DisplaySearch. "Consumers are responding to promotions to buy larger sizes. Panel makers are working to push this trend further by producing larger panels more efficiently. The increase in LCD TV area demand means more capacity consumption. This will be an important aspect in balancing TFT LCD supply/demand."

New panel sizes such as 39”, 43”, 48”, 50” and 65” are being manufactured in the same Gen 6 through Gen 8 fabs, but now offer better glass substrate utilization efficiency. TV makers are combining ultra-slim bezels, direct-type LED backlights, and other user-friendly features with attractive prices on these models. Even larger sizes such as 58"-84" can be produced with high-end features — 21:9 cinema form factor or 4Kx2K resolution — to draw consumers.

Figure 2. 40"+ LCD TV Percentage in Total LCD TV -Q3’11 and Q4’11 (Unit Basis). Source: NPD DisplaySearch Quarterly Worldwide FPD Shipment and Forecast Report.

The NPD DisplaySearch Quarterly Worldwide FPD Shipment and Forecast Report covers quarterly worldwide shipments of all major flat panel applications. With over 140 FPD producers across 10+ countries, this report analyzes historical shipments and forecast projections to provide some of the most detailed information and insights available. NPD DisplaySearch is a global market research and consulting firm specializing in the display supply chain, as well as the emerging photovoltaic/solar cell industries. Learn more at http://www.displaysearch.com/.

Visit the new Displays Manufacturing Channel on ElectroIQ.com!

January 23, 2012 — North America-based manufacturers of semiconductor equipment posted $1.16 billion in orders in December 2011, $1.32 billion in billings, and a book-to-bill ratio of 0.88, according to SEMI’s December Book-to-Bill Report. The book-to-bill ratio has been climbing since September 2011. In December 2011, bookings climbed back above the $1 billion mark.

The three-month average of worldwide bookings in December 2011 was $1.16 billion. The bookings figure is 18.5% above November 2011 and 26.7% below the $1.58 billion in orders posted in December 2010.

The three-month average of worldwide billings in December 2011 was $1.32 billion. The billings figure is 11.8% more than the final November 2011 level and is 25.2% less than the December 2010 billings level of $1.76 billion.

Bookings for semiconductor equipment are increasing, said Dan Tracy, senior director of Industry Research and Statistics at SEMI, adding, "Recent capital spending announcements by leading device manufacturers indicate the potential for continued improvement in 2012." Samsung and Intel both announced ambitious 2012 capex plans this month.

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of US dollars. Source: SEMI January 2012.
  Billings (3-mo. avg) Bookings (3-mo. avg) Book-to-Bill
July 2011  1,521.2 1,298.2 0.85
Aug 2011 1,457.7 1,162.4 0.80
Sept 2011 1,313.5 926.5 0.71
Oct 2011 1,258.3 926.8 0.74
Nov 2011 (final) 1,176.7 977.2 0.83
Dec 2011 (prelim)  1,315.9 1,157.8 0.88

A book-to-bill of 0.88 means that $88 worth of orders were received for every $100 of product billed for the month. The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS). SEMI is a global industry association serving the nano- and micro-electronic manufacturing supply chains. For more information, visit www.semi.org.

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January 18, 2012 — The evening SEMI’s International Semiconductor Strategy Day 2 ended with a banquet celebrating the 35th anniversary of this ISS meeting and honoring Stan Meyers, who retired in November after 15 years as SEMI President and 24 years as a SEMI Board member. Jim Morgan of Applied Materials, Ken Levy of KLA-Tencor and Stan’s successor Denny McGuirk paid tribute to Stan’s contributions and character over the years. Denny also presented the 2011 SEMI Award for North America to QD Vision of Lexington, MA for commercialization of quantum dot technology used in lighting and displays. The award was accepted by CTO and Founder Seth Coe-Sullivan.

Day 3 of ISS 2012 began under brisk clear skies, but with an ominous storm front clearly defined and moving toward land. Soon…

Luc Van Den Hove, CEO of IMEC, opened this final day with his view of innovation in semiconductors and the wide-ranging implications for the ways they will impact our lives even more. Medical care is a hugely impactful area, including the migration from reactive treatment of symptoms to proactive detection of predictive biomarkers. By 2030, the global population over age 65 will exceed 1 billion. Luc recapped the enabling materials innovation that took us from 90nm to 14nm, then ventured to super mobility channels and tunnel FETs that will be components of the road to 7nm. The top 8 fabs representing 76% of 300mm capacity are working with IMEC.

Figure 1. Tunnel FET.

Marianne Wu, Partner at Mohr Davidow, brought in the current VC view of clean tech and how it relates to our industry. The global population is becoming wealthier and living longer, driving energy demand aggressively and making clean tech the 3rd largest VC investment sector today. The cost of PV modules has fallen to the point where the solar power market is sustainable without government subsidies. The semiconductor opportunities are grouped in power electronics and distributed power management; LED lighting; and sensors — the internet of things. Quantum dot enhancement will improve color management in LED lighting, but thermal management remains a gating factor.

Figure 2. Fundamental drivers remain strong.
Figure 3. Global demand growth continues.

Waguih Ishak, Division VP at Corning, talked about the role of glass in enabling the technology advances covered in this meeting. Their invention of low loss optical fiber in 1972 arguably created the internet. Very tough Gorilla Glass is ubiquitous in smart phones and iPads where handling can be rough. Corning’s video on YouTube, “A Day Made of Glass” has over 17M hits and prompted calls for orders of displays shown in the video. These were visionary mockups, not available products, but these calls prompted a product development workshop at Stanford last October.

Figure 3. Surface strength of thin semiconductor-quality wafer glass: Amazingly strong.

Matthew Taylor, CEO of Edwards, espoused the product solutions resulting from vacuum science. While maintaining a semiconductor-centric focus, there is a strong emphasis on diversification to tangentially-related emerging technologies, new general vacuum applications, and environmental abatement. For all of the fuss made over high technology sectors, note that the application shown at the upper right in the figure, representing greatest vacuum intensity, is steel degassing.

Figure 4. Vacuum and abatement applications are proliferating. 

Michael Wright, President of Applied Global Strategies, moderated the Streetviews Panel; panelists included Edwin Mok of Needham, Avinash Kant of DA Davidson and Krish Sankar of Bank of America Merrill Lynch. Nuns in drag did not participate in this year’s discussion. Edwin: capital intensity is declining, but is likely to stabilize as was the case for the HDD industry. Expect a flat line in 2012 and modest growth in 2013. Avinash: he’s expanded his coverage to include advanced materials (ATMI, CCMP, ENTG) and clean tech. The 10 year segment CAGR of 9% is significantly lower than the previous 8 year CAGR of 27%, possibly responsible for the lower multiples these companies are enjoying. Krish: forecasting 2012 cap-ex to be down 15% Y/Y, with capacity expansion returning late in the year. A NAND rebound is anticipated 2H12; DRAM bit growth will come from shrinks, not capacity addition. Michael: we haven’t had a semiconductor equipment IPO in 6 years. Samsung announced a $13.2B cap-ex plan this morning. Q&A: There was no prescient insight provided regarding what analysts look for in evaluating companies in our industry; do everything well. There are a handful of candidate small equipment suppliers on the table for consolidation or aggregation into the larger players.

Read Fury’s reports from ISS:

ISS kicks off with IC industry reality talks

ISS day 2: Cloud computing to drive 450mm, closer collaboration

And chief editor Pete Singer’s report:

ISS: Top Ten Economic Trends in 2012

January 17, 2012 — Day 2 of SEMI’s Industry Strategy Symposium (ISS) 2012 began with weather related issues. The meeting itself was not affected, but several tee times were delayed due to frost. But it was warm inside, where the rest of us huddled around the barrel fires that sent our hopes and dreams for a quick economic recovery up in flames.

Also read: Fury’s Day 1 ISS report and Chief Editor Pete Singer’s ISS report

Mike Splinter, Chairman & CEO of Applied Materials, kicked off the second day with Applied’s view of what the future holds for us as we accelerate change. He noted that both PV and displays are single-purpose devices, whereas semiconductors can be tasked for a much broader range of applications. The next 5 years will take us through more inflections than the past 15 years. Success will require improvements in R&D productivity. The 300mm transition cost $12B with a 14 year investment recovery time. The 450mm transition is estimated to cost $15-20B, but the investment recovery time remains a big unknown. The top 5 capital spending fabs grew from 36% of the total spending in 2000 to 75% in 2012. The top 5 capital equipment suppliers grew from 54% of total revenue to 67% over the same period.

Figure 1.Top 5 capex spenders, tool suppliers.

 

Mark Thirsk of Linx Consulting opened the materials session with his prognosis on the health of the global electronic materials supply chain. If 450mmm fabs are not built, the number of 300mm fabs required will exceed 300 by 2028; the 450mm transition is required on economic grounds alone. Delaying the implementation of EUV will result in an additional industry cost of $8.5B in 2016 due to the use of less productive double patterning. The semiconductor materials CAGR for 2011-2020 is 12%. The cost of process materials as a percentage of chip revenue will rise from its 2002-2011 average of 1.7% to 3.5% by 2020. Photoresist is no longer performing the ‘resist’ portion of its function, being too thin and having sacrificed etch resistance for pattern definition. There is abundant opportunity for consolidation in CMP slurry, but little chance in photoresist due to strong legacy supplier relationships. Patterning, CVD/ALD and CMP will drive the materials demand growth. The PV materials demand is forecast to be $25B by 2015.

Figure 2. Global electronics materials industry, 2011.

 

Tim Hendry, VP of Intel’s Technology & Manufacturing Group, addressed the advanced products that are enabled by materials development. Early engagement and close collaboration through joint development agreements has been an increasing component of the R&D plan since 130nm. Volume forecasting is becoming more critical to maintain profitability for both supplier and fab. In some materials, barrels and totes are giving way to tankers as consumption volumes increase. Business continuity planning is now focusing on better customizing each material’s reserve based on its supply chain complexity and specific risk levels throughout.

David Lazovsky, Founder of Intermolecular, talked about the collaboration models used by his company to accelerate innovation and time to market. Their process tools are built specifically for the purpose of rapid R&D learning in both wet processes and thin film deposition processes. Given its focus on innovation, it’s no surprise that they have filed 207 patent applications in the past 12 months. He believes the sub-22nm CMOS logic IDM base will shrink to Intel, TSMC, GlobalFoundries and Samsung. The speed of innovation in mobile computing is a strategic match for IM’s growth objectives, as is the increasing dependence on materials and device architecture innovation.

Figure 3. Performance improvements. SOURCE: IBM Microelectronics, IBM, IC Insights.

 

Harvey Frye, Vice Chairman of TEL, moderated the semiconductor markets discussion panel which included Bob Johnson of Gartner, Egan Christiansen of Dell, Will Stofega of IDC, and Paul Semenza of DisplaySearch. Harvey: During the week of December 25-31, 2011, there were over 20M new subscriber activations for Apple and Android smart phones. The number of downloaded apps that week was 1.2B globally, of which 500M were in the US and 100M in China. The Apps Store generates 4% (~$7B) of Apple’s market cap; this is about the same as RIM’s total market cap. Bob: By 2015 the semiconductor industry will derive $375B, almost 2/3 of its revenue, from mobile cloud computing. The internet handles 15 petabytes of new information every day. Over 50% of internet connections today are things (largely public utility related), as opposed to computing or phone devices in the hands of an individual. Implementation of predictive analytics will result in a cloud that knows what you want to do before you do it, and then influence you to do it. Egan: Facebook handles 1M updates and photo postings every minute. The public cloud services market will be $176B by 2015. 43% of the US workforce (63M workers) will be telecommuting by 2016. Will: Smart phone units shipped will surpass ‘feature phones’ in 2015, at 1B each. Paul: As internet-connected TV evolves, it will morph strongly from broadcaster-controlled services to consumer-controlled services. The cloud will replace the TV as the central connection point to which other devices must conform.

Figure 4. From the Internet of Things to the Internet of Everything.

Handel Jones, Founder of IBS, forecast some high level IC trends for the next 5 years. We will continue the trend of a 10x increase in wireless bandwidth every 5 years. Demand is strong but delivery is lagging for 28nm HKMG devices; 20nm is expected to ramp even more slowly. Intel is thought to be 18-30 months ahead of the industry in FinFET implementation. Declarations of insolvency are expected for several DRAM manufacturers, which he declined to identify. The projected cost per gate is increasing slightly at 22nm and 14nm, a trend that must be reversed. IC revenue growth will be low as fabs lower prices to protect market share in an unstable global economy. Qualcomm will be a $30B fabless company in 2015. Samsung will challenge Intel for the position of largest semiconductor manufacturer. TSV must reduce cost and stress problems in order to become competitive. 3D packaging can provide a competitive advantage equivalent to a half node.

Figure 5. Cost per gate trends.

Dan Hutchenson, CEO of VLSI Research and winner of the 2012 Bob Graham Award, kicked off the 450mm discussion panel with the expectation that while it will clearly be expensive, the 450mm transition will not be as costly overall as the oft-delayed 300mm transition. Spending on 450mm has been $0.5B so far, with another $7.6B needed by 2020. The equipment business, having flat-lined at ~$56B for several years, is not keeping pace the overall growth of the semiconductor fabs; the cost model needs to change to sustain development. Panelists were John Chen of Nvidia, Paolo Gargini of Intel, Randhir Thakur of Applied Materials, Takahashi Abe of Sumco, and Kazuo Ushida of Nikon. John: Transistor cost is not scaling with node for 28nm, 20nm and 14nm; they are all falling to the same normalized cost per transistor, as did 55nm and 40nm. Paolo: 450mm equipment development will take place in 2012-2014 and begin to move into production in 2015. The tipping point will come when litho production equipment is available. Randhir: The 450mm investment is stacked on top of 3 additional nodes that need to be developed for 300mm. Abe-san: Coordinated timing will be critical to achieve a cost-effective rollout of 450mm supplies. Ushida-san: Technology progress will drive technology decisions. CEO’s need to drive the economic decision for 450mm litho. EUV is a technology-gated issue that must be kept separate.

Figure 6. Suppliers have not shared in the semiconductor industry’s growth.

 

The economic outlook for the world is dismal, the semiconductor industry has consolidated and matured to the point where it’s looking for tips from the automotive industry, and unprecedented challenges must be overcome to stay on the path defined by Moore’s Law. This negative news, delivered during the first day of SEMI’s Industry Strategy Symposium (ISS), was offset by projections that the world has so embraced electronic devices that the use of transistors is expected to skyrocket over the next decade, growing 15X in the next five years, and another 15X in the five years after that. “We’re barely at the beginning,” said Bill Holt of Intel in the keynote. “The next ten years will make the previous 40 years look like a flat line,” he said, showing the worldwide transistor demand growing from 5 quintillion in 2005 to 75 quintillion in 2010 and 1100 quintillion in 2015 (see figure). Holt is the senior vice president and general manager of the technology manufacturing group at Intel.

 

Among the devices driving the transistor explosion are new ultrabooks – more than 50 were introduced at the Consumer Electronics Show (CES) according to Shawn Du Bravac, chief economist and director of research at CEA, who also spoke at ISS. He noted that the makers of the ultrabooks were not touting performance, as has often been the case in the past, but industrial design elements such as the thinness or aluminum casings. He said the future was all about ubiquitous connectivity, where mobile devices could connect with everything from your thermostat in your home (it uses GPS tracking to know to power down when you leave the house, and power up when you’re five minutes away from returning) to the stereo in your car.

The economists speaking at ISS were less positive about the world economy, however, predicting a recession in Europe (which seems increasingly inevitable), the impact of massive government debt in the US, concerns of a slowdown in China and general world volatility. “World growth will slow in 2012,” said Duncan Meldrum of IHS. “It’s only a question of how much.” Meldrum is senior director, center for forecast and modeling. He said in the most likely scenario, world growth will slow from 3% in 2011 to around 2.7% in 2012 – continuing a path of subpar performance relative to “normal” recoveries. He said weak recoveries are usually due to uncertainty in markets, caused by government debt reaching extreme levels, and euphoric spending leading to excessive investment and asset bubbles (e.g. housing). “It’s difficult to get any return on investment of any kind,” he said. The one bright spot from Duncan’s talk: The US economy will “muddle through” 2012, with very little risk of inflation.

Duncan concluded with two nightmare scenarios. The biggest risk is a “Lehman moment” in Europe with some small countries exiting the Eurozone and/or a messy default by one or more large Eurozone countries, especially Italy or Spain. This scenario would drag the rest of the world into recession. The second big risk is a sharp slowdown in China (to around 5%), triggered by a bursting of the real estate bubble. This scenario would have the biggest impact on the rest of Asia and the commodity-exporting emerging markets. Although he said the probability of each of these scenarios is only in the 20% to 30% range, either scenario would pull semiconductor growth rates negative in 2012.

Meldrum’s presentation also included the IHS “top ten” list for 2012:

1.      The United States will probably avoid a recession. Domestic risks have diminished somewhat and growth momentum has picked up modestly. Consumers seem willing to spend and businesses are more disposed to hire, but fiscal tightening continues, household deleveraging continues, housing is still in excess supply, and export prospects have dimmed. This means that 2012 growth is likely to come in between 1.5% and 2%. The Eurozone sovereign-debt crisis is the biggest threat to the U.S. economy. The longer-term outlook is clouded by uncertainty over how America’s burgeoning sovereign-debt problem will be fixed.

2.      Europe is headed for a second dip. All forward-looking indicators suggest that Europe is headed for (or already in) a recession. It will be a mild downturn if the region’s sovereign debt problems are resolved or a deep one if they are not. Fiscal austerity is in full swing, bank credit is tightening, and confidence is plummeting. Few, if any, countries will be able to avoid negative growth. The Eurozone economy will likely contract by around 0.7%. The U.K. economy can only be expected to eke out a 0.3% growth rate next year, with the distinct possibility that it could be worse.

3.      Asia will continue to outpace the rest of the world. Asia will not be immune to a Eurozone recession, but strong growth momentum and economic resilience will help the region grow around 5.5% in 2012. Japan’s post-earthquake rebound will help underpin the region’s exports, offsetting some of the weakness in sales to Europe. Chinese growth can be expected to hold up (7.5% to 8%), also bolstering regional growth prospects, provided China’s housing downturn does not evolve into anything much worse. Last but not least, easing inflation will give all Asian governments the leeway to provide policy stimulus if necessary.

4.      Growth in other emerging markets will (mostly) hold up. The Eurozone crisis will have a differential impact on the rest of the emerging world. Hardest hit will be Emerging Europe, since Western Europe is its most important export destination, and because the region is dominated by subsidiaries of Western European banks – all of which are tightening credit. Latin America, the Middle East and Africa are relatively more vulnerable to the United States, China and the rest of Asia. Barring a catastrophe in Asia or North America and/or another plunge in commodity prices, growth in these regions should hold up fairly well in the coming year.

5.      Commodity prices will (mostly) move sideways. Commodity prices will get pulled down by weaker growth in the developed world,  and pushed up by limited spare capacity and continued robust growth in key emerging economies, such as India and China. The biggest demand-side risk is the possibility of a hard-landing in China. Supply-side risks are commodity-specific. In the case of oil, markets are worried about an escalation of conflict over Iran’s nuclear weapons program. Bottom line: the most likely scenario for the price of oil and other commodities is fluctuations around current levels.

6.      Inflation will diminish almost everywhere. With world growth softening and commodity prices off their peaks, inflation in every region (and almost every country) will decline in 2012. The disinflationary process will be most pronounced in the developed world, because of vast amounts of excess capacity in both labor and product markets. In the emerging world, the recent declines in food prices are having the biggest impact. Without a spike in food or fuel prices – triggered by geopolitical events or bad weather – the inflation picture in 2012 will be quite benign.

7.      Monetary policy will either be on hold or ease further. Easing inflationary pressures and increasing anxiety about the growth outlook have changed the priorities of central banks worldwide. Central banks with policy rates already at or near zero (the Fed, Bank of England and Bank of Japan) will keep rates low, indefinitely (or at least for a couple more years), with further quantitative easing likely. Some central banks that had been raising rates have now stopped (e.g., the Reserve Bank of India). Others that had been tightening have reversed course and are now easing (e.g. the European Central Bank and the People’s Bank of China).

8.      Fiscal policy set to tighten further in the US and Europe. Notwithstanding the policy deadlock in Washington, U.S. fiscal policy is already tightening. Federal government purchases (in real terms) will contract over the next several years, acting as a major drag on growth. State and local spending is also expected to fall for at least another year. The payroll tax cut will probably be extended for another year, limiting any extra tightening. In Europe, not only are the most indebted countries (Greece, Ireland and Portugal) in the midst of tough austerity programs, but three of the four largest Eurozone countries (France, Italy and Spain) are being pressured to drastically cut budget deficits and sovereign debt levels.

9.      With the exception of the euro, the dollar will keep sliding. Economic fundamentals suggest that the dollar should keep sliding against most currencies. The U.S. current account deficit is still huge, and both growth and interest rate differentials favor emerging market currencies. However, as long as the Eurozone crisis drags on, the euro is likely to depreciate against the dollar – reaching around $1.25 by next spring. In a Eurozone financial meltdown scenario, the euro could easily go to parity against the Greenback – or lower. In such a scenario, the dollar would likely also rise against most currencies – as it did in the fall of 2008.

10.  Most of the risks to the outlook are on the downside. The two biggest risks are a “Lehman moment” in Europe and a sharp slowdown in China.

What can the semiconductor industry learn from the automotive industry (where companies enjoy an enviable operating profit of 5% year after year)? Steve Newberry, vice chairman of the board of directors of Lam Research said that 60% of R&D is spent by suppliers. “Auto manufacturers have closely coupled relationships with their suppliers in R&D, which promotes systems-level innovation,” he noted. “This has manifested in contracted R&D and about half the auto manufacturer’s budget.” Elements that are necessary are close collaboration with suppliers and customers, and an integrated approach to design and development. The benefits to the OEM with this approach include faster time to market with innovations, the ability to lock in designs and production early in the development of an integrated product, contracts with multiple outside experts instead of having experts on staff in every area and efficient use of cash. Benefits to the supplier include significant funding for development work, a close relationship with customer in understanding design requirement, a mutual dependency – a shared destiny for success –which increases collaboration and results in a better product and integrated system design, and a “lock-in” to production design. The benefit to the industry as a whole is more efficient use of R&D funds, and less waste on designs that won’t be used. “Are there aspects or elements of this more mature industry that we should, at a minimum, at least dialog in this industry — talk about between the big IC manufacturing companies and the equipment and the materials suppliers?” Newberry asked.

January 17, 2012 — Micro electro mechanical system (MEMS) microphones are set to enjoy another blockbuster year in 2012 as the devices continue to find strong adoption in portable electronics, including the wildly popular iPhone and iPad from Apple Inc., according to a new report from IHS iSuppli.

Revenue this year for MEMS microphones is projected to reach $493.5 million, up a solid 32% from $373.2 million in 2011. This year’s expansion continues the mighty growth path seen by MEMS mics following last year’s remarkable 64% increase, and the next few years also will see healthy prospects for the space.

By 2015, MEMS microphone revenue will hit approximately $667.0 million, equivalent to a five-year compound annual growth rate (CAGR) of 24% starting from 2010. Shipments in 2015 will hit 2.9 billion units.

  2010 2011 2012 2013 2014 2015
Billions of US Dollars  227.7 373.2 493.5 576.2 628.6 667.0

MEMS microphones are miniature devices that employ a pressure-sensitive diaphragm etched on a semiconductor. The microphones are commonly designed into cellphones, headsets, notebook PCs, and video cameras, replacing conventional electret condenser microphones (ECM) while providing greater clarity and sound reception for spoken commands from device users.

The rapid growth is due to a combination of factors. First, MEMS penetration in handsets continues unabated, deepening to 50% in 2011 from 38% the year before. Handsets, in fact, make up the top application device. Second, there has been a rapid adoption of multiple microphones in smartphone devices for noise compression — particularly important for voice commands such as those used in the Siri speech-recognition feature of Apple’s iPhone 4S. Finally, MEMS microphones are becoming more broadly used, in laptops, tablets, gaming consoles and cameras.

Top MEMS mic buyers and suppliers
Not surprisingly, Apple was the top purchaser of MEMS microphones in 2011. Apple uses two analog MEMS microphones in its iPhone 4 and 4S phones, one analog MEMS microphone in the headset sold with the iPhone, and one digital MEMS microphone for the iPad 2 tablet.

Samsung Electronics Co. Ltd. is an important buyer of MEMS microphones, the top purchaser until Apple overtook the company last year. Samsung uses dual MEMS microphones for its handsets, and microphones are also utilized in the company’s Galaxy 10.1 tablet.

Other notable MEMS microphones buyers include LG Electronics for its phones and G-Slate tablet and Motorola Inc., an early adopter via its Razr phones as early as 2003.

Among suppliers, Knowles Electronics continues to dominate the market, though its share of MEMS microphone shipments has fallen from 88% in 2010 to 75% last year. Knowles supplies Apple, Samsung, LG, and Motorola.

ECM suppliers have begun to expand their portfolios by including MEMS microphones. Within this group, AAC Inc. is the most successful to date with 11% market share in 2011, functioning also as a second source to Knowles for the iPhone 4 and 4S. AAC, together with other Chinese-based ECM makers GoerTek Inc., Hosiden and BSE Co. Ltd, shipped more than 200 million MEMS microphones in 2011, with each buying MEMS dies from German outfit Infineon Technologies AG.

The No. 3 supplier in 2011 was Analog Devices Inc., thanks to its design win with the digital MEMS microphone in the Apple iPad 2. The company also sells into some niche applications, including teleconference equipment.

Other important MEMS microphone suppliers are Akustica (part of Bosch), which in 2011 sold tens of millions of digital MEMS microphones for use in laptops, up from less than 4 million in 2010; and STMicroelectronics, a top supplier also of digital MEMS microphones.  

Digital MEMS microphones sound out the right path
While MEMS microphones can be analog and are often used for the acoustic function in handsets, digital microphones yield several advantages. For instance, changes in design are easy to implement in the device for which the microphones are intended, and time to market is also shorter. Digital microphones are less sensitive to electromagnetic interference, and an increased Power Supply Rejection Ratio (PSRR) simplifies architecture and improves audio quality. In the case of noise suppression with three or more microphones, the signal from digital microphones is easier to process than from analog.

Aside from their use in handsets, digital microphones also provide better immunity to electromagnetic interference when used in laptops, especially in Voice over IP (VoIP) applications.

Though currently more expensive than comparable surface-mountable (SMD) digital ECMs, digital MEMS microphones will become more competitive, IHS believes, leading to their rapid adoption for the foreseeable future. Nokia Corp. started to increase the share of digital MEMS microphones in its handsets during the second half of 2011 — a trend that will continue with other handset manufacturers in the next two years.

Apple also has started implementing digital MEMS microphones on its iPad 2, and the next iPhone version is expected to use multiple digital MEMS microphones.
 
Learn more about this topic with the forthcoming IHS iSuppli report "MEMS Microphones Go Digital in 2012." For more information, visit http://goo.gl/IWykx.

Jérémie Bouchaud is an analyst at IHS.
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January 16, 2012 — With an official registration of 261 attendees, more than double 2011, the 2012 Industry Strategy Symposium (ISS 2012) kicked off today for semiconductor industry professionals at the Ritz-Carlton, Half Moon Bay, CA under blustery skies with choppy seas.

The opening keynote address was delivered by William Holt, Senior VP & GM of Intel’s Technology & Manufacturing Group. For those of us who missed it, last year was the 40th anniversary of the introduction of Intel’s 4004 processor, a 10µm technology with 2,300 transistors built on 50mm wafers. The number of transistors in use has increased 15x in the last five years, and will increase again 15x in the next 5 years. Bill’s view is that traditional scaling arguably ended with 130nm; since then, we have engaged in numerous materials, process and design innovations that have resulted in the necessary improvements in device performance. Some but not all of these have included geometric (i.e. traditional) scaling. For all of the advancement that has taken place over the past 40 years, his conclusion is that we are only at the beginning of opportunity.

Duncan Meldrum, Senior Director at IHS, opened the geo-economic trends session with a quick review of his ISS outlook from two years ago. In short, little has changed. The outlook is bleak, although some improvement is expected following the November 2012 US elections because the level of policy uncertainty will decrease. If we can continue to grow jobs, “there’s a chance we can muddle through.” Business & consumer demand for tech products is still declining, resulting in a weak MSI (millions of square inches) forecast for silicon, shown below.

Figure 1. Semiconductor outlook from IHS Center for Forecasting and Modeling. Demand-driven model-based projection: Weak growth.

The audience attended to his words in depressed silence while the hotel staff quietly removed sharp objects from the tables.

David Townes, Managing Director of Needham, may have pushed some folks over the edge by opening his talk with word that his long term view is that equities have been immersed in a fantasy valuation that is destined to collapse. Since 1995, semi cap equipment companies have increased 32% in value. Adjusted for inflation, they have declined 44%. There have been no sector IPOs since Nextest and Eagle Test in 2006. Only three small companies today are presenting a healthy financial picture: Jordan Valley, Nexx and Intermolecular (though not a semi cap business, Intermolecular represents an innovative business model for R&D). The economic metrics for government liabilities are pointing inescapably to default. The Bureau of Labor Statistics reports an inflation rate of 3% as a result of revised methods for reporting such data. David says the more realistic number is 8%. His outlook for the next ten years for real capital value appreciation is that it is very much at risk. Recommendation: own real things and maintain high liquidity. Don’t assume that cash is safe, because its source may not be sound.

Robert Fry, Senior Economist at DuPont, found a bright spot with an increase in US automobile sales. Much of 2011 growth was below the trend line, and US GDP growth will be just barely positive at only 2% in 2012. The TED Spread (look it up…) fluctuated wildly from 2007 to 2009, then settled down to about 20 basis points, which is a good indicator of market stability. Lately it’s been creeping up to 57 basis points, possibly portending a stealth financial crisis in the making. Economist humor: the underperforming portion of the European economy is referred to as the PIIGS (Portugal, Italy, Ireland, Greece, Spain). Yes, it’s pronounced “pigs.” US feedstock chemicals are largely made from natural gas. Europe and the rest of the world depend more on oil, placing US suppliers at a long term net advantage. The current outlook is for recession in Europe, with slow growth everywhere else — but recession risks remain elevated globally. According to Reinhart and Rogoff (authors mentioned by all three of the speakers on the economy), growth slows significantly when a country’s government debt exceeds 90% of GDP. We are there.

Steve Newberry, Vice Chairman of Lam,  tried to lighten things up by shifting topics to the semiconductor industry itself. Really? Chip fabs are more profitable today than in 2007, but most of that profit resides in the top 5 companies. Among foundries, only TSMC has a healthy cost structure. A viable foundry strategy is to operate in trailing edge technologies (N-1 to N-3 nodes) rather than compete at the leading/bleeding edge. NAND profitability is good among the 4 key suppliers; DRAM is not so healthy, with significant restructuring among suppliers and alliances. The auto industry has been running at ~5% profitability for the past 40 years. That industry pays 65% of the R&D costs in close connection with their suppliers, who pay the balance. This close relationship results in a more efficient use of R&D funds, with less wasted on designs that won’t be used. The learning opportunity for the semiconductor industry is clear. Early indications are that the industry R&D investment model is significantly more robust at the 450mm precipice than it was during the 300mm transition, but there remains a lot of room for improvement.

Figure 2. Foundry profitable: Profile remains the same and problematic. Only one of the foundries continues to sustainably fund capex purely through cash from operations. Technology leader has maintained dominance; other foundries continue to be profit-challenged despite declining depreciation. Source: Lam Research

Bernie Meyerson, IBM’s VP of Innovation and Global University Relations, returned to ISS to define the future of semiconductors. The industry is officially in the end game: for five decades, we have been “turning the small knob” of device shrinkage and it has broken off. Advancement is not about manufacturing; it’s about science fundamentals. A good portion of innovation will come from low dimension carbon structures (graphene, CNT). Less than a week before this presentation, IBM demonstrated a sub-10nm CNTFET with good device parameters. A 40nm epitaxial graphene RF FET showed a cutoff frequency of 280 GHz. Another limiting parameter has become the speed of light: during a single machine cycle, light travels about the length of the last segment of your little finger, making this a rule of pinkie rather than a rule of thumb. Integration of logic, memory and optics is required for successful 3D innovation, in large part to reduce the amount of heat generated by the chip I/O alone. The end game for magnetic storage has been demonstrated with work showing that a 12 atom memory cell is the smallest possible; any fewer, and stability gives way to quantum effects. Racetrack designs using 60nm wires on a 90nm CMOS driver were demonstrated as manufacturable only last month at IEDM 2011. This uses largely conventional technology to improve storage density significantly. It’s no accident that Bernie’s job includes university relations; innovations come from innovators, not from corporations, even if corporations are people. Innovators come from cross-disciplinary university programs focused on science fundamentals that lead to industry relevant breakthroughs.

Figure 3. 3D integration of logic, memory, and optics. 3D integration allows restructuring of the compute node to leverage dense memory and dramatically increase memory bandwidth. This produces significant performance improvements with necessary software co-evolution/adaptation. SOURCE: IBM.

Bill McLean of IC Insights talked about the IC industry outlook in the aforementioned uncertain economy. The semiconductor business grew ~2% in 2011. However, if you take out DRAM, the remaining 90% of the industry grew 6%. The “new normal” for capital equipment spending as a percent of semi sales is 15%, down from 19%. The top 10 fabs control 84% of the 300mm market capacity. China represents the last group of newcomers to the chip manufacturing business, resulting in a closed loop system for suppliers seeking new entry points.

Figure 4. Semiconductor capital spending as a percent of semiconductor sales. SOURCE: IC Insights.

Prof. S. Massoud Amin, Director of the Technological Leadership Institute at the University of Minnesota, switched gears with a discussion of opportunities in smart grids. The North American power grid is the largest single machine on the planet. It comprises over 450,000 miles of 100 KV or higher transmission lines. The efficiency of delivering power from a coal-fired plant to a home light bulb is 1.6%. A single Tweet takes only 0.025 watt-hour of energy, but since there are a billion tweets per week, the consumption is 2,500 MWh, the total output of two nuclear power plants. The control demands for a stable grid require time management for events over 10 orders of magnitude. Large opportunities for semiconductors are found in the transceiver chip set in electric cars, building energy management systems, and other elements of smart grid implementation. Global expenditure for smart grids is expected to run $17B-24B/year for the next 20 years, with a net benefit to the US economy of $2.3T.

Figure 5a. 10-years long-term market forecast for SiC devices in various power applications (Sensors on silicon, MCUs in everything, heat-tolerant semiconductors, power management, solar, energy harvesting).
Figure 5b. World market for semiconductors in electric vehicle (EV) powertrains.

Jim Koonmen, SVP & GM of Brion at ASML, brought us closer to home with the industrialization of new lithographic technologies. From a litho perspective, the “small knob” is not broken; device shrink is still a driver. Single exposure EUV will extend below 20nm, with double exposure EUV necessary to get to 8nm. Rule-based SRAF placement in computational lithography is giving way to model-based SRAFs. Six NXE:3100 EUV tools have been shipped, four to development groups in production fabs. IMEC has successfully demonstrated 16nm lines/spaces. Dedicated chuck overlay has been certified at <1nm; 1nm is about 4 silicon atoms. The NXE:3300B will ship by YE12 with a throughput of 69wph, N.A. 0.33 and 3/5nm overlay DCO/MMO. Each scanner is built in its own dedicated cleanroom; ASML is planning on 23 of these. Optical source power is presently at 10W and is projected to achieve 20W this year. The production need is for 125-250W. The transition to 450mm needs to take place across all litho platforms concurrently in order to support fabrication capability at the larger wafer size.

Figure 6. Two options for shrink: Immersion and EUV lithography. SOURCE: ASML.

Shawn DuBravac, Chief Economist and Director of Research at CEA, reported on the January 2012 CES in Las Vegas. New notebooks are touting battery life, usability and design features rather than traditional metrics such as processor speed and storage capacity. Quad-core smart phones have appeared. Interconnectivity rather than compute power will be the next big drive in computing devices. TV remotes now include MEMS and audio computation for gesture and voice control. Many innovation concepts began as gaming elements for market introduction; this provided for technology debug while creating a market appetite for more serious applications as consumers became more comfortable with them. Motion gesturing and remote sensing are examples. MEMS and other sensor technology has reached a price point at which it can be widely integrated into a variety of devices at many price points. Best anecdote: a smart phone app has been developed that monitors your pulse rate and blood pressure. You can then scan your smart phone over your Outlook calendar to ascertain which meetings cause you the greatest stress.

Michael A. Fury, Ph.D, is senior technology analyst at Techcet Group, LLC, P.O. Box 29, Del Mar, CA 92014; e-mail [email protected].

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