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Magnetic nanocontacts propagate spin waves, prove magnonics researchers

September 12, 2011

September 12, 2011 — University of Gothenburg and the Royal Institute of Technology (KTH) researchers demonstrated that theories about nanoscale spin waves agree with observations — potentially replacing microwave technology in many applications, such as mobile phones and wireless networks. The "magnonics" phenomenon could lead to smaller and cheaper components.

The group demonstrated that spin waves propagated from magnetic nanocontacts, observing the dynamic properties via an advanced spin wave microscope (based at the University of Perugia, Italy) with a resolution of approximately 250nm. The observations were enabled by their method of constructing the magnetic nanocontacts. The research field has been named "magnonics," meaning the understanding and use of nanoscale magnetic waves.

In 2010, the group was able to demonstrate the existence of spin waves with the aid of electrical measurements (published, Physical Review Letters). The researchers competed with two other groups to confirm experimentally theoretical predictions that came to light about a decade ago, said Professor Johan Åkerman of the Department of Physics, University of Gothenburg, where he is head of the Applied Spintronics group.

Magnonic components and circuits are "powered by simple direct current, which is then converted into spin waves in the microwave region. The frequency of these waves can be directly controlled by the current. This will make completely new functions possible," says Åkerman. Magnonic technology boasts magneto-optical and metallic properties that will work with traditional microwave-based electronic circuits, and also suit more minaturization.

Results have been published in Nature Nanotechnology: "Direct observation of a propagating spin wave induced by spin-transfer torque." Access it here: http://www.nature.com/nnano/journal/vaop/ncurrent/abs/nnano.2011.140.html

Animated simulations of spin waves are available on the researchers’ YouTube channel:
http://youtu.be/EGV25mUxnmk: A simulation of six magnetic nanocontacts placed in a circle to illustrate how the nanocontacts can be placed in freely chosen patterns. All the signals synchronize in this case through the spin waves that propagate through the magnetic film.

http://youtu.be/PFnLRXzl4uI: The simulation of magnetic nanocontacts shows how spin waves spread like rings on water. The nanocontact has a diameter of 40 nanometer and the spin waves are created in a thin film of nickel-iron alloy, 3 nanometer thick.

iPad teardown reveals Apple’s hardware supremacy

August 4, 2011

August 4, 2011 — Apple Inc.’s iPad has thus far thwarted competitive tablets in design efficiency, according to an IHS iSuppli Teardown Analysis of eight tablet models from IHS (NYSE: IHS). Major savings come from Apple’s control of chips like SDRAM and applications processors.

Apple is a vertically integrated manufacturer, creating much of the hardware and software in the iPad, points out Wayne Lam, senior analyst, competitive analysis, at IHS. Apple uses its own applications processor design in the iPad and iPad 2, Lam notes, while other tablets have processors sourced from Nvidia, Texas Instruments and Qualcomm.

Apple has limited the memory in the iPad 2, with only 512 megabytes (competitive designs use 1 gigabyte) of synchronous dynamic random access memory (SDRAM). This cuts nearly $14 from the iPad bill of materials (BOM) compared to the competition. Because Apple controls the hardware and software of the iPad, it can structure the operating system to use less memory.

Similiarly, the iPad battery is the thinnest of all competing tablet designs, yet has the largest capacity.

The table below presents an overview of the results of the dissection of eight tablet models. Note that the BOM figures accounts only for hardware and manufacturing costs and do not take into consideration other expenses such as software, licensing, royalties or other costs.

Table. Teardown comparison of 8 tablet models (BOM and summary of major components). SOURCE: IHS iSuppli 2011.
	Apple iPad (WiFi)	Apple iPad (WiFi + 3G)	Samsung Galaxy Tab	Motorola XOOM*	Apple iPad2 (WiFi + 3G)	RIM Blackberry Playbook	Asus Eee Pad	HP TouchPad
Release	April 2010	April 2010	Sept. 2010	Feb. 2011	March 2011	April 2011	May 2011	July 2011
OS	iOS 3.x	iOS 3.x	Android 2.x	Android 3.x	iOS 4.x	QNX	Android 3.x	WebOS 3.x
Screen/ Display	9.7 Inch IPS Display w/ Capacitive Multitouch Overlay	9.7 Inch IPS Display w/ Capacitive Multitouch Overlay	7 Inch TFT Display w/ Capacitive Multitouch Overlay	10.1 Inch TFT Display w/ Capacitive Multitouch Overlay	9.7 Inch IPS Display w/ Capacitive Multitouch Overlay	7 Inch TFT Display w/ Capacitive Multitouch Overlay	10.1 Inch IPS Display w/ Capacitive Multitouch Overlay	9.7 Inch IPS Display w/ Capacitive Multitouch Overlay
Apps Processor	Apple A4 (Single Core)	Apple A4 (Single Core)	Samsung S5PC110 (Single Core)	Nvidia Tegra2 (Dual Core)	Apple A5 (Dual Core)	TI OMAP 4 (Dual Core)	Nvidia Tegra2 (Dual Core)	Qualcomm APQ8060 (Dual Core)
Memory (SDRAM)	256MB DDR	256MB DDR	512MB DDR	1GB DDR2	512MB DDR2	1GB DDR2	1GB DDR2	1GB DDR2
Storage (NAND)	16GB	16GB	16GB	16GB*	16GB	16GB	16GB	16GB
Camera (1st/2nd)	N/A	N/A	3MP/1.3MP	5MP/2MP	1MP/VGA	5MP/3MP	5MP/1.2MP	1.3MP
3G Modem	N/A	Infineon (HSPA)	Infineon (HSPA)	Qualcomm (EVDO)	Infineon (HSPA) / Qualcomm (EVDO)	N/A	N/A	N/A
Battery	6600mAh / 3.75V Dual Cells	6600mAh / 3.75V Dual Cells	4000mAh / 3.7V Single Cell	3250mAh / 7.4V Dual Cells	6930mAh / 3.75V Dual Cells	5400mAh / 3.7V Dual Cells	3300mAh / 7.4V Dual Cells	6000mAh / 3.7V Dual Cells
Sensors	eCompass and Accelerometer	GPS, eCompass and Accelerometer	GPS, eCompass and Accelerometer	GPS, eCompass, Accelerometer, Gyro and Pressure	GPS, eCompass, Accelerometer and Gyro	eCompass, Accelerometer and Gryo	GPS, eCompass, Accelerometer and Gyro	Accelerometer and Gyro
BOM Cost	$268	$320	$262	$330 (w/o LTE module)	$310 (HSPA)	$271	$284	$318
Retail Price	$499	$629	$749	N/A*	$629	$499	$399	$499
*Motorla XOOM only comes in 32GB which retails for $799. We’ve normalized capacity for purpose of this comparitive exercise.
Source: IHS iSuppli Research, Aug 2011

The IHS iSuppli Teardown Analysis Service also illustrates the trend toward multi-core processors in tablet designs, price points, and display sizes. Following the introduction of the Motorola Xoom in February and the iPad 2 in March, all new tablet designs within 2011 have included dual-core processors that deliver higher computing and graphical performance. In 2012 IHS expects to see this trend to continue with the introduction of tablets featuring quad-core processors for even more enhanced performance.

Learn more about this topic with IHS iSuppli Teardown Analysis Service at http://www.isuppli.com/Teardowns/Pages/Products.aspx.

Also read: Apple’s A5 Processor is by Samsung, not TSMC

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3D IC is only solution for scaling “up,” says MonolithIC 3D exec

March 31, 2011

By Debra Vogler, senior technical editor

March 31, 2011 — Serial entrepreneur, Zvi Or-Bach, was interviewed by ElectroIQ about his latest startup, MonolithIC 3D. In this podcast interview, Or-Bach explains why the company changed its name (from NuPGA) when its mission changed. "The name change was in response to a strategic change we made once we discovered a path to monolithic 3D ICs," said Or-Bach. He noted that on-chip interconnects are the limiting aspect with respect to scaling, and that after making materials changes (i.e., Al to Cu, and SiO₂ to low-k), the only solution is to go to 3D ICs.

Listen to Or-Bach’s interview: Download (iPod/iPhone users) or Play Now

Interconnect delay → Monolithic 3D Implant H+ dummy gates Transfer on top of processed wafer and replace gates (<400°C)

90nm (2005) 45nm (2010) 22nm (2015) 12nm(2020)

Transistor delay 1.6ps 0.8ps 0.4ps 0.2ps

Delay of 1mm-long interconnect 5 x 10²ps 2 x 10³ps 1 x 10⁴ps 6 x 10⁴ps

Ratio 3 x 10² 3 x 10³ 4 x 10⁴ 3 x 10⁵

3D
→

Figure. Next-generation monolithic 3D IC — leveraging the gate-last process. SOURCE: MonolithIC 3D

Semiconductor scaling costs

Scaling down 0.7x		Scaling up (3D packaging)

Cost:	Capital >$4B	Cost:	Capital: <$200M
	R&D >$1B		R&D <$100M
Benefits:	Die size 0.5x	Benefits:	Die size 0.5x
	Power 0.5x		Power 0.5x
Speed:	No change	Speed:	No change
Table. The next-generation dilemma — going up or going down? Companies can do both. SOURCE: MonolithIC 3D.

"While TSVs are a big help with off-chip interconnects, they are not helpful for on-chip interconnects — they are just too large," explained Or-Bach. "Our vertical interconnect is 10000× more dense than TSVs." The company’s mission is an answer to what Or-Bach calls the next-generation dilemma (table). Whether one chooses to continue to scale down 0.7×, or scale "up" by going to 3D, there are costs. However, the company’s estimates show a glaring difference: capital costs and R&D costs are, respectively, >$4B and >$1B for scaling down; and <$200M and <$100M for scaling up.

3D IC technology

The technology being proposed by Or-Bach uses a combination of four ideas:
1) the gate-last process and proper sequencing of ion-cut (i.e., Smart Cut) technology;
2) low-temperature face-up layer transfer;
3) repeating layouts;
4) innovative alignment.

Or-Bach explains the process in detail (figure) in his audio interview. The technology still requires process development work, but looking ahead, Or-Bach views it as being applicable to both Tier 2 fabs that want to reinvent themselves and compete with leading-edge fabs, and leading-edge fabs that want to add value.

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Molex joins antenna consortium

March 14, 2011

March 14, 2011 — Molex Incorporated, interconnect supplier, has joined with other researchers to advance the goals of the Danish SAFE (Smart Antenna Front End) project. Scheduled to span four years, the $8.7 million project is being conducted by a consortium comprising Aalborg University, Intel Mobile Communications, WiSpry and Molex.

Through collaborative research and new product innovation, SAFE members aim to address communication bandwidth, standards, and antenna issues related to the global proliferation of mobile phone devices.

"Since the mid-1990s, we have struggled to get more bandwidth out of cheap antennas that cover a wide range of mobile communication bands and standards. The size of the antennas and RF components have grown, which is problematic, because the market demands smaller products. Adding more design building blocks reduces overall system performance. With the SAFE program we want to rethink and reinvent how industry solves these challenges," said Professor Gert Frølund Pedersen, head of the Antenna and Propagation section at Aalborg University.

Located in Aalborg, Denmark, the Molex RF Antenna Research team brings to the consortium a state-of-the-art facility and more than a decade of experience in mobile antenna development. Molex designs, develops and manufactures custom antennas and antenna assemblies that support a wide range of wireless communication technologies, including cellular, UMTS, WiFi, WIMAX, Bluetooth, GPS and others.

"We are embarking on necessary next steps in an evolution that began when mobile phone antennas were visible components that could be pulled out and replaced to improve performance," explains Morten Christensen, RF research manager, Molex. "The future is a standardized ‘one size fits all’ antenna system. We intend to create technology capable of handling all bandwidths and radio systems into one small unit that covers all the bands. It must be made in such a way that enables antennas to operate unaffected by user influence, whether they are integrated in a portable cell phone or device, laptop or tablet PC."

A significant project investor, the Danish National Advanced Technology Foundation attended the SAFE opening ceremony held in January at the Molex-Denmark facility. Based on a competitive grant application process, the Foundation offers private companies and universities the resources and framework for developing new and important technologies.

Managing director Per Hartmann Christensen, Intel Mobile Communications, Denmark, noted: "Until now, the development of RF and antenna has been separated, yielding less than optimal solutions. In this project, we have for the first time convened leading experts in a targeted effort to develop a specific control and integration technology for antenna and RF that can potentially be incorporated into all mobile phones in the future."

WiSpry, a leading global manufacturer of tunable RF solutions for mobile platforms, has established a new research and development center in Aalborg. "Our MEMS-based technology is the ideal solution to the demanding requirements of today’s multi-mode, multi-band, data-centric terminals, offering the highest performance of any tunable solutions on the market or in development today," adds WiSpry founder and CEO Jeff Hilbert.

Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is www.molex.com.

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TSV substrates for power amplifiers A*STAR IME partners with ELTA Systems

March 7, 2011

March 7, 2011 — The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR), and electronic defense systems company ELTA Systems Ltd. (ELTA), a group and a wholly owned subsidiary of Israel Aerospace Industries (IAI), have inked an agreement to design and develop a novel through silicon via (TSV) substrate technology for multi-chip module (MCM) packaging.

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.

"Our joint goal is to develop innovative manufacturing and design processes to address the challenges associated with the use of TSV substrate technologies. We expect the resultant technology to have a fundamental impact on the defense systems industry, and on a wider scale, the worldwide semiconductor packaging market," said Professor Dim-Lee Kwong, executive director of IME. IME offers capabilities in IC packaging design and wafer-level molding.

By providing high density, very fine pitch interconnects and better stress tolerance between the die and substrate, TSV substrate technology is increasingly viewed as a critical means of resolving the growing geometric and material incompatibility between printed circuit boards and ICs. Apart from the greater miniaturization they afford, TSV substrate technology also offers more flexibility and shorter time-to-market. IME has been spearheading the development of this disruptive technology through its TSV research program and the 3D TSV consortium it leads.

The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR) in Singapore. Its key research areas are in integrated circuits design, advanced packaging, bioelectronics and medical devices, MEMS, nanoelectronics, and photonics. For more information, visit IME at http://www.ime.a-star.edu.sg. A*STAR is the lead agency for fostering world-class scientific research and talent for a vibrant knowledge-based and innovation-driven Singapore.

Israel Aerospace Industries Ltd. is a leader in the aerospace and defense industry and Israel’s largest industrial exporter. ELTA Systems Ltd., a group and wholly owned subsidiary of IAI, is one of Israel’s leading defense electronics companies specializing in intelligence, surveillance, target acquisition and reconnaissance (ISTAR); early warning command and control; homeland security (HLS); self-protection and self-defense, and fire control applications. Please visit www.iai.co.il for more information.

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Thin film passives consortium wants participants

March 4, 2011

March 4, 2011 – A new global R&D consortium is seeking companies to join its efforts working on embedding thin-film passive components into packages using through-silicon vias (TSV), for use in smart mobile electronics and implantable bio-electronic systems.

The Global Industry R&D Consortium in Thin Film Passive Components (TPC), housed at the Georgia Tech Packaging Research Center (PRC), will focus on micro/nanoscale high-density, low-loss capacitors and inductors as surface thin film passives on silicon or glass, and digital and RF passives as thin-film integrated passive devices (IPD) with high permittivity and permeability dielectrics and noise isolation structures. These then can be added into the package, realizing system miniaturization with improved performance.

Areas of research include:

– High-density inductors: High permeability and low-loss magnetic core for higher volumetric and power efficiency
– High-density capacitors: Advanced high-surface area electrodes and conformal dielectrics
– Package integration of supercapacitors and thin film batteries
– TSV and trench capacitors: Advanced dielectrics with low-cost wafer-compatible processes.
– RF components: Stable dielectrics with high permittivity and permeability
– EMI isolation: Horizontal and vertical EMI isolation in 3D systems.

And the consortium’s listed goals:

– Power supply components with 10-100X enhancement in component volumetric efficiency;
– Enhanced film properties for lower loss and improved efficiency;
– Power integrity in high-speed processors and 3D ICs;
– Integrated energy storage in packages;
– Stable dielectrics with high permittivity and permeability at high frequencies;
– Tunable thin-film components;
– Noise isolation in mixed-signal systems

The PRC’s previous work led to high-density capacitors on silicon and organic packages to demonstrate power noise suppression in high-speed digital systems, and novel magnetic composites for high-density inductors. It also has led work developing and integrating high-Q RF components on silicon and organic packages, novel high permittivity and high permeability materials for miniaturizing RF components as well as unique EMI isolation structures.

More info about the TPC consortia, including contacts for companies interested in joining, are at http://www.prc.gatech.edu/partnership/TPC/.