Tag Archives: We Recommend

September 12, 2011 — University of Gothenburg and the Royal Institute of Technology (KTH) researchers demonstrated that theories about nanoscale spin waves agree with observations — potentially replacing microwave technology in many applications, such as mobile phones and wireless networks. The "magnonics" phenomenon could lead to smaller and cheaper components.

The group demonstrated that spin waves propagated from magnetic nanocontacts, observing the dynamic properties via an advanced spin wave microscope (based at the University of Perugia, Italy) with a resolution of approximately 250nm. The observations were enabled by their method of constructing the magnetic nanocontacts. The research field has been named "magnonics," meaning the understanding and use of nanoscale magnetic waves.

In 2010, the group was able to demonstrate the existence of spin waves with the aid of electrical measurements (published, Physical Review Letters). The researchers competed with two other groups to confirm experimentally theoretical predictions that came to light about a decade ago, said Professor Johan Åkerman of the Department of Physics, University of Gothenburg, where he is head of the Applied Spintronics group.

Magnonic components and circuits are "powered by simple direct current, which is then converted into spin waves in the microwave region. The frequency of these waves can be directly controlled by the current. This will make completely new functions possible," says Åkerman. Magnonic technology boasts magneto-optical and metallic properties that will work with traditional microwave-based electronic circuits, and also suit more minaturization.

Results have been published in Nature Nanotechnology: "Direct observation of a propagating spin wave induced by spin-transfer torque." Access it here: http://www.nature.com/nnano/journal/vaop/ncurrent/abs/nnano.2011.140.html

Animated simulations of spin waves are available on the researchers’ YouTube channel:
http://youtu.be/EGV25mUxnmk: A simulation of six magnetic nanocontacts placed in a circle to illustrate how the nanocontacts can be placed in freely chosen patterns. All the signals synchronize in this case through the spin waves that propagate through the magnetic film.

http://youtu.be/PFnLRXzl4uI: The simulation of magnetic nanocontacts shows how spin waves spread like rings on water. The nanocontact has a diameter of 40 nanometer and the spin waves are created in a thin film of nickel-iron alloy, 3 nanometer thick.

August 23, 2011 – Marketwire — SATS provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) honored its top materials and equipment suppliers in 2010, for the fourth annual Supplier Excellence Awards.

Also read: Intel honors 28 top suppliers, "achievers"

STATS ChipPAC chose four suppliers for their best overall performance in cost, delivery, quality, technology, service, and support: NAMICS Corporation, Samsung Electro-Mechanics Co., Tanaka Kikinzoku International K.K., and Verigy Ltd. (of Advantest Group).

Six suppliers received an "Outstanding Award in Service and Support" recognition for service, support and responsiveness: BE Semiconductor Industries N.V., Daewon Semiconductor Packaging Industrial Co. Ltd., DISCO Corporation, Heraeus Materials Technology LLC, Nitto Denko Corporation, and Rudolph Technologies Inc.

Two companies were given site awards for outstanding service and support for STATS ChipPAC’s operations in China and Singapore: LG Chem Ltd. (for STATS ChipPAC Shanghai) and Teradyne Inc. (for STATS ChipPAC Singapore).

These suppliers show an "intense focus and commitment to performance, quality, cycle time, and cost," said Wan Choong Hoe, Executive Vice President and Chief Operating Officer, STATS ChipPAC, stating that a strong supply chain enables quality, cost-effective semiconductor packaging and test.

STATS ChipPAC Ltd. provides semiconductor packaging design, assembly, test and distribution services. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

August 10, 2011 – Marketwire — Sensors are experiencing faster growth than the overall semiconductor chip industry, according to the Q3 Sensors and MEMS Market Tracker released by MarketResearch.com. Sensors hit almost $7 billion in 2010, with 6.5 million units shipped.

The WSTS expects sensors to surge 18% in 2011 to $8.18 billion, and another 11% in 2012 to $9 billion. For 2013 the WSTS projects nearly another 10% for sensors sales (still almost twice the overall market) to just under $10 billion.

After unprecedented 2010 increases, total optoelectronics, sensors, and discretes (O-S-D) revenues are predicted to hit $58.3 billion in 2011, says IC Insights.

Touch and orientation electronics require sensors to operate, and are being integrated into increasing numbers of applications. Other sensors are also seeing strong demand from automotive, medical electronics, and security applications.

The micro electro mechanical systems (MEMS) and sensors tracker vital market statistics on revenue by product, market forecasts, regional forecasts, and breakouts for each application sector, such as computers and automotive.

MarketResearch.com provides global market intelligence products and services. Learn more at http://www.marketresearch.com/product/display.asp?ProductID=6479420.

Subscribe to our MEMS Direct newsletter

August 4, 2011 — Apple Inc.’s iPad has thus far thwarted competitive tablets in design efficiency, according to an IHS iSuppli Teardown Analysis of eight tablet models from IHS (NYSE: IHS). Major savings come from Apple’s control of chips like SDRAM and applications processors.

Apple is a vertically integrated manufacturer, creating much of the hardware and software in the iPad, points out Wayne Lam, senior analyst, competitive analysis, at IHS. Apple uses its own applications processor design in the iPad and iPad 2, Lam notes, while other tablets have processors sourced from Nvidia, Texas Instruments and Qualcomm.     

Apple has limited the memory in the iPad 2, with only 512 megabytes (competitive designs use 1 gigabyte) of synchronous dynamic random access memory (SDRAM). This cuts nearly $14 from the iPad bill of materials (BOM) compared to the competition. Because Apple controls the hardware and software of the iPad, it can structure the operating system to use less memory.

Similiarly, the iPad battery is the thinnest of all competing tablet designs, yet has the largest capacity.

The table below presents an overview of the results of the dissection of eight tablet models. Note that the BOM figures accounts only for hardware and manufacturing costs and do not take into consideration other expenses such as software, licensing, royalties or other costs.

Table. Teardown comparison of 8 tablet models (BOM and summary of major components). SOURCE: IHS iSuppli 2011.
  Apple iPad (WiFi) Apple iPad (WiFi + 3G) Samsung Galaxy Tab Motorola XOOM* Apple iPad2 (WiFi + 3G) RIM Blackberry Playbook Asus Eee Pad HP TouchPad
Release
April 2010 April 2010 Sept. 2010 Feb. 2011 March 2011 April 2011 May 2011 July 2011
OS iOS 3.x iOS 3.x Android 2.x Android 3.x iOS 4.x QNX Android 3.x WebOS 3.x
Screen/
Display
9.7 Inch IPS Display w/ Capacitive Multitouch Overlay 9.7 Inch IPS Display w/ Capacitive Multitouch Overlay 7 Inch TFT Display w/ Capacitive Multitouch Overlay 10.1 Inch TFT Display w/ Capacitive Multitouch Overlay 9.7 Inch IPS Display w/ Capacitive Multitouch Overlay 7 Inch TFT Display w/ Capacitive Multitouch Overlay 10.1 Inch IPS Display w/ Capacitive Multitouch Overlay 9.7 Inch IPS Display w/ Capacitive Multitouch Overlay
Apps
Processor
Apple A4
(Single Core)
Apple A4
(Single Core)
Samsung S5PC110 (Single Core) Nvidia Tegra2
(Dual Core)
Apple A5
(Dual Core)
TI OMAP 4
(Dual Core)
Nvidia Tegra2
(Dual Core)
Qualcomm APQ8060 (Dual Core)
Memory (SDRAM) 256MB DDR 256MB DDR 512MB DDR 1GB DDR2 512MB DDR2 1GB DDR2 1GB DDR2 1GB DDR2
Storage (NAND) 16GB 16GB 16GB 16GB* 16GB 16GB 16GB 16GB
Camera
(1st/2nd)
N/A N/A 3MP/1.3MP 5MP/2MP 1MP/VGA 5MP/3MP 5MP/1.2MP 1.3MP
3G Modem N/A Infineon (HSPA) Infineon (HSPA) Qualcomm (EVDO) Infineon (HSPA) / Qualcomm (EVDO) N/A N/A N/A
Battery 6600mAh / 3.75V Dual Cells 6600mAh / 3.75V Dual Cells 4000mAh / 3.7V Single Cell 3250mAh / 7.4V Dual Cells 6930mAh / 3.75V Dual Cells 5400mAh / 3.7V Dual Cells 3300mAh / 7.4V Dual Cells 6000mAh / 3.7V Dual Cells
Sensors eCompass and Accelerometer GPS, eCompass and Accelerometer GPS, eCompass and Accelerometer GPS, eCompass, Accelerometer, Gyro and Pressure GPS, eCompass, Accelerometer and Gyro eCompass, Accelerometer and Gryo GPS, eCompass, Accelerometer and Gyro Accelerometer and Gyro
BOM Cost $268 $320 $262 $330 (w/o LTE module) $310 (HSPA) $271 $284 $318
Retail Price $499 $629 $749 N/A* $629 $499 $399 $499
*Motorla XOOM only comes in 32GB which retails for $799.  We’ve normalized capacity for purpose of this comparitive exercise.
Source: IHS iSuppli Research, Aug 2011

The IHS iSuppli Teardown Analysis Service also illustrates the trend toward multi-core processors in tablet designs, price points, and display sizes. Following the introduction of the Motorola Xoom in February and the iPad 2 in March, all new tablet designs within 2011 have included dual-core processors that deliver higher computing and graphical performance. In 2012 IHS expects to see this trend to continue with the introduction of tablets featuring quad-core processors for even more enhanced performance.

Learn more about this topic with IHS iSuppli Teardown Analysis Service at http://www.isuppli.com/Teardowns/Pages/Products.aspx.

Also read: Apple’s A5 Processor is by Samsung, not TSMC

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

By Debra Vogler, senior technical editor

March 31, 2011 — Serial entrepreneur, Zvi Or-Bach, was interviewed by ElectroIQ about his latest startup, MonolithIC 3D. In this podcast interview, Or-Bach explains why the company changed its name (from NuPGA) when its mission changed. "The name change was in response to a strategic change we made once we discovered a path to monolithic 3D ICs," said Or-Bach. He noted that on-chip interconnects are the limiting aspect with respect to scaling, and that after making materials changes (i.e., Al to Cu, and SiO2 to low-k), the only solution is to go to 3D ICs.

Listen to Or-Bach’s interview:  Download (iPod/iPhone users) or Play Now

Interconnect delay → Monolithic 3D   Implant H+ dummy gates Transfer on top of processed wafer and replace gates (<400°C)
  90nm (2005) 45nm (2010) 22nm (2015) 12nm(2020)
Transistor delay 1.6ps 0.8ps 0.4ps 0.2ps
Delay of 1mm-long interconnect 5 x 102ps 2 x 103ps 1 x 104ps 6 x 104ps
Ratio 3 x 102 3 x 103 4 x 104 3 x 105
3D 

Figure. Next-generation monolithic 3D IC — leveraging the gate-last process. SOURCE: MonolithIC 3D

Semiconductor scaling costs

Scaling down 0.7x Scaling up (3D packaging)
 Cost: Capital >$4B  Cost: Capital: <$200M
   R&D >$1B   R&D  <$100M 
 Benefits: Die size 0.5x Benefits:  Die size 0.5x 
  Power 0.5x   Power 0.5x
Speed: No change Speed: No change

Table. The next-generation dilemma — going up or going down? Companies can do both. SOURCE: MonolithIC 3D. 

"While TSVs are a big help with off-chip interconnects, they are not helpful for on-chip interconnects — they are just too large," explained Or-Bach. "Our vertical interconnect is 10000× more dense than TSVs." The company’s mission is an answer to what Or-Bach calls the next-generation dilemma (table). Whether one chooses to continue to scale down 0.7×, or scale "up" by going to 3D, there are costs. However, the company’s estimates show a glaring difference: capital costs and R&D costs are, respectively, >$4B and >$1B for scaling down; and <$200M and <$100M for scaling up.

3D IC technology

The technology being proposed by Or-Bach uses a combination of four ideas:
1) the gate-last process and proper sequencing of ion-cut (i.e., Smart Cut) technology;
2) low-temperature face-up layer transfer;
3) repeating layouts;
4) innovative alignment.

Or-Bach explains the process in detail (figure) in his audio interview. The technology still requires process development work, but looking ahead, Or-Bach views it as being applicable to both Tier 2 fabs that want to reinvent themselves and compete with leading-edge fabs, and leading-edge fabs that want to add value.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

March 28, 2011 — Henkel Electronics released its Ablestik C100 series conductive die attach films. Available in two formulations — Ablestik C130 and Ablestik C115 supplied in 30 micron and 15 micron thicknesses, respectively — the conductive die attach films eliminate, protect thinner die during attach, and facilite greater bondline control than traditional die attach pastes, says Henkel.

Click to EnlargeAblestik C100 series film die attach materials workability has been established on die sizes ranging from 1 x 1mm up to 6 x 6mm for a variety of package types including both QFNs and QFPs. The materials’ better wetting ability with lower bonding temperature provides stable adhesion strength, allowing robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

Die attach film provides process control and reliability, especially with thinner wafers, said Kevin Becker, Henkel director of product development for film die attach adhesives, adding that these advantages are now available for conductive as well as nonconductive processes.

Henkel operates worldwide with brands and technologies in three business areas: Laundry & Home Care, Cosmetics/Toiletries, and Adhesive Technologies. For more information on Henkel’s Ablestik C130 or Ablestik C115, visit www.henkel.com/electronics

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

March 14, 2011 — Molex Incorporated, interconnect supplier, has joined with other researchers to advance the goals of the Danish SAFE (Smart Antenna Front End) project. Scheduled to span four years, the $8.7 million project is being conducted by a consortium comprising Aalborg University, Intel Mobile Communications, WiSpry and Molex.

Through collaborative research and new product innovation, SAFE members aim to address communication bandwidth, standards, and antenna issues related to the global proliferation of mobile phone devices.

"Since the mid-1990s, we have struggled to get more bandwidth out of cheap antennas that cover a wide range of mobile communication bands and standards. The size of the antennas and RF components have grown, which is problematic, because the market demands smaller products. Adding more design building blocks reduces overall system performance. With the SAFE program we want to rethink and reinvent how industry solves these challenges," said Professor Gert Frølund Pedersen, head of the Antenna and Propagation section at Aalborg University.

Located in Aalborg, Denmark, the Molex RF Antenna Research team brings to the consortium a state-of-the-art facility and more than a decade of experience in mobile antenna development. Molex designs, develops and manufactures custom antennas and antenna assemblies that support a wide range of wireless communication technologies, including cellular, UMTS, WiFi, WIMAX, Bluetooth, GPS and others.

"We are embarking on necessary next steps in an evolution that began when mobile phone antennas were visible components that could be pulled out and replaced to improve performance," explains Morten Christensen, RF research manager, Molex. "The future is a standardized ‘one size fits all’ antenna system. We intend to create technology capable of handling all bandwidths and radio systems into one small unit that covers all the bands. It must be made in such a way that enables antennas to operate unaffected by user influence, whether they are integrated in a portable cell phone or device, laptop or tablet PC."

A significant project investor, the Danish National Advanced Technology Foundation attended the SAFE opening ceremony held in January at the Molex-Denmark facility. Based on a competitive grant application process, the Foundation offers private companies and universities the resources and framework for developing new and important technologies.

Managing director Per Hartmann Christensen, Intel Mobile Communications, Denmark, noted: "Until now, the development of RF and antenna has been separated, yielding less than optimal solutions. In this project, we have for the first time convened leading experts in a targeted effort to develop a specific control and integration technology for antenna and RF that can potentially be incorporated into all mobile phones in the future."

WiSpry, a leading global manufacturer of tunable RF solutions for mobile platforms, has established a new research and development center in Aalborg. "Our MEMS-based technology is the ideal solution to the demanding requirements of today’s multi-mode, multi-band, data-centric terminals, offering the highest performance of any tunable solutions on the market or in development today," adds WiSpry founder and CEO Jeff Hilbert.

Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is www.molex.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

March 10, 2011 — Multitest, designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announced that a major fabless semiconductor manufacturer has evaluated and approved its Mercury-based wafer-level contactors for subcontractors in Asia.

Click to EnlargeMercury contactors have eight sites and over 25 spring probes per site. The contactors passed all qualification tests in the US and have now been deployed to multiple testing subcontractors in Taiwan and Singapore. Based on this successful evaluation, the manufacturer has awarded Multitest with two additional wafer-level chipscale package (WLCSP) projects. Several of the Asian subcontractors have experience with the Mercury technology and cite its long life, low maintenance requirements, and low replacement probe price.

Mercury probes have a bandwidth of approximately 20GHz, current-carrying capacity of over 2Amps, inductance of approximately 1nH, and life of over one million insertions at wafer level (values are pitch dependent).

For more information about Multitest’s Mercury-based wafer-level contactors, visit www.multitest.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

March 7, 2011 — The Institute of Microelectronics (IME), an institute of the Agency for Science, Technology and Research (A*STAR), and electronic defense systems company ELTA Systems Ltd. (ELTA), a group and a wholly owned subsidiary of Israel Aerospace Industries (IAI), have inked an agreement to design and develop a novel through silicon via (TSV) substrate technology for multi-chip module (MCM) packaging.

The collaboration will result in new applications in multi-chip modules in radar, communication, and electronic warfare systems. The new technology platform would enable miniaturization of wireless applications that are faster, lighter and can withstand higher temperatures.
 
"Our joint goal is to develop innovative manufacturing and design processes to address the challenges associated with the use of TSV substrate technologies. We expect the resultant technology to have a fundamental impact on the defense systems industry, and on a wider scale, the worldwide semiconductor packaging market," said Professor Dim-Lee Kwong, executive director of IME. IME offers capabilities in IC packaging design and wafer-level molding.

By providing high density, very fine pitch interconnects and better stress tolerance between the die and substrate, TSV substrate technology is increasingly viewed as a critical means of resolving the growing geometric and material incompatibility between printed circuit boards and ICs. Apart from the greater miniaturization they afford, TSV substrate technology also offers more flexibility and shorter time-to-market. IME has been spearheading the development of this disruptive technology through its TSV research program and the 3D TSV consortium it leads.

The Institute of Microelectronics (IME) is a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR) in Singapore. Its key research areas are in integrated circuits design, advanced packaging, bioelectronics and medical devices, MEMS, nanoelectronics, and photonics. For more information, visit IME at http://www.ime.a-star.edu.sg. A*STAR is the lead agency for fostering world-class scientific research and talent for a vibrant knowledge-based and innovation-driven Singapore.

Israel Aerospace Industries Ltd. is a leader in the aerospace and defense industry and Israel’s largest industrial exporter. ELTA Systems Ltd., a group and wholly owned subsidiary of IAI, is one of Israel’s leading defense electronics companies specializing in intelligence, surveillance, target acquisition and reconnaissance (ISTAR); early warning command and control; homeland security (HLS); self-protection and self-defense, and fire control applications. Please visit www.iai.co.il for more information.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

March 4, 2011 – A new global R&D consortium is seeking companies to join its efforts working on embedding thin-film passive components into packages using through-silicon vias (TSV), for use in smart mobile electronics and implantable bio-electronic systems.

The Global Industry R&D Consortium in Thin Film Passive Components (TPC), housed at the Georgia Tech Packaging Research Center (PRC), will focus on micro/nanoscale high-density, low-loss capacitors and inductors as surface thin film passives on silicon or glass, and digital and RF passives as thin-film integrated passive devices (IPD) with high permittivity and permeability dielectrics and noise isolation structures. These then can be added into the package, realizing system miniaturization with improved performance.

Areas of research include:

– High-density inductors: High permeability and low-loss magnetic core for higher volumetric and power efficiency
– High-density capacitors: Advanced high-surface area electrodes and conformal dielectrics
– Package integration of supercapacitors and thin film batteries
– TSV and trench capacitors: Advanced dielectrics with low-cost wafer-compatible processes.
– RF components: Stable dielectrics with high permittivity and permeability
– EMI isolation: Horizontal and vertical EMI isolation in 3D systems.

And the consortium’s listed goals:

– Power supply components with 10-100X enhancement in component volumetric efficiency;
– Enhanced film properties for lower loss and improved efficiency;
– Power integrity in high-speed processors and 3D ICs;
– Integrated energy storage in packages;
– Stable dielectrics with high permittivity and permeability at high frequencies;
– Tunable thin-film components;
– Noise isolation in mixed-signal systems

The PRC’s previous work led to high-density capacitors on silicon and organic packages to demonstrate power noise suppression in high-speed digital systems, and novel magnetic composites for high-density inductors. It also has led work developing and integrating high-Q RF components on silicon and organic packages, novel high permittivity and high permeability materials for miniaturizing RF components as well as unique EMI isolation structures.

More info about the TPC consortia, including contacts for companies interested in joining, are at http://www.prc.gatech.edu/partnership/TPC/.