Tag Archives: We Recommend

Mobile devices use sensors to measure more than µT of magnetic field and m/s2 of acceleration. Sensor data also reveal user activities, postures, environments, and even attention. Sensors are not merely metrological instruments linking sensor algorithms and hardware. To enable user context awareness, advanced sensor algorithms must be well-matched with mobile system architectures on the one hand, and simultaneously understand how users behave on the other.

August 7, 2012 — In 2007, Apple rolled out the iPhone and started a revolution in smart mobile devices. The original iPhone included an accelerometer to sense how a user is holding the device, and orient the image on the display in landscape or portrait accordingly. Today, smartphones from all makers include one or more inertial motion sensors (accelerometers, magnetometers, and gyroscopes). However, application developers and system designers are just beginning to take advantage of their sensing capabilities, including combining sensor inputs — sensor fusion — with advanced algorithms.

Early sensor applications: Motion interfaces

To date, many sensor applications track user gestures, and use the results as another input to the user interface. This allowed users to change screen orientation by rotating the device, erase an email by shaking the phone, or double tap to send an incoming call to voicemail, for example.

The most significant advancement enabled by a gesture-based user interface so far allows users to navigate available applications by tilting their phones to step through menu selections. This ability, coupled with advances in image processing and speech synthesis, now allows vision-impaired users to browse supermarket aisles using their smartphones [1]. For the average smartphone user, besides controlling screen orientation, motion interfaces have largely gone unappreciated and unnoticed.

Figure. A model for sensor algorithms. SOURCE: Sensor Platforms.

User context

Introducing any new user interface requires the user to learn a new set of behaviors. For the vision-impaired, learning and adopting motion interfaces for their smartphones opens new possibilities [2]. For average users, however, using gestures to control their devices is at best a passing novelty, since they do not see enough benefits to justify learning something new. To be truly successful with the general public, a new generation of smart devices must adapt to their users and not demand that users adapt to them. This takes a combination of sensors, intelligent algorithms, and mobile computing resources.

Sensors in mobile devices capture a lot more than gross user movements, like gestures. Accelerometers and gyroscopes in smart phones record muscle tremors and biomechanical resonances from their users. Magnetometers detect magnetic fields emissions from nearby power lines and engines. Such information is generally discarded in motion interfaces but it does contain user contexts; that is, information about the user that can improve interaction.

For example, muscle tension and resonance can identify when and how a user is holding the device. Calculating that the user is holding the phone at his side, the smartphone can turn off the backlight for its display, sensing it is currently unused. On the other hand, sensor signals can indicate when the user is reading the display, and so keep the backlight on.

Again, motion dynamics can identify if a user is standing, sitting, walking or running [3], and so control functions like refreshing GPS or WiFi fixes. Unless, that is, subtle signatures in the magnetic field suggests the device is in a vehicle, which may start to move. Detecting these characteristics requires more than just clean metrological measurements.

To derive user contexts, algorithm developers first collect data containing the specific context, and then create a set of algorithms to recognize it reliably. The data are best collected from subjects who are acting naturally and unaware of the context of interest. Some algorithms can develop an understanding of a user on a personal level, and thus improve reliability by catering to the user’s unique characteristics.

In this article, I use the term “anthropology” as a broad umbrella to include studies of the characteristics of human physical traits, human behavior, and the variations among humans. These inputs are critical today: in designing the appropriate settings to collect the algorithm training information; for determining if the data collected are sufficiently diverse for the algorithm to work for an average smartphone user; and in understanding which part of the algorithm could benefit from user-specific adaptation.

Low-power system architecture

Besides sensors and intelligent algorithms, designers must consider mobile computing resources, which are always limited by battery life. Context-detection algorithms monitor user activities by running continuously in the background, creating a nonstop demand for power whether the user is interacting with the phone or not.

Of course, cell phone designers are familiar with circuits that must remain continuously active. A phone has to be in constant connection with the cellular network to receive calls and text messages. Over many phone generations, designers have focused on minimizing the standby current, the electricity consumed by cellular connectivity when the phone is otherwise completely idle. To do this, the standby mode of a cell phone consists of repeated cycles of sleep and wakeup. The phone wakes up to check for the presence of a call or text message. In the absence of either, the phone re-enters sleep mode. The design increases the efficiency of any hardware needed to check for calls.

The same considerations are applicable to sensor algorithm design. They should be power-aware and adjust the processing requirements based on the amount of meaningful information contained in each sample. For example, the gyroscope used to track the angular rate of device motion requires significantly more power than the accelerometer and the magnetometer combined. The magnetometer and the accelerometer in combination form an electronic compass, which measures the angular position of the device. Because the first derivative of angular position is angular rate, an intelligent algorithm can decide that, when the device is turning slowly in a uniform magnetic field, it is possible to derive angular rate by using a high-bandwidth electronic compass as a virtual gyroscope. Doing so avoids the higher power use of the gyroscope, as well as the computation needed to process gyroscope samples. As the rotation rate approaches the limit of the electronic compass’s tracking ability, the algorithm can switch on the gyroscope and transition to its angular rate measurement seamlessly.

Sensor hardware agnosticism

Sensor component manufacturers have argued that the best-performing sensor algorithms need to be customized to the proprietary characteristics of each sensor component [4] Such arguments treat mobile sensing applications as mere measurement instruments, and thus ignore the impact that system design, target use cases, and user variances can have on the performance and usefulness of sensor algorithms.

While targeted optimization is possible with any algorithm, its impact falls far short of the higher-level architectural concerns discussed here. Given the nature of sensor physics, no single sensor manufacturer can offer the breadth of products that satisfy every price/performance objective for every mobile device in a manufacturer’s product portfolio. Rather than catering to specific configuration components, good sensor algorithms must be derived from sound usage data and be architected for low power, as well as work with a wide selection of sensor components to meet a device manufacturer’s requirements.

Conclusion

Applications for sensors in mobile devices are still evolving. Instead of treating sensors like a set of measuring instruments, new context-aware devices are using sensor information to learn about their users and adapt to improve interactions. Sensor algorithms for these devices must be founded on power-conscious architecture, and a sound understanding of the behavior of target users.

References

1. Vladimir Kulyukin, “Toward Comprehensive Smartphone Shopping Solutions for Blind and Visually Impaired Individuals,” Computer Science Assistive Technology Laboratory, Department of Computer Science, Utah State University, Logan, UT, Rehab and Community Care Magazine, 2010.

2. H. Shen and J. Coughlan, “Towards A Real-Time System for Finding and Reading Signs for Visually Impaired Users,” 13th International Conference on Computers Helping People with Special Needs (ICCHP ’12), Linz, Austria, July 2012.

3. James Steele, “Understanding Virtual Sensors: From Sensor Fusion to Context-Aware Applications,” Electronic Design Magazine, July 10, 2012, http://electronicdesign.com/article/embedded/understanding-virtual-sensors-sensor-fusion-contextaware-applications-74157.

4. As discussed in “You make MEMS. Should you make sensor fusion software?” Meredith Courtemanche, blog entry, Solid State Technology Magazine, May 25, 2012, www.electroiq.com/blogs/electroiq_blog/2012/05/you-make-mems-should-you-make-sensor-fusion-software.html.

Ian Chen is executive vice president at Sensor Platforms Inc. Contact him at [email protected].

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

August 3, 2012 — Global semiconductor sales stayed flat in June 2012, hitting $24.38 billion (a decline of 0.1% from May 2012), reports the Semiconductor Industry Association (SIA). Year-over-year (Y/Y), sales fell just 2% in June, a slower decline than the semiconductor industry has seen since October 2011.

Figure. Worldwide semiconductor revenues, Y/Y percent change. SOURCE: WSTS, SIA.

“The semiconductor industry continues to navigate the turbulent global economy better than most sectors, but macroeconomic uncertainties are limiting overall recovery and growth,” said Brian Toohey, president & CEO, Semiconductor Industry Association. “Congress can help ease economic uncertainty by enacting effective and dependable policies that promote American competitiveness and spur economic growth.”

Regionally, semiconductor sales increased on a sequential monthly basis in Japan (2%) and Asia Pacific (0.6%) but declined in Europe (-0.7%) and the Americas (-3.6%). Compared to June 2011, sales in June 2012 increased in Japan (3.7%) and Asia Pacific (1.0%) but fell steeply in the Americas (-8.1%) and Europe (-12.1%). “The Japan and Asia Pacific sequential increases are encouraging signs, but are tempered by continued weakness in Europe and the Americas,” said Toohey. This is the first time since September 2010 that Japan and Asia Pacific attained month-over-month and year-over-year growth simultaneously.

All monthly sales numbers represent a three-month moving average.

June 2012

Billions

Month-to-Month Sales

Market

Last Month

Current Month

% Change

Americas

4.48

4.32

-3.6%

Europe

2.84

2.82

-0.7%

Japan

3.36

3.43

2.0%

Asia Pacific

13.72

13.81

0.6%

Total

24.40

24.38

-0.1%

Year-to-Year Sales

Market

Last Year

Current Month

% Change

Americas

4.70

4.32

-8.1%

Europe

3.21

2.82

-12.1%

Japan

3.30

3.43

3.7%

Asia Pacific

13.67

13.81

1.0%

Total

24.89

24.38

-2.0%

Three-Month-Moving Average Sales

Market

Jan/Feb/Mar

Apr/May/June

% Change

Americas

4.46

4.32

-3.1%

Europe

2.83

2.82

-0.2%

Japan

3.42

3.43

0.2%

Asia Pacific

12.58

13.81

9.8%

Total

23.28

24.38

4.7%

The Semiconductor Industry Association (SIA) represents the US semiconductor industry. Learn more at www.sia-online.org.

Visit the Semiconductors Channel of Solid State Technology!

In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

August 2, 2012 — Chip manufacturers need wafers that are both bigger and better: bigger to help achieve cost targets through gains in manufacturing efficiency, and better to help reach device performance targets through the time-honored path of the pattern shrink. Our industry leaders have announced plans for pilot lines producing devices with sub-20nm linewidths on 450mm wafers, beginning in 2014 or 2015.

In the meantime, wafer manufacturers need to figure out how to make these giant wafers. The increased time required to grow the huge silicon ingot and then to cool it down under conditions optimized for crystal quality raises the risk of defects in the silicon crystal significantly.1 Polishing the surface uniformly and without microscratches requires new equipment and consumables. New cleaning equipment and processes must be developed. Also, 450mm wafers are proportionally thinner than 300mm wafers — which means they are more likely to deform during processing or handling. Such deformation can induce slip lines — crystal lattice defects similar to geological slip lines after an earthquake — around the edge of the large wafer. Crystal-originated pits (COPs), particles, slip lines, microscratches and cleaning residues all can interfere with one or more of the tightly-controlled processes that comprise the early steps of building a semiconductor device.

Printing smaller patterns necessitates tighter specs on many aspects of the wafer — regardless of wafer size. Because 450mm wafers will be used for sub-20nm lithography, their flatness and surface roughness must be very well controlled. Gradual changes in the shape of the wafer surface can be corrected by the scanner during patterning, but the wafer must be reasonably planar across the reticle field. More abrupt changes in the shape of the wafer surface may not be correctable; this is termed higher-order shape. Uncorrectable higher-order shape can displace the pattern, resulting in misalignment (overlay error) between layers — or it can cause defocus errors that affect the critical dimension (CD) of the printed structures. Higher-order shape can also interfere with film uniformity during chemical-mechanical polish (CMP) processes. Any of these errors can result in electrical problems affecting the device’s reliability, performance or yield.

450mm wafers have a higher number of edge die — notoriously the lowest yielding die on the wafer. The shape of the edge (“Edge Roll-Off” or ERO) can affect CD during patterning of edge die. Defectivity at and near the edge of 450mm wafers is typically higher, and will need to be very carefully monitored.

In essence, substrate manufacturers need to make much larger wafers with surfaces even more perfect than they are now: truly bigger and better wafers.  The impact of the surface quality, defectivity, flatness and ERO of 450mm wafers is considerable: With more than twice the number of die as a 300mm wafer, every 450mm wafer is extremely valuable. And just to add an extra challenge, some industry pioneers have announced that they will manufacture devices on 450mm epi wafers — adding the complexity of an epitaxial silicon layer, with its slightly increased surface roughness, stress-induced warp and unique epi defects. There is also interest in validation of 450mm silicon-on-insulator (SOI) technology.

Bare-wafer metrology and defect inspection play key and early parts in enabling wafer, equipment and chip manufacturers to develop and control their sub-20nm processes on 450mm wafers. These tools need the sensitivity to meet sub-20nm node requirements, and the ability to handle 450mm wafers with reliability and speed. Sub-20nm inspection sensitivity is enabled by deep-ultraviolet (DUV) technology and high-resolution haze mapping, technology that was pioneered recently on 300mm wafers by the latest-generation surface inspection systems. The images below show examples of surface defects, polishing marks and cleaning residues revealed on 450mm wafers by the latest inspection technology. These images are visually interesting, but indicative of the early stages of the manufacturing process; images of wafers meeting chip manufacturing specs would look nearly uniform. High resolution surfaces images such as these are a quick and intuitive tool for identifying the source of the defect, so that the issue can be remedied immediately, before additional time and materials are consumed.

 

Rebecca Howland, Ph.D., is a senior director in the corporate group and Amir Azordegan, Ph.D., is a senior director in the Surfscan/ADE division at KLA-Tencor.

1. See for example, “Technical challenges in the development of next generation wafers.”.

Check out other Process Watch articles: “The Dangerous Disappearing Defect,” “Skewing the Defect Pareto,” “Bigger and Better Wafers,” “Taming the Overlay Beast,” “A Clean, Well-Lighted Reticle,” “Breaking Parametric Correlation,” “Cycle Time’s Paradoxical Relationship to Yield,” and “The Gleam of Well-Polished Sapphire.”

Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.

August 2, 2012 — IC Insights released a Q2 update to its top-20 ranking of semiconductor companies. Three pure-play foundries are in the top 20 ranking, with a cumulative increase of 20% from Q1 2012 to Q2 2012.

As fabless companies continue to thrive, and many integrated device manufactures (IDMs) move to a fab-lite business model, IC foundries will continue to see strong demand over the next few years. 

TSMC’s capacity utilization rate in 2Q12 was 102% (exceeding 100% because of the way the company defines its utilization rate).

GLOBALFOUNDRIES’ 2Q12 sales jumped by 18%, which helped move the company past UMC to become the second-largest foundry in the world. GlobalFoundries is ranked as the 16th largest semiconductor supplier worldwide. IC Insights believes the company has a good chance of surpassing Fujitsu in the rankings in full-year 2012 sales.

Table 1. H1 2012 top 20 semiconductor companies, by sales (including foundries). Revenue in $M. SOURCE: IC Insights.

H1 2012 rank

2011 rank

Company

HQ

2011 total semiconductor sales

Q1 2012 semi sales

Q2 2012 semi sales

H1 2012 semi sales

Q2/
Q1 % change

1

1

Intel

US

49697

11874

12422

24296

5

2

2

Samsung

South Korea

33483

7067

7484

14551

6

3

3

TSMC

Taiwan

14600

3568

4337

7905

22

4

4

TI

US

12900

2934

3135

6069

7

5

7

Qualcomm

US

9828

3059

2869

5928

-6

6

5

Toshiba

Japan

12745

3232

2382

5614

-26

7

6

Renesas

Japan

10653

2344

2099

4443

-10

8

9

SK Hynix

South Korea

9403

2115

2291

4406

8

9

10

Micron

US

8571

2102

2210

4312

5

10

8

ST

Europe

9631

1997

2126

4123

6

11

11

Broadcom

US

7160

1770

1917

3687

8

12

13

Sony

Japan

6093

1514

1560

3074

3

13

12

AMD

US

6568

1585

1413

2998

-11

14

14

Infineon

Europe

5599

1292

1272

2564

-2

15

15

Fujitsu

Japan

4430

1216

931

2147

-23

16

21

GLOBAL
FOUNDRIES

US

3480

945

1115

2060

18

17

17

NXP

Europe

4147

969

1084

2053

12

18

18

Nvidia

US

3939

935

990

1925

6

19

16

Freescale

US

4391

912

988

1900

8

20

20

UMC

Taiwan

3760

834

970

1804

16

Top 20 Total

221078

52264

53595

105859

3

 

The combined sales of the 4 Japanese companies in the top 20 ranking (Toshiba, Renesas, Sony, and Fujitsu) dropped 16% sequentially, with Sony being the only Japanese company to register quarterly growth. This region may see a boost in Q3.

Renesas is currently expecting a sequential semiconductor sales increase of 24% in Q3.

Toshiba has not yet changed its relatively aggressive full-year fiscal 2013 (ending March 2013) guidance, which suggests it may be expecting a strong rebound in sales later this year.  

When Micron (#9) completes its acquisition of bankrupt Elpida (#24), the memory maker likely will add $2.5 billion to $3.0 billion in revenue annually. This could bump Micron up in the rankings by as many as 2 slots.

There was a wide range of sequential quarterly growth rates among the top 20 semiconductor suppliers. In total, the top 20 semiconductor suppliers showed a 3% increase in Q2 sales over Q1. The entire worldwide semiconductor industry growth rate was 6%. When excluding the top three foundries — TSMC, GLOBALFOUNDRIES, and UMC — combined sales of the top companies logged an increase of only 1% sequentially.

Table 2. H1 2012 top 20 semiconductor sales leaders ranked by growth rate (including foundries. Revenues in $M. SOURCE: IC Insights.

H1 2012 rank

Company

HQ

2011 total semiconductor sales

Q1 2012 semi sales

Q2 2012 semi sales

H1 2012 semi sales

Q2/
Q1 % change

1

TSMC

Taiwan

14600

3568

4337

7905

22

2

GLOBAL
FOUNDRIES

US

3480

945

1115

2060

18

3

UMC

Taiwan

3760

834

970

1804

16

4

NXP

Europe

4147

969

1084

2053

12

5

Freescale

US

4391

912

988

1900

8

6

SK Hynix

South Korea

9403

2115

2291

4406

8

7

Broadcom

US

7160

1770

1917

3687

8

8

TI

US

12900

2934

3135

6069

7

9

ST

Europe

9631

1997

2126

4123

6

10

Samsung

South Korea

33483

7067

7484

14551

6

11

Nvidia

US

3939

935

990

1925

6

12

Micron

US

8571

2102

2210

4312

5

13

Intel

US

49697

11874

12422

24296

5

14

Sony

Japan

6093

1514

1560

3074

3

15

Infineon

Europe

5599

1292

1272

2564

-2

16

Qualcomm

US

9828

3059

2869

5928

-6

17

Renesas

Japan

10653

2344

2099

4443

-10

18

AMD

US

6568

1585

1413

2998

-11

19

Fujitsu

Japan

4430

1216

931

2147

-23

20

Toshiba

Japan

12745

3232

2382

5614

-26

As shown, Toshiba ranked as the worst performing top-20 company in 2Q12, registering a steep 26% 2Q12/1Q12 sales decline.  This drop was due almost entirely to the poor performance of its memory segment (primarily NAND flash), which saw a dramatic 40% 2Q12/1Q12 sales collapse (a decline of about $800 million).  As has been recently reported, the company plans to cut its NAND flash production by 30% in response to this situation.  In contrast to its memory sales, Toshiba’s 2Q12/1Q12 logic IC sales were down only 9% and its O-S-D (optoelectronics, sensors, and discretes) sales were flat.  It is interesting to note that SanDisk, Toshiba’s NAND flash memory partner, encountered a much more moderate 2Q12/1Q12 sales decline of 14%.

After reviewing the top 20 companies’ 3Q12 outlooks, it appears that the top 20 semiconductor suppliers, in total, are likely to show a 5% increase in sales in 3Q12 as compared with 2Q12.  While this level of growth is not very exciting, it is only one point below the past 30-year average third quarter total semiconductor market increase of 6%.

Several major product introductions are set to occur in 4Q12 that could potentially bring additional momentum to the semiconductor market at the end of this year.  The release of Apple’s newest version of its iPhone (iPhone 5) is expected no later than October.  Moreover, Microsoft’s Windows 8 operating system is the first major upgrade to its OS in several years and is scheduled to be released in 4Q12.  Also, Intel reports that numerous new ultra-thin but powerful Ultrabook computers will debut in 4Q12, some priced as low as $699. In total, IC Insights expects a 4Q12/3Q12 semiconductor sales increase of 2% and a full-year 2012 semiconductor market increase of 3%.

A ranking of the 1H12 top semiconductor suppliers will be included as part of IC Insights’ upcoming August Update to The McClean Report. IC Insights has released the new 200+ page Mid-Year Update to the 2012 edition of The McClean Report. To review additional information about IC Insights’ new and existing market research products and services please visit our website: www.icinsights.com.

Visit the Semiconductors Channel of Solid State Technology!

August 2, 2012 – BUSINESS WIRE — Movea, motion processing and data fusion technology developer, raised EUR6.5 million in a funding round led by Intel Capital, with existing investors iSource and GIMV.

Movea will use the funds to develop new motion sensing and data fusion technologies, enhancing its current offerings and advancing its roadmap, particularly for consumer electronics, sports and fitness, and eHealth categories. Sam Guilaumé, CEO of Movea, said the company is receiving material support for its “vision of convergence from mobile devices — such as tablets, smartphones and Ultrabooks — to Set Top Boxes, Activity Monitoring and Car Infotainment, etc.”

Movea’s technologies enrich user experiences a “main differentiators in consumer devices,” said Marcos Battisti, managing director, Intel Capital Western Europe and Israel. Intel Capital is increasing its involvement in the micro electro mechanical systems (MEMS) sector in general, added Erik Jorgensen, investment director, Intel Capital. “We believe the role MEMS plays in technology, particularly on the mobile side, is going to continue to increase at a rapid pace and that Movea is in a position to be a key player to help drive and enable this important evolution.”

Movea provides motion sensing and data fusion software, firmware, and IP for the consumer electronics, particularly smart phones and tablets, sports and fitness and eHealth industries. For more information, visit www.movea.com.

Intel Capital, Intel’s global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media, semiconductor manufacturing and cleantech. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

July 30, 2012 — Just after releasing plans to cut its NAND Flash production by 30%, Toshiba Corporation (TOKYO: 6502) said that it will start mass production of white light-emitting diodes (LEDs) on a new 200mm wafer production line in its Kaga Toshiba Electronics Corporation fab in northern Japan. Mass production will start in October.

Toshiba will use gallium nitride on silicon (GaN-on-Si) substrates for the LEDs, born from its collaboration with Bridgelux Inc. The combination of Bridgelux’s crystal growth and LED chip structure and Toshiba’s advanced silicon process and manufacturing technology yielded a prototype LED with a maximum optical output of 614mW. Toshiba will now put these LEDs into mass production.

Toshiba expects white LEDs to be the next generation growth area in its discrete semiconductors business, alongside power devices. White LEDs offer energy efficiency and long lifespans for general purpose lighting, TV backlighting, etc.

Learn more at www.toshiba.com.

Plessey Semiconductor in the UK also is setting up a GaN-on-Si LED production line, building production on 150mm wafers in Plymouth, UK.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

July 25, 2012 — GLOBALFOUNDRIES will add 90,000 more square feet of semiconductor manufacturing space to Module 1 of Fab 8 in NY. The completed semiconductor manufacturing area will total 300,000sq.ft.

Construction activities are scheduled to begin in August and work is expected to be completed in December 2013.

“During the construction of Fab 8, we extended the shell of the Module 1 building with the expectation that our business would continue to grow. Today we see increasingly strong demand from our customers, especially at the 28nm node, and we are excited to be moving forward with this next phase in the development of the Fab 8 campus,” said Eric Choh, vice president and general manager, Fab 8, GLOBALFOUNDRIES

Consisting of approximately two million square feet, Fab 8 is being developed as the an advanced semiconductor foundry manufacturing facility. GLOBALFOUNDRIES began construction on Fab 8 in July 2009 and began moving people and equipment into the facility in mid-2011. Initial wafer starts began earlier this year and the facility is on track to begin risk production by the end of the year, with volume production in early 2013.

Extending the Fab 8 cleanroom is expected to increase the Fab 8 capacity to approximately 60,000 wafers per month and increase the capital budget by approximately $2.3 billion, taking the total capital budget from $4.6 billion to approximately $6.9 billion, once tools and equipment are installed.

Since breaking ground on Fab 8 in 2009, GLOBALFOUNDRIES has created more than 1,500 new direct jobs, developing a unique and diverse workforce drawn from local talent in the region as well as experienced professionals from across the United States and more than 30 countries. In addition, the project has created an additional 4,300 construction-related jobs. President Obama visited the area earlier this year to speak about manufacturing and high-tech jobs in America.

GLOBALFOUNDRIES is a full-service semiconductor foundry with a global footprint. The foundry employs about 1,800 people in New York, including research teams at the IBM facilities in East Fishkill and at CNSE at the University of Albany, and more than 12,000 employees worldwide with additional manufacturing campuses in Germany and Singapore. GLOBALFOUNDRIES is owned by the Advanced Technology Investment Company (ATIC). For more information, visit http://www.globalfoundries.com.

Visit the Semiconductors Channel of Solid State Technology!

July 25, 2012 — In reporting its Q2 and H1 2012 results, STMicroelectronics (ST, NYSE:STM) said it will reduce its 2012 capital expenditures (capex) plan by about 25%, down to $500 million to $600 million.

ST said the “global economic environment has weakened” through the end of Q2, but expects new product momentum, particularly in micro electro mechanical systems (MEMS), microcontrollers, and power MOSFETs & IGBTs, to drive sequential growth, said Carlo Bozotti, president and CEO.

Q2 results were sequentially higher for ST, although the company said it is managing expenditures and assets, looking for market share gains, and reforming ST-Ericsson in the near future to maintain positive operations through a weak market.

Get all the numbers from ST’s Q2 and H1 2012 report here.

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!