May 18, 2012 – BUSINESS WIRE — In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China
Tag Archives: Advanced Packaging
May 16, 2012 – BUSINESS WIRE — Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ:SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.
The program is available for the company
May 16, 2012 — The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.
The new wire bonder handles leadframes up to 100mm-wide on its improved transport. The larger leadframe-acceptance specification is designed to reduce transport times.
The bonder
May 16, 2012 — Semiconductor assembly equipment supplier Kulicke & Soffa (NASDAQ:KLIC) broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art 30,000m2 facility in Serangoon will bolster the company
May 15, 2012 — Deep reactive ion etching (DRIE) is a structuring process originally used to make micro electro mechanical systems (MEMS). This process enables achieving etch depths of 100s of micrometers with almost vertical sidewalls with very high aspect ratio (> 50:1 in some cases). The process was first developed by Robert Bosch, and thus it is also called the
May 14, 2012 — At the 15th Symposium on Polymers for Microelectronics (May 8-10 in Wilmington, DE), TSMC and Yole Developpement gave plenary presentations on the use of polymeric materials in wafer-level packaging (WLP) from foundry and overall industry perspectives.
The most controversial comment came from TSMC’s Doug Yu, senior director of front-end and back-end technology development, who challenged the current nomenclature and pronounced that the versatile interposer technology should be called
May 14, 2012 — Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.
During passive temperature cycling and active power cycling tests, the Al-clad Cu bonding wire showed improved long-term reliability over Al bonding wires.
The aluminum coating is soft, structured around the copper core in a way that enables a reliable bonding window with existing chip metallizations and conventional wirebond tools. The thick wire is 60-70% copper by volume. It is available in 200-500
May 14, 2012 — Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe. ASMPT acquired SIPLACE as a business unit under the name ASM Assembly Systems in 2011. SIPLACE
May 7, 2012 — Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record (2007 saw $1.36 billion), 2011 was one of the probe card sector
May 4, 2012 — Semiconductor packaging and test services provider Carsem will assemble and further develop light-emitting diode (LED) packaging technologies, partnering with a key customer.
Carsem has begun assembling and qualifying high-brightness silicon-substrate LED arrays and will ramp high-volume, full turn-key manufacturing services, including electrical testing, laser mark, and tape-and-reel, in early 2012.
To enable standard mass production, Carsem deployed matrix substrate design; auto die attach, wire bond, and high reflection coating dispense; compression molding through an automold system; substrate-mapping; and bin sort per test mapping on the LED packages.
Carsem