Tag Archives: Advanced Packaging

April 23, 2012 – Marketwire — Semiconductor packaging service provider STATS ChipPAC Ltd. (SGX-ST:STATSChP) appointed Pasquale Pistorio as a member of the Board of Directors, effective immediately, at its annual general meeting. Pistorio joined as an advisor to STATS ChipPAC’s board last year.

Pistorio is known throughout the semiconductor industry for his role in the creation of STMicroelectronics (ST). He was president and CEO at SGS Microelectronica from 1980 to 1987. In May 1987, he led the formation of ST, integrating SGS Microelectronica with Thomson Semiconducteurs. He became president and CEO of the new company, serving through 2005. Pistorio has been Honorary Chairman of the STMicroelectronics group of companies since 2005. He has more than 39 years of experience in the semiconductor industry.

Pistorio has received honorary degrees from the University of Genova, the University of Malta, the University of Pavia, the University of Catania, the University of Palermo, and the University of Sannio, Benevento. He holds an Electronics degree in Electrical Engineering from the Polytechnic of Turin.

Pistorio

April 19, 2012 — Pure-play MEMS foundry Silex Microsystems brought its Met-Via full-wafer-thickness through silicon via (TSV) technology into Chip Architectures by Joint Associated Labs for European Diagnostics (CAJAL4EU), where it is being used to create cost-effective molded chip-level packaging with through metal vias (TMV).

Figure 1. Cross section of final product, showing Biosensor from NXP (Netherlands), TSV interposers from Silex, and epoxy mold to be performed by Frauenhofer (Germany) and gold (Au) bumping by Pactec (Germany). Frontside RDL to be processed by Bosch (Germany), and backside RDL to be processed by Frauenhofer (Germany).

The program is developing nanoelectronics-based biosensor technology platforms for in-vitro diagnostic test manufacturers to rapidly build various new multi-parameter test applications cost-effectively. CAJAL4EU will develop a generalized platform for low cost biofluidic sensing. Biosensing allows for rapid detection of unique biological markers (proteins, antibodies, and other biomarkers for infectious diseases) from microliter fluid samples in an extremely controlled environment. The biosensors will consist of a nanoelectronics-based transducer with an interface chemistry, which makes the connection to the clinical sample to be analyzed. With on-chip detection electronics, small electrical changes can be detected within milliseconds, enabling massively parallel real-time monitoring of bio-molecule binding events. Besides the transducers, interface chemistry and spotting technologies, microfluidics, software and hardware developments (and their integration) will play a crucial role to realize fully integrated biosensor systems and lab-on-chip devices. Therefore, the main deliverables of this project are the different developed technologies: sensor technology including bio-chemical functionalization, microfluidics and related hardware and software drivers.

Figure 2. Actual TSV interposer die from Silex.

Silex

April 16, 2012 — Semiconductor assembly and test services (SATS) provider ChipMOS TECHNOLOGIES (Bermuda) LTD. (NASDAQ:IMOS), via its majority-owned subsidiary, ChipMOS TECHNOLOGIES INC. (ChipMOS Taiwan), purchased a 393,173sq.ft. building adjacent to its existing facility in Southern Taiwan Science Park.

ChipMOS Taiwan won a public court bidding process for the building, at a purchase price of approximately US$10.1 million. The location — across the street from ChipMOS Taiwan

April 16, 2012 — Micro Control Company uncrated the HPB-5C High-Power Burn-In System, with variable airflow control for active thermal control of each device under test. The HPB-5C provides individual temperature control to each device under test. The tool can burn-in and test up to 150W devices.

Test tool operators can adjust the speed of the oven blower during system operation on a device by device basis as required. Active thermal control provides precise temperature control, up to 150

April 16, 2012 – PRNewswire — Highly secretive wafer level chip scale packaging (WLCSP) start-up Deca Technologies might take over SunPower Corp. (NASDAQ:SPWR) Fab 1, when the solar photovoltaics (PV) supplier consolidates its Philippine manufacturing operations to Fab 2 this quarter.

SunPower invested an undisclosed amount of capital in Deca when the packaging house launched, and is a minority shareholder. It gave Deca half of its fab space in Laguna Technopark, Philippines to use, as well as human resources, and process/operational know-how. Deca is also funded by Cypress Semiconductor. Read about Deca Technologies’ launch here.

Sunpower has 2 lines running on its new process for Maxeon Gen E cells, and expects to have all 12 lines at Fab 2 converted by the end of 2012, said Tom Werner, SunPower president and CEO. He added that repurposing Fab 1 enables SPWR to rationalize operating expenses, improve supply chain efficiency, and lower manufacturing cost per watt. Yields and efficiency will be improved at Fabs 2 and 3 in conjunction with the move.

SunPower is working with Deca Technologies and others on the use of the Fab 1 facility. Employees at Fab 1 will be transferred to Fab 2 or have the opportunity to work for potential Fab 1 tenants. SunPower will transfer some equipment from Fab 1 to Fab 2 to reduce manufacturing constraints.

SunPower expects to record pre-tax GAAP charges in restructuring totaling $51 million to $69 million, primarily non-cash asset impairment charges of $40 million to $54 million, and other cash-based associated costs of $11 million to $15 million, for the closure of Fab 1.  Of the pre-tax GAAP charges totaling $51 million to $69 million, $47 million to $63 million will likely be recorded in the second quarter of fiscal 2012 and the remainder in ensuing quarters.

SunPower Corp. (NASDAQ:SPWR) designs, manufactures and delivers high-efficiency, high-reliability solar panels and systems. For more information, visit www.SunPowercorp.com.

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April 12, 2012 – PRNewswire — The Defense Advanced Research Projects Agency (DARPA) gave Raytheon Company (NYSE:RTN) an 18-month, $1.8 million contract to develop next-generation gallium nitride (GaN) devices on diamond substrates, named Thermally Enhanced Gallium Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x, Raytheon reports.

Advanced transistors and monolithic microwave integrated circuits (MMICs) can use TEGaN to reduce thermal resistance, multiplying GaN performance.

The diamond substrates could reduce the cost, size, weight and power of defense electronics. The contract allows Raytheon to develop and vet TEGaN for technology insertion into military systems. Raytheon uses GaN in major radar programs, and enables

April 12, 2012 — Adhesives maker DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various chip packaging substrates.

The DELOMONOPOX adhesive family for die attach adhere to all smart card substrates including silicon, epoxy and gold, as well as new substrates, such as PEI, PET and PEN. DELOMONOPOX adhesives cure in seconds at low temperatures.

When used for bonding and encapsulating chips in smart card modules, the adhesives mechanically safeguard the chips and the contacting area from pressure, bending and torsion. They also protect the die from physical influences and environmental conditions such as humidity, cold or heat.

DELO

April 11, 2012 — Georgia Institute of Technology (Georgia Tech) Packaging Research Center (GT-PRC) proposes a new consortium on 3D semiconductor packaging called 3D ThinPack (THInPack) for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in partnership with global companies.

The goal is ultra-miniaturized heterogeneous sub-systems created using 3D integration of multiple ultra-slim packages with embedded thin active or passive components. Within 2 years, the consortium will demonstrate a 4-package stack within ~1mm thickness.

GT-PRC has been developing ultra-miniaturized embedded MEMS, actives, and passives (EMAP) technology through a global industry consortium of about 15 semiconductor, package and supply-chain companies with chip-last (CL) interconnections but with chip-first benefits to demonstrate ultra-miniaturized modules with digital, RF, analog, MEMS and sensor functions. GT-PRC has demonstrated ultra-thin organic substrates, fine-pitch copper-to-copper (Cu-Cu) interconnections, low-temperature bonding with high assembly throughput and prototype functional module demonstration of digital Si and RF GaAs die embedding.

Building on these advances, GT-PRC

April 11, 2012 — Semiconductor maker Invensas Corporation, a wholly owned subsidiary of Tessera Technologies Inc. (Nasdaq:TSRA), unveiled a DIMM-IN-A-PACKAGE multi-die face-down (xFD) packaging architecture for memory semiconductors in low-profile devices like ultrabooks and tablet computers.

The DIMM-IN-A-PACKAGE design delivers the memory capacity and performance of a small outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package. The number of dynamic random access memory (DRAM) chips in the package is flexible. A Quad Face Down (QFD) DIMM-IN-A-PACKAGE can replace a single-sided SO-DIMM in a 16 x 16 x 1.0mm form factor.

The aim is reduced motherboard size and complexity, increased battery life, and reduced heat from the package.

Invensas will demonstrate its xFD technology in booth GE23 at the Intel Developer Forum (IDF), April 11 and 12, 2012 at the China National Convention Center in Beijing.

Invensas will present its Ultrabook DIMM-IN-A-PACKAGE solution at the International Conference on Electronics Packaging (ICEP) at Tokyo Big Sight in Tokyo, Japan. Titled "A multi-die DRAM package for solder-down memory in Ultrabook and Tablet PC applications" and coauthored by Dell Inc., the paper will be part of the technical session program taking place in Room B at 10:50 AM on Friday, April 20, 2012.

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Go to www.invensas.com.

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