March 1, 2012 – Marketwire — Semiconductor test equipment supplier Verigy, an Advantest Group company (TSE: 6857, NYSE:ATE), installed multiple V93000 Smart Scale and Pin Scale Generation testers with Pin Scale digital channel cards at ISE Labs’ test and packaging facilities in CA and TX.

ISE Labs has a long history with Verigy tools. Its Austin, TX facility will begin using Verigy’s Pin Scale technology to develop advanced test methodologies for the latest generation of low-power ARM-based server processors with high-speed DDR3 memories, PCI Express interfaces and consumer ICs such as smart media system-on-chip (SOC) devices for next-generation media gateways and set-top boxes. The lab will run a V93000 Pin Scale Generation system with an L-Class test head, delivering more than 900 pins, based on Verigy’s Pin Scale 400 and Pin Scale 800 cards.

ISE Labs’ Fremont, CA semiconductor testing laboratory installed two V93000 Smart Scale Generation testers with Pin Scale 1600 cards for use in production-volume IC testing. One V93000 has a C-Class test head with over 1,000 pins using Pin Scale 1600 and Pin Scale 9G cards and the other unit is equipped with Verigy’s smallest A-Class test head, populated with 512 pins, and a MB-AV8 PLUS analog card. The systems also are upgradeable to provide increased pin counts or to add new measurement resources such as Verigy’s Port Scale RF solution.

These installations mark the first application of the company’s Smart Scale technology by a test-services provider in Silicon Valley. ISE Labs will use them for technology development and commercial testing services, noted Sanjeev Mohan, VP of North America sales and support at Verigy. The scalable test systems and pin cards target cost-efficient testing of advanced semiconductor designs, including 3D device architectures and 28nm technology node and smaller ICs.

The Pin Scale 1600 card opens a new dimension in test flexibility. With this card’s universal per-pin architecture, each channel is able to perform any function needed by the device under test, providing maximum flexibility. Per-pin capabilities such as individual clock domain, high accuracy DC and industry-leading digital performance are expanded with the Pin Scale 1600.

Verigy’s Pin Scale 9G card is the only fully integrated, high-speed, digital instrument covering the entire range from DC to more than 8 gigabits per second, making at-speed test affordable. The highly versatile Pin Scale 9G can test any combination of parallel or serial, single-ended or differential, and uni- or bi-directional interfaces.

The MB-AV8 PLUS analog card expands real-time analog bandwidth to cover emerging applications such as LTE Advanced for 4G wireless communications. It provides high throughput while maintaining compatibility with established MB-AV8 instruments.

ISE Labs, Inc. is a wholly owned subsidiary of Advanced Semiconductor Engineering, Inc., is an independent provider of semiconductor packaging and testing services. For more information, visit www.iselabs.com.

Verigy provides advanced semiconductor test systems and solutions used by leading companies worldwide in design validation, characterization, and high-volume manufacturing test. Additional information about Verigy, an Advantest Group company, can be found at www.verigy.com. Information about Advantest can be found at www.advantest.com.

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February 23, 2012 — Wafer-level packaging tool maker NEXX Systems was awarded a $42,765 Workforce Training Fund grant from the state of Massachusetts, where NEXX Systems is headquartered. The grant will help provide training and professional development for more than 100 employees there, improving lean manufacturing techniques and adding to their skill sets.

NEXX will focus trainings on leadership, encouraging employees to enhance their skills, improve individual performance and increase overall productivity. Another major effort will go into continuous process improvement training, with practices based on 6 Sigma, lean manufacturing and the Five S’s. NEXX manufactures its semiconductor packaging equipment in the US, with emphasis on high performance tools for packaging lines and development work.

The Workforce Training Fund works with Massachusetts Governor Deval Patrick and Lieutenant Governor Timothy Murray, training over 85,000 Massachusetts employees since 2007. "With this training, companies create greater efficiencies in doing business, leading to more opportunities for jobs, increases in work capacity and business growth," said Murray.

NEXX Systems provides flip chip and advanced packaging equipment. Learn more at http://www.nexxsystems.com/.

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February 17, 2012 — The International Electronics Manufacturing Initiative (iNEMI) will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.

Also read: 2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

The day-and-a-half workshop will begin with a review of the product sector key attribute spreadsheets, followed by break-out meetings of the technology groups as they begin the process of identifying technology and infrastructure needs for the electronics manufacturing supply chain. Packaging attendees will be interested in the Packaging & Component Substrates chapter of the roadmap especially.

Membership is not required to participate in the roadmap; non-member participation is encouraged to ensure a broad and accurate perspective of the supply chain.

The iNemi roadmap highlights processes and capabilities that will be needed for future products, including disruptive and emerging technologies. Every 2 years, the Roadmap is mapped out to identify key gaps in technology and infrastructure, R&D needs, and other activities needed for advanced electronics supply chains.

Check out the 2011 Roadmap: MEMS, 3D packaging major factors in iNEMI roadmap

Efforts are organized into Product Emulator Groups (PEGs) and Technology Working Groups  (TWGs).  The PEGs, each chaired by a major OEM in the specific sector covered, define the future technology needs of

February 15, 2012 — Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.

The multi-application FINEPLACER Pico MA bonder with 5