Tag Archives: Advanced Packaging

February 15, 2012 — Electronics materials supplier Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for light emitting diodes (LEDs) and small power semiconductor die packaging.

The new thermally and electrically conductive adhesives enable high thermal transfer for LEDs and power electronics. Thermal conductivities are greater than 20 W/mK when measured by laser flash. Both products feature high glass transition temperatures (Tg) and modulus, enabling wire bonding. They are electrically conductive for static drain. DA-5045-2 and -4 withstand JEDEC level 1/260

February 10, 2012 — In its 2011 recap and Q4 financial results, semiconductor packaging company Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.

Amkor incurred a $4 million charge in Q4 associated with the workforce reduction in Q4.

"As part of our continuing efforts to rationalize our cost structure, we have initiated a voluntary retirement program in Japan. While the ultimate amount of the charge for this restructuring initiative will depend on the level of employee participation, we currently anticipate incurring a charge of around $6 million in the first quarter 2012," said Joanne Solomon, Amkor’s executive vice president and chief financial officer.

Amkor’s Q4 results and 2011 review, as well as Q1 2012 forecast, are available here.

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February 7, 2012 — BTU International Inc., thermal processing equipment supplier, won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.

PYRAMAX reflow ovens feature high throughput, with closed-loop convection control of heat and cooling, constant heat transfer, and low nitrogen consumption, among other elements.

The orders total over $1 million. Shipments will be completed during the first half of 2012.

Major SATS companies require high-performance solder reflow ovens, commented Jim Griffin, vice president of sales and service for BTU International, adding that the SATS market segment remains "one of the strongest in the electronics industry."

BTU International provides advanced thermal processing equipment and processes to the alternative energy and electronics assembly markets. Internet: www.btu.com.

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February 7, 2012 — Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego. Kyocera America is a Qualified Manufacturer’s List (QML)-certified flip-chip assembly provider.

The cleanroom can fabricate fine-pitch flip-chip multiple components within one operation, and performs vacuum die-attach and vacuum-assembly sealings for flip-chip and multi-chip module (MCM) assembly. The expansion also reduces overall cycle times for all levels of manufacturing at Kyocera America.

Kyocera America can provide prototype to high-volume microelectronics package production in San Diego rather than sending it offshore, said Tim Roth, GM, Kyocera’s Assembly Technology Division. "Along with higher volume production, Kyocera now offers lead-free flipchip assembly, ahead of federal RoHS regulations, which take effect in 2014."

Kyocera provides assembly services for diverse microelectronics markets, including high-speed digital communications, high-reliability applications, high-count I/O devices, high-end servers, multi-core processors and data transport infrastructure. The company recently increased its engineering staff to provide additional customer service, design and development expertise.

Kyocera has performed US microelectronic package manufacturing for more than 40 years; it has performed assembly services in San Diego since 1991.

Kyocera America Inc. provides high-reliability ceramic packages, complex modules, and contract assembly services. It is a wholly-owned subsidiary of Kyocera International, Inc., the North American holding company for Kyocera Corporation. Internet: http://americas.kyocera.com/kai/semiparts

Kyocera Corporation (NYSE:KYO) (TOKYO:6971), the parent and global headquarters of the Kyocera Group, can be found at http://global.kyocera.com/.

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February 6, 2012 — Rudolph Technologies Inc. (NASDAQ:RTEC), process characterization equipment and software supplier, delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.

The MetaPULSE system has been proven in metrology for front-end wafer processing applications. This is the first use in back-end packaging metrology. The MetaPULSE system offers nondestructive measurements with small spot size, speed, and accuracy for measurements on patterned wafers. It can measure each layer within the completed multilayer stack or separate layers as they are deposited.

The tool was shipped in Q4 2011 and has been installed at the user site, a major IC manufacturer. The evaluation program took over 12 months.

The customer decided to implement on-product metrology as decreasing feature sizes and increasing pattern densities introduced pattern-dependent deposition effects in their plating process, Rudolph representatives stated.

Numerous other logic, memory and foundry customers are considering the metrology technology to expand into additional critical back-end applications. RDL and UBM route dense I/O signals between the circuit and the electronic system. Pattern-dependent deposition effects that must be measured on patterned product wafers, rather than the unpatterned monitor wafers used in previous process generations.

Rudolph Technologies Inc. designs, develops, manufactures and supports defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers. Additional information can be found on the company

February 6, 2012 — Semiconductor process equipment maker SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.

The Gen2 tool doubles the number of process modules available over the first generation of XBC300. It can be configured for any major permanent bonding process, as well as mechanical debonding processes at room temperature. Cleaning processes for 3D integration and 3D packaging are also supported. Cu-Cu, polymer, fusion and hybrid bonding processes can take place in the tool.

When configured as a debonder and cleaner the XBC300 Gen2 is the complementary platform to SUSS MicroTec’s XBS300 temporary wafer bonder. Device wafers are temporarily bonded to a carrier in the XBS300 and are debonded at room-temperature and cleaned on the XBC300 Gen2 after passing all the backside processing steps. The XBC300 Gen2 debonder/cleaner is configured for handling carrier wafers or film frames.

Also read: SUSS Microtech adds Brewer Science ZoneBond to wafer bonders

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, provides equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

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February 3, 2012 – Marketwire — Silicon Frontline Technology Inc. (SFT), an EDA company in the post-layout verification market, announced that X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT’s R3D (Resistive 3D) software for X-FAB’s 0.18

February 2, 2012 – BUSINESS WIRE — 3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI) for small form factor computer hardware, high-performance RF boards, microphones, integrated circuit (IC) packaging, and consumer electronics. The ECM material contributes to hi-fidelity signals, high-signal-to-noise ratio in radio frequencies, and higher speed digital signals.

Previous 3M ECM versions have a maximum capacitance density of approximately 10nF/inch2. The 3M ECM High-Capacitance Density products offer a 20-40nF/inch2 capacitance density range. The ECM material is halogen-free and RoHS compliant.

Also read: 3M, IBM to make 3D chip adhesives

The material matches the needs of increased fidelity and rapid miniaturization in electronic devices, said Abhay Joshi, global business development manager, 3M Electronic Solutions Division, Interconnect Business.

3M

February 1, 2012 — Semiconductor test equipment provider Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.

Based on the MT95XX platform technology, the MT9510 x16 performs temperature testing and device under test (DUT) handling for high parallel test from -55 to +175