August 2, 2012 — Semiconductor packaging house Unisem (M) Berhad named Lee Hoong Leong as group COO, replacing Ang Chye Hock, who has retired. Ang will remain as executive director, responsible for sales and business development for the Group.
Lee assumes responsibility for the Group
August 1, 2012 — Park Electrochemical Corp. (NYSE-PKE) plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China, and liquidate, subject to the requisite approvals of government authorities in China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.
Bismaleimide triazine (BT) substrates are widely used for IC packaging. Park will support all its customers in Asia from its Nelco Products Pte. Ltd. business unit in Singapore now, with manufacturing activities from Zhuhai moving to Singapore. The proposed cessation of operations does not contemplate the loss of any business by Park.
As the result of the cessation of operations at Nelco Technology (Zhuhai FTZ) Ltd., Park expects to record total pre-tax charges of approximately $3.2 million. The charges include non-cash charges of approximately $2.4 million and cash charges of approximately $0.8 million. The Company is recording approximately $2.6 million of these charges in the 2013 fiscal year second quarter ending August 26, 2012 and expects to record the balance of the charges during the remaining two quarters of the current fiscal year ending March 3, 2013 and the first quarter of the 2014 fiscal year. The Nelco Technology (Zhuhai FTZ) Ltd. business operations will have no further impact on the consolidated financial condition or results of operations of Park Electrochemical Corp. after the cessation of operations.
Park Electrochemical Corp. is a global advanced materials company that develops and manufactures high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure and high-end computing markets. The company also supplies advanced composite materials, parts and assemblies for the aerospace markets. Learn more at http://www.parkelectro.com/.
August 1, 2012 – PRNewswire — FlipChip International (FCI), wafer-level packaging and flip chip bumping provider, named Weng Kay Lui as Asian sales director. Weng Kay Lui, based in Shanghai, will bring FCI
July 31, 2012 — Cardiff University spin-out Mesuro, semiconductor testing and services provider, raised
July 31, 2012 – Marketwire — Cascade Microtech, Inc. (NASDAQ:CSCD), wafer-level IC test equipment supplier, introduced the modular MPS150 manual probe station with six application-specific packages for high-accuracy RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.
The probe station is designed to be upgraded as needed, with a scalable base platform and system packages.
Also read: Cascade Microtech touts wafer-level test innovators at inaugural Innovation Awards
The 6 pre-configured packages for specific measurement applications target measurement repeatability in a shared lab environment, such as a research lab or university. Multiple users can access the prober, change test set-up, and reset quickly to another set up.
The MPS150 system platform comprises a rigid microscope bridge and solid station frame, and a built-in vibration-isolation design. The design protects contact quality over measurement time. Probe placement and contact repeatability are served by backlash-free X-Y-Z movement of probe positioners, integrated platform planarization, and a contact separation drive with 1
July 30, 2012 — Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film can be used as a dicing tape as well as die attach.
The pre-cut film joins LOCTITE ABLESTIK C100, a conductive die attach film in roll format.
Conductive die attach films enable uniform, consistent bondlines, eliminate die tilt, and work with thinned wafers, for leadframe and laminate packages. Films eliminate the fillet associated with paste-based die attach materials, which Henkel notes allows more die per package due to tighter die-to-pad clearance, and saves on wire bonding materials, substrate area, and mold compound usage.
LOCTITE ABLESTIK CDF 200P is compatible with commonly used lamination equipment, at lamination temperature of 65
July 27, 2012 — At Nanya Technology
July 27, 2012 – Marketwire — Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.
Cascade Microtech promoted its history in the test and measurement industry — the first microwave on-wafer probe, the first GHzF- capable probe card, the first on-wafer power device characterization system, the first integrated 1/f noise measurement system, the first multi-channel configurable quadrant probe capable of automated testing over temperature, and the first production power test system — with honors for
July 26, 2012 — Semiconductor packaging and assembly equipment supplier ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.
July 25, 2012 — SEMI Europe will host a new event, the European 3D TSV Summit, January 22-23, 2013 in Grenoble, France. This inaugural meeting will revolve around the theme: "On the Road towards TSV Manufacturing," denoting how device designers and manufacturers are crossing from 2D packaging to 3D for more functionality in a smaller form factor.
Europe