Tag Archives: Advanced Packaging

July 25, 2012 — STATS ChipPAC Ltd. (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, appointed Gary Tanner as a member to its Board of Directors. Tanner brings experience from Zarlink Semiconductor, Intel (INTC), Texas Instruments (TI, TXN), and other semiconductor companies.

Tanner served as director, CEO and president of Zarlink Semiconductor Inc. (2007-2011) until it was acquired by Microsemi Corporation in October 2011. Before joining Zarlink, he was VP of operations of Legerity Inc. Tanner also held various management positions during 9 years at Intel, and held fab management roles at National Semiconductor, Texas Instruments, and NCR Corporation.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com.

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July 24, 2012 — Global Semiconductor Alliance (GSA) recently named Jalinous (Jay) Esfandyari, MEMS product marketing manager, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, group director of marketing, Strategic Planning, Cadence Design Systems, as the 3D IC Working Group chairman.

Micro electro mechanical systems (MEMS)

In June, the MEMS working group heard presentations on MEMS market directions for the next decade and discussed collaboration with other industry efforts, as well as a strong focus on setting impactful deliverables. The Working Group considered several possible areas of development during this inaugural meeting, including potential deliverables such as MEMS Product Design Kits, a MEMS Glossary of Terms, or providing a MEMS EDA Tools Workshop.

Esfandyari has more than 20 years of industry experience in semiconductor technology, integrated circuits fabrication processes, MEMS development and fabrication, and strategic MEMS market and business development. As the MEMS Product Marketing Manager at STMicroelectronics, he has developed new markets for MEMS products and achieved multi-million dollar business opportunities.

In his previous roles, Jay worked closely with customers to develop custom MEMS products, developed models to describe the physics of defect generation in silicon wafer during device fabrication processes, and created solutions to perform analysis and computer simulation to improve the quality of silicon wafers. Esfandyari holds a master

July 18, 2012 – BUSINESS WIRE — Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC).

The room-temperature product encapsulates ball-grid array (BGA) and land-grid array (LGA) semiconductor packages, with encapsulation quality and connectivity to match compounds that must be stored in a frozen state.

The room-temperature state of Kyocera

July 18, 2012 — Semiconductor packaging company STATS ChipPAC Ltd. (SGX-ST:STATSChP) presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplier partners are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.

More supplier awards from 2011:

Texas Instruments (TI, TXN) names top suppliers

Intel awards 9 elite suppliers in 2011

Intel

July 17, 2012 — Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.

The high-volume consumer application will benefit from cost savings and efficiency of Ziptronix DBI wafer stacking, the company says. The wafer bonding technology can offer smaller pitch, increased functionality, increased density and scalability, along with lower-cost manufacturing, for future generations of 3D integrated devices.

The technology saw its initial adoption in image sensor manufacturing, and is now being applied in 3D memory stacking and other applications, said Daniel Donabedian, CEO of Ziptronix. Additional licensing discussions are underway with companies targeting 3D integration, he added. Ziptronix licenses its technology throughout the semiconductor supply chain, including OEMs, IDMs and some fabrication and assembly facilities

Ziptronix develops low-temperature direct bond technology for various semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D ICs. Ziptronix

July 16, 2012 — 3D IC and stacked die semiconductor packaging configurations are often difficult to image with an acoustic microscope because the multiple internal surfaces send back abundant echoes and re-echoes from the ultrasound pulsed into the stack.

Now, Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.

Also read: Multi depth imaging system shows defect progress

The SonoSimulator determines optimal gate positions and other parameters with far less effort than is possible with the physical stacked parts alone. It also results in higher quality acoustic images.

Operators create a virtual die stack that matches the characteristics of the physical 3D IC or die stack to be inspected, including defects at specified layers. The virtual defects help determine the optimum placement of gates to image specific levels in the stack.

Imaging parameters are easily transferred to the Gen6 Sonolytics software for imaging the physical 3D IC or die stack.

Sonoscan reports that the simulation software reduces the imaging time for 3D ICs and stacked die packages, and allows less-experienced operators to do the inspection effectively.

Sonoscan is the leading developer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems, widely used for nondestructive analysis of defects in industrial products and semiconductor devices. Internet: www.sonoscan.com.

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