Tag Archives: Advanced Packaging

June 25, 2012 — Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International. The webcast is sponsored by EV Group (EVG) and ALLVIA.

3D and 2.5D Integration: A Status Report will cover through-silicon via (TSV) formation, interposers, and other die stacking methods. What is the present status of these advanced packaging technologies?

Now, William Chen, senior technical advisor, Advanced Semiconductor Engineering Inc. (ASE US Inc.), had been added to the speaker list for this webcast. ASE is a leading semiconductor assembly and test services (SATS) provider, headquartered in Taiwan. William Chen recently spoke at The ConFab 2012, where he discussed the rise of

June 22, 2012 — SEMICON West is taking place July 10-12 at the Moscone Center in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.

Automated temporary bonding/debonding system

The EVG850 TB/DB XT Frame from EV Group is an automated temporary bonding and debonding system for thin wafer handling, configured to address high-volume 3D IC and TSV manufacturing. The system temporarily bonds a device wafer to a rigid carrier wafer for safe and efficient processing of the device wafer. After subsequent processing (back thinning, lithography, metallization, etching, through via processing, etc.), the device wafer is debonded from the carrier substrate using various techniques dependent of the intermediate material. The system can be configured for LowTemp debonding methods like ZoneBOND technology with the required EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules. A thermal-activated, mechanical slide-off is utilized for thermo-plast materials, while UV-exposure and lift-off debond is utilized for UV-activated tapes. It accommodates up to 9 process modules and boasts a continuous-mode operation with an ultra-fast handling system, up to 4 FOUP load ports, a material buffer in the form of a local FOUP storage system holding up to 10 additional FOUPs, and in-line metrology module option. EV Group, South Hall, Booth 719.

Electrochemical deposition tool

TEL NEXX’s new plating tool, Stratus Thunder, is used for electrochemical deposition of TSV, middle and interposer, lead-free, copper pillar, and RDL advanced packaging materials. Stratus Thunder features a low-cost vertical plating architecture and additional features improve its productivity by up to 50%. TEL, South Hall, Booth 1531.

Spray coater

The MAX-800 is a large format, high speed X-Y-Z spray coating system designed for the thin, uniform application of a variety of coatings and suspensions used in semiconductor packaging, display manufacturing, fuel cell manufacturing and medical device manufacturing applications.  The system features USI

June 20, 2012 — DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of radio frequency identification (RFID) device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.

DELOMONOPOX AC268 reliably bonds chips, which measure down to 400

June 20, 2012 – Marketwire — Pure-play foundry Shanghai Hua Hong NEC Electronics Company Ltd. and test equipment supplier Advantest Corporation (TSE: 6857, NYSE:ATE) co-developed a wafer-level, multi-site parallel test scheme for radio-frequency identification (RFID) semiconductor devices that meets industry-standard ISO 14443 guidelines.

RFID devices that comply with ISO 14443 standards are divided into two types: Type A and Type B, by the modulation/demodulation for the 13.56 MHz carrier wave. When in use, a proximity coupling device (PCD) sends a carrier signal at 13.56 MHz to the RFID device. The RFID device’s antenna receives the signal wave, which carries both transmitted data and the power that drives the RFID device. The RFID device then sends a return signal carrying response data back to the PCD.

Crosstalk among RFID devices during wafer-level testing can result in reduced production yields and low productivity. The foundry worked with Advantest’s T2000 test platform to develop a test solution that offers fast, accurate recognition and feedback for RFID devices. The result is a high-signal-quality, anti-crosstalk interface and an optimized algorithm within the test program to minimize the bit error rate and perform multi-site parallel testing.

This methodology is currently being used in mass production to test 32 RFID sites in parallel. Hua Hong NEC is seeing improved cost efficiency of volume-production testing and reduced bottleneck at RF test, with approval from the foundry’s key customers. Hua Hong NEC offers advanced production processing and test development capabilities for smart card and information security applications.

The companies are collaborating on a next-generation solution capable of 64-site parallelism.

Shanghai Hua Hong NEC Electronics Company Limited is an 8

June 19, 2012 – BUSINESS WIRE — Signetics Corporation approved plans to purchase additional semiconductor assembly process equipment — wafer grinders, wafer saws, die attach tools, and wire bonders — to grow its packaging capacity for mobile chips.

The capital expenditures (capex) are phase 4 of Signetics

June 18, 2012 – Marketwire — Semiconductor packaging and test services provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped. STATS ChipPAC offers high-volume semiconductor assembly and dedicated engineering expertise to developing a copper wire bonding process to suit advanced, multi-die laminate and leaded packages including 3D packaging.

STATS ChipPAC

ECTC


June 15, 2012

June 15, 2012 — San Diego, CA, hosts the annual ECTC (Electronic Component Technology Conference) every three years. Attendance at this year

June 15, 2012 — Anritsu Company will demonstrate its broadband Vector Network Analyzer (VNA) system, which conducts single sweeps from 70kHz to 140GHz during wafer probe test, in its booth 807 at the International Microwave Symposium (IMS), June 19-21 in Montreal.

The demonstration will showcase Anritsu

June 13, 2012 — StratEdge Corporation, high-performance semiconductor package maker for microwave, millimeter-wave, and high-speed digital devices, launched the LL family of high-power laminate packages. The LL leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high-power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC) chips.

These packages handle applications through 6GHz, suiting use in RF radios for communications, radar, and high-power millimeter-wave signals.

The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, a good thermal match for alumina-based materials and a GaN chip. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. The LL802302 is 20.32 x 9.91mm with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board (PCB). The LL362302 is a flangeless, fully hermetic version of the LL802302 package, with a flat ceramic lid. Hermeticity is especially critical in aerospace and defense applications.

"StratEdge’s new laminate power packages solve thermal problems encountered when using GaN devices," explained Tim Going, StratEdge president. "The excellent thermal conductivity of the CMC base enables use of GaN devices in high power applications, and the flange package facilitates manufacturing."

IMS2012 is taking place in The Palais de Congres, Montreal, Canada, June 19-21, 2012. StratEdge will debut the new package family at booth #1625.

StratEdge Corporation designs, manufactures, and provides test and assembly services for a complete line of high-performance semiconductor packages operating from DC to 50+ GHz for the high speed digital, mixed signal, broadband wireless, satellite, point-to-point/multipoint, VSAT, and test and measurement industries, as well as aerospace stripline filters. Website: www.stratedge.com.

Visit the Advanced Packaging Channel of Solid State Technology, and sign up for our Advanced Packaging News e-newsletter!