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Annual semiconductor unit shipments (integrated circuits and opto-sensor-discretes, or O-S-D, devices) are expected to grow 9% in 2018 and top one trillion units for the first time, based on data presented in the new, 2018 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry (Figure 1).  For 2018, semiconductor unit shipments are forecast to climb to 1,075.1 billion, which equates to 9% growth for the year.  Starting in 1978 with 32.6 billion units and going through 2018, the compound annual growth rate for semiconductor units is forecast to be 9.1%, a solid growth figure over the 40 year span.

Figure 1

Figure 1

Over the span of just four years (2004-2007), semiconductor shipments broke through the 400-, 500-, and 600-billion unit levels before the global financial meltdown caused a big decline in semiconductor unit shipments in 2008 and 2009.  Unit growth rebounded sharply with 25% growth in 2010 and displayed another strong increase in 2017 (14% growth) to climb past the 900-billion level.

The largest annual increase in semiconductor unit growth during the timespan shown was 34% in 1984, and the biggest decline was 19% in 2001 following the dot-com bust.  The global financial meltdown and ensuing recession caused semiconductor shipments to fall in both 2008 and 2009; the only time that the industry experienced consecutive years in which unit shipments declined.  The 25% increase in 2010 was the second-highest growth rate across the time span.

The percentage split of total semiconductor shipments is forecast to remain weighted toward O-S-D devices.  In 2018, O-S-D devices are forecast to account for 70% of total semiconductor units compared to 30% for ICs.  Thirty-eight years ago in 1980, O-S-D devices accounted for 78% of semiconductor units and ICs represented 22% (Figure 2).

Figure 2

Figure 2

Semiconductor products forecast to have the strongest unit growth rates in 2018 are those that are essential building-block components in smartphones, automotive electronics systems, and within systems that are helping to build out of Internet of Things.  Some of the fast-growing IC unit categories for 2018 include Industrial/Other—Application-Specific Analog (26% increase); Consumer—Special Purpose Logic (22% growth); Industrial/Other—Special Purpose Logic, (22%); 32-bit MCUs (21%); Wireless Communication—Application-Specific Analog (18%); and Auto—Application-Specific Analog (17%). Among O-S-D devices, CCDs and CMOS image sensors, laser transmitters, and every type of sensor product (magnetic, acceleration and yaw, pressure, and other sensors) are expected to enjoy double-digit unit growth this year.

North America-based manufacturers of semiconductor equipment posted $2.39 billion in billings worldwide in December 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.  The billings figure is 16.3 percent higher than the final November 2017 level of $2.05 billion, and is 27.7 percent higher than the December 2016 billings level of $1.87 billion.

“December 2017 monthly billings for North American equipment manufacturers ended the year at the highest levels in this record-breaking year,” said Ajit Manocha, president and CEO of SEMI. “For 2017, total billings for North American equipment companies soared over 40 percent compared to 2016.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)
Year-Over-Year
July 2017
$2,269.7
32.9%
August 2017
$2,181.8
27.7%
September 2017
$2,054.8
37.6%
October 2017
$2,019.3
23.9%
November 2017 (final)
$2,052.3
27.2%
December 2017 (prelim)
$2,387.8
27.7%

Source: SEMI (www.semi.org), January 2018

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases.

 

SEMI today announced that SEMI Europe’s Industry Strategy Symposium (ISS Europe), coming on the heels of the highly successful ISS 2018 in the U.S., will highlight STEM education and a talent pipeline, critical issues to electronics manufacturing executives sharpening their competitive edge in the global supply chain. Day two of the flagship business event – March 4-6 in Dublin, Ireland – will feature two experts focusing on how companies can “Gain, Train and Retain World-Class Talent.”

Ann-Charlotte Johannesson, CEO, CEI-Europe AB, will examine strategies to attract, retain and develop highly skilled workers in the semiconductor industry as an essential component of Europe´s global competitiveness in her presentation “Smart Training for Smarter Engineers – The Way of Ensuring the Competitive Advantage for the Global European Industry.”

Cheryl Miller, Founder/Executive Director, Digital Leadership Institute, will present an overview of education and digital skills, innovation, entrepreneurship and the workplace of the future. The Digital Leadership Institute, a Brussels-based, international NGO, is a recognised world leader in promoting greater participation of girls and women in strategic, innovative ESTEAM (Entrepreneurship & Arts powered by STEM).

“A skilled workforce is not only a keystone to the success of the global supply chain but a source of competitive advantage, making STEM education and a strong talent pipeline critical focus areas for the industry,” said Laith Altimime, president, SEMI Europe. “SEMI member companies feel the pinch, with thousands of open positions that are critical to sustaining the pace of innovation and growth. To address the talent shortfall, SEMI Europe this year launched a workforce development and diversity initiative.”

Other ISS Europe 2018 highlights include the panel discussion “Critical Strategies to Grow Europe in the Global Supply Chain,” the opening networking reception, a gala dinner, and the 2017 European Award ceremony.

ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management, subject to notification of the Annual General Meeting of Shareholders scheduled for April 25, 2018. Dassen succeeds Wolfgang Nickl who will leave ASML at the end of April (as announced on 12 September 2017). Roger Dassen (age 52) will join ASML on June 1, 2018.

Roger Dassen is the Global Vice Chairman, Risk, Regulatory, and Public Policy of Deloitte Touche Tohmatsu Limited (DTTL). In this capacity, he also serves as the Global Chief Ethics Officer and a member of the DTTL Executive. Dassen is a former CEO of Deloitte Netherlands. He has been a Deloitte Netherlands audit partner since 1996 and has served as advisory partner and/or global LCSP for a number of the firm’s largest clients.

Dassen is professor of auditing at the Free University of Amsterdam. He has a master’s degree in economics and business administration, and a PhD in business and economics from the University of Maastricht.

“We are very pleased to have Roger Dassen join us as our CFO. We welcome his deep financial expertise and broad managerial experience. The Board of Management is confident that he will quickly integrate into our senior management team to support ASML in delivering our company’s growth objectives,” said Peter Wennink, President and Chief Executive Officer at ASML.

ASML is a manufacturer of chip-making equipment.

Worldwide PC shipments totaled 71.6 million units in the fourth quarter of 2017, a 2 percent decline from the fourth quarter of 2016, according to preliminary results by Gartner, Inc. For the year, 2017 PC shipments surpassed 262.5 million units, a 2.8 percent decline from 2016. It was the 13th consecutive quarter of declining global PC shipments, as well as the sixth year of annual declines. However, Gartner analysts said there were some signs for optimism.

“In the fourth quarter of 2017, there was PC shipment growth in Asia/Pacific, Japan and Latin America. There was only a moderate shipment decline in EMEA,” said Mikako Kitagawa, principal analyst at Gartner. “However, the U.S. market saw a steep decline, which offset the generally positive results in other regions.

“The fourth quarter results confirmed again that PCs are no longer popular holiday gift items. This does not mean that PCs will disappear from households,” Kitagawa said. “Rather, the PC will become a more specialized, purpose-driven device. PC buyers will look for quality and functionality rather than looking for the lowest price, which will increase PC average selling prices (ASPs) and improve profitability in the long run. However, until this point is reached, the market will have to go through the shrinking phase caused by fewer PC users.”

HP Inc. moved into the No. 1 position in the fourth quarter of 2017, as its shipments grew 6.6 percent, and its market share totaled 22.5 percent (see Table 1). The company showed year-over-year growth in all regions, including the challenging U.S. market. For the fourth consecutive quarter, Lenovo experienced a decline in shipments. Lenovo had moderate growth in EMEA and Asia/Pacific, but shipments declined in North America.

Table 1
Preliminary Worldwide PC Vendor Unit Shipment Estimates for 4Q17 (Thousands of Units)

Company

4Q17 Shipments

4Q17 Market Share (%)

4Q16 Shipments

4Q16 Market Share (%)

4Q17-4Q16 Growth (%)

HP Inc.

16,076

22.5

15,084

20.7

6.6

Lenovo

15,742

22.0

15,857

21.7

-0.7

Dell

10,841

15.2

10,767

14.7

0.7

Apple

5,449

7.6

5,374

7.4

1.4

Asus

4,731

6.6

5,336

7.3

-11.3

Acer Group

4,726

6.6

4,998

6.8

-5.4

Others

13,990

19.6

15,599

21.4

-10.3

Total

71,556

100.0

73,015

100.0

-2.0

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.
Source: Gartner (January 2018)

Dell’s shipments grew slightly in the fourth quarter of 2017. Dell did well in EMEA, Asia/Pacific and Latin America, but it had weak results in North America. Generally, Dell has put a higher priority on profitability over market share.

Steep PC shipment decline in the U.S.

In the U.S., PC shipments surpassed 15.2 million units in the fourth quarter of 2017, an 8 percent decline from the fourth quarter of 2016 (see Table 2). Four of the top five vendors experienced a decline in U.S. PC shipments in the fourth quarter of 2017. HP Inc. was the only vendor to increase shipments in the quarter. The decline was attributed to weak consumer demand despite holiday season sales.

“U.S. consumer confidence was high in the fourth quarter of 2017, but that did not influence PC demand. U.S. holiday sales were filled with popular products, such as voice-enabled speakers, and newly released smartphones,” Kitagawa said. “PCs simply could not compete against these gift items during the holiday season. We did see some consistent growth of gaming and high-end PCs.”

Table 2
Preliminary U.S. PC Vendor Unit Shipment Estimates for 4Q17 (Thousands of Units)

Company

4Q17 Shipments

4Q17 Market Share (%)

4Q16 Shipments

4Q16 Market Share (%)

4Q17-4Q16 Growth (%)

HP Inc.

5,130

33.7

5,049

30.5

1.6

Dell

3,691

24.3

4,209

25.4

-12.3

Apple

1,972

13.0

2,003

12.1

-1.6

Lenovo

1,792

11.8

2,344

14.2

-23.6

Acer Group

587

3.9

661

4.0

-11.2

Others

2,042

13.4

2,276

13.8

-10.3

Total

15,214

100.0

16,543

100.0

-8.0

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.
Source: Gartner (January 2018)

PC shipments in EMEA totaled 21.8 million units in the fourth quarter of 2017, a 1.4 percent decline year over year. PC demand in the U.K. was still ailing and unit shipments into Germany were weaker than expected. PC revenue is expected to be up year over year in Western Europe. The rise in ASPs is due to currency fluctuations, the need for vendors to offset rising component costs, and a product-mix shift toward higher-value items, such as gaming systems and high-performing notebooks.

The Asia/Pacific PC market totaled 25 million units in the fourth quarter of 2017, a 0.6 percent increase from the fourth quarter of 2016. The consumer market stabilized with fourth-quarter online promotions in many countries, which drove demand for gaming PCs and thin and light notebooks. China experienced its first positive PC shipment growth since the first quarter of 2012. The success of the 11.11 shopping festival and the continuing demand for PCs in the commercial market drove the China PC market to 1.1 percent growth in the quarter.

PC market consolidation in 2017

For the year, worldwide PC shipments totaled 262.5 million units in 2017, a 2.8 percent decrease from 2016 (see Table 3). As the PC industry continues to consolidate, the top four vendors in 2017 accounted for 64 percent of global PC shipments. In 2011, the top four vendors accounted for 45 percent of PC shipments.

“The top vendors have taken advantage of their volume operations to lower production costs, pushing small to midsize vendors out of the market,” Kitagawa said.

Table 3
Preliminary Worldwide PC Vendor Unit Shipment Estimates for 2017 (Thousands of Units)

Company

2017

Shipments

2017 Market

Share (%)

2016

Shipments

2016 Market Share (%)

2017-2016 Growth (%)

HP Inc.

55,162

21.0

52,734

19.5

4.6

Lenovo

54,714

20.8

55,951

20.7

-2.2

Dell

39,871

15.2

39,421

14.6

1.1

Apple

19,299

7.4

18,546

6.9

4.1

Asus

17,967

6.8

20,496

7.6

-12.3

Acer Group

17,088

6.5

18,274

6.8

-6.5

Others

58,435

22.3

64,683

23.9

-9.7

Total

262,537

100.0

270,106

100.0

-2.8

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.
Source: Gartner (January 2018)

These results are preliminary. Final statistics will be available soon to clients of Gartner’s PC Quarterly Statistics Worldwide by Region program. This program offers a comprehensive and timely picture of the worldwide PC market, allowing product planning, distribution, marketing and sales organizations to keep abreast of key issues and their future implications around the globe.

 

United Microelectronics Corporation (NYSE:UMC; TWSE:2303) (“UMC”), a global semiconductor foundry, today announced that the company has filed a patent infringement lawsuit against Micron Semiconductor (Xi’an) Co., Ltd. and Micron Semiconductor (Shanghai) Co., Ltd. in the Fuzhou Intermediate People’s Court of the People’s Republic of China (PRC). The lawsuit covers three areas that allegedly infringe upon UMC’s patent rights in China, including specific memory applications that relate to DDR4, SSD and memory used in graphics cards.

In the complaint, UMC has requested the court to order the defendant(s) to stop manufacturing, processing, importing, selling and intending to sell the allegedly infringing products, destroy all inventory and related molds and tools and demand that Micron compensate the company for a total amount of RMB 270 million in damages.

UMC has devoted a great deal of resources and manpower to researching and developing semiconductor manufacturing technology. Its achievements can be applied to logic chips or memory chips (DRAM), and the company has applied for patents in various countries while continuing to monitor these patents as market conditions evolve. After conducting an in-depth review, UMC found that Micron’s products sold in mainland China did indeed infringe upon the patent rights of the company, and thus patent infringement litigation has been pursued in order to obtain fair judgment.

By Emir Demircan, Senior Manager Advocacy and Public Policy, SEMI Europe

Electronic manufacturing is becoming cool to today’s youth. STEM skills are hot in the global job market – though the number of females pursuing a STEM education continues to lag. Work-based learning is key to mastering new technologies. And the electronics industry needs a global talent pipeline more than ever.

These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider. Here are the takeaways:

1) Electronics is much more than manufacturing

For many years, working in the manufacturing industry was not an appealing prospect for millennials. This picture is certainly changing. The pivotal role of electronics manufacturing in helping solve grand societal challenges in areas such as the environment, healthcare and urban mobility is reaffirmed by countries around the world. Electronics is the lifeblood of game-changing technologies such as autonomous driving, AI, IoT, and VR/AR, enticing more young employees into careers in research, design, technology development, production, cyber security and international business, and in disciplines ranging from engineering and data analytics to software development and cyber security.

What’s more, the drudgery of many factory jobs is disappearing thanks to automation, digitization and robotization. According to CEDEFOP, the European Centre for the Development of Vocational Training, low-skilled jobs in electro-engineering and machine operations/assembly in the European Union (EU) is projected to decrease 6.98 percent and 2.03 percent, respectively, between 2015 and 2025.

In parallel, the industry will need more high-skilled workers. For instance, within the same period, CEDEFOP forecasts a 12.51 percent increase in jobs for EU researchers and engineers. Soft skills will see high demand too. As the electronics industry continues to globalize and drive the integration of vertical technologies, workers proficient in communicating in an international environment, leading multicultural teams, developing tailor-made solutions and making data-driven decisions will see higher demand.

2) STEM skills will remain under the spotlight

Continuous innovation is the oxygen of the electronics manufacturing industry, powering the development of highly customized solutions by workers with technical expertise in chemistry, materials, design, mechanics, production and many other fields. In addition, capabilities such as smart manufacturing require workers with growing technical sophistication in areas such as software, information and communications technology (ICT) and data analytics, stiffening the challenge the electronics industry faces in finding skilled workers. Little wonder that employers in Europe struggle to build a workforce with the right technical expertise. The findings of the study “Encouraging STEM Studies for the Labour Market” conducted by the European Parliament underscores the difficulty of hiring enough workers with adequate STEM skills:

  • The proportion of STEM students is not rising at the European level and the underrepresentation of women persists.
  • Businesses are expected to produce about 7 million new STEM jobs, an uptick of 8 percent, between 2013 and 2025 in Europe.

3) The women-in-tech gap is becoming more persistent 

The global manufacturing industry suffers from strikingly low female participation in STEM education and careers. According to UNSECO, in Europe and North America, the number of female graduates in STEM is generally low. For instance, women make up just 19 percent of engineers in Germany and the U.S. The European Parliament study confirms that STEM employment remains stubbornly male-dominated, with women filling just 24 percent of science and engineering jobs and 15 percent of science and engineering associate positions in Europe. According to an article by Guardian, a mere 16 percent of computer science undergraduates in the United Kingdom and the U.S. are female. This yawning gender gap is a deep concern for electronics manufacturing companies in Europe, hampering innovation in a sector that relies heavily on diversity and inclusion and shrinks the talent pipeline critical to remaining competitive.

4) Coping with new technologies: work-based learning is the key

The evolution of the electronics industry since the 1980s has been swift. PCs emerged largely as islands of communication, then became networked. Networking bred the proliferation of social platforms and mobile devices and, today, is giving rise to IoT. Education curricula in Europe, however, have not matured at the same pace, opening a gap between the worlds of industry and education and imposing a formidable school-to-work transition for many young graduates. Work-based learning, which helps students develop the knowledge and practical job skills needed by business, is one solution. The industry reports that work-based learning is vital to remaining competitive in the long run. Innovative dual-learning programmes, apprenticeships and industrial master’s and doctorates are shining examples that are already paying off in some parts of Europe. Such work-based learning models can be extended as a common pillar of education in Europe.

5) A global industry needs a global talent pipeline

The electronics value chain workforce needs an international and multicultural talent pipeline, chiefly spanning the U.S., Europe and Asia. However, many European manufacturers, in particular small and medium enterprises (SMEs), report that building an international workforce remains a challenge due to employment and immigration law barriers as well as cultural and linguistic differences. The EU’s Blue Card initiative, designed to facilitate hiring beyond Europe, is a step in the right direction. Nevertheless, with the exception of Germany, EU member states have made little or no use of the EU Blue Card scheme.

SEMI drives sector-wide initiatives on workforce development

Understanding the urgency, SEMI is accelerating its workforce development activities at global level. Contributing to this initiative, the SEMI talent pipeline Forum in Dresden served as an effective platform for the industry to share its challenges and opportunities with students at various education levels. Led by industry representatives, the sessions enabled the exchange of workforce-development best practices and paved the way for further collaboration among industry, academia and government in Europe. For example, in the Career Café session, students networked with hiring managers. Other workforce development initiatives include:

To help position the skills challenges faced by SEMI members high on the public policy agenda, SEMI in 2017 joined several policy groups including Digital Skills and Jobs Coalition and Expert Group on High-Tech Skills. Last year SEMI also launched Women in Tech, an initiative that convenes industry leaders to help increase female representation in the sector. SEMI also educates its members about key EU resources such as the Blue Card and Digital Opportunity Internship programmes aimed at hiring international talent. In 2018, SEMI will reach out to even more young people through its High Tech U programme to raise awareness of careers in electronics. SEMICON Europa 2018 will host dedicated talent pipeline sessions to help the industry tackle its skills challenges. ISS Europe 2018 sessions on Gaining, Training and Retaining World Class Talent will disseminate best practices to the wider industry. Also this year, SEMI Europe plans to start a new advisory group, “Workforce 4.0,” dedicated to bringing together human resources leaders in the sector to give the electronics manufacturing industry a stronger voice on workforce development.

 

GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) today announced that ST has selected GF’s 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.

After deploying the industry’s first 28nm FD-SOI technology platform, ST is extending its commitment and roadmap by adopting GF’s production-ready 22FDX process and ecosystem to deliver second-generation FD-SOI solutions for the intelligent systems of tomorrow.

“FD-SOI is ideally suited for cost-sensitive applications requiring significant processing and connectivity capabilities at lower power consumption,” said Joël Hartmann, Executive Vice President, Digital Front-End Manufacturing and Technology, STMicroelectronics. “The cost-effective performance and best-in-class energy efficiency benefits of GF’s 22FDX platform, coupled with ST’s extensive design experience and IP base in FD-SOI, will enable our customers with unparalleled value for power, performance and cost. We are relying on GF’s Dresden site for manufacturing products using this technology.”

“ST has established a strong track record with FD-SOI technology,” said Alain Mutricy, senior vice president of product management at GF. “The addition of GF’s 22FDX platform, coupled with ST’s long history of pioneering new technologies and products, will enable the two companies to deliver differentiated FD-SOI products at the 22nm node.”

As a complementary path to FinFETs, GF’s versatile FDX platform offers the ability to integrate digital, analog, and RF functions onto a single chip, which allows customers to design intelligent and fully-integrated system solutions. The technology is uniquely suited for chips that require performance on demand and energy efficiency at the lowest solution cost, making it ideal for a broad range of applications, from intelligent clients and wireless connectivity to artificial intelligence and smart vehicles.

Nordson Corporation (Nasdaq: NDSN) has acquired Sonoscan, Inc., an Elk Grove Village, Illinois-based designer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems used in a variety of microelectronic, automotive, aerospace and industrial electronics assembly applications. The transaction is not material to Nordson results, and terms of the deal were not disclosed.

“The Sonoscan acquisition broadens the offering to our customers within our Test and Inspection range of products and solutions,” said Joseph Stockunas, Vice President for Nordson’s Advanced Technology Systems segment. “Sonoscan’s acoustic imaging solutions are adjacent and highly complementary to Nordson’s existing bond testing, X-ray and automated optical inspection solutions and are sold to the same set of customers.”

Founded in 1974 by Dr. Lawrence Kessler and employing approximately 85 people, Sonoscan will operate within Nordson’s Advanced Technology Systems segment. Since its inception, Sonoscan has been the most trusted authority on the application of Acoustic Microscopy, also known as Acoustic Micro Imaging (AMI) technology, to nondestructively find and characterize physical defects such as cracks, voids, delaminations and porosity that occur during manufacturing, environmental testing or even component operation. This acquisition builds on our strategic objective to grow our Electronics Systems business in the advanced semi-conductor packaging and automotive electronics markets.

Nordson Corporation engineers, manufactures and markets differentiated products and systems used to dispense, apply and control adhesives, coatings, polymers, sealants, biomaterials, and other fluids, to test and inspect for quality, and to treat and cure surfaces.

The SEMI European 3D Summit will make its Dresden, Germany, debut  22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market. The event will highlight the latest 3D technologies including 3DIC Through-Silicon-Via (TSV), 2.5D, 3D FO-WLP/ e-WLB, glass interposers, thermal management and 3D alternative technologies for heterogeneous integration and high-density systems.

A market briefing on the latest business challenges and opportunities in the 3D sector will kick off the summit, with 3D and packaging industry experts presenting their exclusive business and market insights and analysis confirming the huge forecast growth of advanced packaging. Keynotes and presentations on the current adoption of 3D applications such as high-end memory, performance, mobile, imaging and automotive will highlight this 6th edition of SEMI European 3D Summit.

Sold-out for five years straight, the European 3D Summit will showcase the leading names in 3D integration microelectronics manufacturing and offer numerous networking opportunities including a gala dinner and cocktail hour, along with frequent coffee and lunch break mixers. In addition, attendees will meet emerging new talent engaged in the future of 3D integration including Sabrina Fadloun, PhD student and senior field process engineer, SPTS Technologies, and September 2017 winner of the international competition “My Thesis in 180 Seconds.”

The European 3D Summit will showcase speakers from companies such as Third Millennium Test Solutions (3MTS), Amkor Technology, CEA-Leti, Chipworks, Epcos, Fraunhofer, GLOBALFOUNDRIES, Hewlett Packard, Huawei, IBM, IMEC, Intel, ProPrincipia, Qualcomm, Silex, ST Microelectronics, SMIC, TechSearch, Tessera Xperi, Université de Sherbrooke, Western Digital, X-Fab and Yole Développement.

Featuring a huge supplier base, Dresden is home to some of Europe’s largest fabs, from GLOBALFOUNDRIES, Infineon, and X-FAB to a new 300mm BOSCH fab.

Premium Sponsors of the European 3D Summit are SPTS Technologies (platinum sponsor), ASE Group (gold sponsor), Suss MicroTec Group (silver sponsor), EV Group and Trymax (event sponsor)

Please find more registration information at www.semi.org/eu/European-3D-Summit-2018-Register. For more information on the show, please visit www.semi.org/eu/european-3d-summit-2018 or contact Mr. Michael Kaiser, Senior Manager Business Development, SEMI Europe (email: [email protected] or tel. +49 30 3030 8077 10).