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Analog Devices, Inc. (NASDAQ: ADI), a developer of high-performance semiconductors for signal processing applications, today announced that Mark M. Little, former Senior Vice President, GE Global Research and Chief Technology Officer of General Electric Company, has been elected as a Director of the Company, and that the Board of Directors of the Company intends to elect Robert H. Swanson, Executive Chairman of Linear Technology Corporation, as a Director following the closing of the Company’s acquisition of Linear Technology Corporation. Richard Beyer and John Hodgson will retire from the Company’s Board of Directors, effective as of the Company’s 2017 Annual Meeting of Shareholders.

“We are very grateful to Rich and John for their years of dedicated service to ADI, and for their wise counsel as members of our Board,” said Ray Stata, ADI Chairman of the Board. “We are pleased to welcome Mark Little as a new Director, and we are also looking forward to Bob Swanson joining the Board following our acquisition of Linear Technology Corporation.”

Dr. Little is the former Senior Vice President, GE Global Research and Chief Technology Officer of General Electric Company, a global digital industrial company. Dr. Little joined GE in 1978, and during his 37-year tenure, held management positions in engineering and business, culminating with his most recent position, which he held from 2005 to 2015. In addition to his technology leadership, Dr. Little led several multi-billion dollar business units at GE including GE Energy’s power-generation segment. Dr. Little holds bachelor’s and master’s degrees in mechanical engineering from Tufts and Northeastern universities, respectively, and a Ph.D. in mechanical engineering from Rensselaer Polytechnic Institute.

Mr. Swanson, a founder of Linear Technology, has served as Executive Chairman of the Linear Technology board of directors since January 2005. Prior to that time, he served as Chairman and Chief Executive Officer of Linear Technology since its incorporation in 1981. Mr. Swanson has a B.S. degree in Industrial Engineering from Northeastern University.

On July 26, 2016, ADI and Linear Technology entered into an agreement and plan of merger that provides for the acquisition of Linear Technology by the Company. The Company and Linear Technology currently expect the acquisition to be completed by the end of the Company’s second fiscal quarter of 2017, subject to receipt of the remaining required regulatory approvals and subject to the satisfaction or waiver of the other conditions contained in the merger agreement. The Board of Directors of the Company intends to elect Mr. Swanson to the Board at the later of the completion of the acquisition or the Board of Directors meeting following the Company’s 2017 Annual Meeting of Shareholders, currently anticipated to be held on March 8, 2017.

This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market. The global market for semiconductor assembly and testing services (SATS) will continue to be primarily driven by the surging demand for high-end packaging solutions. The global semiconductor assembly and testing services market will possibly reach a value of US$ 24.72 Bn by 2016 end. The market will gain continued traction communication vertical. Asia Pacific will remain the most attractive market for semiconductor assembly and testing services.

Increased demand for outsourced SATS or OSAT services will be a remarkable trend favoring the growth of the global SATS market. With the rapidly thriving consumer electronics industry, the demand for connectivity and mobility is also on the rise, which is foreseen to be an important booster to the demand for connected devices, eventually fostering the semiconductor assembly and testing services market. Rising adoption of multimedia technology devices is identified to be another factor bolstering the demand for SATS. A number of SATS providers offer value added services, such as in-house testing and high-end packaging, which will remain an important driver to the market growth. Several integrated design manufacturers are increasingly prioritising semiconductor assembly and testing services as a time-efficient alternative.

Moreover, rising demand for automotive safety systems is expected to be a strong factor providing impetus to the SATS market. Due to higher costs associated with larger wafer fabrication factory, manufacturers are largely inclined toward outsourcing semiconductor assembly and testing services to third party providers. Leading fabless companies will continue to outsource everything, including testing, assembly, and packaging of semiconductor. This will favour the market growth. Rising adoption of automotive electronics and promising emergence of next-generation electronic vehicles are likely to boost the market growth further.

However, high capital costs related to high-end packaging solution provision, volatility of prices in the market, and uncertainty in exchange rates will continue to pose a negative impact on the global SATS market growth.

By service, assembly and packaging segment will continue to be dominant over the testing segment, prominently driven by the rising demand for consumer electronics and advanced packaging solutions.

On the basis of packaging solution, the copper wire and gold wire bonding segment is expected to retain the leading segment position with over 53% market value share, accounting for the revenues of around US$ 13.24 Bn in 2016. However, the growth of this segment is likely to witness sluggish growth post-2016. The flip chip segment is foreseen to exhibit a robust growth rate, contributing around 18% share to the entire market revenues in 2016. This segment will witness an impressive Y-o-Y growth of 8.6% in 2017 over 2016.

Based on application, communication segment is projected to remain dominant, whereas consumer electronics application segment is likely to register a stellar growth rate in terms of Y-o-Y.

By regional analysis, the global semiconductor assembly and testing services market is segmented into four key markets viz. North America, Europe, Asia Pacific, and Middle East and Africa. APAC will remain the dominant market with over 84% market value share in 2016 but is anticipated to witness a consistent Y-o-Y decline post-2016. On the other side, North America is likely to see a consistent gain in the Y-o-Y growth post-2016. This region will account for over 31% share of the market in 2016, in terms of revenues.

Some of the key companies operating in the global marketplace for semiconductor assembly and testing services (SATS), include Amkor Technologies Inc., ASE Group, Silicon Precision Industries Co. Ltd., STATS ChipPAC Ltd. (JCET), Psi Technologies Inc. (IMI), Powertech Technology Inc., Global Foundries, CORWIL Technology corporation, and Chipbond Technology Corporation.

Long-term Outlook: By 2021 end, the global semiconductor assembly and testing services (SATS) market is expected to account for US$ 39.05 Bn in terms of revenues.

ON Semiconductor (Nasdaq: ON) has announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process. The eight initial designs resulting from this collaboration include a variety of analog-to-digital converters, digital-to-analog converters, voltage references and current references. There is provision, if needed, for the designs to be custom-tailored to match particular application demands. Further data converter and PLL designs are currently being developed for introduction later this year.

ON Semiconductor’s ONC18 process relies on a 0.18 micrometer (µm) CMOS architecture and due to its high voltage capabilities is extremely well suited to automotive, industrial, military and medical deployment. By having access to an expansive portfolio of qualified IP that supports this process, customers will be able to benefit from ASIC implementations that are highly optimized for their specific requirements, without needing to allocate too much of their own engineering resources to the task. As a result, much quicker design cycles, reduced risk of re-spins and lower associated costs can all be realized.

“The mixed signal ASIC market continues to grow as systems need to utilize the real-word data that is captured by sensors and user interface,” states Rocke Acree, Director of the Custom Foundry business unit at ON Semiconductor. “OEMs are looking to integrate more effective proprietary designs, rather than relying on standard off-the-shelf components. Through this, performance levels can be enhanced, board space saved and unit costs significantly lowered. By working together, ON Semiconductor and Hexius Semiconductor are delivering qualified analog IP needed to facilitate this migration and enabling a new era of mixed signal design.”

“Through the combination of the respective skill sets that our two companies possess, we are in a position to supply the industry with qualified analog IP macrocells on superior semiconductor processes that will deliver clear performance and logistical advantages. This will allow OEMs to respond more quickly to market opportunities that they have identified by taking products from the concept phase right through to full commercial production in the shortest possible time,” adds Chris Cavanagh, CEO at Hexius Semiconductor.

Worldwide combined shipments of PCs, tablets, ultramobiles and mobile phones are projected to remain flat in 2017, according to Gartner, Inc. Worldwide shipments for these devices are projected to total 2.3 billion in 2017, the same as 2016 estimates.

There were nearly 7 billion phones, tablets and PCs in use in the world by the end of 2016. However, Gartner does not expect any growth in shipments of traditional devices until 2018, when a small increase in ultramobiles and mobile phone shipments is expected (see Table 1).

“The global devices market is stagnating. Mobile phone shipments are only growing in emerging Asia/Pacific markets, and the PC market is just reaching the bottom of its decline,” said Ranjit Atwal, research director at Gartner.

“As well as declining shipment growth for traditional devices, average selling prices are also beginning to stagnate because of market saturation and a slower rate of innovation,” added Mr. Atwal. “Consumers have fewer reasons to upgrade or buy traditional devices (see Table 1). They are seeking fresher experiences and applications in emerging categories such as head mounted displays (HMDs), virtual personal assistant (VPA) speakers and wearables.”

Table 1 
Worldwide Devices Shipments by Device Type, 2016-2019 (Millions of Units)

Device Type

2016

2017

2018

2019

Traditional PCs (Desk-Based and Notebook)

219

205

198

193

Ultramobiles (Premium)

49

61

74

85

PC Market

268

266

272

278

Ultramobiles (Basic and Utility)

168

165

166

166

Computing Devices Market

436

432

438

444

Mobile Phones

1,888

1,893

1,920

1,937

Total Devices Market

2,324

2,324

2,357

2,380

Note: The Ultramobile (Premium) category includes devices such as Microsoft Windows 10 Intel x86 products and Apple MacBook Air.
The Ultramobile (Basic and Utility Tablets) category includes devices such as Apple iPad and iPad mini, Samsung Galaxy Tab S2, Amazon Fire HD, Lenovo Yoga Tab 3, and Acer Iconia One.
Source: Gartner (January 2017)

The embattled PC market will benefit from a replacement cycle toward the end of this forecast period, returning to growth in 2018. Increasingly, attractive premium ultramobile prices and functionality will entice buyers as traditional PC sales continue to decline. The mobile phone market will also benefit from replacements. There is, however, a difference in replacement activity between mature and emerging markets. “People in emerging markets still see smartphones as their main computing device and replace them more regularly than mature markets,” said Mr. Atwal.

Device vendors are increasingly trying to move into faster-growing emerging device categories. “This requires a shift from a hardware-focused approach to a richer value-added service approach,” said Mr. Atwal. “As service-led approaches become even more crucial, hardware providers will have to partner with service providers, as they lack the expertise to deliver the service offerings themselves.”

More detailed analysis is available to clients in the reports “Forecast: PCs, Ultramobiles and Mobile Phones, Worldwide, 2013-2020, 4Q16 Update.”

The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 7.0 percent for Q3 2016 to $2093.7 million, compared to $1957.5 million in Q3 2015. The four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 3.7 percent.

“The industry realized solid growth in Q3, with all of the geographic regions – Americas, Europe, Middle East and Africa, Japan, and Asia/Pacific – reporting revenue increases,” said Walden C. Rhines, board sponsor for the ESD Alliance MSS and chairman and CEO of Mentor Graphics. “Product categories CAE, Semiconductor IP, IC Physical Design & Verification, and services all reported increases in the third quarter.”

Companies that were tracked employed a record 35,515 professionals in Q3 2016, an increase of 6.2 percent compared to the 33,430 people employed in Q3 2015, and up 1.5 percent compared to Q3 2016.

The complete quarterly MSS report, containing detailed revenue information broken out by both categories and geographic regions, is available to members of the ESD Alliance.

Revenue by product category

Computer Aided Engineering (CAE) generated revenue of $666.7 million in Q3 2016 which represents a 5 percent increase compared to Q3 2015. The four-quarters moving average for CAE decreased 1.2 percent.

IC Physical Design & Verification revenue was $441.3 million in Q3 2016, an 8.2 percent increase compared to Q3 2015. The four-quarters moving average increased 2.8 percent.

Printed Circuit Board and Multi-Chip Module (PCB & MCM) revenue of $162.2 million for Q3 2016 represents a decrease of 0.1 percent compared to Q3 2015. The four-quarters moving average for PCB & MCM increased 0.9 percent.

Semiconductor Intellectual Property (SIP) revenue totaled $720.9 million in Q3 2016, a 10.4 percent increase compared to Q3 2015. The four-quarters moving average increased 10.1 percent.

Services revenue was $102.6 million in Q3 2016, an increase of 3 percent compared to Q3 2015. The four-quarters moving average increased 2.9 percent.

Revenue by region

The Americas, EDA’s largest region, purchased $932.9 million of EDA products and services in Q3 2016, an increase of 3.2 percent compared to Q3 2015. The four-quarters moving average for the Americas increased 1.3 percent.

Revenue in Europe, the Middle East, and Africa (EMEA) increased 2.3 percent in Q3 2016 compared to Q3 2015 on revenues of $297 million. The EMEA four-quarters moving average decreased 0.7 percent.

Third-quarter 2016 revenue from Japan increased 3.9 percent to $213.2 million compared to Q3 2015. The four-quarters moving average for Japan increased 5.5 percent.

The Asia/Pacific (APAC) region revenue increased to $650.6 million in Q3 2016, an increase of 16.6 percent compared to the third quarter of 2015. The four-quarters moving average increased 9 percent.

The complete MSS report, available to the ESD Alliance members, contains additional detail for countries in the Asia/Pacific region.

From artificial intelligence to the Internet of Things (IoT), far-reaching innovations are unfolding in virtually every technology sector around the globe, continuing to change the way consumers, businesses and machines interact while also spurring the next revolution in tech market growth, according to a new white paper from IHS Markit (Nasdaq: INFO).

For the white paper, IHS Markit surveyed its leading technology experts, who represent various industry segments including advertising, automotive, connected networks, consumer devices, entertainment, displays, media, semiconductors, telecommunications and others. These analysts were asked to provide their informed predictions for the global technology market in the New Year.

The Top Seven Technology Trends for 2017, as identified in this IHS Markit report and listed in no particular order, are as follows:

Trend #1 – Smart Manufacturing Accelerates With More Real-World Products

  • Companies use IoT to transform how products are made, how supply chains are managed and how customers can influence design.
  • Example: look for automation/operator tech firms to release their own Platforms-as-a Service (PaaS) offering in the cloud as they compete to offer and own IoT projects for the industrial market.

Trend #2 – Artificial Intelligence (AI) Gets Serious

  • Already, personified AI assistants from a handful of companies (Amazon’s Alexa, Apple’s Siri) have access to billions of users via smartphones and other devices.
  • However, even bigger, more profound changes are on their way as levels of human control are ceded directly to AI, such as in autonomous cars or robots.

Trend #3 – The Rise of Virtual Worlds

  • After several years of hype, the operative reality behind virtual, augmented and mixed digital worlds is set to manifest more fully in 2017. The technology for augmented reality (AR) and virtual reality (VR) will advance significantly as Facebook, Google and Microsoft consolidate their existing technologies into more exhaustive strategies.
  • New versions of VR-capable game consoles featuring 4K video and high dynamic range (HDR) will also create the medium for high-quality VR content, even if availability will be limited for the next few years.

Trend #4 – The “Meta Cloud” Era Arrives

  • Communication service providers plan to deliver a new wave of innovation, allowing for a single connection to the enterprise and acting as a gateway to multiple cloud service providers. IHS Markit refers to this as the meta cloud.
  • In 2017, new offerings will become available from traditional Software-as-a-Service (SaaS) vendors, coupled with expanded offers from the likes of IBM, Amazon and— most notably—Google via its Tensor chip. Watch for the development and deployment of more specialized silicon in the next two years.

Trend #5 – A Revolution in New Device Formats

  • The development of the consumer drone is the closest example of a product type evolved over the past few years that has quickly gone mass market. 3D printers and pens are heading the same way.
  • The next set of new devices may well materialize at the boundary of cheap 3D printing and inexpensive smartphone components to create completely novel device types and uses.

Trend #6 – Solar Still the Largest Source of Renewable New Power

  • The next year, 2017, will see photovoltaic (PV) technology retaining—and confirming—its position as the planet’s largest source of new renewable power.
  • More than a quarter of all PV capacity added worldwide in 2016 and 2017 will be in the form of solar panels. The growth of solar can be attributed to sharp drops in the cost of PV systems, combined with favorable country policies toward new renewable power.

Trend #7 – Low-Power Technologies Extend Reach to Inaccessible IoT Devices

  • The first batch of low-power, wide-area networks (LPWAN) will go live around the world in 2017 as an alternative to short-range wireless standards such as Wi-Fi and Bluetooth. LPWAN technologies will connect hard-to-reach, IoT devices more efficiently and at a lower cost, dealing with challenges stemming from range limitation to poor signal strength. As a result, opportunities will open up for telecom providers to support low-bit-rate applications.
  • In turn, the increased availability and low cost of LPWAN technologies will drive connectivity for smart metering, smart building and precision agriculture, among many other applications.

North America-based manufacturers of semiconductor equipment posted $1.55 billion in orders worldwide in November 2016 (three-month average basis) and a book-to-bill ratio of 0.96, according to the November Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI.  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in November 2016 was $1.55 billion. The bookings figure is 4.0 percent higher than the final October 2016 level of $1.49 billion, and is 25.1 percent higher than the November 2015 order level of $1.24 billion.

The three-month average of worldwide billings in November 2016 was $1.61 billion. The billings figure is 1.1 percent lower than the final October 2016 level of $1.63 billion, and is 25.2 percent higher than the November 2015 billings level of $1.29 billion.

“As 2016 comes towards a close, equipment spending is stronger than expected at the start of the year,” said Dan Tracy, senior director, SEMI. “Spending has been driven by 3D NAND, leading-edge foundry, and advanced packaging investments, and these segments are key for the expected spending growth in 2017.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
June 2016

$1,715.2

$1,714.3

1.00
July 2016

$1,707.9

$1,795.4

1.05
August 2016

$1,709.0

$1,753.4

1.03
September 2016

$1,493.3

$1,567.2

1.05
October 2016 (final)

$1,630.4

$1,488.4

0.91
November 2016 (prelim)

$1,613.2

$1,547.2

0.96

Source: SEMI (www.semi.org), December 2016

Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms, explains Yole Développement (Yole). Indeed while the first significant volume of embedded die in IC package substrate came from DC/DC converters in smartphones, penetration in other market segments of interest to embedded die such as automotive, medical or aerospace was simply delayed due to much longer qualification times and regulatory approval cycles.

embedded die revenue

Furthermore, embedded die platforms are showing different drivers compared to competing solutions.

The embedded die platform has been incubated and brewed for years patiently waiting for the right moment to appear on the scene in considerable volume. It seems we are finally nearing the point of inflection – from incubation to volume, comments Yole’s Advanced Packaging & Semiconductor Manufacturing team.

Embedded Die Packaging: Technology& Market Trends 2017 report contains a full segmentation of the embedded die platform including embedded die in IC package substrate, rigid board and flexible board and the related drivers. This report proposes a detailed analysis of market revenue and unit forecasts per segments such as mobile, automotive, medical, consumer, ICT and industrial. Yole’s analysts review detailed splits per product within each market segment. These estimations are based on industry developments and likelihood of further success of the embedded die platform.

“In 2015, an estimated 94% of the US$23.5 million embedded die packaging market was recorded in the highly competitive mobile segment,” said Emilie Jolivet, Technology & Market Analyst within Advanced Packaging & Semiconductor Manufacturing team at Yole.

2016 exhibited a revenue decline, expected to last through 2017, due to production decline of camera modules in mobile phones utilizing the embedded die packaging platform. Going forward, the embedded die market is expected to drastically change with product launches in the automotive, medical, ICT, consumer and industrial segments. By 2021 non-mobile share of the US$ 49.7 million embedded die packaging market will rise from 6% to 36% of the total revenue. Automotive and medical markets offer a promising opportunity for the embedded die technology rising from scratch to a combined US$15.5 million packaging revenue. Certain products in the medical domains are in the final stages of long awaited regulatory approvals while the automotive market could be more disruptive with 5-10 times higher revenues, depending on big player adoption rates.

For the first time, in a dedicated technology & market report, the “More than Moore” market research & strategy consulting company Yole treats the embedded die in PCB platform as a standalone topic covering both embedding in an IC package substrate, rigid boards and flexible boards. In addition, Yole’s analysts detail the advanced embedded interconnects such as MCeP developed by Shinko or Intel’s solution named EMIB. When advanced embedded interconnects are included, the embedded die packaging revenue rises an order of magnitude.

As announced, in terms of applications, the limited products/one market image is expected to change significantly. The embedded die technology has been known to the high reliability markets such as medical, aerospace and automotive for years. However cycle times and especially regulatory approvals follow much different and longer schemes than in the consumer sector. A variety of products is expected to arrive on the market in the near future. A trend from low cost to high value embedded die packaging is on the horizon.

•  The automotive sector is forecasted with highest revenue and unit growth with CAGR values from 2015 to 2021 of 246% and 239%, respectively and first volumes expected already in 2017. The high growth is expected from the adoption of embedded die in 48V power converters, motor control units, camera modules, distance sensors and lighting modules.
•  Following the automotive market, the high value lower unit count medical market is forecasted to exhibit a CAGR of 84%. The products associated include hearing aids, pacemakers, neurostimulation and endoscopic cameras.

In combination with products from other market segments, the overall embedded die packaging revenue CAGR is estimated at 13% and unit CAGR at 25% by 2021. However, although non-mobile products are expected to gain speed, the mobile segment is likely to maintain leadership by 2021 due to several RF and power management units adopting embedded die resulting in a mobile segment revenue CAGR of 9%.

Looking ahead, the adoption of embedded die in new markets is expected to propel the embedded die platform from 2018 onwards to the long awaited higher volumes and growth slopes.

SEMI today announced the lineup for six forums at SEMICON China and FPD China held at the Shanghai New International Expo Centre on March 14-16, 2017. SEMICON China is the largest and most important gathering of the semiconductor supply chain in China.

SEMICON China will feature six forums, including a new forum:

  • NEW: Automotive Forum: From self-parking to anticipatory braking, semiconductors are critical for cars’ safety, communication, navigation, and entertainment. Increasingly adoption of ADAS applications and other driver assistance technologies will be discussed.
  • China IC Industry Forum: A four-day forum that includes: China Semiconductor Technology International Conference (CSTIC, March 12-13); China Memory Strategic Forum; Building China’s IC Ecosystem: Advanced Manufacturing, Assembly & Test (morning) and Equipment and Materials (afternoon).
  • Power and Compound Semiconductor Forum’s four sessions, including: LED & Optoelectronics, Wide Band Gap (WBG) Power Electronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.
  • Tech Investment Forum: An international platform to explore investment, M&A, and China opportunities. Speakers include executives from: China’s National IC Fund and municipal IC funds, and the global leading investment institutions.
  • Emerging Display Forum: Co-organized by SEMI and SID and concurrent with FPD China 2017, the forum is an exchange of knowledge on emerging display technologies and future development of the display, including: Flexible Displays, Evolving Equipment and Materials, and OLED and “MicroLED.”
  • IoT Forum: MSIG Conference ─ Creating and Capturing Value in the MEMS and Sensors Ecosystem (Kerry Hotel Pudong, Shanghai): Presented by SEMI’s MEMS & Sensors Industry Group (MSIG), speakers will highlight areas of opportunity for products “on the cusp” of commercialization. The conference will also address the convergence of MEMS/sensors and semiconductors.

Further information on sessions and events at SEMICON and FPD China 2017, please visit www.semiconchina.org/en/54.

SEMICON China also features six exhibition floor theme pavilions: IC Manufacturing, LED and Sapphire, Semiconductor Materials, MEMS, Touch (Panel Display), and OLED.

Register now for SEMICON China 2017 (www.semiconchina.org/en).

Today, SEMI updated the World Fab Forecast report revealing that 62 new Front End facilities are expected to begin operation between 2017 and 2020. The report has been the industry’s trusted data source for 24 years ─ observing and analyzing spending, capacity, and technology changes for all front-end facilities worldwide.

The 62 facilities and lines range from R&D to high-volume fabs.  Most of the newly operating facilities will be volume fabs; only seven are R&Ds or Pilot facilities.

Between 2017 and 2020, 26 facilities and lines begin operation in China, about 42 percent of the worldwide total currently tracked by SEMI.  The Americas region follows with 10 facilities, and Taiwan with 9 facilities.

Fab-Dec-2016

By product type, 32 percent are foundries, 21 percent are Memory, 11 percent LED, then Power, MEMS, Logic, Analog, and Opto, in decreasing order.

Between 2017 and 2020, the World Fab Forecast indicates that five facilities are unconfirmed, 10 are planned, 11 are announced, 26 are in construction and 10 are equipping. These numbers include facilities and lines of all probabilities, including unconfirmed projects and projects which have been announced, but may have a low probability of completion.

The projects under construction, or soon to be under construction, will be key drivers in equipment spending for this industry over the next several years — with China expected to be the key spending market.

SEMI’s World Fab Forecast provides detailed information about each of these fab projects, such as milestone dates, spending, technology node, products, and capacity information. Since the last publication in August 2016, the research team has made 249 changes on 222 facilities/lines. The report, in Excel format, tracks spending and capacities for over 1,100 facilities, using a bottoms-up approach methodology, and provides high-level summaries and graphs, with in-depth analyses of capital expenditures, capacities, technology and products by fab. The SEMI World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, including new equipment, used equipment, or in-house equipment, while the SEMI Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data tracks only new equipment for fabs and test and assembly and packaging houses; also check out the Opto/LED Fab Forecast. Learn more about the SEMI fab databases at: www.semi.org/en/MarketInfo/FabDatabase and www.youtube.com/user/SEMImktstats.