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Intel Corporation today announced that 19 companies will receive the 2014 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to performance excellence and continuous improvement. These companies achieve PQS status by demonstrating industry-leading commitment across all key performance focus areas: quality, cost, availability, technology, customer service, labor and ethics systems, and environmental sustainability.

In addition to the PQS award, Intel recognized two suppliers with the Supplier Achievement Award, which is a focused recognition for extraordinary accomplishments in one or more key performance areas. This year’s winners were acknowledged for exceptional results delivering leading-edge technology solutions and excellence in product availability to meet Intel’s evolving needs as an industry leader. The 2014 PQS and Achievement winners will be honored at a ceremony tonight in Santa Clara, California.

“Intel is excited to acknowledge our Preferred Quality Suppliers for their outstanding performance in 2014 to deliver industry-leading technology with world-class cost, velocity and sustainability,” said Robert Bruck, vice president and general manager of Global Supply Management at Intel. “The innovation and cooperation of these suppliers remains one of the crucial factors in enabling Intel to extend our industry-leading silicon, packaging and test technologies, to enhance value to our customers.”

“2014 was a really pivotal year when our efforts to ramp new technologies and innovative products culminated in achieving positive momentum across all product categories,” added Jacklyn Sturm, vice president, Technology and Manufacturing Group and general manager of Global Supply Management at Intel. “ We could not have done this without Intel’s Preferred Quality Supplier Award winners working alongside us, tackling complex technical and supply chain challenges with market speed, with innovative solutions and sometimes, just exceptionally hard, flawless execution. Thank you for your unfaltering support toward your customer’s success.”

The PQS award is part of Intel’s Supplier Continuous Quality Improvement (SCQI) program that encourages suppliers to innovate and continually improve. To qualify for PQS status, suppliers must exceed high expectations and uncompromising performance goals while scoring at least 80 percent on an integrated report card that assesses performance throughout the year. Suppliers must also achieve 80 percent or greater on a challenging continuous improvement plan and demonstrate solid quality and business systems.

The PQS winners provide Intel with the following products or services:

  • Amkor Technology Inc.*: wafer probe, wafer bump, assembly, final testing services
  • Applied Materials Inc*: wafer fab capital equipment, mask capital equipment, fab automation software and services
  • ASML*: semiconductor lithography equipment
  • Daifuku*: automated material handling systems
  • Entegris Inc.*: contamination control, critical materials handling and advanced process materials
  • Fujifilm Electronic Materials*: process and formulated chemicals, developers, slurry, precursors and resist
  • Fujimi Corporation*: chemical mechanical planarization and silicon polishing slurries
  • Mitsubishi Gas Chemical Company Inc.*: high purity peroxide and custom back end cleans
  • ModusLink Global Solutions Inc.*: channel box CPU for Penang, Shanghai, Miami and finished goods warehouse distribution for Miami
  • Murata Machinery Ltd.*: automated material handling systems, hoist vehicles and stockers
  • Nikon Corporation*: semiconductor lithography systems for technology development and high volume manufacturing
  • Shin Etsu Handotai Co. Ltd.*: silicon wafers
  • Shinko Electric Industries Co., Ltd.*: plastic laminated packages and heat spreaders
  • Siliconware Precision Industries Co. Ltd.*: semiconductor assembly and test services
  • Siltronic AG*: polished and epitaxial silicon wafers
  • Taiyo Yuden Co. Ltd.*: ceramic capacitors, inductors, and filters
  • Tokyo Electron Limited*: coater/developer, dry etch systems, wet etch systems, thermal processing systems, deposition systems and test systems
  • Tokyo Ohka Kogyo Co. Ltd*: high purity photo resists, developers, cleaning solutions and supporting chemistries
  • Veolia North America*: waste management services

The Supplier Achievement Award winners are:

  • ASM International*: front end equipment manufacturer (recognizing extraordinary results in leading-edge technology solutions)
  • GE Water and Process Technologies*: UPW & wastewater recycle/reuse equipment and services (recognizing extraordinary results in product availability)

TowerJazz, a specialty foundry, announced today it has begun mass production of an IR sensor used by Intel in one of its new 3D sensing solutions. Intel chose TowerJazz’s CMOS image sensor (CIS) platform, specifically its unique IS11 process, due to its unparalleled pixel performance at near infrared light with very high speed, high quantum efficiency (QE) and high optical resolution.

“Partnering with TowerJazz was a part of our success in producing our advanced image sensor for 3D imaging and was a natural choice as they were able to offer the required technical specifications and performance for this breakthrough technology,” said Sagi Ben Moshe, Director Depth Camera Engineering, Intel Corporation.

The unique pixel developed by TowerJazz for Intel is a 3.5um global shutter very fast pixel that allows high quantum efficiency at near infrared light, specifically at the scanning laser wavelength with high sensor resolution.

“This collaboration between Intel and TowerJazz was a natural fit. Intel’s leadership in this market, combined with our leading technology that provides outstanding pixel performance for near IR 3D imaging, along with the proximity of our Israel fab with Intel Israel, the group developing this technology, was an ideal alignment,” said Russell Ellwanger, Chief Executive Officer, TowerJazz. “We are very excited to partner with Intel to produce lifestyle changing technology that will revolutionize the way we interact with devices in both our professional and personal lives. We highly value our business relationship with Intel and look forward to further collaboration on their sensing technology.”

“It is truly amazing and thrilling to see our lengthy experience in the imaging field and our own CMOS image sensor technology developed in-house, combined with all of the R&D work we have undertaken for many years come to fruition in such a groundbreaking way,” said Dr. Avi Strum, Vice President and General Manager, CMOS Image Sensor Business Unit, TowerJazz. “Intel sensing solutions will bring consumers new experiences and will change the way people capture and share 3D images. We are very proud of our work with Intel and our ability to assist them in bringing cutting-edge technologies to market quickly and in high volume.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $28.5 billion for the month of January 2015, the industry’s highest-ever January total and an increase of 8.7 percent from January 2014 when sales were $26.3 billion. Global sales from January 2015 were 2 percent lower than the December 2014 total of $29.1 billion, reflecting normal seasonal trends. Regionally, sales in the Americas increased by 16.4 percent compared to last January to lead all regional markets. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“After a record-setting 2014, the global semiconductor industry is off to a promising start to 2015, posting its highest-ever January sales led by impressive growth in the Americas market,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Global sales have increased on a year-to-year basis for 21 consecutive months and remain strong across most regions and product categories.”

Regionally, year-to-year sales increased in the Americas (16.4 percent) and Asia Pacific (10.7 percent), but decreased in Europe (-0.2 percent) and Japan (-8 percent). Sales decreased compared to the previous month in Asia Pacific (-0.8 percent), Europe (-2 percent), the Americas (-3.3 percent), and Japan (-6.4 percent).

January 2015
Billions
Month-to-Month Sales
Market Last Month Current Month % Change
Americas 6.73 6.51 -3.3%
Europe 3.01 2.94 -2.0%
Japan 2.80 2.62 -6.4%
Asia Pacific 16.59 16.46 -0.8%
Total 29.13 28.53 -2.0%
Year-to-Year Sales
Market Last Year Current Month % Change
Americas 5.59 6.51 16.4%
Europe 2.95 2.94 -0.2%
Japan 2.84 2.62 -8.0%
Asia Pacific 14.87 16.46 10.7%
Total 26.25 28.53 8.7%
Three-Month-Moving Average Sales
Market Aug/Sep/Oct Nov/Dec/Jan % Change
Americas 6.41 6.51 1.5%
Europe 3.21 2.94 -8.2%
Japan 3.01 2.62 -13.1%
Asia Pacific 17.05 16.46 -3.5%
Total 29.68 28.53 -3.9%

Total production value of electronic systems increased 5 percent in 2014 to $1,488 billion.  Electronic system production is forecast to grow at a compound annual growth rate (CAGR) of 5.2 percent from 2013-2018. Figure 1 compares the relative market sizes and projected growth rates of 10 major systems segments covered in the 2015 edition of IC Insights’ IC Market Drivers report.  These 10 market categories represented a little over two-thirds of the total production value of all electronic systems in 2014.

Cellphones expanded their lead over standard personal computers (desktops and notebooks) as the largest electronic systems market in 2014 after overtaking standard PCs for the first time in 2013. Cellphones accounted for 18 percent of total electronics systems sales ($265.2 billion) versus about 13 percent for standard PCs ($196.0 billion) in 2014.  As seen in Figure 1, cellular phone sales are projected to rise by a CAGR of 5.6 percent in the 2013-2018 period, while standard PC revenues are expected to slump by an annual rate of -1.1 percent, partly due to the popularity of tablet computers and growing use of smartphones to access the Internet.

ic fig 1

 

Figure 2 shows the market sizes and projected growth rates of IC sales for 11 major electronic system categories covered in the 2015 IC Market Drivers report.  After dominating IC sales for most of the last two decades, standard PCs were unseated by cellphones as the largest end-use IC application in 2013 and the gap widened in 2014.  Cellular handsets accounted for 25 percent of IC sales in 2014, while standard PCs represented about 21 percent of the total.  IC sales for standard PCs have stalled out while cellphone IC revenues are projected to grow by a CAGR of 8.7 percent between 2013 and 2018.  Among these 11 end-use market segments, IC sales growth is expected to be the strongest in systems for connections to the Internet of Things (a CAGR of 22.3 percent) in the five-year forecast period.  IC revenues generated by these 11 end-use systems categories represented nearly 80 percent of total integrated circuit sales worldwide in 2014.

ic fig 2

 

IC Market Drivers 2015—A Study of Emerging and Major End-Use Applications Fueling Demand for Integrated Circuits examines the largest, existing system opportunities for ICs and evaluates the potential for new applications that are expected to help fuel the market for ICs.

“Embedded die in substrate is a promising packaging technology,” comments Yole Développement (Yole) in its latest advanced packaging report entitled “Fan-Out and Embedded Die: Technologies & Market” (Feb. 2015 Edition – Yole Développement). According to Yole’s team, this approach becomes more and more attractive for potential customers because of its numerous advantages. Embedded die in substrate: what are the next steps for the growth?

“The embedding allows a smaller form-factor, and it can be done using a mature manufacturing chain, providing low costs,” explains Jérôme Azemar, Technology & Market Analyst, Advanced Packaging and Manufacturing at Yole Développement. “The approach also offers good thermal performance, high integration capability and low inductance thanks to shorter connections”, he adds.
But these advantages still have to be realistic at high volume manufacturing scales before being able to convince customers. Embedding die in laminate substrates is indeed a promising packaging principle, but it has to overcome several challenges.

embedded die

One of these challenges is the supply chain. The process is being pushed by printed circuit board manufacturers such as AT&S and can create a new supply chain, bringing new players into the semiconductor industry. This new supply chain comes along with new business models, including packagers, module sellers, IDMs pushing for embedding solutions and R&D laboratories.

One of the supply chain’s main advantages is the usage of a mature and affordable manufacturing chain created initially for PCB manufacturing. That achieves low cost technology that would allow easier component integration, with easy access to both sides of the chips. However, a new supply chain brings with it a lack of technical experience with embedding processes and questions about business models that require clarification.

Under the report “Fan-out and Embedded Dies: Technologies & Market Trends,” Jérôme Azemar and the advanced packaging team, analyze the applications that will drive the embedded die market in the future and the potential keys for success.

Single die are the first products currently being sold, demonstrating the technology’s capabilities.

They are essentially low I/O applications with easy to embed dies such as DC/DC converters for wireless products. Yole’s expectations are that the technology will show its real potential with more complex systems such as power application SiPs. There, actives and passives will fully benefit from embedded packages thanks to good heat management and low inductance.

Among the technical requirements, one is especially important: pad pitch on the die. In order to reach volume in the mobile/wireless market, pad pitch has to go below 150μm. Some players, like TDK-EPCOS, claim they already have products with 50μm pitch.

If technical and logistic objectives like this are achieved, and if an application provides a real boost in terms of initial large volumes, the overall market will be able to grow rapidly in the near future.
Under this new advanced packaging technology & market study, Yole, the More than Moore market research and strategy consulting company gives an overview of players involved in embedded die packages. The company describes the strategies they’re hoping will overcome technical issues such as yield, resolution and reliability and their choices of business model to enter the semiconductor packaging market with.

Under this report, Yole’s analysts also detail the different milestones this technology must pass if it is to reach high volumes, and what room there is for innovations where embedded die could provide clear added value. Yole’s study report highlight the different possibilities under investigation or required by customers to achieve volume manufacturing and sustainability. These include details of technical requirements, multi-sourcing and standardization needs and integration roadmaps.

Yole Développement (Yole) announces the return to the power electronics market growth, after two years of stagnancy. According to Yole’s analyst, the power semiconductor devices market reached $11.5B in 2014, with a 8.4 percent growth. In its latest report entitled, Status of the Power Electronics Industry (Feb. 2015 edition), the “More than Moore” market research and strategy consulting company, analyzes the evolution of the power electronics industry and the reshaping of its entire value chain. Vertical/Horizontal integration, industrial companies are looking for the road to success…

Under its new power electronics report, Yole reviews the organization of this industry taking into account the strategies of the main players and key drivers. Yole’s analysts investigate the disruptive power electronics technologies including Wide Band Gap (WBG) materials such as Silicon Carbid (SiC) and Gallium Nitride (GaN), MOSFETs and IGBTs devices and related applications such as wind turbines, transmission and distribution, EV/HEV, rail traction, uninterruptible power supplies and motor drives…

Last year, 2014, was a year of recovery for the power electronics market. After two tough years without seeing any growth, in 2014 the market’s size increased by 8.4 percent, reaching $11.5B for power semiconductor devices. And Yole’s analysts add: “The outlook for the years ahead is also optimistic. Market growth will be driven by a significant increase in electric and hybrid vehicle (EV/HEV) sales, as well as the ramp-up of renewable energy and more smart-grid technology implementation.”

The market will surpass $17B by 2020, representing a compound annual growth rate (CAGR) of 6.9% for the period 2014-2020.

“Power modules, and more precisely IGBTs, will lead this growth. Modules are expected to reach a CAGR 2014-2020 of 10.3%, compared to 5.1% growth for discrete components,” explains Mattin Grao Txapartegi, Technology & Market Analyst at Yole. This growth in the demand of IGBT modules is due to their improved overall performance in terms of efficiency and thermal conductivity management.

“The new wide band gap (WBG) device market will also drive growth,” says Dr Pierric Gueguen, Business Unit Manager for Power Electronics & Compound Semiconductor activities, Yole. According to Yole’s report, lot of industrial companies has been focusing its development on WBG technologies. And today, both solutions, SiC and GaN have proved to be powerful solutions. Ready to be implemented in numerous applications, WBG solutions will represent around 5% of the overall market by 2020, even though in terms of units their presence will still be limited. Dr Gueguen and his team are working to identify and analyze the current bottlenecks to implement WBG technologies in the power electronics industry.

SEMICON Russia, a meeting place of the entire micro- and nanoelectronics industry in Russia, will take place from 16 to 18 June in Moscow. SEMICON Russia Exhibition is scheduled for 17-18 June with traditional location at Expocentre fairgrounds.  With programs that include the Microelectronics Market Conference, an Exhibition, TechARENA sessions and presentations, SEMICON Russia offers advanced opportunities for networking and cooperation with local and foreign professionals.  The event features the latest developments and emerging new markets, in addition to an opportunity to connect with customers, partners and investors. In 2015, SEMICON Russia features a new program TechARENA, consisting of sessions on Intelligent Systems and Semiconductor Optoelectronics. In addition, SEMICON Russia offers its exhibitors a TechLOUNGE where they can present their latest products and innovations. Over 130 exhibitors from 15 countries — including international and regional leading suppliers of equipment, materials and services — are expected to be on the show floor and more than 1500 attendees.

The Microelectronics Market Conference takes place on 16 June the day before the exhibition opening in Expocentre. It is devoted to the creation of large-scale manufacture of electronics in the Russian regions: markets, technology and government support.   The event is a unique opportunity to get a comprehensive perspective of the market situation, with panel discussions which include open debates. The Conference is attended by the representatives of federal and regional organizations and agencies, top and middle managers of major Russian and foreign companies, development institutions, Research Studies Institutes, industrial clusters, Russian and foreign experts.

Conference speakers include: Heinz Kundert, President of SEMI Europe; Alena Fomina, Managing director of JSC “CNII Elektronika;” Pavel Rudnik, Deputy Director, the Department of Innovative Development of the Ministry of Economic Development of the Russian Federation;  Dmitry Krinitskiy, Head of the Department for regional policy and cooperation with authorities, JSC “RUSNANO”; Denis Mironov, Vice-Chairman of Saint Petersburg Industrial Policy Innovations Committee; and  Evgeny Shakhmatov, Head of Samara State Aerospace University. For details about the agenda, please visit http://www.semiconrussia.org/en/Programs/Overview.

From 17 to 18 June, the Expocentre in Moscow will host the eighth SEMICON Russia exhibition, where leading companies from around the world will showcase their products, equipment, technology, facilities and services. Every year SEMICON Russia becomes a must-visit event for the global industry community: consumers, developers, engineers and researchers interested in the application and development of microelectronics technologies including: MEMS technology packaging, A3B5 electronics, photovoltaics, and flexible electronics. SEMICON Russia 2015 exhibitors include: SVCS s.r.o., Maicom Quarz GmbH, DIPAUL group, Eltech SPb, JSC, Schenker Deutschland AG, FÄTH, IMEC, M+W Group, STMicroelectronics, «NPP «ESTO» Isc, Zelenograd Innovation cluster Technounity.  Exhibiting companies are from Russia, Germany, Belarus, Czech Republic, France, UK, Netherlands, Singapore, Japan, the Netherlands, Sweden, and Italy.

“Despite global challenges, we believe that now is the time to strengthen the Russian industry. As the №1 global trade association committed to microelectronics industry development worldwide, SEMI will continue the effort to support the Russian microelectronic industry. Russian companies are looking for technical partnerships to improve competitiveness. SEMICON Russia is discussing new opportunities— including public-private partnership project development.  The semiconductor (and related) industries are also supported by the government and other local organizations, making SEMICON Russia an ideal place to connect to the industry,“ said Heinz Kundert, President of SEMI Europe.

On 17 June, for the first time TechARENA will present the “Smart Systems” session, which will provide an overview of global developments, future applications and markets. The session will focus on building successful cooperation with the Russian companies and funding possibilities.  In addition, the “Semiconductor Optoelectronics” session will take place on the 18 June at TechARENA in honor of the International Year of Light (YIL2015) and light-based technologies declared by the United Nations. This session will give an overview of the current trends and developments of the semiconductor optoelectronics technologies in Russia. Leading Russian and European experts and specialists will provide the R&D results and implementation projects, and review current and potential collaboration between Russian and other world players in this field. Within the framework of TechARENA program, SEMICON Russia exhibitors will make presentations. Visitors of SEMICON Russia get a free access to all TechARENA events.

For more information on SEMICON Russia 2015, please visit: http://www.semiconrussia.org

The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia. The event promises to be larger and more comprehensive than its predecessor SEMICON Singapore, which has been held annually since 1993, with an expanded programme and larger audience base focusing on Southeast Asia communities in the semiconductor and microelectronics sector. The expanded strategy for the new SEMICON Southeast Asia Show — between Singapore, Malaysia and potentially the rest of the regions — will open new business opportunities for customers and foster stronger cross-regional engagement, according to SEMI, the event organiser. SEMICON Southeast Asia will feature a tradeshow exhibition, networking events, market and technology seminars, and conferences.

The event will connect decision makers from leading and emerging semiconductor companies with important industry stakeholders from both the region and all over the world.  Penang was selected for the inaugural SEMICON Southeast Asia exhibition because of its reputation as the “Silicon Valley of the East” and Malaysia’s vibrant eco-system, coupled with the drive and support from the state government.  Focusing on key trends and technologies in semiconductor design and manufacturing, the event also addresses expanding applications markets like mobile devices and other connected “Internet of Things” (IoT) technologies, many of which require development of specialised materials, packaging, and test technologies, as well as new architectures and processes.

For 2015 and 2016, SEMI estimates spending of almost US$ 5 billion on front-end and back-end equipment in the Southeast Asia region, and another $14 billion in spending on materials including $11 billion on packaging-related materials. In addition, according to the SEMI (www.semi.org) World Fab Forecast, Southeast Asia is home to over 35 production fabs covering Foundry, Compound Semiconductors, MEMS, Power, LED, and other devices.

Ng Kai Fai, President of SEMI Southeast Asia, said, “Southeast Asia is a significant and exciting market for the semiconductor industry. In fact, the region contributes a substantial 27 percent of global assembly, test and production, on top of being the largest market for assembly and test equipment.”

“SEMICON Southeast Asia is a natural progression from its earlier SEMICON Singapore exhibition and actively unites industry participants throughout the region. In addition to offering a deep networking opportunity for industry stakeholders, the event is also a catalyst for industry players within the region to collaborate and innovate to become larger players in this US$ 19 billion industry. This year, we expect about 60 industry speakers and close to 200 companies to participate in SEMICON Southeast Asia,” he added.

According to En. Zulkefli Haji Sharif, CEO of Malaysia Convention & Exhibition Bureau, “We are delighted to be able to host SEMICON Southeast Asia here in 2015. This prestigious event will showcase the best of the semiconductor industry and attendees can expect to find out more about the latest developments in microelectronics field. We have the utmost confidence that Penang will live up to all expectations as an attractive business events destination, and that the event will be a benefit to local and global players alike.”

Early-bird pricing on paid programmes ends 20 March, so register now. For more information and exhibition opportunities, visit www.semiconsea.org.

“Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume” announces Yole Développement (Yole) in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015. And the More than Moore market research and strategy consulting company, Yole expects 30% CAGR in the coming years. What can explain such a great potential?

Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications, essentially single die packages for cell phone baseband chips. But this growth reached its limit in 2011. And in 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology.

It faced strong competition from other packaging technologies, such as wafer-level chip scale packaging (WLCSP) in 2013/2014. Intel Mobile also backed off from the technology, and the main manufacturers reduced their prices in 2014, creating a transition phase with low market growth.

Today, according to Fan-Out and Embedded Dies: Technologies & Market Trends report, Yole’s analysts now expect strong growth. They explain: “The market is worth almost $200M and we anticipate 30% CAGR is in coming years”. One of the key factors driving this is the arrival of 2nd generation FOWLP. More customers are also being convinced, a wider range of potential applications reached, and technology qualifications started during the transition phase completed by strong fabless players.

What can explain such great potential? Primarily, mobile customers have high expectations of miniaturization and higher integration while keeping costs low. This leads naturally to WLP for cost and performance and system-in-package (SiP) solutions for integration and functionality. FOWLP has proven its ability to reach these targets. Its small form-factor and low cost potential shown in the 1st generation are now enhanced with high-integration capability of the 2nd generation.

“Benefiting from the delay in introducing 3D through-silicon via (TSV) architectures, FOWLP is currently seen as the best fit for the highly demanding mobile/wireless market and is attractive for other markets focusing on high performance and small size”, explains Jérôme Azemar, Technology & Market Analyst, Advanced Packaging & Manufacturing, Yole Développement.

Under this technology & market report, Yole provides a complete overview of the different market expectations and a detailed application-by-application breakdown. The company also describes the different strategies and products of each player involved in FOWLP, from the main outsourced assembly and test companies, like STATS ChipPAC and Nanium, to foundries like TSMC. Since cost is always the first driver, the report also focuses on equipment and material challenges and substrate size evolution, both for wafers and panels.

North America-based manufacturers of semiconductor equipment posted $1.31 billion in orders worldwide in January 2015 (three-month average basis) and a book-to-bill ratio of 1.03, according to the January EMDS Book-to-Bill Report published today by SEMI.   A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in January 2015 was $1.31 billion. The bookings figure is 4.9 percent lower than the final December 2014 level of $1.38 billion, and is 2.6 percent higher than the January 2014 order level of $1.28 billion.

The three-month average of worldwide billings in January 2015 was $1.28 billion. The billings figure is 8.6 percent lower than the final December 2014 level of $1.40 billion, and is 3.5 percent higher than the January 2014 billings level of $1.23 billion.

“2014 was a strong growth year for the semiconductor equipment industry, and both bookings and billings at the start of this year are comparable to the early 2014 figures,” said SEMI president and CEO Denny McGuirk. “Given the positive outlook for the semiconductor industry in 2015 and based on current capex announcements, we expect the equipment market to continue to grow this year.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
August 2014 

$1,293.4

$1,346.1

1.04
September 2014 

$1,256.5

$1,186.2

0.94
October 2014 

$1,184.2

$1,102.3

0.93
November 2014 

$1,189.4

$1,216.8

1.02
December 2014 (final)

$1,395.9

$1,381.5

0.99
January 2015 (prelim)

$1,276.3

$1,313.6

1.03

Source: SEMI, February 2015