Tag Archives: letter-ap-business

Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

Peglar will lead next-generation technology and architecture enablement efforts of Micron’s Storage Business Unit to drive storage solution development with strategic customers and partners. A 38-year veteran of the data storage industry, Peglar joins Micron after serving as Chief Technical Officer, Americas, for EMC Isilon since 2011.

“We are excited to have Rob join our Storage Business Unit. Micron continues to attract top industry talent as a further demonstration of our commitment to build a world-class storage business,” said Micron President Mark Adams.

Prior to joining EMC, Peglar served as Senior Fellow and Vice President of Technology at Xiotech, held technology and engineering leadership roles at StorageTek and its subsidiary Network Systems Corporation and engineering development and product management roles for ControlData and its supercomputer division ETA Systems.

Micron Technology, Inc., is a developer of advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Micron’s common stock is traded on the NASDAQ under the MU symbol.

Mentor Graphics Corporation today announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design. Don Miller is the former research director for British Hydromechanics Research (now BRH Group) in the U.K., and author of Internal Flow Systems. His book serves as the foundation for Mentor Graphics Flowmaster software technology. Mentor Graphics is establishing the award with Mr. Miller to recognize excellence for System Level Design using Flowmaster software, and to uncover breakthroughs in research and real-world applications in the field.

Award application criteria must be based on a practical and realistic approach to 1D computational fluid dynamics (CFD). This entry must be quantifiable and representative of an advance in system level thermo-fluid analysis and modeling. The submission must demonstrate a relevant, clear and practical approach to system design and must be within the public domain and circulated publicly within 12 months prior to the award entry closing date. Applicants must have permission from their organization, or have relevant authority to apply. All entries, including the supporting materials, must be submitted by April 30, 2015 via an email to [email protected].

The winners and runners up of this inaugural award will be announced in November 2015 and will receive a cash prize and engraved plaques. The panel of expert judges who will review all submissions will include Don Miller. “We are honored to establish this award after Don Miller, whose body of work inspired the development of our market-leading Flowmaster 1D CFD technology,” stated Roland Feldhinkel, general manager, Mentor Graphics Mechanical Analysis Division. “We are excited to review the broad range of system design entries from our global customers, who are changing the world with innovative products and solutions.”

China’s new industry investment and government promotion policies outlined in the recent “National Guidelines for Development and Promotion of the IC Industry” represents major opportunities for China and global semiconductor companies. The details of the policy and its implementation are being closely watched by the global industry for the resources China’s government has dedicated and potential impact to the global semiconductor manufacturing supply chain. During SEMICON China 2015, to be held March 17-19 in Shanghai, SEMI organized Market and Investment forums where key government decision makers, IC fund managers, and global industry analysts will share their insights on the policy and impact to the industry. SEMI expects record numbers of global industry executives to attend the world’s largest microelectronics manufacturing exposition to learn about these semiconductor and emerging/adjacent markets opportunities.

The China “National Guidelines for the Development and Promotion of the IC Industry” sets ambitious targets and sizable support for a China National IC industry investment fund. The combined investment in fabless, IDMs, foundries, and OSATs aims to spur industry at annualized growth rates above 20 percent through 2020. China’s ambitious targets cover: IC manufacturing, IC design, IC packaging and test, materials, and equipment. SEMI estimates the implemented investment plan could reach US$100 billion with the total government and associated local industry funding.

“The rapid development of the semiconductor industry in China has already formed an industry base of domestic enterprises. The unprecedented scale of new industry investment signaled by government plans is likely to further impact the global industry landscape,” said Allen Lu, president of SEMI China. “We are pleased to see significant interest in SEMICON China 2015 as an international gathering — with comprehensive attendance from our industry — to identity the latest business intelligence, global trade prospects, and collaboration opportunities.”

Global companies looking to understand the opportunities, challenges, and risks of China’s investment plans will be participating in events and key forums, including the Semiconductor Market and China Opportunity Forum, Tech Investment Forum-China 2015, Build China’s IC Ecosystem Forum, and China Equipment and Materials Forum. SEMICON China is co-located with FPD China and the LED China Conference, leveraging synergies with these emerging and adjacent markets. Featuring more than 900 exhibitors occupying more than 2,600 booths, SEMICON China is the largest exposition of its kind in China with over 50,000 people expected to attend.

The event will present a comprehensive set of topics through its exhibition, keynote addresses, executive panels, technical and business forums and full-day technology conferences. Grand Opening keynote presenters include: Lisa Su, president and CEO of AMD; Tzu-Yin Chiu, CEO and executive director of SMIC; Xinchao Wang, chairman and CEO of JCET; Simon Yang, president and CEO of XMC; and Michael Hurlston, EVP at Broadcom; and Lei Shi, president of Nantong Fujitsu Microelectronics.

“Semiconductor Market and China Opportunity” forum speakers include:

  • Zixue Zhou, chief economist, Ministry of Industry and Information Technology (MIIT); vice chairman and secretary-general, China Information Technology Industry Federation (Zhou is a vice minister-level MIIT official and the chief architect of the new China IC initiatives with setting up of the National IC Fund)
  • Professor Shaojun Wei, director, Institute of Microelectronics, Tsinghua University (Wei is also the leader of the expert group overseeing China’s National Project 01 responsible for growing China’s core competencies in computing and communication). Plus Handel Jones, founder and CEO of IBS; Jim Feldhan, president, Semico Research; and Dan Tracy, senior director, Industry Research and Statistics, SEMI

“Tech Investment Forum—China 2015” forum speakers include: Mr. Wenwu Ding, the CEO of the newly formed China National IC Fund (Ding has been a director-general of MIIT in charge of Semiconductor industry); Yongzhi Jiang, managing director of Goldman Sachs Securities in charge of M&A; Lip-Bu Tan, founder and chairman of Walden International and CEO of Cadence; and fund managers from CGP Investment, GM E-town Capital, Summitview Capital and Shenzhen Capital.

“Build China’s IC Ecosystem” forum is chaired by Professor Shaojun Wei, with speakers from the complete supply chain from IC design, device makers, to equipment manufacturers. Presenters include executives from Verisilicon, SMIC, XMC, ASMC, JCET, Northern Micro Electronics, and Applied Materials.

“China Equipment and Materials Forum” includes speakers from China and global companies: Sevenstar, TEL, ACM Research, and Shanghai Sinyang with a panel discussion moderated by Mr. Tianchun Ye, director of the Institute of Microelectronics, China Academy of Sciences (Mr. Ye is also the leader of expert group of National Project 02 overseeing developing China’s semiconductor manufacturing core-competencies).

This year’s event features six technical conferences: Mobile Technology Enabled by Semiconductors, China Equipment and Materials Forum, Building China’s IC Ecosystem, Advanced Packaging, LED China Conference, and Intelligent Wearable Industry Seminar.  Business programs include: Tech Investment Forum and Semiconductor Market and China Opportunity. Keynote speakers from Intel, IBM, ITRI, University of California, and SMIC will present. ­ FPD China 2015 features special programs on OLED displays, LCD displays, Oxide and LTPS Displays, and Printing Displays and Touch Screens.

China Semiconductor Technology International Conference (CSTIC) is also co-located at SEMICON China. Organized by SEMI and  IEEE-EDS , co-organized by China’s High-Tech Expert Committee (CHTEC), and co-sponsored by ECS, MRS and the China Electronics Materials Industry Association, CSTIC 2015 will cover all aspects of semiconductor technology and manufacturing (more than 300 papers), including devices, design, lithography, integration, materials, processes, and manufacturing, as well as emerging semiconductor technologies and silicon material applications. Hot topics, such as 3D integration, III-V semiconductors, carbon nano-electronics, LEDs, MEMS and Photovoltaic Technology will also be addressed in the conference. (CPTIC 2015 has joined CSTIC 2015 as Symposium XII).

Sponsors of SEMICON China 2015 include: Tokyo Electron, Laytec, SMIC, Huahong Group, JCET, Disco, Edwards, Advantest, Vastity, Shanghai Sinyang, Spirox, and many others.

Samsung Electronics Co., Ltd. announced that it has begun mass production of industry’s first mobile application processor using the advanced 14-nanometer (nm) FinFET process technology.

“Samsung’s advanced 14nm FinFET process technology is undoubtedly the most advanced logic process technology in the industry,” said Gabsoo Han, Executive Vice President of Sales & Marketing, System LSI Business, Samsung Electronics. “We expect the production of our 14nm mobile application processor to positively impact the growth of the mobile industry by enabling further performance improvements for cutting-edge smartphones.”

As the most advanced technology available today, 14nm FinFET process is able to achieve the highest levels of efficiency, performance and productivity. When compared to Samsung’s 20nm process technology, this newest process enables up to 20 percent faster speed, 35 percent less power consumption and 30 percent productivity gain.

By successfully incorporating three-dimensional (3D) FinFET structure on transistors, Samsung has overcome performance and scaling limitations of the planar structure used in previous 20nm and older processes and gained a significant competitive edge in advanced semiconductors for the mobile industry.

This ground-breaking accomplishment is a result of Samsung’s unparalleled R&D efforts in FinFET technology since the early 2000s. Starting with a research article presented at IEDM (International Electron Devices Meeting) in 2003, Samsung has continuously made progress and announced its technological achievements in FinFET research and has also filed a pool of key patents in the field.

As for memory, Samsung has been successfully mass producing its proprietary 3D V-NAND products since 2013. Together with its 3D transistor based FinFET process technology, Samsung has strengthened its leadership in 3D semiconductors in both memory and logic semiconductors that addresses the current scaling limitations with planar designs.

Samsung’s leading-edge 14nm FinFET process will be adopted by its Exynos 7 Octa, then expanded to other products throughout the year.

Worldwide silicon wafer area shipments increased 11 percent in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry. However, worldwide silicon revenues increased by just 1 percent in 2014 compared to 2013.

Silicon wafer area shipments in 2014 totaled 10,098 million square inches (MSI), up from the 9,067 million square inches shipped during 2013. The previous market high for silicon area shipments was 9,370 MSI in 2010. Revenues totaled $7.6 billion slightly up from $7.5 billion posted in 2013, yet 2014 silicon revenues remain 37 percent below their peak set in 2007. “After three consecutive flat years, annual semiconductor silicon shipment levels achieved respectable growth last year to reach a market high,” said Hisashi Katahama, chairman of SEMI SMG and director, Technology of SUMCO Corporation. ”However, industry revenues did not experience the same magnitude of recovery.”

Annual Silicon* Industry Trends

2007

2008

2009

2010

2011

2012

2013

2014
Area Shipments (MSI) 8,661 8,137 6,707 9,370 9,043 9,031 9,067 10,098
Revenues ($B) 12.1 11.4 6.7 9.7 9.9 8.7 7.5 7.6

 

*Shipments are for semiconductor applications only and do not include solar applications

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or “chips” are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers, epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

Amkor Technology, Inc. today announced that Susan Y. Kim has been appointed as a new member of the Company’s Board of Directors. With this appointment, Amkor’s Board has been expanded to ten members.

“We are pleased to have Susan join us,” said James Kim, Amkor’s Executive Chairman. “Susan is an experienced director and will be a great addition to our Board.”

Ms. Kim is a former Board Member of EB Games Corp. She is an active philanthropist who currently sits on the Board of Directors of the Catholic Foundation of Greater Philadelphia. In the past she has served on numerous Boards of Directors including: The National Constitution Center, The Philadelphia Orchestra, The Franklin Institute, The GESU School, and The Shipley School. Ms. Kim holds a B.A. in Sociology from Hamilton College. She is the daughter of Amkor’s Executive Chairman, James Kim, and the sister of Amkor’s Vice Chairman, John Kim.

Amkor is a provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs.

Power electronics based on gallium nitride (GaN) and silicon carbide (SiC) have the potential to significantly improve efficiency. But since these materials are higher-cost, companies need market-specific strategies in order to succeed as these new wide-bandgap (WBG) materials claim market share from silicon-based semiconductors, according to Lux Research.

Carmakers would succeed by playing the role of an “integrator,” by vertically integrating upstream in the value chain to power modules, while a GaN or SiC developer would do well to pursue a “technology disruptor” strategy, offering core technology expertise to solar inverter makers and incumbent system integrators like ABB.

“Fast-growing markets like automotive and solar inverters are unforgiving when it comes to players without strong business and strategy,” said Pallavi Madakasira, Lux Research Analyst and the lead author of the report titled, “Strategic Playbook for Power Electronics: Lessons from the IC Sector Evolution.”

“Start-ups trying to address these opportunities need to forge partnerships and collaborations — companies like Transphorm and GaN Systems that have done so are best-positioned for success,” she added.

Lux Research analysts evaluated the value chain in GaN and SiC power electronics to identify strategies for the automotive and solar inverter market. Among their findings:

  • Integrators face low risk. Carmakers could integrate upstream through acquisition to include power modules and inverter/converter manufacturing. Such acquisitions will allow carmakers to own drivetrain design and lower overall costs.
  • Tech differentiation is critical. A vertically integrated GaN/SiC device or module player is well-positioned in the solar value chain. The core technology differentiation that such a company offers will be critical for incumbent solar inverter makers like SMA and Fronius, and something system integrators like ABB do not have the competencies for.
  • Other players need to be nimble. Suppliers of substrates, packaging materials and thermal materials will need to customize. Staying nimble and planning for an increased number of specialized device makers in the power electronics value chain will be critical to their overall success.

The report, titled “Strategic Playbook for Power Electronics: Lessons from the IC Sector Evolution,” is part of the Lux Research Energy Electronics Intelligence service.

Mentor Graphics Corporation today announced the embedded systems industry’s broadest portfolio for industrial automation. In partnership with key industry vendors, Mentor Graphics now offers a solution differentiated from other marketplace products by its unique multi-platform approach and robust security architecture. Mentor Graphics new Mentor Embedded multi-platform solution enables embedded product developers to create more feature-rich, power-efficient, safe and secure systems. It encompasses a breadth of runtime platform options, customized development tools, system partitioning, power management, safety certification and system characterization tools, plus market-leading multicore support, making this the broadest solution in the industry.

The Mentor Embedded industrial automation solution includes:

  • The Nucleus real-time operating system (RTOS) with advanced power management and optional IEC 61508 safety certification and Wurldtech Achilles communications certification
  • The Mentor Embedded Linux platform with integrated industrial protocols, SELinux mandatory access control support, and Sourcery CodeBench Professional toolsuite
  • Type-1 hypervisor technology for partitioning and separation
  • Advanced Sourcery Analyzer tool for advanced debug and system characterization
  • Qt graphics optimized for embedded automation controller user interface (UI) applications
  • Customized open source toolchains to optimize hardware components, code footprint, and application performance

The Mentor Embedded solution provides developers with integrated and tested capabilities and features that enable equipment manufacturers to focus on strategic competitive differentiation across the spectrum of industrial devices (industrial controllers, process automation controllers, PLCs, data acquisition devices, and motor driver controllers, along with motion, vision, and SCADA systems).  This enables convergence of the product features and capabilities necessary to increase profitability by minimizing footprint (floor space), reducing power usage (electricity costs), and decreasing downtime (security vulnerabilities).

“Our goal is to provide our process-driven customers with three of the most important things they need to secure their futures: operational integrity, which keeps their plants up and running; operational insight, which provides the knowledge and applications they need to run their plants safely and profitably; and future-proof technology, which provides the agility they need to respond quickly to changing conditions and new business opportunities,” said Andrew Kling, Director of Technology and Process at Schneider Electric.

The solution offers support for advanced homogeneous and heterogeneous multicore System-on-Chip (SoC) architectures integrated with runtime operating platforms and tools to allow manufacturers to reuse existing IP (legacy applications) while taking advantage of leading-edge, power-efficient multicore devices. The key industrial automation partners include Icon Labs for critical security management components that enable end-to-end security, and Softing AG who provides a breadth of industrial connectivity options including OPC-UA, Ethernet/IP, and more.

“Securing critical infrastructure has been a top priority for many businesses and governments, and now with the rapid growth of the Internet of Things (IoT), the challenges will increase exponentially,” stated Alan Grau, founder and CEO of Icon Labs. “We have worked closely with Mentor Graphics to move past the legacy concept of securing the embedded device perimeter, to protecting the embedded device itself. This device protection, data protection, and advanced management and reporting capabilities provide the necessary level of protection from both external and internal threats.”

The Mentor Embedded industrial automation solution was developed to address the growing challenges of building, extending, and maintaining embedded hardware and software for a variety of industrial automation products. It provides a new way to integrate legacy applications, new technologies, comprehensive security architecture, and the latest multicore processors on the same industrial device.

“Mentor Graphics continually advances its market-leading embedded software technologies powered by Freescale devices such as i.MX applications processors and QorIQ multicore processors based on Layerscape architecture, to create a complete ecosystem to ease embedded systems development,” stated Alex Dopplinger, industrial business development manager, Freescale. “Mentor’s unique and comprehensive security framework helps manage the complexities of multicore heterogeneous systems needed for today’s secure industrial automation applications.”

Qualcomm Incorporated today announced that it has reached a resolution with China’s National Development and Reform Commission (NDRC) regarding the NDRC’s investigation of Qualcomm under China’s Anti-Monopoly Law (AML). The NDRC has issued an Administrative Sanction Decision finding that Qualcomm has violated the AML. Qualcomm will not pursue further legal proceedings contesting the NDRC’s findings. Qualcomm has agreed to implement a rectification plan that modifies certain of its business practices in China and that fully satisfies the requirements of the NDRC’s order.

Although Qualcomm is disappointed with the results of the investigation, it is pleased that the NDRC has reviewed and approved the Company’s rectification plan. The following are the key terms of the rectification plan:

  • Qualcomm will offer licenses to its current 3G and 4G essential Chinese patents separately from licenses to its other patents and it will provide patent lists during the negotiation process. If Qualcomm seeks a cross license from a Chinese licensee as part of such offer, it will negotiate with the licensee in good faith and provide fair consideration for such rights.
  • For licenses of Qualcomm’s 3G and 4G essential Chinese patents for branded devices sold for use in China, Qualcomm will charge royalties of 5% for 3G devices (including multimode 3G/4G devices) and 3.5% for 4G devices (including 3-mode LTE-TDD devices) that do not implement CDMA or WCDMA, in each case using a royalty base of 65% of the net selling price of the device.
  • Qualcomm will give its existing licensees an opportunity to elect to take the new terms for sales of branded devices for use in Chinaas of January 1, 2015.
  • Qualcomm will not condition the sale of baseband chips on the chip customer signing a license agreement with terms that the NDRC found to be unreasonable or on the chip customer not challenging unreasonable terms in its license agreement. However, this does not require Qualcomm to sell chips to any entity that is not a Qualcomm licensee, and does not apply to a chip customer that refuses to report its sales of licensed devices as required by its patent license agreement.

In addition, the NDRC imposed a fine on the Company of 6.088 billion Chinese Yuan Renminbi (approximately $975 million at current exchange rates), which Qualcomm will not contest. Qualcomm will pay the fine on a timely basis as required by the NDRC.

“We are pleased that the investigation has concluded and believe that our licensing business is now well positioned to fully participate in China’s rapidly accelerating adoption of our 3G/4G technology,” said Derek Aberle, president of Qualcomm. “We appreciate the NDRC’s acknowledgment of the value and importance of Qualcomm’s technology and many contributions to China, and look forward to its future support of our business in China.”

“Qualcomm has played an important role in the success of the mobile and semiconductor industries in China for many years, and we look forward to building upon this foundation as we grow our investments, engagement and business in China,” said Steve Mollenkopf, CEO of Qualcomm. “We are pleased that the resolution has removed the uncertainty surrounding our business in China, and we will now focus our full attention and resources on supporting our customers and partners in China and pursuing the many opportunities ahead.”

Qualcomm is proud to have contributed extensively for many years to the growth and success of the mobile and semiconductor industries in China, and plans to continue to grow its investments and collaborations going forward, including with China’s mobile operators and handset and other device suppliers, and within the Chinese semiconductor sector. Some recent examples of these investments and support include:

  • Providing extensive engineering assistance and support to China’s mobile operators in rolling out their 4G LTE networks in China.
  • Working closely with Chinese handset manufacturers to build their businesses both inside and outside of China as they seek to become top global brands and leading global suppliers of smartphones.
  • Expanding Qualcomm’s longstanding relationship with Semiconductor Manufacturing International Corporation (SMIC), one of China’s largest and most advanced semiconductor foundries, which has led to SMIC’s major milestone of producing high-performance, low-power mobile processors using cutting-edge advanced 28nm technology.
  • Creating a China-specific investment fund of $150 million to further the development of mobile and semiconductor technologies, including initial investments from the fund in five innovative Chinese companies.

Spansion Inc. and XMC, China’s fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements.

According to TechNavio, 3D NAND is expected to grow at a compounded annual growth rate of over 180 percent by 2018.  The increase in memory requirements and demand for low form factors for NAND flash is contributing to this growth.

“The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future,” said Ali Pourkeramati, senior vice president of strategic alliances at Spansion.  “Our leading charge trap MirrorBit technology, which we invented over 10 years ago, will be the key advantage for 3D NAND innovation and will provide unparalleled high-performance data storage.”

“We are pleased to co-develop 3D NAND technology with Spansion,” said Michael Chen, Chief Business Officer of XMC. “XMC will continue to leverage its leading edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-class R&D team in memory expertise. By partnering with Spansion, we are confident to successfully bring innovative 3D NAND technology to market. “

The first 3D NAND products will be available in 2017.