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Driven by mobile and automotive applications, the CIS industry is expected to grow at a CAGR of 10.6 percent from 2014 – 2020. Yole Développement (Yole) announced a US$16.2B market by 2020 (in value).

“Smartphone applications still take the lion’s share of the CMOS Image Sensor (CIS) market”, announces Yole, the “More Than Moore” market research, technology and strategy consulting company, in its new report Status of the CMOS Image Sensor Industry, 2015 Edition, released this week. “Many different applications are part of CIS’ growth story,” details Yole in its technology & market analysis. It includes automotive, medical, and surveillance are areas where great opportunities have surfaced and are driving the market and technology efforts of existing and new players.

Pierre Cambou, Activity Leader, Imaging & Sensors at Yole Développement and Jean-Luc Jaffard, formerly at STMicroelectronics and part of Red Belt Conseil both pursue their investigation and highlight in this new study the CIS market issues.

Under the report Status of the CMOS Image Sensor Industry, Yole’s team provides key technical insight and analysis about future technology trends and challenges including manufacturing & devices technologies and a technology focus on game-changing areas such as BSI and 3D stacked BSI. This analysis also presents CIS revenue forecast, volume shipments and wafer production by application, market shares and application focus on key CIS growth areas: mobile, DSLR, automotive, medical, security, machine vision.

Exciting new emerging market trends are relevant to the CIS industry. In mobile, the addition of the secondary front-facing camera is already old news, as all high-end handsets and smartphones now have two cameras. In fact, Chinese manufacturers are actually pushing for higher resolution secondary cameras.

”This significantly impacts the average selling price (ASP) of micro camera modules, and is causing low-end players to abandon their focus on submega pixel production and move toward 5Mp+ territories,” explained Pierre Cambou.

Naturally, this has had a major impact on the capital expenditures and technology portfolio roadmaps of these CIS mobile players. This trend is even more crucial for main rear cameras, where compactness and performance are pushed to the extreme. Mobile has become a high-performance/high-volume domain in which one player has excelled so far: Sony Corp (Latest announcement in Nov. 2014)

Automotive is the big story this year, as car manufacturers like Tesla, Nissan and Ford are showing off their first camera-enabled features. Market traction is particularly impressive, with most CIS players enjoying growth rates of 30% – 50%. But this is only the beginning, with most CIS players looking at this market, total revenue should reach US$800M in 2020 – for CIS sensors only.

Automotive’s emerging importance promises profound implications for the CIS ecosystem. As CIS moves from a “for display” application towards a “for sensing” application, new players such as processor and software providers will become key partners for sensor design and marketing.

On the other hand, some CIS segments have suffered sharp decline. With feature phone cameras and digital still-cameras being replaced by more widely-used smartphone cameras, players in these applications are suffering, which is leading to industry consolidation. Yole’s analysts have seen a high level of M&A activity in 2014, which should continue in 2015.

SEMICON Korea 2015 at COEX in Seoul opens tomorrow with more than 500 exhibiting companies and an expected 40,000 attendees. With the backdrop of Korea as a pacesetter in the industry in memory and DRAM, today’s SEMICON Korea press conference expressed an optimistic lookout, for both 2015 and for longer-term monolithic growth drivers, like the Internet of Things (IoT).

Denny McGuirk, president and CEO of SEMI, summarized recent 2015 semiconductor revenue forecasts, which ranged from IDC’s 3.6 percent to VLSI’s 7.8 percent (IC only). 2015 semiconductor equipment revenue forecasts varied from Gartner forecasting an increase of 5.6 percent to the 15.0 percent growth SEMI forecasted in early December, which would see revenues approaching historic 2011 spending levels.  For semiconductor materials, 2015 could also approach 2011 spending levels. McGuirk described silicon cycles moderating with year-to-year volatility becoming more rational within the consolidated industry.

Semiconductor manufacturing in Korea represents the largest region of installed 300mm fab capacity in the world, with much of the capacity targeted towards both advanced NAND Flash and DRAM.  Korea holds 40 percent of the worldwide Memory output, and is the market leader for installed Memory fab capacity.  According to the SEMI World Fab Forecast, DRAM was a significant driver for the 18 percent growth rates for semiconductor equipment in 2014 and is expected to again fuel growth in 2015. While NAND’s pricing and growth moderated, the tight capacity and expansion of DRAM applications and customer diversity roughly doubled the DRAM ASPs in three years.  Mobility continues to be the primary driver for the Memory market and has kept the pressure on scaling and added functionality. In addition, 3D-IC is now coming to fruition as a solution to NAND to ensure the costs continue to scale with size and transistor density.

Korea fab equipment spending (front-end) in 2015 is forecast to be US$7.8 billion, an almost 28 percent increase over 2014.The combined equipment and materials spending outlook for Korea in 2015 will likely top US$14 billion. The semiconductor, semiconductor equipment, and materials supply chain in Korea is developing depth and breadth and becoming a more complete ecosystem.

The LED market remains an important segment for SEMI members, and this market will experience strong double-digit growth in lighting applications over the next several years. Overall LED fab capacity expansion is stabilizing, and many manufactures continue to transition manufacturing to 4-inch diameter sapphire wafers. Similar to the capacity growth trends, spending on LED fab equipment is also stabilizing with 12 percent growth estimated for 2015. 

Keynotes tomorrow at SEMICON Korea will be presented by Samsung Electronics, Intel, and Cisco Systems. Highlights include: Semiconductor Technology Symposium which addresses the global trends and new technologies of the semiconductor manufacturing process; Supplier Search Program; OEM Supplier Search Meeting; Presidents Reception; and International Standards meetings.

SEMICON Korea 2015 is the leading semiconductor technology event to explore the latest market trends and future developments for technology, featuring extensive technical forums, business programs and standards programs. Key sponsors of SEMICON Korea 2015 include Samsung, SK Hynix, and Dongbu HiTek, plus Lam Research, Applied Materials, Wonik IPS, ASE Group, Advantest, Hanmi Semiconductor, and TEL.

The event is co-located with LED Korea 2015, the largest exhibition in the world for LED manufacturing. For more information on the events, visit SEMICON Korea: www.semiconkorea.org and LED Korea: www.led-korea.org.

Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

The new Printed Electronics Research Collaborative (PERC) at UMass Lowell intends to position Massachusetts employers, large and small, to capitalize on the burgeoning printed and flexible electronics field, whether through direct development of products or as a piece of the supply chain. The PERC will initially focus on supporting the state’s defense cluster in printed electronics, but long-term, these technologies are expected to also have a broad range of applications in fields including health care, telecommunications and renewable energy. Printable electronics is currently a $16 billion global market and is projected to quadruple in 10 years, according to a 2014 report by IDTechEx.

“It is a privilege to announce today’s grant as another positive step forward for UMass Lowell, students and businesses across the Commonwealth. We have already seen great success stem from this partnership to fund research, support education and make new strides in innovation,” said Gov. Baker. “By connecting the incredible resources in our universities with the business community, the Commonwealth will continue to stimulate economic growth and create more good-paying jobs.”

The four-year grant award will be matched by $12 million in industry support and is being made as part of the Collaborative Research and Development Matching Grant Program, a $50 million dollar capital fund formed to support large-scale, long-term research projects that have high potential to spur innovation, cluster development and job growth in the Commonwealth. The fund was created as part of the 2012 Jobs Bill and is managed by the Innovation Institute at MassTech. Proposals are reviewed by an Investment Advisory Committee composed of executives from academia, industry, and the venture capital communities.

UMass Lowell Chancellor Marty Meehan and MassTech CEO Pamela Goldberg joined Gov. Baker at UMass Lowell’s Mark and Elisia Saab Emerging Technologies and Innovation Center, an 84,000-square-foot, state-of-the-art research facility where PERC will connect businesses with the expertise of UMass Lowell researchers. The MassTech grant will outfit laboratories and other research space at the Saab Center, also home to the Raytheon-UMass Lowell Research Institute, which will be among the participants in PERC. Other companies that have signed on include MicroChem of Westborough, Rogers Corp. of Burlington, SI2 Technologies of Billerica and Triton Systems of Chelmsford and more are expected, according to UMass Lowell Vice Provost for Research Julie Chen.

“Our mission is to convene industry, academia and government to catalyze economic opportunity in regions and clusters around the Commonwealth,” said Pamela Goldberg, CEO of the Massachusetts Technology Collaborative. “This project hits the mark on several fronts, including the potential to drive the development of innovative products and business growth. We are excited to partner with UMass Lowell and regional industry partners like Raytheon to expand R&D capacity and help advance this exciting new industry cluster.”

“UMass Lowell has decades of experience in partnering with businesses, large and small, to advance technologies and economic development. Not only does bringing our researchers together with innovators in industry stimulate economic growth, it offers our students unparalleled opportunities for experiential education,” Meehan told attendees, including representatives of the business and technology communities, UMass Lowell and the Lowell legislative delegation. “We are grateful to the Commonwealth for its investment in what we believe will be a model for academic and industry collaboration.”

Highlighting the importance of both public and private investment in the University of Massachusetts, today’s event also included the announcement by UMass Lowell that two of its most successful and generous alumni are making another multimillion-dollar gift to the campus and students, bringing their total commitment to the campus to nearly $10 million.

Robert and Donna Manning, Methuen natives who earned degrees at UMass Lowell, will commit an additional $4 million to the university to be used specifically for strategic initiatives in UMass Lowell’s Robert J. Manning School of Business and the School of Nursing.

The gift, combined with the MassTech grant, will strengthen the university’s North Campus Innovation District, located on University Avenue in Lowell. Made up of the Saab Center, the Manning School, the Lydon Library and nearby academic and laboratory complex, the district brings together the expertise of UMass Lowell’s engineering, science and business programs to provide ease of access for students, entrepreneurs and industry partners.

The business school was named for Rob Manning in May 2011 in recognition of the couple’s earlier multimillion-dollar commitment to the university. Since the Mannings graduated from UMass Lowell in the 1980s, they have supported capital and other initiatives at the university, including establishing the Robert and Donna Manning Endowment Fund, which supports scholarships for students majoring in nursing and business. Rob Manning began his career at MFS Investment Management shortly after receiving his UMass Lowell degree in business administration. He worked his way up from research analyst to chairman, a role he has held since 2010, overseeing billions of dollars in assets and employees in 80 countries around the world.  Donna Manning – whose career as an oncology nurse at a Boston hospital spans three decades – earned degrees in nursing and business administration at UMass Lowell.

“Donna and I received a world-class education at UMass Lowell that allowed us to become successful in our careers and our passion is to give back to future generations so they can fulfill their hopes and dreams,” said Rob Manning.

The latest commitment to UMass Lowell by the Mannings will support strategic priorities in the university’s School of Nursing and the Manning School of Business. Those include providing resources for the new dean of the business school as its new home, the Pulichino Tong Business Building, is constructed and outfitted, as well as equipping the new nursing simulation laboratory in the Health and Social Sciences Building.

“Once again, UMass Lowell is grateful to Rob and Donna Manning for their generosity and their support for the future of business and nursing education on our campus. They understand firsthand how a UMass Lowell education positions students for success after graduation and thanks to their gift, our students will be even more prepared they enter the job market,” said Meehan.

Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling. By tightly unifying scheduling into critical MES functions in a modern, Microsoft-based operations management system, cmNavigo 4.0 software improves on-time delivery, shortens total cycle time, and makes better use of plant resources.

“As margins in global high-technology manufacturing shrink, many manufacturers are finding that their legacy MES systems don’t have the flexibility and functionality to meet the demands of today’s volatile markets. The new scheduling, quality control, warehouse management, and shift handoff capabilities we are announcing today reflect our commitment to provide the most modern and unified MES solution available,” said Francisco Almada-Lobo, CEO, Critical Manufacturing. “This new functionality will help manufacturers improve cost control, better manage inventory, and boost productivity of advanced, discrete production operations.”

New Scheduling Functionality Optimizes Production to Meet Customer Demand

cmNavigo 4.0 scheduling models plant floor resources and defines the role of each in fulfilling a mix of orders in an optimal near-term time frame, driven by customer demand. Schedules can be weighted around multiple production criteria and key performance indicators, such as minimizing delivery delays, maximizing machine loads, and reducing cycle times.

Built on Microsoft application development layers, the new scheduling application integrates with more than 30 extensible MES applications. These provide visibility and traceability, operational efficiency, quality management, factory integration, operations intelligence, and factory management.  The modern architecture empowers operations managers to configure and extend models and define workflows without the need for programming.

Integrating scheduling and other MES functionality so tightly avoids duplication of master data, allows real-time updates across different areas of the plant floor, and eliminates the need to maintain separate interfaces. Other new cmNavigo integrated applications announced today deliver the following capabilities:

  • Lot-based sampling enables automated calendar or time-based sampling of production.
  • Document management provides visualization, control, and approval of shop-floor, operations-related documents.
  • Warehouse management synchronizes exchange of information and material between the warehouse and the plant floor.
  • Durables-tracking  simplifies tracking of durable components such as boards, fixtures, tooling and masks, supporting recipe management, maintenance, exception handling, and data collection.
  • A shift logbook enhances both performance and safety by regulating exchange of critical information between shifts.

The new scheduling, sampling, factory management, tracking and logbook features of the software combine to address a wide range of MES needs in semiconductor manufacturing, electronics manufacturing, and medical device manufacturing and other manufacturing industries that might have both high mix and high volume lines. cmNavigo 4.0 software is available now for implementation throughout the world. Critical Manufacturing delivers its solutions through highly acclaimed service teams, skilled in extracting maximum value from complex operations. Expertise covers advanced information technology, business intelligence, migration from legacy MES systems, and greenfield installations.

There will also be a free webcast featuring a case history of an IC substrate manufacturer who is now implementing the new software. The webcast will take place on February 19th at 4:00 GMT (11:00 AM EST).  Register at http://www.criticalmanufacturing.com/en/webinar_201502 or at www.criticalmanufacturing.com.

The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS. Robust vehicle production growth, together with increased semiconductor content in cars charted a path of 10 percent growth year over year to reach $29B in 2014. IHS reports the fastest growing segments for automotive semiconductors are hybrid electric vehicles, telematics and connectivity and advanced driver assistance systems (ADAS).

The semiconductor revenue in these applications is forecast to achieve a compound annual growth rate (CAGR 2013–2018) of 20 percent, 19 percent and 18 percent respectively. The outlook for 2015 is also promising and the automotive semiconductor market is forecast to reach $31B, a strong 7.5 percent improvement over 2014.

Main growth drivers

Emissions legislations are leading semiconductor take rates in powertrain applications in regions around the world.

“The new concepts in emissions mitigation in the engine and in exhaust aftertreatment systems require advance sensors for their operation, said Ahad Buksh, analyst, automotive semiconductors, at IHS. “For example, a hybrid electric vehicle demands ten times more semiconductor content in powertrain,” he said.

Some of the key semiconductor applications for these vehicles include: a motor inverter is needed to convert the direct current to alternating current and vice versa, DC/DC converter is needed for bidirectional voltage control, battery management system is needed to monitor the state of the battery and plug-in charger required for charging the battery. All these applications require high-power management which will be achieved mainly with analog integrated circuits (ICs) and discrete components. After 24 percent growth in 2014, this segment is forecast to increase 22 percent in 2015, the highest of any automotive application.

Safety mandates and guidelines are driving the adoption of ADAS technology. Because of the encouragement of regional authorities and regulators for better safety standards, OEMs are increasingly adopting ADAS applications such as Lane Departure Warning (LDW), Forward Collision Warning (FCW) and Automatic Emergency Braking (AEB), among other technologies. These applications are being implemented with a front view camera module besides radar and lidar modules, providing high potential for semiconductor growth. A higher processing power (DMIPS) in micro-component ICs, increased non-volatile memory for image storage and increased volatile memory for execution of image processing functions would be required for these applications. The semiconductor market for ADAS technology is expected to reach $1.8B in 2015, a 21 percent increase over 2014.

The infotainment domain also provides strong growth opportunities for the future.  An important trend in head-units is the high-definition video function. It primarily comes from the adoption of consumer and mobile devices. This is also reflected in the incredible growth of the consumer electronic suppliers in the automotive industry, including Nvidia, which is estimated to have grown more than 80 percent in 2014.

The next five years are extremely important for telematics and broadband technology as well. 4G LTE technology will continue to grow in 2015, marking an inflection point toward sunset on 2G and 2.5G solutions in years to come. In the instrument cluster, the trend is moving from conventional analog to hybrid and fully digital instrument clusters. At the moment, the premium OEMs are going for a digital approach for their high-end vehicles, but in the long run, having digital instrument clusters in all the vehicles could be an option as well.

2014 Winners

2014 has seen a major change in the automotive supply chain, according to the Competitive Landscaping Tool CLT – Automotive – Q4 2014, now available from IHS Technology.  It has been a great year for Infineon, which enjoyed double digit revenue growth. Infineon has a strong presence in Powertrain, Chassis and Safety and Body and Convenience domains. Increased electrification in vehicles has helped its power management solutions, including the micro-component ICs.  Infineon, which was lagging more than $500 million behind Renesas in 2013, has now taken the lead over Renesas, who had been leading the market for many years.

IHS research indicates this change is largely due to fluctuation rates between the U.S. Dollar and the Japanese Yen, but it does not take into account the acquisition of International Rectifier, which was still in process in 2014. Now that the acquisition is complete, Infineon will further increase its lead over Renesas. International Rectifier’s strong presence in low-power insulated-gate bipolar transistor (IGBT), power modules and power metal-oxide-semiconductor field-effect transistor (MOSFET) arenas will particularly reinforce Infineon’s position in the key growing applications.

Based on the IHS analysis, other suppliers and their ranks are as follows:

Top Winners among Automotive Semiconductors Suppliers in 2014

Supplier

Rank, 2014

Rank, 2013

Market Share, 2014

Market Share, 2013

Key Drivers

Infineon

1

2

9.8%

9.2%
  • Strong growth in Chassis and Safety, Powertrain and Body and Convenience
  • Infineon’s power management solution benefit from HEV/EVs market

Freescale

4

4

7.4%

7.0%
  • Distinctive presence in fast growing segments such as Infotainment, ADAS and HEV/EVs

Texas Instruments

5

7

6.4%

5.3%
  • Strong year for TI’s embedded processors especially in ADAS and Infotainment

On Semiconductors

8

8

3.6%

2.9%
  • Increased position in ADAS with acquisition of Aptina’s CMOS imaging sensors

Micron

9

13

2.5%

1.8%
  • Increased its share in memory ICs for infotainment with its DRAM and eMMC solutions

Source: IHS

North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 0.98 means that $98 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in December 2014 was $1.37 billion. The bookings figure is 12.3 percent higher than the final November 2014 level of $1.22 billion, and is 1.1 percent lower than the December 2013 order level of $1.38 billion.

The three-month average of worldwide billings in December 2014 was $1.39 billion. The billings figure is 17.0 percent higher than the final November 2014 level of $1.19 billion, and is 3.1 percent higher than the December 2013 billings level of $1.35 billion.

“While three-month averages for both bookings and billings increased, billings outpaced bookings slightly, nudging the book-to-bill ratio slightly below parity,” said SEMI president and CEO Denny McGuirk. “2015 equipment spending is forecast to remain on track for annual growth given the current expectations for the overall semiconductor industry.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
July 2014 

$1,319.1

$1,417.1

1.07
August 2014 

$1,293.4

$1,346.1

1.04
September 2014 

$1,256.5

$1,186.2

0.94
October 2014 

$1,184.2

$1,102.3

0.93
November 2014 (final)

$1,189.4

$1,216.8

1.02
December 2014 (prelim)

$1,391.9

$1,366.2

0.98

Source: SEMI, January 2015

By Dr. Adam He, director of Industry Research and Consulting, SEMI China

In June 2014, the State Council of China issued the “National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures. It has echoed strongly across the semiconductor industry and attracted global attention due to the ambitious development targets and sizeable support for a national IC industry investment fund.

What’s new?

(1) The Ambitious Development Target

According to the Guideline, the China IC industry revenue should reach RMB350 billion in 2015, and maintain a CAGR of more than 20 percent through 2020. In other words, 2020 revenues are expected to reach US$143 billion, which is 3.5 times that of the US$40.5 billion in 2013. (Note: China IC Industrial revenue refers to the total IC companies’ sales revenue within China, including IC design companies, foundries, IDMs and OSAT companies.)

SEMI--Adam He--for China article

 

Technical and product targets in each segment of the IC industry are clearly defined in the Guideline. The major targets of each segment are listed below.

  • IC manufacturing: mass production for 32/38 nm process shall be realized by 2015 and 16/14 nm process shall be realized by 2020.
  • IC design: certain key technologies (e.g. mobile smart terminal, network communication) shall approach international first-tier level by 2015, and other strategic technologies shall achieve international leading edge by 2020.
  • IC packaging and test: revenue from mid-end to high-end technologies shall be more than 30% of total revenue by 2015, and key technologies shall achieve international leading edge by 2020.
  • Material: 12-inch silicon wafers produced in China shall be ready for use in device production by 2015, and enter global supply chain by 2020.
  • Equipment: 65-45nm key equipment manufactured in China shall be used into production line by 2015, and enter global supply chain by 2020.

(2) National IC Industry Investment Fund Establishment

The manner of industry support has markedly changed from previous policies. The new policy will be adopted with a market-based approach and implemented through national IC industry investment funds to support industry development.

As of December 16, 2014, the latest information indicates that ordinary share-raising for a national IC industry investment fund has been completed and RMB 98.72 billion (US$ 15.9 billion) has been raised. Preferred shares amounting to RMB 40 billion (US$ 6.5 billion) will be further issued in the first quarter of 2015, accumulating to more than RMB130 billion (US$ 21 billion).

Meanwhile, local IC industry investment funds have been established by the cities of Beijing, Shanghai, Wuhan, and Hefei. Of these, Beijing took the lead in establishing a fund in June 2014, totaling RMB 30 billion (US$ 4.8 billion). It is structured as a “fund of funds” and two sub-funds. One sub-fund, supporting for IC manufacturing and semiconductor equipment, is managed by CGP Investment (the “fund of funds” is also managed by CGP); the other sub-fund, supporting IC design and packaging, is managed by Hua Capital.  In addition, the Shanghai IC industry fund, named Shanghai Summitview Capital IC information industry merger fund, totaling RMB10 billion (US$ 1.6 billion) was established in November 2014.

The total government funds are estimated to reach to US$100 billion with the implementation of local industry funds.

What will happen?

It is anticipated that the new policies will exert a significant influence on the semiconductor ecosystem in China.

China’s semiconductor industry will be dramatically expanded given the scale of industry equity funds that are leveraged by government investments. The existing semiconductor industry in China is estimated to have more than 10 percent of global fab capacity and more than 20 percent of global packaging capacity. The new investments will contribute to a powerful expansion in China-based capacity and create a stronger and more globally prominent semiconductor industry in China.

Secondly, the investment and merger activity in the semiconductor industry in China has been very dynamic and will continue to be so with the new investment funds. These newly established national and local IC industry investment funds will not only directly focus on the Fab and IC design companies, but also stimulate the IC industry merger and acquisition activity in and outside of China. For example, shortly after its establishment, Hua Capital (the investment company of IC design and packaging sub-fund of Beijing IC industry fund) proposed to buy Omnivision with Shanghai Pudong Science and Technology Investment Co. Ltd.

In addition, the new policies will also promote marketization development and global cooperation beyond previously implemented investment activities. In the 1990s, the Chinese government established two semiconductor production lines directly through National Engineering Project 908 and 909. In the beginning of the 21st century, SMIC was co-established by state-owned enterprises and an entrepreneurial team. Now, relying on the new capital, the Chinese government is going to support the industry development through equity funds, which is in line with the marketization reform philosophy of the new government and places investors and entrepreneurs at center stage in implementing industry growth. Experienced investors and entrepreneurs with international vision will lead China’s semiconductor industry to a broader global cooperation.

How should international companies respond?

China IC industry investment funds will likely drive market share gains for China players and also more buyout offers from China. Therefore, it is increasingly critical for international companies to consider their strategy and cooperation objectives with China’s semiconductor industry in the light of a huge application market and a dynamic industry ecosystem.

The first step is to better understand China. Companies need to recognize that China is not only the largest semiconductor market — and not just a manufacturing base with a cost advantage. The most important point is that China’s economy and semiconductor industry is changing dramatically, and this will affect the global semiconductor industry ecosystem. Second, China is a diversified economic body, with the developed metropolitan areas such as Shanghai, Beijing and Shenzhen, and the to-be-developed middle and west regions.  Each of these regions will offer specific opportunities for companies in the semiconductor supply chain.

To participate in China’s industry ecosystem, it is essential to establish connections with the stakeholders in China, such as government, customers, suppliers, and even competitors, and to seek opportunities in cooperation and development through mutual understanding and engagement.

During SEMICON China 2015 (March 17-19), SEMI China will host the Tech Investment Forum-China 2015 on March 18. The Tech Investment Forum has already become an important platform between investment and pan-semiconductor industry in China. This year, Mr. Wenwu Ding, the CEO of China National IC Investment Fund will give a keynote speech. There will also be a session where startup companies can pitch to venture investors for project funding.

SEMI China’s Industry Research and Consulting team provides market research, supply chain surveys, investment site evaluations, and partner matching services (visit www.semi.org.cn/marketinfor/exclusive.aspx) or visit the SEMI Industry Research and Statistics website at www.semi.org/en/MarketInfo.

Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

Under the terms of the settlement, Amkor has agreed to pay Tessera a total of $155 million in equal quarterly installments over the next four years, and the parties have agreed to a mutual release and dismissal of all claims relating to their pending litigation and arbitration proceedings, including the previously awarded judgment of $128.3 million plus interest. The settlement agreement also provides that Tessera and Amkor will look for opportunities to engage in potential technology collaboration.

“We are pleased to have reached a comprehensive resolution in this long-running dispute and look forward to exploring technical collaboration with Tessera,” said Gil Tily, Amkor’s Executive Vice President, Chief Administrative Officer and General Counsel.

Amkor expects to record an after-tax charge to earnings in the fourth quarter of 2014 for most of the total settlement amount, net of amounts previously reserved. Amkor will provide more detail in its upcoming earnings release for the fourth quarter and full year 2014.

Amkor is a provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs.

Orbotech Ltd. today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.  

“To meet the technical requirements of future microelectronic products, 3D-IC architectures using through silicon vias (TSVs) are being employed to overcome scaling limits while delivering better device performance,” stated Kevin Crofton, President of SPTS Technologies and Corporate VP at Orbotech. “SPTS has over 300 DRIE modules being used for advanced packaging applications around the world. Together with Fraunhofer IZM, we aim to develop the techniques needed for cost-effective volume manufacturing of 2.5D and 3D-IC devices.”

For the joint development project, Fraunhofer IZM is using SPTS’ Rapier process module to etch a range of silicon features, such as deep cavities and tapered or vertical TSVs with high aspect ratios.  Leveraging its multi-process capability, the Rapier is also used for other 3D processes, including blanket Si etching for via reveal, post grind stress relief and general wafer thinning.  The Rapier carries SPTS’ endpoint detection (EPD) systems: Claritas for etches to stop layers and low exposed areas, and ReVia, the industry’s only in-situ EPD for via reveal etching, ensuring repeatable and accurate exposure of TSV tips from the wafer back-side, at via densities as low as 0.01 percent.  With the APM CVD chamber, Fraunhofer IZM is benefiting from SPTS’ ability to deposit PECVD SiN/SiO film stacks at <190°C with tunable stress, low electrical leakage and excellent diffusion barrier performance. Both technologies are on the single Versalis fxP platform, saving capex and valuable floor space.  The ability to run multiple process recipes inside the same system gives Fraunhofer IZM significant flexibility: a valuable resource when working with clients from diverse sectors including automotive, healthcare and industrial electronics.

Martin Wilke, the expert in plasma etching at Fraunhofer IZM, commented, “Our researchers and customers expect us to use the latest state-of-the-art equipment. The SPTS Versalis fxP system was selected for our cleanroom facility in Berlin as it combines industry leading DRIE and CVD modules on a single platform, with the option to add additional modules as our capacity demands increase. The multi-technology Versalis fxP allowed us to reduce initial capital outlay and therefore cost of ownership, within a small footprint.”

Crofton added, “Fraunhofer IZM is a leading institute with a key competence in wafer level packaging and system integration. By working with renowned R&D institutes who specialize in industry-oriented applied research, we are able to provide our customers with production ready wafer processing solutions that give them competitive advantage and lower their cost of manufacture.”

The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.” The sold-out conference of the industry’s C-level executives highlighted favorable forecasts in the year’s first strategic outlook for the global microelectronics manufacturing industry.  The underlying drivers for growth and the next wave emerging from the Internet of Things (IoT) were discussed from several perspectives.

Opening keynoter Scott McGregor, president and CEO of Broadcom, traced the history of the industry’s more than 50 years of exponential improvements in silicon speed, power and design since Moore’s Law in 1965.  McGregor sees the next wave of Silicon Magic as a $15 trillion opportunity that will provide ubiquitous, nonstop, seamless high-speed connectivity.  Still, McGregor believes that three key issues challenge the industry’s growth.   First, patent reform, as patents are the foundation of the innovation economy and the global patent system does not meet today’s industry realities. Second, interoperability and standards, as IoT is raising the stakes for data privacy and security.  Finally, STEM education, as in the future, all businesses will be tech businesses.

In the Economic Trends session, presenters took on both macroeconomic and detailed industy-specific forecasts:

  • Nariman Behravesh, senior economist at IHS, presented the macroeconomic view of 2015 and the global implications brought on by the sharp drop in oil prices.  IHS predicted that the U.S. will grow in the 2.5-3.0 percent range in 2015 while other regions will be mixed: the European recovery will be slow, Japan’s economy will regain weak momentum, and China growth will continue to slow, but remain stronger than most. 
  • Mario Morales, VP at IDC, presented the 2015 semiconductor outlook. IDC saw the semiconductor market grow 7 percent in 2014 and projects 3.8 percent growth in 2015. Market growth will be led largely by automotive and industrial segments. 
  • Andrea Lati, principle analyst for VLSI Research, presented the 2015 semiconductor equipment outlook.  VLSI saw semiconductor equipment sales coming in at 17 percent growth in 2014 and forecasts 8 percent growth in 2015. VLSI noted the top 7 chipmakers accounted for 71 percent of spending in 2014 (vs. 56 percent in 2010). VLSI sees the consolidation driving an industry that has smaller cyclic peaks and is settling into a moderated two-year cycle cadence with fewer players having less incentive to individually make a market share grab.” 

Several presenters discussed the Internet of Things (IoT) and offered that the IoT provides an unprecedented growth opportunity — and understanding just what IoT is, at this stage, a challenge.  The lively session featured Frank Jones, VP and GM at Intel, David Ashley, VP of Customer Value Chain Management at Cisco Systems, Shawn DuBravac, chief economist and director of research at the Consumer Electronics Association (CEA), and Martin Reynolds, managing VP and fellow at Gartner.

Among the insights in the IoT session, Jones stressed that with all the IoT hype, it’s critical to demonstrate business value. Working with partners, he cited emerging IoT examples such as: saving 43 percent in time with an integrated “Smart Parking Solution” and improvements to Intel’s own factories with fab personnel defining a process step predictive maintenance tool (sensors and analytics) that saved $9 million per year.  Ashley made the point that with $19 trillion for the IoE at stake, the supply chain, including economic trends (labor wage inflation, government policy, shrinking life cycles) and ecosystem (supplier consolidation, visibility, consumer-driven technology) need to be addressed.  DuBravac focused on how everyday objects are becoming smarter and more connected and said that the key to technology should be what is meaningful as opposed to what is possible.

Days 2 and 3 at ISS will delve deeper into the underpinnings of the industry.  Technology and manufacturing insights will be discussed with presentations from:  TSMC, Altera, XMC, Intel, Honeywell, Micron, imec, ASE, IBM, Lux Research, Illumina, Cypress, Boing, and McKinsey.  A “Silicon Magic” panel will wrap up the conference with Intel, Lam Research, JSR, TSMC, and Qualcomm. The SEMI Industry Strategy Symposium (ISS) examines global economic, technology, market, business and geo-political developments influencing the semiconductor industry.